PRODUCT GUIDE 2019 - Seco
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PRODUCT
GUIDE
2019
PRO DUCT GUIDE
INDEX
Qseven® ETX®
Q7-B03 p. 14 ETX-A61 p. 50
Q7-974 p. 15
Q7-A36 p. 16
Q7-C25 p. 17 Single Board Computer
Q7-C26 p. 18 SBC-B68-eNUC p. 54
Q7-928 p. 19 SBC-A80-eNUC p. 55
Q7-922 p. 20 SBC-C41-pITX p. 56
μQseven® SBC-A44-pITX p. 57
SBC-992-pITX p. 58
μQ7-A76-J p. 22
SBC-C61 p. 59
μQ7-962 p. 23
SBC-C20 p. 60
μQ7-A75-J p. 24
SBC-C43 p. 61
Carrier Board
SBC-C23 p. 62
CQ7-A42 p. 25 SBC-A62-J p. 63
Development Kit SBC-B08 p. 64
SBC-984 p. 65
Q7 DEV KIT 2.0 p. 26
Q7 STARTER KIT 2.0 p. 27
Modular HMI & Boxed Solutions
SMARC SYS-A62-10
SYS-B08-7
p. 68
p. 69
SM-B69 p. 30 SYS-B68-IPC p. 70
SM-C12 p. 31 SYS-A90-IPC p. 71
SM-B71 p. 32
Carrier Board
CSM-B79 p. 33
COM Express™
COMe-B75-CT6 p. 36
COMe-A98-CT6 p. 37
COMe-C55-CT6 p. 38
COMe-C24-CT6 p. 39
COMe-A41-CT6 p. 40
COMe-A81-CT6 p. 41
COMe-C08-BT6 p. 42
COMe-B09-BT6 p. 43
COMe-953-BT6 p. 44
Carrier Board
CCOMe-C30 p. 45
CCOMe-965 p. 46
SECO GROUP: YOUR TECHNOLOGY PARTNER
SECO group designs and manufactures embedded systems all in-house.
SECO offers a wide range of standard modules, SBCs, systems and custom solutions to leverage
innovative, state-of-the-art technologies. Thanks to its drive for continuous evolution and relying on its
strong know-how, SECO responds to new challenging market demands with cutting edge solutions, and
a strong focus on the Internet of Things.
SECO AT A GLANCE
SECO STRENGTHS
Product reliability:
Design: creativity and innovation with a strong
Product validation & verification support
x86 & ARM R&D department
Product design support
Reliable and safe In-house manufacturing
embedded solutions KNO
TY W
LI
A
-H
Process reliability in terms
QU
System integration
OW
of cost, time, resources
I
Y
Partnership with
N
Customer oriented GROUP
LIT
N
process & services the most important
OV
technological players
BI
I AT
ION
FLEX
Experience in a broad range Collaboration with important
of vertical markets research institutes
Products expertise:
Modules, boards, systems To study the future in order to anticipate
and intercept the needs of the customer
KNOW-HOW
DESIGN MANUFACTURING SYSTEMS
In-house manufacturing.
Extensive experience in Design and integration
Lean Manufacturing
Micro Computer design, of Micro Computers with
employed to reduce
both Hardware and video interfaces and
waste and accelerate the
Software-wise mechanical design
time to market
Analysis & Design FPGA design BIOS Hardware Software Mechanical
Engineering Engineering development Engineering
& Development & Development & Development
Signal Integrity Drivers Engineering BSP Firmware Validation & Thermal
& Development Development Verification Analysis
PRODUCT LINES
STANDARD SEMI-CUSTOM FULL-CUSTOM
PRODUCTS SOLUTIONS SOLUTIONS
MODULAR SOLUTIONS CUSTOM CARRIER BOARDS + END-TO-END “TAILORED”
MODULAR SOLUTIONS SOLUTIONS:
Full support from concept
development to the complete
system solution
Qseven® COM
Express™
MODULAR HMI &
SMARC ETX /XTX
® BOXED SOLUTIONS
SINGLE BOARD COMPUTERS
Embedded NUC™ Pico-ITX
Beyond the long-established and consistent hardware product portfolio, SECO GROUP offers custom design,
system integration, and a range of multi-sector, customer centric services, such as BIOS customization,
surface treatments, PCB specific certifications for industry requirements like transportation, amongst others.
