New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
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From Technologies to Market
New technologies
& architectures
for efficient
Data Centers
Sample
© 2015
TABLE OF CONTENTS
Report objectives 5 • Architectures 69
Who should be interested in this report? 6 Traditional
Glossary 8 Modular & containers
DC grid
Executive summary 10
• Technical solutions & breakthroughs 128
• Data Centers 28
Server
Drivers
Memories
Big metrics
UPS
• Limitation & Challenges 41
Silicon Photonics
Power consumption – Energy efficiency issues
Cooling systems
Data & storage challenges
Wide Band Gap
• Supply Chain 62
• Conclusion 170
2
COMPANIES CITED IN THE REPORT
Cisco, Arista Networks, HP, Dell, Vmware, Brocade, Lenovo, Huawei, Extreme Networks, Avaya, Toshiba, EPC, Samsung, SanDisk,
Micron, Sony, SK Hynix,Violin memory, STEC, Tms, Fusion-io, Eaton Corp., Emerson Electric, Schneider Electric, General Electric,
Belkin Industries, Socomec, Newave, Emerson Network Power, Stulz, Uniflair, GEA Group, APC, Air Data, Airedale, RC Group,
Intel, IBM, Luxtera, Mellanox, Molex, SGI, Sun Microsystems, Lampertz, Bull, ActivePower, Verari Forest, Delta, ABB, Digital Really,
QTS Data Centers, Sabey Data Centers, DuPont Fabros, Equinix, NTT, Facebook, Google, Ebay, Amazon, Microsoft, and more!
3
MAIN 4 CHARACTERISTICS
• Requirements on extremely high (24/7) data availability • Huge amounts of data
and security • Increasing need for bandwidth
• Solutions implemented to ensure “ALWAYS-ON state” - uninterrupted
power supply, redundancy - System resilient to failure and enabling rapid • Interconnexions between servers are done
recovery after failure thanks to being at the same physical site
• System protected against human and natural detrimental influence • Data Centers need to be close to big
urban areas
• Very high electricity consumption
• A proximity of a point access to very high • High concentration of heat
electrical power is required
• Multi-sourcing is obligatory for safety reasons • All the concentrated electronics generate huge
amount of heat in a closed space
• Strong trends towards the use of renewable
electricity sources (hydro, PV, wind…) • Large cooling systems have to be installed
• Ways to reduce the consumption are actively
researched
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 4
POWER REQUIREMENTS
Power needed by the IT equipment
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 5
POWER REQUIREMENTS OF A DATA CENTER
In order to feed the IT equipment, more than double of power is needed
• In a traditional Data Center, about
50% of the power consumption is
used for something else than the IT
loads.
Traditional
Data Centers • This means that to supply the IT PUE = 2.5
are equipment with a power of 60 kW, at
considered least 150 kW are required. (For a PUE
extremely of 2.5)
inefficient, as
in many cases
less than half • Virtually, every watt expended in a
server room in terms of processing
of the power power, power supplies, lighting, etc. is
is used for IT turned into heat.
loads
• Thereby, huge amounts of heat have to
be dissipated in a relatively small and
close environment.
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 6
RENEWABLE ENERGY SOURCES
Different alternative power sources
• Several projects have been presented using renewable energies to power their data centers:
Wind-Powered Data Centers: Only a handful of Solar-Powered Data Centers: Emerson Network
companies have implemented wind turbines in Power, i/o Data Centers and AISO are among the
working data centers, but new players have some companies that have implemented on-site solar
ambitious plans in this area. solutions.
In order to
reduce the
electricity bill,
Data Centers
Waste Heat Reclamation: Most data centers are
are already generating an energy source: the heat
incorporating emerging from the back of their server racks.
additional Here’s a look at some facilities that are reusing
this waste heat.
alternative
power
sources Waste heat from servers at the new Telecity Paris data center (left) is
being used to heat an on-site arboretum (right).
Geothermal Data Centers: A number of data
centers in the Midwest (US) are using geothermal
cooling in their data centers.Then there’s Iceland
and its plentiful supply of geothermal energy.
In the US, there is a potential of >2,000 GW on
geothermal energy
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 7
GLOBAL ENERGY CONSUMPTION
Evolution with a decreasing average PUE
-24%
In the case that
by 2019 PUEs
would decrease
considerably, with
averages
between 1.3-1.5,
the global energy
consumption will
stay stable
(below 400TWh)
until 2020
• Each hypothesis fix new PUEs by region from the mentioned years on.
• Each new hypothesis also takes into account the previous hypothesis.
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 8
ENTERPRISE STORAGE SUPPLY CHAIN
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 9
F3 & F4 CLASSES
Multi-sourcing and circuit redundancy are the key features of the safest Data Centers
The two safest topologies – class 3 & class
4 – provides different power source
access connections from the grid (multi-
sourcing).
There are (at least) two completely
independent power circuits, with
component redundancy.
• The F3 class does not have a
complete circuit redundancy as
UPSs are used just in one of the two
independent circuits.
• The F4 topology guarantees that
every critical load is at least supplied
by two independent and equal
distribution circuits.
Class F3
Not UPSs in every
distribution channel – Class F4 Fault Tolerant
Not a complete
redundancy
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 10MARKET SPLIT OF ARCHITECTURES
Which topology is the most widespread?
• F0 and F1 architectures are the most Architecture class split by number of sites
expanded ones: >95%
• However, they represent server closet
and small rooms which we do not
consider as a Data Center.
• The real Data Center split is here below:
• Multi power sourcing,
circuit redundancy • Double power source,
UPS redundancy, but
not circuit redundancy
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 11REDUNDANCY
Redundancy increases the problem of overrating
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 12CONTAINERS
Modular “Plug & Play” solutions
• Rugged, portable and energy efficient containerized datacenters that provide plug & play datacenter
capacity inside an ISO container in a fast and cost effective way.
Huawei:
- Up to 8x45 servers
All-in-one - Up to 60 kW in IT
compact - Row-level air conditioner
horizontal air supply
units - 120kVA UPS
providing a - 320sqft (29.7 m2)
fully
functional IDS1000A-40 container
data center
AST Modular containers:
- Up to 12x42 servers
- Up to 96 kW in power and cooling Schneider Electric acquired
- N+1 redundancy (power & cooling) AST Modular in 2014
- 100kVA UPS
- 320sqft (29.7 m2)
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 13CONTAINER DATA CENTER MANUFACTURERS
2014 market share
AST
Modular was
bought by
Schneider
Electric in Other players are:
the - Sun Microsystems
beginning of - Verari Forest
2014 - Lampertz
- Bull
- ActivePower
- Cisco
- etc.
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 14CONTAINER DATA CENTER MARKET
Market estimation in M$ for the period 2010-2020
• From 2014 on, this market will significantly
increase as many Data Center manufacturers
have seen the interest of using these modular
containers.
CAGR 15-20
• Container based Data Centers +23.2%
had an stable growth in the last
five years.
CAGR 10-14
+11.7%
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 15DC ARCHITECTURE
From AC to DC power distribution in Data Center
A 10% to 20% energy saving on
the overall Data center is
expected by moving to DC
distribution
Redundant
AC distribution: at least 3 sequential power
conversion stages involving a change from AC to
DC or vice versa
DC distribution removes 2 of the 3
Redundant
sequential AC-DC/DC-AC power
conversion stages.
AC is 400 Vrms in Europe and 120 Vrms or 240 Vrms in the US
DC can be 48V, 326V or 380V depending on the region and the power load
POL: point-of-load
VRM: voltage regulation modules
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 16ARCHITECTURE COMPARISON
Design
In the short-mid
time future
Row level DC Facility level DC
distribution distribution
Most
innovative AC solutions
Innovations
concept are
used in Modular AC
installations Increasing systems Facility level DC
for outdoor environmental
installations demonstrators
DC solutions constraints
(higher
power and
less
controlled
architectures
Traditional
environment) Traditional AC
systems
Next coming
architectures
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 17DC EQUIPMENT PLAYERS
• Several Data Center equipment suppliers are working on DC voltage solution, even though there is not a market for it yet.
• Special efforts are done at a reliable 400 V DC breaker that would suit with Data Center safety & reliability requirements.
• So far, 48 VDC and 60VDC breakers are commercially available.
Players involved in the development of DC solutions:
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 18FOCUS ON MEMORIES
Introduction of the typical memory types in data centers
Working memory
Non-volatile DRAM
memories
stock data even
if they are not Speed > $1/Gb
supplied by
electricity. Gb capacity
Volatile
memories are
erase without
electricity
supply.
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 19RRAM CHIP MAXIMUM DENSITY ROADMAP
Stand-alone devices
RRAM
Chip Maximum High density
density
for
10 T b enterprise
Yole Développement © January 2015
storage
1T b 3D NAND NAND
Transition
RRAM will NAND
start being 100 Gb substitution in
Micron/sony
used in data 16 Gb
data centers
centers from
2015 on as 10 Gb
Storage Class Memory SCM Attacking the
Memory enterprise storage data storage RRAM
Low
(SCM) 1 Gb
applications application density for
wearable &
Adesto industrial
100 Mb 64 Mb
Year of
commercial
sample
availability
10 Mb
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 20EMERGING NVM MARKET FORECAST
By application from 2014–2020 (in $M)
CAGR 2014-2020
118%
CAGR 2014-2020
CAGR 2014-2020 118%
118%
85%
154%
85%
35%
85%
154%
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 21
154%
35%UPS MARKET
>200kVA UPS market dedicated to data centers
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 22DATA CENTRE NETWORKING
Where optics is cool!
Router ASIC with integrated optics Hybrid optical/electrical switching (UCSD)
(Compass-EOS) OOO routers (Calient)
Just a few
examples of
photonic
solutions
that will Active Optic interconnect
reduce Si photonics and closer integration
AOC (Finisar) (TE Connectivity)
power. (Luxtera)
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 23WHY SiC & GaN ADDED VALUE?
Intrinsic High Junction
properties High electron mobility
Temperature
Impact on No recovery time
operation during switching
High electron
mobility and
high junction Impact on Low losses High switching
temperature power module
are the key
less energy to dissipate frequency
intrinsic
characteristics.
Fewer cooling Smaller filters
needs and passives
Impact on
power system
System size and
weight
reduction
©2015 | www.yole.fr | New technologies & architectures for efficient data centers 24Market & Technology Report
Data Center Technologies
New Technologies and Architectures for Efficient
Data Centers
An analysis of the trends, market, and opportunities for the next
generation of data centers, including new architectures and technologies.
KEY FEATURES OF THE REPORT Ever-increasing internet traffic and the video streaming
•D escription of data centers’ boom will encourage large data center investments in the
global energy consumption coming years
from 2010 - 2020
• The impact of data center Last year, around $143B was invested worldwide than 20% in 2014 to almost 35% by 2020.
challenges on power for new data center projects. Large internet Our regional split shows that North America
electronics equipment, UPS, companies like Amazon, Facebook, and Google (particularly the US) has the biggest share of
and cooling systems are leading the investment in next-generation the server market, at 34%/$3.5B. Europe,
• Analyses of new architectures “green” data centers. There is a trend towards however, leads the UPS equipment and cooling
such as Alternative Current building larger data centers, consolidating systems markets for data centers. In fact,
(AC) modular, containers, and densifying server concentration for the Europe’s large UPS (>100kVA) market was
and DC grid sites which require more efficient buildings. estimated at $931M in 2014. In this report, Yole
• Description of new data center
Consequently, the blade server market for Développement presents market forecasts for
technologies, i.e. photonic,
data centers will display a 2015 - 2020 CAGR 2010 - 2020, regional splits, and players’ market
emerging NVM, and WBG
of +10.8%, while the entire server market will share for servers, UPS, and cooling systems.
• Market metrics by technology,
including regional split, 2010 - increase by 2.3%. Global server market share Also, each technology’s technical evolution will
2020 forecast, market share, for data centers will increase from slightly lower be presented.
and more
• Supply chain overview, Optimizing modern data centers’ energy consumption is a key
including players’ market share challenge. Also, technical solutions are required for
by market
storage aspects and data flow limitations
REPORT OUTLINE
Data centers are huge electricity users, highly-efficient data centers, with PUEs close
•N ew Technologies and
representing around 1.62% of the world’s to 1.1. In order to address the urgency for
Architectures for Efficient Data
consumed energy in 2014. Yole Développement reduced energy consumption, manufacturers
Centers
•P DF & Excel file analyses several possible scenarios for the are emphasizing improved efficiency of the
•€ 5,990 – Multi user license evolution of data centers’ energy consumption. architectural design, the equipment, the
(170+ slides) In the actual scenario, with an average Power cooling system, and more. Yole Développement
•€ 4,990 – One user license Usage Efficiency (PUE) of 1.8, worldwide data report describes some of the more efficient
(170+ slides) center energy consumption will reach 507.9 TWh modern data center architectures (modular
• J uly 2015 by 2020. In our hypothetical scenarios, there’s Alternative Current (AC) and Direct Current
•1 70+ slides a possibility for achieving a 12.4% decrease (DC) grid), as well as some upcoming
of this number by implementing some new technologies, i.e. silicon photonics and WBG
Related reports materials that could reduce energy
technologies. Examples from Google, Microsoft,
• Status of Power Electronics
and Facebook show that it is possible to build consumption.
Industry
• Silicon Photonics
With no slowdown in new facility construction, data centers worldwide
• Power GaN Market
will have an increasing need for power
• Energy Management for Smart
Grid, Cities and Buildings 70
• Technologies & Sensors for the
Internet of Things: Businesses 60
& Market Trends 2014 - 2024
50
Find all our reports CAGR 2015-2020
on www.i-micronews.com 40 MEA 10.6%
GW
Latin America 11.2%
30
Asia Pacific 6.8%
Europe 4.2%
20
North America 5.8%
10
0
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
(Yole Développement, July 2015)New Technologies and Architectures for Efficient Data Centers
TRADITIONALLy RIGID AC ARChITECTURES ARE EVOLVING TOwARDS
FLEXIbLE, mODULAR SOLUTIONS. wILL DC GRID bE A SOLUTION FOR
DATA CENTERS?
Tr a d i t i o n a l d a t a c e n t e r s a r e n’ t a b l e t o and distribution sub-networks can be activated/
enlarge their IT equipment, since the power deactivated for improved efficiency. Moreover,
architecture and the centralized cooling system virtualization and server resource management
were designed for rated power. such designs systems eliminate unnecessary power waste.
can’t be modified either, and more importantly,
they present many inefficiencies when servers Yole Développement has also identified a smaller,
work in “low load” mode. Modularity brings a high-potential parallel market consisting of
fresh approach to data center design, enabling “container data centers”. These containers are
the incorporation of additional servers when rugged, portable, energy-efficient plug & play
needed. Also, the power and cooling systems solutions that have enjoyed rising sales over the
are better optimized, since equipment modules last few years. HP leads this new market, which
will enjoy a 23.2% CAGR from 2015 – 2020,
with Huawei following closely behind.
Over the next few years, the container data center market
will enjoy impressive growth Other solutions exist to minimize distribution
chain power loss, such as DC grid data centers.
Thanks to a simplified architecture and fewer
From 2014 on, this market will significantly
increase as many Data Center conversion steps, losses can be reduced by
manufacturers have seen the interest of
using these modular containers. 20%. Players like ABB, NTT, and Huawei have
several DC grid data center demonstrators
CAGR 2015-2020 that use a 380VDC distribution voltage. The
Container based Data Centers +23.2%
had an stable growth in the main barrier for this new architecture is the
last five years.
lack of appropriate DC components, especially
400VDC safety breakers. This report contains
a detailed analysis of who is doing what, and
how DC architecture helps reduce energy
consumption.
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
(Yole Développement, July 2015)
NEw TEChNOLOGIES LIkE SILICON phOTONICS ARE EmERGING TO
RELIEVE TRAFFIC CONGESTION ON DATA TRANSmISSION LINES
In future data centers, photonics is generally
Roadmap of the data center technologies and architectures perceived as a technical solution that will
handle the increasing bandwidth up to 100Gb/s
DC safety breakers
and beyond. But one of photonics’ intrinsic
SiC based UPS
• 400 VFC
• xxx
advantages is power-saving, which is a huge plus
• xxx • xxx
for interconnects that account for a significant
• xxx 20xx
SSD memory widely
deployed
part of power consumption. For example, with a
2015
• xxx 2018
GaN / SiC equipment 10Gb/s link, a copper interconnect will consume
• xxx
gies • xxx
nolo volution 10W, while silicon photonics or VCsELs solutions
Tech
• xxx • xxx
20xx e Silicon Photonics
ment
Equip • xxx
• xxx will consume 0.2W. This equates to a cost
• xxx
reduction from $3500/year for copper to $70/
2010
2025 year for photonics. In our report we review the
Architectures
Design evolution status of the emerging silicon photonics solution
20xx
DC grid demonstrator 2014 DC grid data for data centers, and also cite other “cool” optical
centers
2006
facilities
• xxx • xxx solutions like all-optical switches, direct photonic
• xxx
• xxx • xxx
Containerized
• xxx
• xxx links, and active optic interconnect. All of these
data centers
• xxx solutions contribute to lower power consumption.
• xxx
• xxx Other technologies such as emerging NVM (non-
volatile memory) and WBG (wide-band gap)
xxx: All details in the report
devices are analyzed too.
(Yole Développement, July 2015)Market & Technology Report
OBJECTIVES OF THE REPORT
• Understand the current challenges and limitations of data centers
• Provide a clear overview of data centers’ related market values
• Reveal the next generation of data center architecture
• Understand the main technology and market trends
• Explain some of the key technologies with a deeper analysis
• Identify players’ supply chain position
COMPANIES CITED IN THE REPORT (non exhaustive list)
Cisco, Arista Networks, HP, Dell, Vmware, Brocade, Lenovo, Huawei, Extreme Networks, Avaya,
Toshiba, EPC, Samsung, SanDisk, Micron, Sony, SK Hynix, Violin memory, STEC, Tms, Fusion-io,
Eaton Corp., Emerson Electric, Schneider Electric, General Electric, Belkin Industries,
Socomec, Newave, Emerson Network Power, Stulz, Uniflair, GEA Group, APC, Air Data,
Airedale, RC Group, Intel, IBM, Luxtera, Mellanox, Molex, SGI, Sun Microsystems, Lampertz,
Bull, ActivePower, Verari Forest, Delta, ABB, Digital Really, QTS Data Centers, Sabey Data
Centers, DuPont Fabros, Equinix, NTT, Facebook, Google, Ebay, Amazon, Microsoft, and more!
TABLE OF CONTENTS
• Report objectives 5
• Who should be interested in this report? 6
• Glossary 8
• Executive summary 10
• Data centers 28
> Drivers
> Big metrics
• Limitation & challenges 41
> Power consumption – Energy efficiency issues
> Data & storage challenges
• Supply chain 62
• Architectures 69
> Traditional
> Modular & containers
> DC grid
•T
echnical solutions & breakthroughs 128
> Server
> Memory
> UPS
> Photonics
> Cooling systems
> Wide Band Gaps
• Conclusion 170
AUTHORS
Mattin Grao Txapartegi is a Power Dr. Eric Mounier, MEMS & Sensors Senior Analyst. With almost 20 years of experience in
Electronics Analyst at Yole Développement. MEMS & Sensors applications, markets and technologies analysis, Dr Eric Mounier provides
He graduated from Grenoble INP with a very deep insight to the industry about the current and future trends for MEMS. At Yole
an Engineering degree in Electrical Développement, Dr. Eric Mounier is in charge of MEMS & Sensors, but also covers printed
Systems, followed by a specialization in electronics and future disruptive technologies such as photonics. He has contributed
embedded systems for transportation. to more than 150 marketing & technological analysis and 60 reports in these topics,
He then earned an advanced master’s contributing the MEMS industry moving forward. He has created and has been editor-inchief
degree in Aeronautics Engineering from of numerous media dedicated to the MEMS and Sensors industry. He is a co-founder of Yole
Arts et Métiers ParisTech. During this and previously worked at CEA LETI R&D lab in Grenoble, France in marketing dept. Eric is
time, he oversaw managerial, financial, also an expert at the OMNT (˝Observatoire des Micro & Nanotechnologies˝) for Materials
and marketing fields within the and devices for photonics. Eric has a PhD in microelectronics from the INPG in Grenoble,
aeronautics industry. after studying at Brighton University and MacGill in Montreal.ORDER FORM
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get a discount that can vary from 15% to 10%.
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to Yole Développement, credit card or by electronic transfer to
included. not use the Product for purposes such as:
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agreement. If the Buyer fails to pay within this time and fails
files. has sent the Products and shall personally take care of any
to contact the Seller, the latter shall be entitled to invoice
related proceedings, and the Buyer shall bear related financial
“Seller”: Based in Lyon (France headquarters), Yole interest in arrears based on the annual rate Refi of the «BCE»
consequences in their entirety.
Développement is a market research and business development + 7 points, in accordance with article L. 441-6 of the French
6.4 T
he Buyer shall define within its company point of contact for
consultancy company, facilitating market access for advanced Commercial Code. Our publications (report, database, tool...)
the needs of the contract. This person will be the recipient
technology industrial projects. With more than 20 market are delivered only after reception of the payment.
of each new report in PDF format. This person shall also be
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responsible for respect of the copyrights and will guaranty that
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the Products are not disseminated out of the company.
and technology trends. the stage in progress, and to take legal action for damages.
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AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY business activities, shall be solely responsible for choosing the passwords. The Seller reserves the right to check from time to
THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE Products and for the use and interpretations he makes of the time the correct use of this password.
SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE documents it purchases, of the results he obtains, and of the 6.6
In the case of a multisite, multi license, only the employee
MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY advice and acts it deduces thereof. of the buyer can access the report or the employee of the
ON THE SELLER. 4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable companies in which the buyer have 100% shares. As a matter
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these purposes, the Buyer accepts these conditions of sales a) damages of any kind, including without limitation, incidental
when signing the purchase order which mentions “I hereby or consequential damages (including, but not limited to, 7. Termination
accept Yole’s Terms and Conditions of Sale”. This results in damages for loss of profits, business interruption and loss of 7.1 I f the Buyer cancels the order in whole or in part or postpones
acceptance by the Buyer. programs or information) arising out of the use of or inability the date of mailing, the Buyer shall indemnify the Seller for
1.3 O rders are deemed to be accepted only upon written to use the Seller’s website or the Products, or any information the entire costs that have been incurred as at the date of
acceptance and confirmation by the Seller, within [7 days] provided on the website, or in the Products; notification by the Buyer of such delay or cancellation. This
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orders shall be deemed to have been accepted. 4.4 All the information contained in the Products has been 7.2 In the event of breach by one Party under these conditions
2. Mailing of the Products obtained from sources believed to be reliable. The Seller does
or the order, the non-breaching Party may send a notification
2.1 P
roducts are sent by email to the Buyer: not warrant the accuracy, completeness adequacy or reliability
to the other by recorded delivery letter upon which, after a
• within [1] month from the order for Products already released; of such information, which cannot be guaranteed to be free
period of thirty (30) days without solving the problem, the non-
or from errors.
breaching Party shall be entitled to terminate all the pending
• within a reasonable time for Products ordered prior to their 4.5 All the Products that the Seller sells may, upon prior notice
orders, without being liable for any compensation.
effective release. In this case, the Seller shall use its best to the Buyer from time to time be modified by or substituted
endeavours to inform the Buyer of an indicative release date with similar Products meeting the needs of the Buyer. This 8. Miscellaneous
and the evolution of the work in progress. modification shall not lead to the liability of the Seller, provided All the provisions of these Terms and Conditions are for the benefit
2.2 Some weeks prior to the release date the Seller can propose a that the Seller ensures the substituted Product is similar to the of the Seller itself, but also for its licensors, employees and agents.
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respect of article 2.2 above, and including incases where a the Products contain defects, the Seller undertakes to replace Any notices under these Terms and Conditions shall be given in
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the data in order to enable the Seller to deliver a high quality delays, loss caused or any other reason. The replacement is Conditions and the Buyer, is deemed to have accepted the latest
Products. guaranteed for a maximum of two months starting from the version of these terms and conditions, provided they have been
2.3 The mailing of the Product will occur only upon payment delivery date. Any replacement is excluded for any event as communicated to him in due time.
by the Buyer, in accordance with the conditions contained set out in article 5 below.
in article 3. 4.7 The deadlines that the Seller is asked to state for the mailing 9. Governing law and jurisdiction
2.4. The mailing is operated through electronic means either by of the Products are given for information only and are not 9.1 Any dispute arising out or linked to these Terms and Conditions
email via the sales department or automatically online via an guaranteed. If such deadlines are not met, it shall not lead or to any contract (orders) entered into in application of
email/password. If the Product’s electronic delivery format to any damages or cancellation of the orders, except for non these Terms and Conditions shall be settled by the French
is defective, the Seller undertakes to replace it at no charge acceptable delays exceeding [4] months from the stated Commercial Courts of Lyon, which shall have exclusive
to the Buyer provided that it is informed of the defective deadline, without information from the Seller. In such case jurisdiction upon such issues.
formatting within 90 days from the date of the original only, the Buyer shall be entitled to ask for a reimbursement of 9.2 French law shall govern the relation between the Buyer and the
download or receipt of the Product. its first down payment to the exclusion of any further damages. Seller, in accordance with these Terms and Conditions.Yole Développement
From Technologies to Market
© 2015FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
Imaging Photonics
MEMS &
Sensors MedTech
Compound
Semi.
Manufacturing
LED / OLED
Power Advanced
Electronics Packaging
PV
264 BUSINESS MODELS
o Consulting and Analysis o Financial services
• Market data & research, marketing analysis • M&A (buying and selling)
• Technology analysis • Due diligence
• Strategy consulting • Fundraising
• Reverse engineering & costing • Maturation of companies
• Patent analysis • IP portfolio management & optimization
www.yole.fr www.yolefinance.com
Blu Morpho
o Reports o Media
• Market & Technology reports • i-Micronews.com website
• Patent Investigation and patent infringement risk • @Micronews e-newsletter
analysis • Technology magazines
• Teardowns & Reverse Costing Analysis • Communication & webcast services
• Cost Simulation Tool • Events
www.i-Micronews.com/reports www.i-Micronews.com
27A GROUP OF COMPANIES
M&A operations
Due diligences
www.yolefinance.com
Fundraising
Maturation of companies
Blu Morpho IP portfolio management & optimization
Market, TBA
technology and
strategy Manufacturing costs analysis
Teardown and reverse engineering
consulting
Cost simulation tools
www.systemplus.fr
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
28OUR GLOBAL ACTIVITY
Blu Morpho
Yole
Korea Yole Inc.
Yole Japan
40% of our business is in 30% of our business is in 30% of our business is in
EU countries Asia North America
29RESEARCH PRODUCTS - CONTENT COMPARISON
Breadth of the analysis
Standard Reports
Workshops
Depth of the analysis
Custom
Analysis
Custom analysis scope is defined with
you to meet your information and
budget needs
30SERVING THE ENTIRE SUPPLY CHAIN
Integrators and
end-users
Device
Our analysts
makers
provide market
analysis,
technology
evaluation, and
business plan Suppliers: material,
along the equipment, OSAT,
entire supply foundries…
chain
Financial investors,
R&D centers
31SERVING MULTIPLE INDUSTRIAL FIELDS
Industrial and Medical
• We are defense systems
working
accross
multiples
industries to
understand the
impact of Energy Automotive
More-than-
Moore
technologies
from device to
system
Mobile phone
Transportation and consumer
makers electronics
From A to Z…
32REPORTS COLLECTION
o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
• MEMS & Sensors
• Imaging
• Medical technologies (MedTech)
• Advanced packaging
• Power electronics
• Compound semiconductors
• OLED, LED & Laser diode
• Semiconductor Manufacturing
• Photovoltaics
• Batteries
o Our reports are unmatched in quality and technology depth and typically include:
• Technology trends and evolution: costs, barriers, roadmaps, etc.
• Supply & value chain analysis: business models, relationships, value flows, etc.
• In-depth analysis of applications and market drivers: challenges, inflection points, etc.
• Market data ($, units, wafer starts, etc.)
www.i-Micronews.com
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +60 reports.
o Take the full benefit from our Bundle and Annual Subscription offers.
33OUR 2015 REPORTS PLANNING
MARKET & TECHNOLOGY REPORTS by Yole Développement o LED
− LED Module
o MEMS & SENSORS − OLED for Lighting
− Sensors and Data Management for Autonomous Vehicles − UV LED
− AlN Thin Film Markets And Applications − LED Phosphors Market
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry o POWER ELECTRONICS
− Uncooled IR Imagers − Power Packaging
− IR Detectors − Thermal Management for LED and Power
− High End Gyro, Accelerometers and IMU − Power Electronics for Renewable Energy
− Non-Volatile Memory − Energy Management For Smart Grid And Smart Cities
− Status of Chinese Power Electronics Industry
o IMAGING & OPTOELECTRONICS − New Technologies For Data Center
− Camera Module Packaging (Vol 1 : Market & Technology Trends / Vol 2 Teardowns & − Inverter Market Trends For 2013 – 2020 And Major Technology Changes*
Reverse Engineering) − IGBT Markets And Application Trends
− Uncooled IR Imagers − Power Electronics for HEV/EV*
− Wafer Level Optics − Status of Power Electronics Industry
− Status of the CMOS Image Sensors
− Machine Vision o ADVANCED PACKAGING
− Advanced Packaging in Emerging Markets in China
o MEDTECH − Status of the Advanced Packaging Industry
− Microfluidic for Sample Preparation − Supply Chain Readiness for Panel Manufacturing in Packaging
− Microfluidic Applications − WLCSP*
− Sensors for Wearable Electronics And Mobile Healthcare − Flip Chip Business Update
− 2.5D & 3DIC Business Update
o COMPOUND SEMICONDUCTORS − Fan-Out and Embedded Business Update
− High Purity Alumina (HPA)
− Sapphire o MANUFACTURING
− Wide Bandgap Materials For Power Electronics: SiC, GaN (and also Ga2O3, AlN, − Lithography for MEMS, Advanced Packaging and LED
Diamond, Graphene… as a trend) − Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS
Image Sensors
* Reports to be decided within 2015 − Non-Volatile Memory
34OUR 2015 REPORTS PLANNING
PATENT ANALYSIS by Knowmade
o Patent Infringement (crossed analysis based on Knowmade and System Plus Analysis expertise)
− MEMS Microphone Applications
− Infrared Imaging
o Patent Investigation (crossed analysis based on Knowmade & Yole Développement expertise)
− Power GaN
− MEMS Gyroscope
− 6-axis & 9-axis Inertial MEMS IMUs
− Microbatteries
− Embedded Active & Passive Packages
− Interposer
− Phosphors for LED
TEARDOWN & REVERSE COSTING by System Plus Consulting
More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2015.
* Reports to be decided within 2015
35OUR 2014 PUBLISHED REPORTS LIST
MARKET & TECHNOLOGY REPORTS − LED Packaging
− LED Front-End Manufacturing Trends
by Yole Développement
− LED Front-End Equipment Market
o MEMS & SENSORS
o POWER ELECTRONICS
− Technologies & Sensors for the Internet of Things: Businesses & Market Trends 2014-2024
− Power Electronics for HEV/EV
− MEMS Microphone: Market, Applications and Business Trends 2014
− Inverters
− Status of the MEMS industry
− Gate Driver Unit Market for Power Transistors
− MEMS & Sensors for Mobile Phones and Tablets
− High End Gyroscopes and Accelerometer Applications
o PHOTOVOLTAICS
− Inertial MEMS Manufacturing Technical Trends
− Emerging and Innovative Technology Approaches in the Solar Industry
− New Detection Principles & Technical Evolution for MEMS & NEMS
− 6/9 DOF Applications in Consumer Electronics
o ADVANCED PACKAGING
− 3DIC Equipment and Materials
o IMAGING & OPTOELECTRONICS
− 3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
− Status of the CMOS Image Sensor Industry
− Uncooled Infrared Imaging Technology & Market Trends
o MANUFACTURING
− Silicon Photonics
− Market & Technology Trends in Materials & Equipment for Printed & Flexible Electronics
− Permanent Wafer Bonding for Semiconductor: Application Trends & Technology
o MEDTECH
− Point of Care Testing: Applications for Microfluidic Technologies
− Solid State Medical Imaging: X-ray and Endoscopy PATENT ANALYSIS
by Knowmade
o COMPOUND SEMICONDUCTORS − LED Based on Nano-wires Patent Investigation
− RF GaN Technology & Market Analysis: Applications, Players, Devices & Substrates 2010- − GaN on Si Patent Investigation (LED, Power devices and RF Devices)
2020 − New MEMS Devices Patent Investigation
− SiC Modules, Devices and Substrates for Power Electronics Market − Non Volatile Memory Patent Investigation
− GaN-on-Si Substrate Technology and Market for LED and Power Electronics
− Power GaN Market TEARDOWN & REVERSE COSTING
− Graphene Materials for Opto & Electronic Applications
− Sapphire Applications and Market: from LED to Consumer Electronics
by System Plus Consulting
More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2014.
o LED
36MICRONEWS MEDIA
o About Micronews Media
Micronews Media, powered by Yole
Développement, ensures you the best visibility
in the disruptive semiconductor community. Focused
With our services, we help you to reach your community
customers worldwide with the media products
they prefer, including our website, e-newsletter,
webcasts, and magazines. Invest in a high added-
value editorial program and get access to Yole
Développement’s network (48 000+ contacts).
o Five supports and channels for your visibility
• A technology magazine to highlight
your visibility with advertisements,
company profiles, product descriptions and
white papers Large
community
• A webcast to highlight your expertise and
develop your business identifying Identified
commercial leads Mass contacts
contacts
• Articles, advertisements & logo and
banners dedicated to your company, its
products and expertise in @Micronews e-
newsletter and on i-Micronews.com
37COMMUNICATION SERVICES
All services listed below are available on–demand.
o i-Micronews.com, the website
Slider – Banners (on English or Japanese websites) – Articles –
Logo and profile as sponsor
o @Micronews, the e-newsletter
Headline article - Tiles
o Custom webcast
Develop your dedicated event with a high added-value program. A
turnkey event with Yole support (logistics, promotion, data…)
o Technology Magazines: Custom – Co-produced
Increase your visibility through a dedicated technology magazine
with ads, company profile, product descriptions and white papers.
It can be a custom magazine: your company is the only one to
benefit from it – or a co-produced one: up to 2 companies.
Contacts:
Camille Veyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr),
Media & Communication Coordinators.
38CONTACT INFORMATION
o Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr
• Japan:Yutaka Katano, General Manager,Yole Japan & President, Yole K.K.
Email: katano@yole.fr
• RoW: Jean-Christophe Eloy, President & CEO, Yole Développement
Email: eloy@yole.fr
o Report business
• North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
• Japan & Asia: Takashi Onozawa, Sales Asia & General Manager,Yole K.K.
Email: onozawa@yole.fr
• Korea: Hailey Yang, Business Development Manager, Korean Office
Email: yang@yole.fr
o Financial services
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
Follow us on
o General
• Email: info@yole.fr
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