New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement

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New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
From Technologies to Market

New technologies
 & architectures
   for efficient
  Data Centers

                                     Sample
                                           © 2015
New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
TABLE OF CONTENTS

   Report objectives                                   5    • Architectures                         69
   Who should be interested in this report?            6        Traditional

   Glossary                                            8        Modular & containers
                                                                DC grid
   Executive summary                                   10
                                                            • Technical solutions & breakthroughs   128
   • Data Centers                                      28
                                                                Server
        Drivers
                                                                Memories
        Big metrics
                                                                UPS
   • Limitation & Challenges                           41
                                                                Silicon Photonics
        Power consumption – Energy efficiency issues
                                                                Cooling systems
        Data & storage challenges
                                                                Wide Band Gap
   • Supply Chain                                      62
                                                            • Conclusion                            170

                                                                                                          2
New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
COMPANIES CITED IN THE REPORT

   Cisco, Arista Networks, HP, Dell, Vmware, Brocade, Lenovo, Huawei, Extreme Networks, Avaya, Toshiba, EPC, Samsung, SanDisk,
   Micron, Sony, SK Hynix,Violin memory, STEC, Tms, Fusion-io, Eaton Corp., Emerson Electric, Schneider Electric, General Electric,
    Belkin Industries, Socomec, Newave, Emerson Network Power, Stulz, Uniflair, GEA Group, APC, Air Data, Airedale, RC Group,
   Intel, IBM, Luxtera, Mellanox, Molex, SGI, Sun Microsystems, Lampertz, Bull, ActivePower, Verari Forest, Delta, ABB, Digital Really,
    QTS Data Centers, Sabey Data Centers, DuPont Fabros, Equinix, NTT, Facebook, Google, Ebay, Amazon, Microsoft, and more!

                                                                                                                                          3
New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
MAIN 4 CHARACTERISTICS
      • Requirements on extremely high (24/7) data availability                                       • Huge amounts of data
        and security                                                                                            •     Increasing need for bandwidth
          •   Solutions implemented to ensure “ALWAYS-ON state” - uninterrupted
              power supply, redundancy - System resilient to failure and enabling rapid                         •     Interconnexions between servers are done
              recovery after failure                                                                                  thanks to being at the same physical site

          •   System protected against human and natural detrimental influence                                  •     Data Centers need to be close to big
                                                                                                                      urban areas

        • Very high electricity consumption
              •   A proximity of a point access to very high                              • High concentration of heat
                  electrical power is required
              •   Multi-sourcing is obligatory for safety reasons                              •    All the concentrated electronics generate huge
                                                                                                    amount of heat in a closed space
              •   Strong trends towards the use of renewable
                  electricity sources (hydro, PV, wind…)                                       •    Large cooling systems have to be installed
              •   Ways to reduce the consumption are actively
                  researched
                                                                                             ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   4
New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
POWER REQUIREMENTS
   Power needed by the IT equipment

                                      ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   5
New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
POWER REQUIREMENTS OF A DATA CENTER
     In order to feed the IT equipment, more than double of power is needed

                  • In a traditional Data Center, about
                    50% of the power consumption is
                    used for something else than the IT
                    loads.
Traditional
Data Centers      • This means that to supply the IT                                                                       PUE = 2.5
are                 equipment with a power of 60 kW, at
considered          least 150 kW are required. (For a PUE
extremely           of 2.5)
inefficient, as
in many cases
less than half    • Virtually, every watt expended in a
                    server room in terms of processing
of the power        power, power supplies, lighting, etc. is
is used for IT      turned into heat.
loads
                  • Thereby, huge amounts of heat have to
                    be dissipated in a relatively small and
                    close environment.

                                                               ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   6
New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
RENEWABLE ENERGY SOURCES
      Different alternative power sources

                    • Several projects have been presented using renewable energies to power their data centers:

                       Wind-Powered Data Centers: Only a handful of                                                     Solar-Powered Data Centers: Emerson Network
                       companies have implemented wind turbines in                                                      Power, i/o Data Centers and AISO are among the
                       working data centers, but new players have some                                                  companies that have implemented on-site solar
                       ambitious plans in this area.                                                                    solutions.
In order to
reduce the
electricity bill,
Data Centers
                                                                         Waste Heat Reclamation: Most data centers are
are                                                                      already generating an energy source: the heat
incorporating                                                            emerging from the back of their server racks.
additional                                                               Here’s a look at some facilities that are reusing
                                                                         this waste heat.
alternative
power
sources                                                                                                                               Waste heat from servers at the new Telecity Paris data center (left) is
                                                                                                                                               being used to heat an on-site arboretum (right).

                                                                                           Geothermal Data Centers: A number of data
                                                                                           centers in the Midwest (US) are using geothermal
                                                                                           cooling in their data centers.Then there’s Iceland
                                                                                           and its plentiful supply of geothermal energy.

                                                                                           In the US, there is a potential of >2,000 GW on
                                                                                           geothermal energy

                                                                                                                  ©2015 | www.yole.fr | New technologies & architectures for efficient data centers             7
New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
GLOBAL ENERGY CONSUMPTION
      Evolution with a decreasing average PUE

                                                                                                             -24%
In the case that
by 2019 PUEs
would decrease
considerably, with
averages
between 1.3-1.5,
the global energy
consumption will
stay stable
(below 400TWh)
until 2020

                     •   Each hypothesis fix new PUEs by region from the mentioned years on.
                     •   Each new hypothesis also takes into account the previous hypothesis.

                                                                                                ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   8
New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
ENTERPRISE STORAGE SUPPLY CHAIN

                                  ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   9
New technologies & architectures for efficient Data Centers - From Technologies to Market - Yole Développement
F3 & F4 CLASSES
    Multi-sourcing and circuit redundancy are the key features of the safest Data Centers
              The two safest topologies – class 3 & class
              4 – provides different power source
              access connections from the grid (multi-
              sourcing).
               There are (at least) two completely
              independent power circuits, with
              component redundancy.

               •   The F3 class does not have a
                   complete circuit redundancy as
                   UPSs are used just in one of the two
                   independent circuits.
               •   The F4 topology guarantees that
                   every critical load is at least supplied
                   by two independent and equal
                   distribution circuits.

                                                                  Class F3
                                                                Not UPSs in every
                                                              distribution channel –   Class F4 Fault Tolerant
                                                                  Not a complete
                                                                    redundancy

                                                                                            ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   10
MARKET SPLIT OF ARCHITECTURES
   Which topology is the most widespread?

            • F0 and F1 architectures are the most                               Architecture class split by number of sites
              expanded ones: >95%
            • However, they represent server closet
              and small rooms which we do not
              consider as a Data Center.

                • The real Data Center split is here below:

          • Multi power sourcing,
            circuit redundancy                                • Double power source,
                                                                UPS redundancy, but
                                                                not circuit redundancy

                                                                                            ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   11
REDUNDANCY
   Redundancy increases the problem of overrating

                                                    ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   12
CONTAINERS
     Modular “Plug & Play” solutions
              • Rugged, portable and energy efficient containerized datacenters that provide plug & play datacenter
                capacity inside an ISO container in a fast and cost effective way.

                                                       Huawei:
                                                       -   Up to 8x45 servers
All-in-one                                             -   Up to 60 kW in IT
compact                                                -   Row-level air conditioner
                                                           horizontal air supply
units                                                  -   120kVA UPS
providing a                                            -   320sqft (29.7 m2)
fully
functional                                                                                                      IDS1000A-40 container
data center
                AST Modular containers:
                -   Up to 12x42 servers
                -   Up to 96 kW in power and cooling                                                                  Schneider Electric acquired
                -   N+1 redundancy (power & cooling)                                                                     AST Modular in 2014
                -   100kVA UPS
                -   320sqft (29.7 m2)

                                                                                       ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   13
CONTAINER DATA CENTER MANUFACTURERS
     2014 market share

AST
Modular was
bought by
Schneider
Electric in                                                           Other players are:
the                                                           -      Sun Microsystems
beginning of                                                  -      Verari Forest
2014                                                          -      Lampertz
                                                              -      Bull
                                                              -      ActivePower
                                                              -      Cisco
                                                              -      etc.

                                        ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   14
CONTAINER DATA CENTER MARKET
   Market estimation in M$ for the period 2010-2020

                                             • From 2014 on, this market will significantly
                                               increase as many Data Center manufacturers
                                               have seen the interest of using these modular
                                               containers.

                                                                                           CAGR 15-20
                            • Container based Data Centers                                   +23.2%
                              had an stable growth in the last
                              five years.

                                        CAGR 10-14
                                          +11.7%

                                                                                    ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   15
DC ARCHITECTURE
    From AC to DC power distribution in Data Center

                                                                                                              A 10% to 20% energy saving on
                                                                                                                  the overall Data center is
                                                                                                                 expected by moving to DC
                                                                                                                                distribution

                                                          Redundant

                          AC distribution: at least 3 sequential power
                          conversion stages involving a change from AC to
                          DC or vice versa

                                             DC distribution removes 2 of the 3
                                                                                                Redundant
                                             sequential AC-DC/DC-AC power
                                             conversion stages.
             AC is 400 Vrms in Europe and 120 Vrms or 240 Vrms in the US
             DC can be 48V, 326V or 380V depending on the region and the power load
             POL: point-of-load
             VRM: voltage regulation modules

                                                                                      ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   16
ARCHITECTURE COMPARISON
      Design

                                                                                                                                          In the short-mid
                                                                                                                                             time future
                                                                                  Row level DC                             Facility level DC
                                                                                   distribution                              distribution
     Most
  innovative     AC solutions

                                      Innovations
 concept are
    used in                                                          Modular AC
 installations                                        Increasing      systems                                               Facility level DC
 for outdoor                                        environmental
 installations                                                                                                               demonstrators
                 DC solutions                        constraints
    (higher
  power and
      less
  controlled
                                 architectures
                                 Traditional

environment)                                        Traditional AC
                                                       systems
                 Next coming
                 architectures

                                                                                     ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   17
DC EQUIPMENT PLAYERS
        • Several Data Center equipment suppliers are working on DC voltage solution, even though there is not a market for it yet.
        • Special efforts are done at a reliable 400 V DC breaker that would suit with Data Center safety & reliability requirements.
              •   So far, 48 VDC and 60VDC breakers are commercially available.

                                    Players involved in the development of DC solutions:

                                                                                            ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   18
FOCUS ON MEMORIES
     Introduction of the typical memory types in data centers

                                                                     Working memory

Non-volatile                                                                   DRAM
memories
stock data even
if they are not                                  Speed                          > $1/Gb
supplied by
electricity.                                   Gb capacity
Volatile
memories are
erase without
electricity
supply.

                                                                ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   19
RRAM CHIP MAXIMUM DENSITY ROADMAP
     Stand-alone devices
                                                                                                                                                                     RRAM
                 Chip Maximum                                                                                                                                     High density
                     density
                                                                                                                                                                      for
                   10 T b                                                                                                                                          enterprise
                                Yole Développement © January 2015
                                                                                                                                                                    storage

                    1T b                      3D NAND                                                                                                               NAND
                                              Transition
RRAM will                                                                                                                                 NAND
start being        100 Gb                                                                                                              substitution in
                                                                    Micron/sony
used in data                                                           16 Gb
                                                                                                                                        data centers
centers from
2015 on as         10 Gb
Storage Class                                                                   Memory SCM                                       Attacking the
Memory                                                                        enterprise storage                                 data storage RRAM
                                                                                                                                                 Low
(SCM)               1 Gb
                                                                                 applications                                     application density for
                                                                                                                                                                   wearable &
                                                                                  Adesto                                                                            industrial
                   100 Mb                                                         64 Mb
                                                                                                                                                                             Year of
                                                                                                                                                                           commercial
                                                                                                                                                                              sample
                                                                                                                                                                            availability
                    10 Mb

                                                                                           ©2015 | www.yole.fr | New technologies & architectures for efficient data centers       20
EMERGING NVM MARKET FORECAST
   By application from 2014–2020 (in $M)

                                                                                        CAGR 2014-2020
                                                                                                                      118%

                                                                                        CAGR 2014-2020
                                                                                        CAGR 2014-2020                118%
                                                                                                                      118%
                                                                                                                       85%

                                                                                                                            154%
                                                                                                                             85%
                                                                                                                             35%
                                                                                                                             85%
                                                                                                                            154%
                                           ©2015 | www.yole.fr | New technologies & architectures for efficient data centers     21
                                                                                                                            154%
                                                                                                                             35%
UPS MARKET
    >200kVA UPS market dedicated to data centers

                                                   ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   22
DATA CENTRE NETWORKING
     Where optics is cool!
              Router ASIC with integrated optics                               Hybrid optical/electrical switching (UCSD)
                      (Compass-EOS)                 OOO routers (Calient)

Just a few
examples of
photonic
solutions
that will                                          Active Optic interconnect
reduce                                                                               Si photonics and closer integration
                      AOC (Finisar)                    (TE Connectivity)
power.                                                                                            (Luxtera)

                                                                                ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   23
WHY SiC & GaN ADDED VALUE?

                    Intrinsic     High Junction
                   properties                                      High electron mobility
                                  Temperature

                    Impact on                                           No recovery time
                    operation                                           during switching
High electron
mobility and
high junction        Impact on                       Low losses                                                 High switching
temperature        power module
are the key
                                                  less energy to dissipate                                        frequency
intrinsic
characteristics.
                                                   Fewer cooling                                                 Smaller filters
                                                      needs                                                       and passives
                    Impact on
                   power system
                                                                        System size and
                                                                            weight
                                                                           reduction

                                                                         ©2015 | www.yole.fr | New technologies & architectures for efficient data centers   24
Market & Technology Report

                                      Data Center Technologies
                                      New Technologies and Architectures for Efficient
                                      Data Centers

                                      An analysis of the trends, market, and opportunities for the next
                                      generation of data centers, including new architectures and technologies.

KEY FEATURES OF THE REPORT            Ever-increasing internet traffic and the video streaming
•D  escription of data centers’      boom will encourage large data center investments in the
   global energy consumption          coming years
   from 2010 - 2020
•	The impact of data center          Last year, around $143B was invested worldwide              than 20% in 2014 to almost 35% by 2020.
   challenges on power                for new data center projects. Large internet                Our regional split shows that North America
   electronics equipment, UPS,        companies like Amazon, Facebook, and Google                 (particularly the US) has the biggest share of
   and cooling systems                are leading the investment in next-generation               the server market, at 34%/$3.5B. Europe,
•	Analyses of new architectures      “green” data centers. There is a trend towards              however, leads the UPS equipment and cooling
   such as Alternative Current        building larger data centers, consolidating                 systems markets for data centers. In fact,
   (AC) modular, containers,          and densifying server concentration for the                 Europe’s large UPS (>100kVA) market was
   and DC grid                        sites which require more efficient buildings.               estimated at $931M in 2014. In this report, Yole
•	Description of new data center
                                      Consequently, the blade server market for                   Développement presents market forecasts for
   technologies, i.e. photonic,
                                      data centers will display a 2015 - 2020 CAGR                2010 - 2020, regional splits, and players’ market
   emerging NVM, and WBG
                                      of +10.8%, while the entire server market will              share for servers, UPS, and cooling systems.
•	Market metrics by technology,
   including regional split, 2010 -   increase by 2.3%. Global server market share                Also, each technology’s technical evolution will
   2020 forecast, market share,       for data centers will increase from slightly lower          be presented.
   and more
•	Supply chain overview,             Optimizing modern data centers’ energy consumption is a key
   including players’ market share    challenge. Also, technical solutions are required for
   by market
                                      storage aspects and data flow limitations
REPORT OUTLINE
                                      Data centers are huge electricity users,                    highly-efficient data centers, with PUEs close
•N ew Technologies and
                                      representing around 1.62% of the world’s                    to 1.1. In order to address the urgency for
  Architectures for Efficient Data
                                      consumed energy in 2014. Yole Développement                 reduced energy consumption, manufacturers
  Centers
•P  DF & Excel file                  analyses several possible scenarios for the                 are emphasizing improved efficiency of the
•€  5,990 – Multi user license       evolution of data centers’ energy consumption.              architectural design, the equipment, the
  (170+ slides)                       In the actual scenario, with an average Power               cooling system, and more. Yole Développement
•€ 4,990 – One user license          Usage Efficiency (PUE) of 1.8, worldwide data               report describes some of the more efficient
  (170+ slides)                       center energy consumption will reach 507.9 TWh              modern data center architectures (modular
• J uly 2015                         by 2020. In our hypothetical scenarios, there’s             Alternative Current (AC) and Direct Current
•1  70+ slides                       a possibility for achieving a 12.4% decrease                (DC) grid), as well as some upcoming
                                      of this number by implementing some new                     technologies, i.e. silicon photonics and WBG
Related reports                                                                                   materials that could reduce energy
                                      technologies. Examples from Google, Microsoft,
•	Status of Power Electronics
                                      and Facebook show that it is possible to build              consumption.
   Industry
• Silicon Photonics
                                                 With no slowdown in new facility construction, data centers worldwide
• Power GaN Market
                                                               will have an increasing need for power
•	Energy Management for Smart
   Grid, Cities and Buildings               70

•	Technologies & Sensors for the
   Internet of Things: Businesses           60

   & Market Trends 2014 - 2024
                                            50

Find all our reports                                                                                                                         CAGR 2015-2020

on www.i-micronews.com                      40                                                                                      MEA                10.6%
                                       GW

                                                                                                                                    Latin America      11.2%
                                            30
                                                                                                                                    Asia Pacific       6.8%

                                                                                                                                    Europe             4.2%
                                            20
                                                                                                                                    North America      5.8%

                                            10

                                             0
                                                 2010   2011   2012   2013   2014   2015   2016     2017   2018   2019   2020

                                                                                                                     (Yole Développement, July 2015)
New Technologies and Architectures for Efficient Data Centers

                                                     TRADITIONALLy RIGID AC ARChITECTURES ARE EVOLVING TOwARDS
                                                     FLEXIbLE, mODULAR SOLUTIONS. wILL DC GRID bE A SOLUTION FOR
                                                     DATA CENTERS?

                                                     Tr a d i t i o n a l d a t a c e n t e r s a r e n’ t a b l e t o      and distribution sub-networks can be activated/
                                                     enlarge their IT equipment, since the power                            deactivated for improved efficiency. Moreover,
                                                     architecture and the centralized cooling system                        virtualization and server resource management
                                                     were designed for rated power. such designs                            systems eliminate unnecessary power waste.
                                                     can’t be modified either, and more importantly,
                                                     they present many inefficiencies when servers                          Yole Développement has also identified a smaller,
                                                     work in “low load” mode. Modularity brings a                           high-potential parallel market consisting of
                                                     fresh approach to data center design, enabling                         “container data centers”. These containers are
                                                     the incorporation of additional servers when                           rugged, portable, energy-efficient plug & play
                                                     needed. Also, the power and cooling systems                            solutions that have enjoyed rising sales over the
                                                     are better optimized, since equipment modules                          last few years. HP leads this new market, which
                                                                                                                            will enjoy a 23.2% CAGR from 2015 – 2020,
                                                                                                                            with Huawei following closely behind.
           Over the next few years, the container data center market
                          will enjoy impressive growth                                                                      Other solutions exist to minimize distribution
                                                                                                                            chain power loss, such as DC grid data centers.
                                                                                                                            Thanks to a simplified architecture and fewer
                                        From 2014 on, this market will significantly
                                        increase as many Data Center                                                        conversion steps, losses can be reduced by
                                        manufacturers have seen the interest of
                                        using these modular containers.                                                     20%. Players like ABB, NTT, and Huawei have
                                                                                                                            several DC grid data center demonstrators
                                                                                    CAGR 2015-2020                          that use a 380VDC distribution voltage. The
              Container based Data Centers                                             +23.2%
              had an stable growth in the                                                                                   main barrier for this new architecture is the
              last five years.
                                                                                                                            lack of appropriate DC components, especially
                                                                                                                            400VDC safety breakers. This report contains
                                                                                                                            a detailed analysis of who is doing what, and
                                                                                                                            how DC architecture helps reduce energy
                                                                                                                            consumption.

 2010         2011         2012          2013     2014      2015       2016     2017        2018      2019        2020

(Yole Développement, July 2015)

                                                     NEw TEChNOLOGIES LIkE SILICON phOTONICS ARE EmERGING TO
                                                     RELIEVE TRAFFIC CONGESTION ON DATA TRANSmISSION LINES

                                                                                                                            In future data centers, photonics is generally
          Roadmap of the data center technologies and architectures                                                         perceived as a technical solution that will
                                                                                                                            handle the increasing bandwidth up to 100Gb/s
                                                                                     DC safety breakers
                                                                                                                            and beyond. But one of photonics’ intrinsic
                                                             SiC based UPS
                                                                                     • 400 VFC
                                                                                     • xxx
                                                                                                                            advantages is power-saving, which is a huge plus
                                                             • xxx                   • xxx
                                                                                                                            for interconnects that account for a significant
                                                             • xxx                                   20xx
                             SSD memory widely
                             deployed
                                                                                                                            part of power consumption. For example, with a
                                                              2015
                             • xxx                                                  2018
                                                                                                   GaN / SiC equipment      10Gb/s link, a copper interconnect will consume
                             • xxx
                                                                  gies                             • xxx
                                                              nolo volution                                                 10W, while silicon photonics or VCsELs solutions
                                                         Tech
                             • xxx                                                                 • xxx
                                             20xx                e            Silicon Photonics
                                                              ment
                                                         Equip                • xxx
                                                                              • xxx                                         will consume 0.2W. This equates to a cost
                                                                              • xxx
                                                                                                                            reduction from $3500/year for copper to $70/
                       2010
                                                                                                             2025           year for photonics. In our report we review the
                                                                 Architectures
                                                                 Design evolution                                           status of the emerging silicon photonics solution
                                      20xx
                          DC grid demonstrator           2014                                                DC grid data   for data centers, and also cite other “cool” optical
                                                                                                             centers
         2006
                          facilities
                                                      • xxx                                                  • xxx          solutions like all-optical switches, direct photonic
                          • xxx
                                                      • xxx                                                  • xxx
     Containerized
                          • xxx
                                                                                                             • xxx          links, and active optic interconnect. All of these
     data centers
     • xxx                                                                                                                  solutions contribute to lower power consumption.
     • xxx
     • xxx                                                                                                                  Other technologies such as emerging NVM (non-
                                                                                                                            volatile memory) and WBG (wide-band gap)
     xxx: All details in the report
                                                                                                                            devices are analyzed too.
(Yole Développement, July 2015)
Market & Technology Report

OBJECTIVES OF THE REPORT
•   Understand the current challenges and limitations of data centers
•   Provide a clear overview of data centers’ related market values
•   Reveal the next generation of data center architecture
•   Understand the main technology and market trends
•   Explain some of the key technologies with a deeper analysis
•   Identify players’ supply chain position

    COMPANIES CITED IN THE REPORT (non exhaustive list)
    Cisco, Arista Networks, HP, Dell, Vmware, Brocade, Lenovo, Huawei, Extreme Networks, Avaya,
    Toshiba, EPC, Samsung, SanDisk, Micron, Sony, SK Hynix, Violin memory, STEC, Tms, Fusion-io,
    Eaton Corp., Emerson Electric, Schneider Electric, General Electric, Belkin Industries,
    Socomec, Newave, Emerson Network Power, Stulz, Uniflair, GEA Group, APC, Air Data,
    Airedale, RC Group, Intel, IBM, Luxtera, Mellanox, Molex, SGI, Sun Microsystems, Lampertz,
    Bull, ActivePower, Verari Forest, Delta, ABB, Digital Really, QTS Data Centers, Sabey Data
    Centers, DuPont Fabros, Equinix, NTT, Facebook, Google, Ebay, Amazon, Microsoft, and more!

    TABLE OF CONTENTS
    • Report objectives                                                                          5
    • Who should be interested in this report?                                                   6
    • Glossary                                                                                   8
    • Executive summary                                                                        10
    • Data centers                                                                             28
     > Drivers
     > Big metrics

    • Limitation & challenges                                                                  41
     > Power consumption – Energy efficiency issues
     > Data & storage challenges
    • Supply chain                                                                             62
    • Architectures                                                                            69
     > Traditional
     > Modular & containers
     > DC grid

    •T
      echnical solutions & breakthroughs                                                     128
     >   Server
     >   Memory
     >   UPS
     >   Photonics
     >   Cooling systems
     >   Wide Band Gaps
    • Conclusion                                                                              170

    AUTHORS
    Mattin Grao Txapartegi is a Power                      Dr. Eric Mounier, MEMS & Sensors Senior Analyst. With almost 20 years of experience in
    Electronics Analyst at Yole Développement.             MEMS & Sensors applications, markets and technologies analysis, Dr Eric Mounier provides
    He graduated from Grenoble INP with                    a very deep insight to the industry about the current and future trends for MEMS. At Yole
    an Engineering degree in Electrical                    Développement, Dr. Eric Mounier is in charge of MEMS & Sensors, but also covers printed
    Systems, followed by a specialization in               electronics and future disruptive technologies such as photonics. He has contributed
    embedded systems for transportation.                   to more than 150 marketing & technological analysis and 60 reports in these topics,
    He then earned an advanced master’s                    contributing the MEMS industry moving forward. He has created and has been editor-inchief
    degree in Aeronautics Engineering from                 of numerous media dedicated to the MEMS and Sensors industry. He is a co-founder of Yole
    Arts et Métiers ParisTech. During this                 and previously worked at CEA LETI R&D lab in Grenoble, France in marketing dept. Eric is
    time, he oversaw managerial, financial,                also an expert at the OMNT (˝Observatoire des Micro & Nanotechnologies˝) for Materials
    and marketing fields within the                        and devices for photonics. Eric has a PhD in microelectronics from the INPG in Grenoble,
    aeronautics industry.                                  after studying at Brighton University and MacGill in Montreal.
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ABOUT YOLE DEVELOPPEMENT
   Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media
   in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or
   process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED,
   Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics.
   The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends
   to develop their business.

   CONSULTING                                                  FINANCIAL SERVICES                               REPORTS
   • Market data & research, marketing analysis                • Mergers & Acquisitions                         • Collection of technology & market reports
   • Technology analysis                                       • Due diligence                                  • Manufacturing cost simulation tools
   • Reverse engineering & costing services                    • Fundraising                                    •C omponent reverse engineering & costing
   • Strategy consulting                                       More information on www.yolefinance.com            analysis
   • Patent analysis                                                                                            • Patent investigation
   More information on www.yole.fr                                                                              More information on www.i-micronews.com/reports

   MEDIA & EVENTS
   • i-Micronews.com, online disruptive technologies website
                                                                                       CONTACTS
   •@  Micronews, weekly e-newsletter
                                                                                       For more information about :
   •T  echnology Magazines dedicated to MEMS, Advanced Packaging,
                                                                                       •C  onsulting Services: Jean-Christophe Eloy (eloy@yole.fr)
     LED and Power Electronics
                                                                                       •F  inancial Services: Jean-Christophe Eloy (eloy@yole.fr)
   •C  ommunication & webcasts services
                                                                                       •R  eport Business: David Jourdan (jourdan@yole.fr)
   •E  vents: Yole Seminars, Market Briefings…
                                                                                       • Press relations: Sandrine Leroy (leroy@yole.fr)
   More information on www.i-micronews.com
TERMS AND CONDITIONS OF SALES
Definitions: “Acceptance”: Action by which the Buyer accepts the          2.5 T  he person receiving the Products on behalf of the Buyer             4.8 T
                                                                                                                                                           he Seller does not make any warranties, express or implied,
terms and conditions of sale in their entirety. It is done by signing           shall immediately verify the quality of the Products and their            including, without limitation, those of sale ability and fitness
the purchase order which mentions “I hereby accept Yole’s Terms                 conformity to the order. Any claim for apparent defects or for            for a particular purpose, with respect to the Products. Although
and Conditions of Sale”.                                                        non-conformity shall be sent in writing to the Seller within 8            the Seller shall take reasonable steps to screen Products for
                                                                                days of receipt of the Products. For this purpose, the Buyer              infection of viruses, worms, Trojan horses or other codes
“Buyer”: Any business user (i.e. any person acting in the course
                                                                                agrees to produce sufficient evidence of such defects. .                  containing contaminating or destructive properties before
of its business activities, for its business needs) entering into the
                                                                          2.6 No return of Products shall be accepted without prior                      making the Products available, the Seller cannot guarantee
following general conditions to the exclusion of consumers acting
                                                                               information to the Seller, even in case of delayed delivery.               that any Product will be free from infection.
in their personal interests.
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“Contracting Parties” or “Parties”: The Seller on the one hand
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and the Buyer on the other hand.
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“Intellectual Property Rights” (“IPR”) means any rights held                                                                                          accident, riot, war, government intervention, embargoes, strikes,
by the Seller in its Products, including any patents, trademarks,         3. Price, invoicing and payment
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registered models, designs, copyrights, inventions, commercial            3.1 Prices are given in the orders corresponding to each Product
                                                                                                                                                      other difficulties which are beyond the control, and not the fault
secrets and know-how, technical information, company or trading                sold on a unit basis or corresponding to annual subscriptions.
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names and any other intellectual property rights or similar in any             They are expressed to be inclusive of all taxes. The prices
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part of the world, notwithstanding the fact that they have been
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registered or not and including any pending registration of one of
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the above mentioned rights.
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service on line on I-micronews and a consulting approach), is                                                                                         6.3 The Buyer shall be solely responsible towards the Seller of
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defined in the order. Reports are established in PowerPoint and                                                                                            all infringements of this obligation, whether this infringement
                                                                               from invoice date, except in the case of a particular written
delivered on a PDF format and the database may include Excel                                                                                               comes from its employees or any person to whom the Buyer
                                                                               agreement. If the Buyer fails to pay within this time and fails
files.                                                                                                                                                     has sent the Products and shall personally take care of any
                                                                               to contact the Seller, the latter shall be entitled to invoice
                                                                                                                                                           related proceedings, and the Buyer shall bear related financial
“Seller”: Based in Lyon (France headquarters), Yole                            interest in arrears based on the annual rate Refi of the «BCE»
                                                                                                                                                           consequences in their entirety.
Développement is a market research and business development                    + 7 points, in accordance with article L. 441-6 of the French
                                                                                                                                                      6.4 T
                                                                                                                                                           he Buyer shall define within its company point of contact for
consultancy company, facilitating market access for advanced                   Commercial Code. Our publications (report, database, tool...)
                                                                                                                                                          the needs of the contract. This person will be the recipient
technology industrial projects. With more than 20 market                       are delivered only after reception of the payment.
                                                                                                                                                          of each new report in PDF format. This person shall also be
analysts, Yole works worldwide with the key industrial companies,         3.5 In the event of termination of the contract, or of misconduct,
                                                                                                                                                          responsible for respect of the copyrights and will guaranty that
R&D institutes and investors to help them understand the markets               during the contract, the Seller will have the right to invoice at
                                                                                                                                                          the Products are not disseminated out of the company.
and technology trends.                                                         the stage in progress, and to take legal action for damages.
                                                                                                                                                      6.5 In the context of annual subscriptions, the person of contact
1. Scope                                                                                                                                                   shall decide who within the Buyer, shall be entitled to access
1.1 
    The Contracting Parties undertake to observe the following            4. Liabilities                                                                   on line the reports on I-micronews.com. In this respect, the
    general conditions when agreed by the Buyer and the Seller.           4.1 The Buyer or any other individual or legal person acting on                 Seller will give the Buyer a maximum of 10 password, unless
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    AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY                            business activities, shall be solely responsible for choosing the           passwords. The Seller reserves the right to check from time to
    THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE                        Products and for the use and interpretations he makes of the                time the correct use of this password.
    SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE                           documents it purchases, of the results he obtains, and of the          6.6 
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    MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY                         advice and acts it deduces thereof.                                        of the buyer can access the report or the employee of the
    ON THE SELLER.                                                        4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable        companies in which the buyer have 100% shares. As a matter
1.2 This agreement becomes valid and enforceable between the                  pecuniary loss, caused by the Products or arising from a                   of fact the investor of a company, the joint venture done with
     Contracting Parties after clear and non-equivocal consent                 material breach of this agreement                                          a third party etc..cannot access the report and should pay a
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     when signing the purchase order which mentions “I hereby                  or consequential damages (including, but not limited to,               7. Termination
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     acceptance by the Buyer.                                                  programs or information) arising out of the use of or inability            the date of mailing, the Buyer shall indemnify the Seller for
1.3 O rders are deemed to be accepted only upon written                       to use the Seller’s website or the Products, or any information            the entire costs that have been incurred as at the date of
    acceptance and confirmation by the Seller, within [7 days]                 provided on the website, or in the Products;                               notification by the Buyer of such delay or cancellation. This
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    orders shall be deemed to have been accepted.                         4.4 All the information contained in the Products has been                 7.2 In the event of breach by one Party under these conditions
2. Mailing of the Products                                                     obtained from sources believed to be reliable. The Seller does
                                                                                                                                                           or the order, the non-breaching Party may send a notification
2.1 P
     roducts are sent by email to the Buyer:                                  not warrant the accuracy, completeness adequacy or reliability
                                                                                                                                                           to the other by recorded delivery letter upon which, after a
    • within [1] month from the order for Products already released;           of such information, which cannot be guaranteed to be free
                                                                                                                                                           period of thirty (30) days without solving the problem, the non-
    or                                                                         from errors.
                                                                                                                                                           breaching Party shall be entitled to terminate all the pending
    • within a reasonable time for Products ordered prior to their        4.5 All the Products that the Seller sells may, upon prior notice
                                                                                                                                                           orders, without being liable for any compensation.
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    endeavours to inform the Buyer of an indicative release date               with similar Products meeting the needs of the Buyer. This             8. Miscellaneous
    and the evolution of the work in progress.                                 modification shall not lead to the liability of the Seller, provided   All the provisions of these Terms and Conditions are for the benefit
2.2 Some weeks prior to the release date the Seller can propose a             that the Seller ensures the substituted Product is similar to the      of the Seller itself, but also for its licensors, employees and agents.
     pre-release discount to the Buyer                                         Product initially ordered.                                             Each of them is entitled to assert and enforce those provisions
    The Seller shall by no means be responsible for any delay in          4.6 In the case where, after inspection, it is acknowledged that           against the Buyer.
    respect of article 2.2 above, and including incases where a                the Products contain defects, the Seller undertakes to replace         Any notices under these Terms and Conditions shall be given in
    new event or access to new contradictory information would                 the defective products as far as the supplies allow and without        writing. They shall be effective upon receipt by the other Party.
    require for the analyst extra time to compute or compare                   indemnities or compensation of any kind for labor costs,               The Seller may, from time to time, update these Terms and
    the data in order to enable the Seller to deliver a high quality           delays, loss caused or any other reason. The replacement is            Conditions and the Buyer, is deemed to have accepted the latest
    Products.                                                                  guaranteed for a maximum of two months starting from the               version of these terms and conditions, provided they have been
2.3    The mailing of the Product will occur only upon payment                delivery date. Any replacement is excluded for any event as            communicated to him in due time.
        by the Buyer, in accordance with the conditions contained              set out in article 5 below.
        in article 3.                                                     4.7 The deadlines that the Seller is asked to state for the mailing        9. Governing law and jurisdiction
2.4. The mailing is operated through electronic means either by               of the Products are given for information only and are not             9.1 Any dispute arising out or linked to these Terms and Conditions
      email via the sales department or automatically online via an            guaranteed. If such deadlines are not met, it shall not lead                or to any contract (orders) entered into in application of
      email/password. If the Product’s electronic delivery format              to any damages or cancellation of the orders, except for non                these Terms and Conditions shall be settled by the French
      is defective, the Seller undertakes to replace it at no charge           acceptable delays exceeding [4] months from the stated                      Commercial Courts of Lyon, which shall have exclusive
      to the Buyer provided that it is informed of the defective               deadline, without information from the Seller. In such case                 jurisdiction upon such issues.
      formatting within 90 days from the date of the original                  only, the Buyer shall be entitled to ask for a reimbursement of        9.2 French law shall govern the relation between the Buyer and the
      download or receipt of the Product.                                      its first down payment to the exclusion of any further damages.             Seller, in accordance with these Terms and Conditions.
Yole Développement
 From Technologies to Market

                       © 2015
FIELDS OF EXPERTISE
    Yole Développement’s 30 analysts operate in the following areas

                                 Imaging         Photonics

                    MEMS &
                    Sensors                                    MedTech

             Compound
               Semi.
                                                              Manufacturing
                 LED / OLED

                                Power                  Advanced
                              Electronics              Packaging
                                            PV
                                                                              26
4 BUSINESS MODELS

   o Consulting and Analysis                                   o Financial services
       •   Market data & research, marketing analysis             •   M&A (buying and selling)
       •   Technology analysis                                    •   Due diligence
       •   Strategy consulting                                    •   Fundraising
       •   Reverse engineering & costing                          •   Maturation of companies
       •   Patent analysis                                        •   IP portfolio management & optimization
                                                 www.yole.fr                                     www.yolefinance.com
                                                                                                         Blu Morpho

   o Reports                                                 o Media
       • Market & Technology reports                              •   i-Micronews.com website
       • Patent Investigation and patent infringement risk        •   @Micronews e-newsletter
         analysis                                                 •   Technology magazines
       • Teardowns & Reverse Costing Analysis                     •   Communication & webcast services
       • Cost Simulation Tool                                     •   Events
                              www.i-Micronews.com/reports                                       www.i-Micronews.com

                                                                                                                       27
A GROUP OF COMPANIES

                                                   M&A operations
                                                    Due diligences
                                                     www.yolefinance.com

                                                     Fundraising
                                               Maturation of companies
                          Blu Morpho   IP portfolio management & optimization
             Market,                                      TBA

         technology and
             strategy                         Manufacturing costs analysis
                                           Teardown and reverse engineering
            consulting
                                                 Cost simulation tools
                                                      www.systemplus.fr
            www.yole.fr

                                                      IP analysis
                                                  Patent assessment
                                                      www.knowmade.fr

                                                                                28
OUR GLOBAL ACTIVITY

 Blu Morpho

                                               Yole
                                              Korea                               Yole Inc.
                                                              Yole Japan

              40% of our business is in   30% of our business is in        30% of our business is in
                  EU countries                     Asia                       North America

                                                                                                       29
RESEARCH PRODUCTS - CONTENT COMPARISON

                                                 Breadth of the analysis

                                                               Standard Reports

                                         Workshops

              Depth of the analysis

                                      Custom
                                      Analysis

                                                                Custom analysis scope is defined with
                                                                 you to meet your information and
                                                                          budget needs

                                                                                                        30
SERVING THE ENTIRE SUPPLY CHAIN

              Integrators and
                 end-users

                            Device
 Our analysts
                            makers
provide market
    analysis,
  technology
evaluation, and
 business plan                  Suppliers: material,
   along the                    equipment, OSAT,
 entire supply                     foundries…
     chain

                                            Financial investors,
                                               R&D centers

                                                                   31
SERVING MULTIPLE INDUSTRIAL FIELDS

                                  Industrial and    Medical
• We are                             defense        systems
  working
  accross
  multiples
  industries to
  understand the
  impact of                   Energy                     Automotive
  More-than-
  Moore
  technologies
  from device to
  system
                                                   Mobile phone
                                 Transportation    and consumer
                                    makers          electronics
                                                                  From A to Z…

                                                                                 32
REPORTS COLLECTION
   o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
        • MEMS & Sensors
        • Imaging
        • Medical technologies (MedTech)
        • Advanced packaging
        • Power electronics
        • Compound semiconductors
        • OLED, LED & Laser diode
        • Semiconductor Manufacturing
        • Photovoltaics
        • Batteries

   o Our reports are unmatched in quality and technology depth and typically include:
       • Technology trends and evolution: costs, barriers, roadmaps, etc.
       • Supply & value chain analysis: business models, relationships, value flows, etc.
       • In-depth analysis of applications and market drivers: challenges, inflection points, etc.
       • Market data ($, units, wafer starts, etc.)
                                                                                                               www.i-Micronews.com

   o Every year, Yole Développement, System Plus Consulting and Knowmade publish +60 reports.
   o Take the full benefit from our Bundle and Annual Subscription offers.

                                                                                                                                     33
OUR 2015 REPORTS PLANNING
   MARKET & TECHNOLOGY REPORTS by Yole Développement                                         o LED
                                                                                                     −   LED Module
   o MEMS & SENSORS                                                                                  −   OLED for Lighting
        − Sensors and Data Management for Autonomous Vehicles                                        −   UV LED
        − AlN Thin Film Markets And Applications                                                     −   LED Phosphors Market
        − Sensors for Wearable Electronics And Mobile Healthcare
        − Status of the MEMS Industry                                                         o POWER ELECTRONICS
        − Uncooled IR Imagers                                                                      − Power Packaging
        − IR Detectors                                                                             − Thermal Management for LED and Power
        − High End Gyro, Accelerometers and IMU                                                    − Power Electronics for Renewable Energy
        − Non-Volatile Memory                                                                      − Energy Management For Smart Grid And Smart Cities
                                                                                                   − Status of Chinese Power Electronics Industry
   o IMAGING & OPTOELECTRONICS                                                                     − New Technologies For Data Center
            − Camera Module Packaging (Vol 1 : Market & Technology Trends / Vol 2 Teardowns &      − Inverter Market Trends For 2013 – 2020 And Major Technology Changes*
                Reverse Engineering)                                                               − IGBT Markets And Application Trends
            − Uncooled IR Imagers                                                                  − Power Electronics for HEV/EV*
            − Wafer Level Optics                                                                   − Status of Power Electronics Industry
            − Status of the CMOS Image Sensors
            − Machine Vision                                                                  o ADVANCED PACKAGING
                                                                                                   − Advanced Packaging in Emerging Markets in China
   o MEDTECH                                                                                       − Status of the Advanced Packaging Industry
            − Microfluidic for Sample Preparation                                                  − Supply Chain Readiness for Panel Manufacturing in Packaging
            − Microfluidic Applications                                                            − WLCSP*
            − Sensors for Wearable Electronics And Mobile Healthcare                               − Flip Chip Business Update
                                                                                                   − 2.5D & 3DIC Business Update
   o COMPOUND SEMICONDUCTORS                                                                       − Fan-Out and Embedded Business Update
            − High Purity Alumina (HPA)
            − Sapphire                                                                        o MANUFACTURING
            − Wide Bandgap Materials For Power Electronics: SiC, GaN (and also Ga2O3, AlN,         − Lithography for MEMS, Advanced Packaging and LED
                Diamond, Graphene… as a trend)                                                     − Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS
                                                                                                     Image Sensors
   * Reports to be decided within 2015                                                             − Non-Volatile Memory

                                                                                                                                                                                          34
OUR 2015 REPORTS PLANNING

   PATENT ANALYSIS by Knowmade
   o Patent Infringement (crossed analysis based on Knowmade and System Plus Analysis expertise)
        − MEMS Microphone Applications
        − Infrared Imaging

   o Patent Investigation (crossed analysis based on Knowmade & Yole Développement expertise)
        − Power GaN
        − MEMS Gyroscope
        − 6-axis & 9-axis Inertial MEMS IMUs
        − Microbatteries
        − Embedded Active & Passive Packages
        − Interposer
        − Phosphors for LED

   TEARDOWN & REVERSE COSTING by System Plus Consulting
   More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2015.

                                                                                                            * Reports to be decided within 2015
                                                                                                                                                  35
OUR 2014 PUBLISHED REPORTS LIST
   MARKET & TECHNOLOGY REPORTS                                                                              − LED Packaging
                                                                                                            − LED Front-End Manufacturing Trends
   by Yole Développement
                                                                                                            − LED Front-End Equipment Market

   o MEMS & SENSORS
                                                                                                    o POWER ELECTRONICS
        − Technologies & Sensors for the Internet of Things: Businesses & Market Trends 2014-2024
                                                                                                         − Power Electronics for HEV/EV
        − MEMS Microphone: Market, Applications and Business Trends 2014
                                                                                                         − Inverters
        − Status of the MEMS industry
                                                                                                         − Gate Driver Unit Market for Power Transistors
        − MEMS & Sensors for Mobile Phones and Tablets
        − High End Gyroscopes and Accelerometer Applications
                                                                                                    o   PHOTOVOLTAICS
        − Inertial MEMS Manufacturing Technical Trends
                                                                                                          − Emerging and Innovative Technology Approaches in the Solar Industry
        − New Detection Principles & Technical Evolution for MEMS & NEMS
        − 6/9 DOF Applications in Consumer Electronics
                                                                                                    o ADVANCED PACKAGING
                                                                                                         − 3DIC Equipment and Materials
   o IMAGING & OPTOELECTRONICS
                                                                                                         − 3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
        − Status of the CMOS Image Sensor Industry
        − Uncooled Infrared Imaging Technology & Market Trends
                                                                                                    o MANUFACTURING
        − Silicon Photonics
                                                                                                         − Market & Technology Trends in Materials & Equipment for Printed & Flexible Electronics
                                                                                                         − Permanent Wafer Bonding for Semiconductor: Application Trends & Technology
   o MEDTECH
        − Point of Care Testing: Applications for Microfluidic Technologies
        − Solid State Medical Imaging: X-ray and Endoscopy                                          PATENT ANALYSIS
                                                                                                    by Knowmade
   o COMPOUND SEMICONDUCTORS                                                                                −   LED Based on Nano-wires Patent Investigation
        − RF GaN Technology & Market Analysis: Applications, Players, Devices & Substrates 2010-            −   GaN on Si Patent Investigation (LED, Power devices and RF Devices)
          2020                                                                                              −   New MEMS Devices Patent Investigation
        − SiC Modules, Devices and Substrates for Power Electronics Market                                  −   Non Volatile Memory Patent Investigation
        − GaN-on-Si Substrate Technology and Market for LED and Power Electronics
        − Power GaN Market                                                                          TEARDOWN & REVERSE COSTING
        − Graphene Materials for Opto & Electronic Applications
        − Sapphire Applications and Market: from LED to Consumer Electronics
                                                                                                    by System Plus Consulting
                                                                                                    More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2014.
   o LED
                                                                                                                                                                                                             36
MICRONEWS MEDIA
  o   About Micronews Media
        Micronews       Media, powered        by    Yole
        Développement, ensures you the best visibility
        in the disruptive semiconductor community.           Focused
        With our services, we help you to reach your        community
        customers worldwide with the media products
        they prefer, including our website, e-newsletter,
        webcasts, and magazines. Invest in a high added-
        value editorial program and get access to Yole
        Développement’s network (48 000+ contacts).

  o   Five supports and channels for your visibility
        •   A technology magazine to highlight
            your    visibility  with   advertisements,
            company profiles, product descriptions and
            white papers                                      Large
                                                            community
        •   A webcast to highlight your expertise and
            develop    your    business    identifying                                  Identified
            commercial leads                                            Mass contacts
                                                                                         contacts
        •   Articles, advertisements & logo and
            banners dedicated to your company, its
            products and expertise in @Micronews e-
            newsletter and on i-Micronews.com

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COMMUNICATION SERVICES

  All services listed below are available on–demand.

  o   i-Micronews.com, the website
      Slider – Banners (on English or Japanese websites) – Articles –
      Logo and profile as sponsor

  o   @Micronews, the e-newsletter
      Headline article - Tiles

  o   Custom webcast
      Develop your dedicated event with a high added-value program. A
      turnkey event with Yole support (logistics, promotion, data…)

  o   Technology Magazines: Custom – Co-produced
      Increase your visibility through a dedicated technology magazine
      with ads, company profile, product descriptions and white papers.
      It can be a custom magazine: your company is the only one to
      benefit from it – or a co-produced one: up to 2 companies.

  Contacts:
  Camille Veyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr),
     Media & Communication Coordinators.

                                                                          38
CONTACT INFORMATION
   o Consulting and Specific Analysis
         •   North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
             Email: laferriere@yole.fr
         •   Japan:Yutaka Katano, General Manager,Yole Japan & President, Yole K.K.
             Email: katano@yole.fr
         •   RoW: Jean-Christophe Eloy, President & CEO, Yole Développement
             Email: eloy@yole.fr

   o Report business
         •   North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
             Email: laferriere@yole.fr
         •   Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
             Email: khamassi@yole.fr
         •   Japan & Asia: Takashi Onozawa, Sales Asia & General Manager,Yole K.K.
             Email: onozawa@yole.fr
         •   Korea: Hailey Yang, Business Development Manager, Korean Office
             Email: yang@yole.fr

   o Financial services
         •   Jean-Christophe Eloy, CEO & President
             Email: eloy@yole.fr
                                                                                                     Follow us on
   o General
         •   Email: info@yole.fr

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