SECO GROUP manages the entire production cycle in-house, from the development and design stage to
manufacturing to mass distribution. SECO GROUP always aims to serve as a true collaborative technology
partner for its customers’ special projects.
SERVICES
YOUR TECHNOLOGY PARTNER FOR CUSTOMIZED COMPUTING PLATFORMS
| Design review | Off-the shelf SBCs customization | Carrier board design for modular computing platforms |
| Full custom SBC design | x86, ARM & FPGA know-how | Secure your design & production in our HQ - Italy |
Design Review x86, ARM, FPGA Know-How & Secure your design and Let us design your product
cross-platform design production
YOUR TECHNOLOGY PARTNER FOR SOFTWARE CUSTOMIZATION
| Customized BIOS | Firmware & driver development | BSP development | Long-term support |
BIOS tuning Linux BSP & Android Firmware & driver support We take care of your project,
development with lifetime support
YOUR TECHNOLOGY PARTNER FOR SYSTEMS AND ASSEMBLY
| Software pre-installed on your system | Assembly services | Design and production of your boxed solution |
| Touch-display solutions | Design and production of your final product |
Software preloaded Boxed solutions Touch displays Displays assembly
YOUR TECHNOLOGY PARTNER FOR THE INDUSTRIAL INTERNET OF THINGS
EVERYTHING YOU NEED TO POWER YOUR IoT PRODUCT, FROM DEVICE TO CLOUD
Prototyping Tools Industrial IoT Hardware Connectivity IoT Device Cloud IoT Apps
PARTNERSHIPS
WORLDWIDE SILICON VENDORS OPERATING SYSTEMS
STANDARDS & CONSORTIUM
CERTIFICATIONS
Certified UNI UNI EN ISO 14001
EN ISO - 9001:2015 (in progress)
MAIN FIELDS OF APPLICATION
SECO’s solutions today can be found at the heart of the most sophisticated and diverse products throughout
various industries, such as traditional uses in industrial automation, biomedical devices, digital signage and
across more modern applications like the Internet of Things and robotics.
Automation Automotive Avionics Biomedical/Medical Digital signage - Edge E - health
devices Infotainment Computing Telecare
Energy Fitness Gaming HMI Home Home Industrial
Equipment Automation Entertainment Automation and
Control
Info Kiosks Internet of Things In-Vehicle Measuring Mobile devices Multimedia PDA Electronics
Infotainment instruments devices
Systems
Point of Sales Portable Robotics Surveillance Telco Thin clients Transportation
devices
Vending Visual Computing Wireless Makers & maker boards
Technologies Education by SECO
Qseven
®QSEVEN® STANDARD ADVANTAGES
Cost effective Low power Compact
solution for high consumption form factor
volume projects
High speed Qseven:
Low profile Excellent for
MXM edge 70 x 70 mm
design IoT projects
connector μQseven:
40 x 70 mm
COMPUTER-ON-MODULE APPROACH
| Design investment limited to the carrier board | Consolidated Standard form factor |
| Scalable and future-proof | Long-term availability | ARM and x86 cross-compatibility |
| Multi-vendor solution | Highly configurable | Innovative and upgradable | Accelerated time-to-market |
SECO is one of the founding members of SGET and
a co-founder of the Qseven® standardQseven
Qseven®
® Features
standard Overview
specifications
70 mm - 2,76”
Qseven
70 mm - 2,76”
x86
μQseven
Also available 40 mm - 1,57”
in Industrial
temperature range,
-40°C ÷ +85°C
®
Audio
GBE
Qseven® Rev. 2.1 Supported Features
The Qseven® mandatory and optional features. The table shows the minimum and maximum required
configuration of the feature set.
ARM/RISC X86 Based ARM/RISC X86 Based
System I/O Interface Based Min Max Config. System I/O Interface Based Min Max Config.
Min Config. Config. Min Config. Config.
PCI Express lanes 0 1 (x1 link) 4 I²C Bus 1 1 1
Serial ATA channels 0 0 2 SPI Bus 0 0 1
USB 2.0 ports 3 4 8 CAN Bus 0 0 1
USB 3.0 ports 0 0 3 Watchdog Trigger 1 1 1
Dual Channel Power Button 1 1 1
LVDS channels 0 0
24 bits
Embedded Power Good 1 1 1
0 0 2
DisplayPort
Reset Button 1 1 1
DisplayPort, TMDS 0 0 1
LID Button 0 0 1
High Definition
0 0 1
Audio / I2S Sleep Button 0 0 1
Ethernet 10/100 1 (Gigabit
0 0 Suspend To RAM
Mbit/Gigabit Ethernet) 0 0 1
(S3 mode)
UART 0 0 1
Wake 0 0 1
Low Pin Count bus 0 0 1
Battery low alarm 0 0 1
Secure Digital I/O 4-bit
0 0 1
for SD/MMC cards Thermal control 0 0 1
System Management
0 1 1 FAN control 0 0 1
BusQseven ®
®
Qseven® Rel. 2.1 compliant module with the Intel® Atom™ X Series,
Q7-B03 Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
High graphics performance and extreme temperature for low power designs
HIGHLIGHTS
CPU
CONNECTIVITY
Intel® Atom™ X Series, Intel® Celeron® J / N Series and
2x USB 3.0; 4x PCI-e; 6x USB 2.0
Intel® Pentium® N Series
GRAPHICS MEMORY
Integrated Gen9-LP Graphics controller up to 8GB Dual-Channel DDR3L-1866
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Automotive Biomedical/ Digital Gaming HMI Industrial Internet of Mobile Multimedia Visual
Medical Signage - Things devices devices Computing
devices Infotainment
FEATURES
Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 6 x USB 2.0 Host Ports
2MB L2 Cache, 6.5W TDP 2 x USB 3.0 Host Ports (*)
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), USB
2MB L2 Cache, 9.5W TDP (*) Second USB 3.0 Host port can be exploited only using
Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), Qseven® Rel. 2.1 compliant Carrier boards
2MB L2 Cache, 12W TDP 4 x PCI-e Root Ports (including the PCI-e port used for Gigabit
Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), PCI-e
Processor Ethernet controller)
2MB L2 Cache, 6W TDP
Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), Audio HD Audio interface
2MB L2 Cache, 6W TDP
Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), Serial Ports 1 x UART, TTL interface
2MB L2Cache, 10W TDP
Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), I2C Bus
2MB L2Cache, 10W TDP LPC Bus
SM Bus
Max Cores 4 Other
SPI interface
Interfaces
Watch Dog Timer
Max Thread 4 Thermal / FAN management
Power Management Signals
Memory Dual Channel Soldered Down DDR3L-1866 memory, up to 8GB
Power
+5VDC and +5VSB (optional)
Integrated Gen9-LP Graphics controller, with 18 Execution Units Supply
Graphics 4K HW decoding and encoding of HEVC(H.265), H.264, VP8, Microsoft® Windows 10 Enterprise (64 bit)
SVC, MVC Microsoft® Windows 10 IoT Core
Operating
eDP interface or Single/Dual Channel 18/24bit LVDS interface Wind River Linux (64 bit)
Video System
through eDP-to-LVDS bridge Yocto (64 bit)
Interfaces Android (planning)
HDMI or DP++ interface
DP: Up to 4096 x 2160 @60HZ Operating 0°C ÷ +60°C (Commercial version)
Video eDP: Up to 3840 x 2160 @60Hz Temperature* -40°C ