AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019

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AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019
AT&S
First choice for advanced applications
               Investor and Analyst Presentation
                                September 2019

            AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben
                                                                                      Tel +43 (0) 3842 200-0
                                                                                          www.ats.net
AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019
Table of Contents

       Company Overview

       Financials

       Market Update & Outlook

       Annex

Investor and Analyst Presentation   1
AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019
Company Overview

                                    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben
                                                                                                              Tel +43 (0) 3842 200-0
Investor and Analyst Presentation                                                                                 www.ats.net 2
AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019
AT&S – a world leading high-tech PCB & IC substrates company
                                                Outperforming
    High-end interconnect solutions
                       for                      market growth
    Mobile Devices, Automotive, Industrial,
    Medical Applications and Semiconductor
                                                 over the last
                                                   decade
                                                                               #1
                    Industry                                         high-end PCB producer
                                                                           worldwide*

           Among the top                      € 1bn
             PCB producers                    revenue in
               worldwide                      FY 2018/19          Efficient global production
                                                                         footprint with

                                                                             6
                                                    ~ 10,000      plants in Europe and Asia

                                                    Employees**
*  For CY 2018
   Source: Prismark
** For AT&S FY 2018/19

Investor and Analyst Presentation                                                               3
AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019
Investment highlights

                                    Leading provider of high-end technologies and applications
                                       • Highly advanced position in miniaturisation and modularisation
                                       • Technology advantage at mSAP due to timely extension of the IC substrates technology

                                    Long-standing customer relationships with technology and market leaders

                                    Market outperformance and high profitability
                                       • AT&S has constantly outperformed the PCB and substrates market over the last years
                                       • EBITDA margin of 20 – 25% above industry average
                                       • Strong cash flow generation and therefore improved internal financing capabilities

                                    Successful industrialisation of leading-edge technologies combined with highest quality
                                       • Outstanding process know-how, productivity and efficiency

                                    Solid balance sheet with strengthened equity ratio of 45.0% in 2018/19
                                       • Attractive dividend policy

Investor and Analyst Presentation                                                                                               4
AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019
Market Segments & Product Applications

    Computer,
  Communications,                       IC substrates          Automotive                        Industrial                 Medical
Consumer Appliances
 Smartphones, Tablets,                High Performance        Advanced Driver                Machine-2-Machine               Patient
 Wearables, Ultrabooks,             Computer, Microserver    Assistance Systems,               Communication,        Monitoring, Hearing Aids,
       Cameras                                              Emergency-Call, X2X               Robots, Industrial           Pacemaker,
                                                               Communication                     Computer,           Neurostimulation, Drug
                                                                                             X2X Communication        Delivery, Prosthesis

          Segment Mobile Devices & Substrates                              Segment Automotive, Industrial, Medical

Investor and Analyst Presentation                                                                                                                5
AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019
AT&S – Key Facts
 1               Strong growth track record                                                     2   Balanced portfolio/Global customer base
                                                                                                              Revenue split by segment: Q1 2019/20**

                                         992           1,028

                            815
                763                                                                                    35% (38%)
 667                                           +4%                                                                                                 Mobile Devices & Substrates
                                  +22%
                      +7%                                                                                                 65 (62%)
                                                                                                                                                   Automotive, Industrial,
        +14%
                                                                                                                                                   Medical
                                            226            250         221 +0.3% 223
     168          168
           90                     131*            90             117      52
                                                                                                              Revenue split by customer: Q1 2019/20**
                      77*                                                              35                     (based on customer’s headquarters)
                                    7*                                         18
                                                                                          (1)                  9% (8%)
  2014/15       2015/16     2016/17      2017/18        2018/19          Q1           Q1
                                                                                                    7% (8%)
                                                                       2018/19      2019/20

                                                                                                                                                   Americas
           Revenue                  EBITDA                     EBIT    Revenue growth                  18% (23%)
                                                                                                                         7%                        Germany/Austria

                                                                                                                       66% (61%)
                                                                                                                                                   Asia
€ in millions
*Based on ramp-up effects for new plants in China                                                                                                  Other European countries
                                                                                                                                                                   6
** Figures in parentheses refer to same period last year

  Investor and Analyst Presentation                                                                                                                                              6
AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019
Global footprint ensures proximity
   to supply chain & cost efficiency

   AT&S plant
   AT&S sales support office
   AT&S Headquarters

                       988*                                396*                    1,282*               2,456*              4,501*           269*

Leoben, Headquarters              Fehring                              Nanjangud            Chongqing            Shanghai            Ansan
Austria                           Austria                              India                China                China               Korea
   *Staff, Average, FTE, Q1 2019/20; 74 employees in other locations

    Investor and Analyst Presentation                                                                                                               7
AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019
Strategic focus on high-end technologies

                                                                    AT&S Revenue structure in FY 2018/19 – based on technologies

                                                                                     High-end technology share > 75%
                                                                                          HDI and any-layer PCBs,
                                                                                         Embedding, IC Substrates
                                               High-end
                                             HDI PCBs and
                                             IC substrates
                                                 ~ 30%
                                                                                       Complementary technology
                                                                                             share: < 25%
                                                                                              SS, DS, ML,
                         Single-sided (SS), double-sided (DS), multilayer- (ML),
                                                                                               Flex, RF
                                       flex and rigid-flex (RF) PCBs
                                                   ~ 70%

           Structure of general PCB market – based on technologies
Source: Prismark, AT&S

 Investor and Analyst Presentation                                                                                                 8
AT&S First choice for advanced applications - Investor and Analyst Presentation September 2019
Driving future trends
Medium-term guidance
                                    Expansion of technology leadership
                                    • Leading provider of new interconnect solutions
                                    • Innovation revenue rate: > 20%
                                    Technology development to modul integration and capacitiy expansion
                                    • Revenue target of € 2 billion (around 15% CAGR)
    “First choice                   • Continuation of continuous and sustainable margin improvement
    for advanced
    applications”                   • Medium-term EBITDA margin target of 25-30%
                                    Creation of shareholder value
                                    • Medium-term ROCE above 12%

                                    Sustainable management
                                    • Fulfill and further develop standards in the areas environment, health & safety,
                                      ethics, work conditions and quality

Investor and Analyst Presentation                                                                                        9
Market players in the high-end segment

                                            Market position HDI Technology (2018)
                                                                                                  HDI
 Rank              Supplier            Country/Region      mSAP        IC Substrates
                                                                                       (revenue in USD millions)
    1        AT&S                     AUT                                                                     838
    2        Unimicron                TWN                                                                     799
    3        Compeq                   TWN                                                                     779
    4        TTM                      USA                                                                     681
    5        Meiko                    JPN                                                                     472
    6        Tripod                   TWN                                                                     443
    7        Zhen Ding                TWN                                                                     349
    8        DAP                      KOR                                                                     276
    9        CMK                      JPN                                                                     259
   10        SEMCO                    KOR                                                                     245

Source: Prismark

  Investor and Analyst Presentation                                                                                 10
R&D as the key for technological leadership

           7.4%
           R&D Quota
   (equivalent to € 75.7 million)
                                                  279
                                                  Patents

                                                                               International International
                                                                               R&D Partners R&D Partners

           R&D                                 35.3%
        Headquarters                     Innovation Revenue Rate *
           Austria
 Industrialization at the respective
          production site

As of FY 2018/19
* Revenue generated with products with new, innovative technologies introduced to the market within the last three years

  Investor and Analyst Presentation                                                                                        11
Financials

                                    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben
                                                                                                              Tel +43 (0) 3842 200-0
Investor and Analyst Presentation                                                                                 www.ats.net 12
Highlights in Q1 2019/20
Solid quarter despite strong seasonality and challenging environment
    Revenue flat at € 222.7 million
    − Diversified product, technology and customer portfolio supported to compensate for market fluctuations
    − Strong demand for IC substrates
    − Robust development of Medical & Healthcare
    − Demand in Mobile Devices and Industrial subdued

    EBITDA lower at € 34.9 million
    − Previous year period was impacted by positive product mix
    − Due to challenging market environment
        • Strong saisonality in Mobile Devices as well as market-related underutilization
        • Weaker demand in Automotive and Industrial
        • Lower manufactured value due to saisonality and visibility
    − As preparation for future applications higher R&D expenses (run-up costs for modularization, miniaturization and future applications)
    − EBITDA margin at 15.7% (PY: 23.4%)

    EBIT at € (0.6) million in line with EBITDA

Investor and Analyst Presentation                                                                                                13           13
Revenue and EBITDA development
Revenue and EBITDA impacted by seasonality and market environment

                                                                                                      Revenue split by segment: Q1 2019/20

                             294.8
                                                   273.3
                                                                                                   35%
                                                                   237.9                                                               Mobile Devices & Substrates
     222.1                                                                         222.7
                                                                                                                    65%
                                                                                                                                       Automotive, Industrial,
                                                                                                                                       Medical

                                                                                                       Revenue split by region*: Q1 2019/20
                                                                                                        9%
                                    86.3                82.2                                          7%
                                                                                                                                       Americas
                 52.0                                                                              18%
                                                                                        34.9                                           Germany/Austria
                                                                           29.6
                                                                                                                     66%               Asia
                 23.4%               29.3%                 30.1%           12.5%           15.7%                                       Other European countries
      Q1 2018/19             Q2 2018/19            Q3 2018/19      Q4 2018/19      Q1 2019/20
 € in millions                           Revenue       EBITDA and margin                           *based on customer’s headquarters                   14

Investor and Analyst Presentation                                                                                                              14                    14
Business Development – Mobile Devices & Substrates
 € in millions (unless                                                                                         IC substrate continued to grow due to higher
                                             Q1 2018/19             Q1 2019/20           Change in %
 otherwise indicated)                                                                                          value portfolio and rising sales volume
 Revenue                                            160.2                166.4                3.9%             Due to stronger seasonality lower demand
 Revenue with external                                                                                         for Mobile devices and market-related
 customers                                          137.8                143.8                4.4%
                                                                                                               underutilization
 EBITDA                                              39.3                 23.8               -39.5%
  EBITDA margin
                                                                                                               Unfavorable product mix and low visibility
                                                    24.5%                14.3%
                                                                                                               impacted first quarter earnings
  Revenue* and EBITDA
                            208.9
                                                     186.5
                                                                          150.6                 143.8
    137.8

                                      71.9                   66.1
            39.3
                                                                                  16.3                  23.8

    Q1 2018/19              Q2 2018/19               Q3 2018/19           Q4 2018/19            Q1 2019/20
                                                   Revenue      EBITDA
€ in millions; * Revenue with external customers

  Investor and Analyst Presentation                                                                                                                           15
Business Development – Automotive, Industrial, Medical
 € in millions (unless
                                             Q1 2018/19            Q1 2019/20       Change in %           Medical & Healthcare continued to show
 otherwise indicated)
 Revenue
                                                                                                          good demand
                                                    89.6                88.1             -1.7%
 Revenue with external                                                                                    Weaker market-related demand in Industrial
 customers                                          83.3                78.9             -5.2%
                                                                                                          Overall challenging market environment in
 EBITDA                                             12.0                10.9             -9.2%            Automotive
  EBITDA margin                                    13.4%               12.4%

  Revenue* and EBITDA
      83.3                    84.3                   85.0                 86.2
                                                                                            78.9

             12.0                     12.4                  13.9                 14.4              10.9

     Q1 2018/19              Q2 2018/19             Q3 2018/19           Q4 2018/19         Q1 2019/20
                                                Revenue       EBITDA
€ in millions; * Revenue with external customers

  Investor and Analyst Presentation                                                                                                                    16
Financials Q1 2019/20

STATEMENT OF PROFIT OR LOSS

                                                               Change
€ in thousands                       Q1 2018/19   Q1 2019/20
                                                                YoY

Revenue                               222,081      222,739        0.3%    Supported by IC substrates and Medical & Healthcare

EBITDA                                 51,996       34,905     (32.9%)    Unfavourable product mix, lower manufactured
                                                                          value and R&D costs for future applications
 EBITDA margin                          23.4%        15.7%      (7.7pp)
EBIT                                   18,323        (562)     (>100%)
 EBIT margin                             8.3%       (0.3%)      (8.6pp)
Finance costs – net                     1,703       (1,739)    (>100%)    Lower due to FX effects

Profit for the period                  13,549       (6,204)    (>100%)
Earnings per share                     € 0.30      (€ 0.20)    (>100%)

 Investor and Analyst Presentation                                                                                              17
Financials Q1 2019/20

STATEMENT OF FINANCIAL POSITION
€ in thousands                       31 Mar 2019   30 Jun 2019    Change

Equity                                803,451       759,304      (5.5%)    Negative FX effects and lower earnings

Total assets                         1,784,106     1,774,855     (0.5%)
Net debt                              150,258       208,626       38.8%    Higher capex and impact of IFRS 16

Net working capital                   160,537       156,608      (2.4%)
Equity ratio                            45.0%         42.8%      (2.2pp)

 Investor and Analyst Presentation                                                                                  18
Financials Q1 2019/20

STATEMENT OF CASH FLOWS
                                                                                                 Change
€ in thousands                                                        Q1 2018/19 Q1 2019/20
                                                                                                  YoY

Cash flow from operating activities                                        4,585     28, 505     >100%    Mainly due to increase in trade payables

Cash flow from investing activities                                    (21,614)      (63,745)   (>100%)   Higher net capex main driver

Cash flow from financing activities                                        1,230      (2,710)   (>100%)
Change in cash and cash equivalents                                    (15,799)      (37,950)   (>100%)
Operating free cash flow1)                                             (12,497)      (21,173)   (69.4%)   Result of higher net capex

Free cash flow2)                                                       (17,029)      (35,240)   (>100%)
1)   Cash flow from operating activities minus Net CAPEX
2)   Cash flow from operating activities minus cash flow from investing activities

     Investor and Analyst Presentation                                                                                                               19
Net CAPEX
Investment in IC substrates capacity main trigger for YoY growth

                       254.3
                                      240.7

        164.8
                                                141.7

                                                         100.8

                                                                                 49.7

                                                                      17.1

      2014/15        2015/16         2016/17   2017/18   2018/19   Q1 2018/19 Q1 2019/20
€ in millions

 Investor and Analyst Presentation                                                         20
Market Update &
                                                                                                   Outlook

                                    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben
                                                                                                              Tel +43 (0) 3842 200-0
Investor and Analyst Presentation                                                                                 www.ats.net 21
Growth opportunities in all segments
Focus on high-end applications

Communication                         Consumer / Computer         Automotive                       Industrial / Medical

    Increased digital                   New applications            Autonomous driving               Automation
    networking (IoT)                    (smartwatch, speakers,        RADAR, LiDAR, camera              Machine-to-machine
    Additional functionality            robots, VR, …)                5G                                communication (5G)
                                         Edge & cloud computing       Artificial Intelligence
      5G                                                                                                Artificial Intelligence
                                         Networking                 Electrification of the drive
      Artificial Intelligence                                                                        Mobile therapy and
                                                                    Increasing electronics share
                                         Big data / data server     per vehicle                      diagnostic devices

                                    High end market growth ~10% CAGR (until 2024)
Investor and Analyst Presentation                                                                            22                   22
PCB & IC substrates market – Overview
 Forecast for the total PCB & IC substrates market   IC substrates
 until 2024: CAGR of 5.6%
                                                     − Networking and AI processors trigger demand for high-value IC
                                                       substrates
                                                     − Cloud computing drives data center expansions
                                                     − Increase in server demand
                                                     − Processor heterogeneous integration drives further increase in IC
                                                       substrate unit size and the number of substrate layers
                                                     Automotive
                                                     − Despite a temporary slowdown, future growth is strongly driven by
                                                       autonomous driving (e.g. RADAR, LIDAR, cameras, …), “Vehicle-to-X”
                                                       communication modules and power module PCBs for electrification
                                                     Consumer
                                                     − Wireless connectivity of smart devices enabling IoT drives need for
                                                       high-end PCBs and substrates for module applications
                                                     Communication
                                                     − Despite a flat development in 2019 smartphone unit sales, high-end
                                                       PCB demand for mainboards and modules will grow due to additional
                                                       functionalities like 5G, AI and sensors
                                                     − 5G infrastructure will increase demand PCBs and substrates for
                                                       mainboards as well as modules
$ in billions
Source: Prismark, June 2019; Yole, May 2019

 Investor and Analyst Presentation                                                                         23                23
Investment in
                                                                                       the future of AT&S

                                    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben
                                                                                                              Tel +43 (0) 3842 200-0
Investor and Analyst Presentation                                                                                 www.ats.net 24
AT&S initiates next growth step
IC substrates business becomes an even more important pillar
    Required performance of future high-performance computing modules drives the
    technological demands on all components of the modules including IC substrates
    Production of IC substrates for high-performance computing modules
    − Construction of a new plant in Chongqing and expansion of the location in Leoben
    Close cooperation with a leading semiconductor player
    − will drive future technology development and implementation
    − should support mitigating the investment risk

    Investment volume of up to one billion euro planned for the next five years
    Start of production in the new plant in Chongqing end of 2021

Investor and Analyst Presentation                                                        25   25
Drivers behind the investment
Globally generated data grow by more than 30% p.a. until 2025
     Explosive growth of data
         Smart applications and devices with an increasing number of low cost sensors
         Decreasing storage costs per Giga Byte due to memory technology advances
         Data sharing (entertainment, office and production automation) enabled by higher data rates, bandwidth (3G 4G 5G)
         Autonomous driving generates a flood of data due to necessary applications like RADAR, LIDAR…

     Artificial Intelligence introduces machine learning for more efficient data processing and
     automation and requires further dedicated „AI processors“                           IC substrates for
                                                                                                           AI / self driving car
                                                                                        IC substrates           10-20 layers
                                                                                            for PC,
                                                                                            server
                                                                 IC substrates            4-6 layers
                                                                  for mobile
                                                                    2-4 layers

Investor and Analyst Presentation                                                                                                  26
AT&S operating successfully in China
Industry best-in-class for ramping new technologies and facilities
  Since 2001 plant in Shanghai for high-end HDI
  Since 2013 site in Chongqing with two plants for
  IC substrates and new technologies
  First high-end IC substrates manufacturer in China
  SLP main trigger for becoming No 1 at
  high-end PCBs
  ~7,000 employees in China

Investor and Analyst Presentation                                    27
New plant in Chongqing
One of the most modern IC Substrate plants in the world
    Manufacturing floors space of 65,000 m2 (equals nine football pitches)
    IC substrates for HPC modules demand clean environment
    − Fulfills highest design standards to guarantee necessary product quality
    − High portion of cleanroom       level of semiconductor production
    − Any vibration (from machines, humans…) must be avoided
    − Special building construction
    Respective substrates panel show 30 million laser drilled holes
                                                                                 Hair
    − Structure is reduced to 3µm (a hair ~80µm)

Investor and Analyst Presentation                                                       28
Securing profitable growth in tomorrow
Medium-term guidance
    Step towards module integration and “More than AT&S”
    − Group revenue to double to € 2 billion (CAGR of roughly 15%)
    − EBITDA margin of 25% to 30%
    − ROCE target above 12%
    Significant financing capabilities and solid finance structure to manage the investment
    − Strong operating cashflows
    − High level of existing liquid funds (e.g. promissory note loan)
    − Continuous optimization of financing structure

Investor and Analyst Presentation                                                             29
More than AT&S
Broadening the service range and opening up of new business opportunities

                                                                                                                               Leading
                                                                                                                               provider of
                                                                                                                               interconnect
                                    Technology                                                                                 solutions
                                    Innovation power
                                                                                                                            Module integration
                                    Clear focus on dedicated applications
                                                                                                                            services
                                                                                                                            Build-up of additional
                                                                                                                            capabilities
                                                                                                       Substrates for HPC
                                                                                                       modules
                                                                                                       Diversification of
                                                                                     PCBs/substrates   application and
                                                                                     for modules       customer portfolio
                                                                 mSAP / SLP          High growth
                                                                                     potential
                                            IC substrates        Technology leader
            Printed circuit boards
                                            One of the leading
            Leading producer of high-       producers
            end PCB

Investor and Analyst Presentation                                                                                                                    30
Outlook for 2019/20
Revenues and EBITDA outlook continues to be confirmed
    Volatile and currently weaker market environment for mobile devices, in the Automotive and Industrial
    segment causes low visibility
    On an annual basis the Management Board expects revenue to remain stable and an EBITDA margin in the
    range of 20 to 25%
    Investment (CAPEX) activity in the current financial year
    − Maintenance investments and minor technology upgrades in the amount of € 80 to 100 million
    − Depending on the market development, an additional € 100 million for capacity and technology expansions
    − Investments in IC substrates increase from € 80 million up to € 180 million

Investor and Analyst Presentation                                                                               31
Annex

                                    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben
                                                                                                              Tel +43 (0) 3842 200-0
Investor and Analyst Presentation                                                                                 www.ats.net 32
AT&S – Stock Profile
Listing:                                Vienna Stock Exchange,   # of shares outstanding        38.85m
                                        Prime Standard           Average daily volume*:         ~ 90,000 shares
Indices:                                ATX, Vönix, WBI          Dividend for 2018/19:          € 0.60 per share
Thomson Reuters (A):                    ATSV.VI
Bloomberg (A):                          ATS:AV
                                                                  * 01/09/2018 – 31/08/2019

         Financial Calendar                                             Shareholder structure

Publication of the first half-year 2019/20   07 November 2019
Publication of the first nine months 2019/20 04 February 2020
Preliminary results 2019/20                  14 May 2020

Investor and Analyst Presentation                                                                                  33
Supply chain in the electronics industry
New business opportunities through entry into the module market

Module Design                   Chip                  Chip Assembly         PCB               Substrate       Product/         Product
                             Manufacturing                & Test        Manufacturing        Manufacturing     Module         Ownership
                                    (Front-end)          (Back-end)                                           Assembly

       Design
                                                             03         Module Integration Service Provider
       houses

                                                                               02
       OEMs
                                                                      Module Board Manufacturer (SLP)

      Fab-less
                                                                          01                    01
                                                            OSATs                                             ODM/EMS/
                                    Wafer Foundries                                                                             OEMs
     IC Players                                                                                                 OSATs
                                                                               PCB               Substrate

Investor and Analyst Presentation                                                                                        34               34
Headcount
Capacity extensions require more staff

                                     9,872           10,057                    9,965
            9,598                                                 9,718

       Q1 2018/19                Q2 2018/19        Q3 2018/19   Q4 2018/19   Q1 2019/20

* incl. contractors, FTE, average for the period

 Investor and Analyst Presentation                                                        35
Key credit figures
         Gross debt, financial assets and cash, net debt                                                    Net debt/EBITDA
                                                                         717

                                                593
                                    523                     540
                                                                                                                2.9
                                                                               567
                    405
    372                                           381

                                     263                                                            1.6
                                                                  331
                          274             260
         261                                                                                                              0.9
                       131                            212                                  0.8
       111                                                    209                                                                   0.6
                                                                           150

     2013/14        2014/15         2015/16     2016/17     2017/18      2018/19        2014/15   2015/16     2016/17   2017/18   2018/19
                 Gross debt           Financial assets and cash         Net debt
 € in millions                                                                       Multiple

       Net debt decrease results from positive operating                                  Target: < 3x
       free cash flow

Investor and Analyst Presentation                                                                                                           36
AT&S Product Portfolio – I
                    ECP®:                                                       IC substrates                           Substrate-like printed circuit boards
         Embedded Component Packaging                                                                                                   mSAP

Embedded Component Packaging allows to embed               IC substrates serve as interconnection platform with   Substrate-like PCBs (mSAP technology) are the next
active/passive components (e.g. wafer level dies) within   higher density (Line/Space < 15 micron) between        evolution of high-end HDI PCBs with higher density:
the layers of a PCB – contributes to miniaturization.      semiconductors (Chips) & PCBs .                        Line/Space < 30 micron.

Production site
Leoben, Shanghai                                           Chongqing                                              Chongqing, Shanghai

Applications
Devices such as smartphones, tablets, digital              High-end processors for                                Mobile applications like smartphones
cameras and hearing aids                                   Computer, Communication, Automotive, Industrial

Investor and Analyst Presentation                                                                                                                                       37
AT&S Product Portfolio – II
            HDI                         HDI microvia printed              Multilayer printed circuit             Double-sided printed             IMS printed circuit boards
  any-layer printed circuit             circuit boards – high                      boards                           circuit boards                    – insulated metal
          boards                        density interconnect                                                                                              substrate

Further technological                HDI: high density interconnect,     Found in almost every area of        Used in all areas of electronics.   IMS: insulated metal substrate.
enhancement to HDI microvia:         meaning                             industrial electronics. AT&S         AT&S focuses on double-sided        Primary function: heat
All electrical connections in HDI    laser-drilled connections           produces printed circuit boards      printed circuit boards with         dissipation for use mainly with
any-layer boards consist of laser-   (microvias). HDI is first step      with 4 to 28 layers, in quantities   thicknesses in the range of 0.1-    LEDs and power components.
drilled microvias. Advantage:        towards miniaturization.            from individual prototypes to        3.2mm.
further miniaturization, and         AT&S can produce 4-layer            small batches and mass
higher performance and               laser PCBs up to 6-n-6              production.
reliability. AT&S produces HDI       HDI multi layer PCBs.
any-layer in 4 to 12 layers.
Production site
Shanghai                             Shanghai, Leoben                    Leoben, Nanjangud, Fehring           Fehring, Nanjangud                  Fehring

Applications
Smartphones, Tablets,                Mobile phones and nearly all        Used in all electronic               Primarily industrial and            Lighting industry
Notebooks                            electronic applications including   applications including touch         automotive applications
                                     automotive (navigation,             panels, and in products ranging
                                     infotainment and driver             from aircraft to motorcycles,
                                     assistance systems)                 from storage power plants to
                                                                         solar arrays

Investor and Analyst Presentation                                                                                                                                                   38
AT&S Product Portfolio – III
        Flexible printed               Semi-flexible printed             Rigid-flex printed       Flexible printed circuit            AT&S patented
         circuit boards                   circuit boards                   circuit boards          boards on aluminum                  technologies
                                                                                                                             ECP®: Embedded
                                                                                                                             Component Packaging
                                                                                                                             ECP® is a patented AT&S packaging
                                                                                                                             technology used to embed active
                                                                                                                             and passive electronic components
                                                                                                                             in the inner layers of a printed circuit
                                                                                                                             board. ECP® technology is used in
                                                                                                                             ever smaller, more efficient and
Used to replace wiring and          More limited bend radius than   Combine the                 Used when installing LEDs    more powerful devices, such as
connectors, allowing for            flexible printed circuit        advantages of flexible      in car headlights, for       smartphones, tablets, digital
connections and geometries that     boards. The use of a            and rigid printed circuit   example, where the           cameras and hearing aids.
are not possible with rigid         standard thin laminate          boards, yielding benefits   printed circuit board is     Production sites: Leoben, Shanghai
printed circuit boards.             makes them a cost-effective     for signal transmission,    bonded to an aluminum
                                    alternative.                    size and stability.         heat sink to which the
                                                                                                                             2.5D® Technology
                                                                                                LEDs are then attached.
                                                                                                                             Platform
                                                                                                                             Combines mechanical and electronic
                                                                                                                             miniaturization, and enables partial
Production site                                                                                                              reduction of the thickness of a
Ansan, Fehring                      Fehring                         Ansan                       Ansan                        circuit board. Advantage: populated
                                                                                                                             assemblies have a thinner profile.
                                                                                                                             Can be also used to make cavities in
Applications                                                                                                                 the printed circuit board, e.g. for
Nearly all areas of                 Automotive applications         Industrial electronics,     Lighting, automotive,        acoustic channels. Major application
electronics, including                                              such as production          building lighting            for this technology is the 2.5D® rigid-
measuring devices and                                               machines and industrial                                  flex printed circuit board, a lower
medical applications                                                robots                                                   cost alternative for flex-to install
                                                                                                                             applications.
                                                                                                                             Production sites: Leoben, Shanghai

Investor and Analyst Presentation                                                                                                                                       39
Management

Andreas Gerstenmayer, CEO                       Monika Stoisser-Göhring, CFO               Heinz Moitzi, COO
   Joined AT&S as CEO in 2010                      CFO since 2017                             COO since 2005
   Previous positions include:                     Previous positions include:                With AT&S since 19811)
   − 18 years of work experience at Siemens,       − Since 2011 with AT&S in senior           Previous positions include:
      including Managing Director with                positions in Finance and Human          − Various management positions
      Siemens Transportation Systems GmbH             Resources                                  within AT&S
      Austria and CEO of the Drive Technology      − Various positions at international       − Measurement engineer with Leoben
      business unit in Graz from 2003 to 2008         accounting and tax consulting              University of Mining and Metallurgy
   − Partner at FOCUSON Business                      companies                               Education:
      Consulting GmbH after leaving Siemens        Education:                                 − Degree from Higher Technical
   Education:                                      − Certified Tax Consultant                    College of Electrical Engineering
   − Degree in Production Engineering from         − Degree in Business Administration
      Rosenheim University of Applied                 from Karl-Franzens University Graz
      Sciences
                                                                                              1)He was already with the founding company of AT&S

 Investor and Analyst Presentation                                                                                                                 40
Milestones in the Group’s history
1987                                   1994                             1999                                                    2002
Founding of the Group, emerging        Privatization and                Initial public offering on Frankfurt Stock Exchange     Start of production at new Shanghai
from several companies owned by        acquisition by Messrs            („Neuer Markt“). Acquisition of Indal Electronics       facility – one of the leading HDI
the Austrian State Owned               Androsch, Dörflinger, Zoidl      Ltd., largest Indian printed circuit board plant        production sites in the world
Industries                                                              (Nanjangud) – today, AT&S India Private Limited

              2010                                   2009                                      2008
              Start of production                    New production direction: Austrian        AT&S change
              at plant II in India                   plants produce for high-value niches      to Vienna Stock
                                                     in the automotive and industrial
                                                     segment; Shanghai focuses on the
                                                                                               Exchange                                        2006
                                                     high-end mobile devices segment                                                           Acquisition of Korean
                                                                                                                                               flexible printed circuit
                                                                                                                                               board manufacturer,
                                         2011                                2013                                                              Tofic Co. Ltd. – today,
                                           Construction starts on new        AT&S enters the IC substrate                                      AT&S Korea Co., Ltd.
                                           plant in Chongqing, China         market in cooperation with a
                                           Capacity increase in              leading manufacturer of
                                           Shanghai by 30%                   semiconductors

                                                                                                                              2018                   2019
                                                                                                                              Start of the second    AT&S is the global
         2015                                         2016                             2017                                   expansion phase at     number one for high-
         AT&S again achieves record high sales and     AT&S starts serial production Successful introduction and              plant 1 in Chongqing   end printed circuit
         earnings for financial year 2014/15 and       of IC substrates at the plant optimisation of the mSAP technology                             boards
         decides to increase the investment program in in Chongqing                  in Shanghai and Chongqing
         Chongqing from € 350 million to € 480 million
 Investor and Analyst Presentation                                                                                                                                        41
A sustainability benchmark in the industry

     “Highest resource                                “Highest standards at all                    “Highest
     efficiency“                                      locations worldwide“                         transparency“
                                    YoY change in %                                              Sustainability reporting since 2012/13
               Revenue                 +3.6%            Environment:   ISO 14001                 Gold recognition from the Responsible
                                                        Safety:        OHSAS 18001               Business Alliance
              Intensities
                                                        Energy:        ISO 50001                 Public conflict minerals reporting (in-line
               CO2 footprint           -5.0%            Quality:       ISO 9001, IATF 16949      with Responsible Minerals Initiative)
               Water consumption       -6.5%                           AS/EN 9100, DS/EN 13485   Public CDP reporting on climate change
               Waste                   -15.8%
                                                                                                 (C score) and water (B- score)

Investor and Analyst Presentation                                                                                                              42
AT&S – First choice for advanced applications

                                                            IR contact
                                                            Gerda Königstorfer
                                                            Tel: +43 3842 200 5925
                                                            Mobile: +43 676 8955 5925
                                                            Fax: +43 3842 200 15909
                                                            g.koenigstorfer@ats.net

                                                            Johannes Mattner
                                                            Tel: +43 3842 200 5450
                                                            Mobile: +43 676 8955 6093
                                                            j.mattner@ats.net

                                                            Fabriksgasse 13,
                                                            8700 Leoben/Austria
                                                            www.ats.net
   Visit: www.ats.net;              @AT&S IR_PR;   AtundS

Investor and Analyst Presentation                                                       43
Disclaimer
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contents are proprietary to AT&S and for information only.
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Investor and Analyst Presentation                                                                                                                                                           44
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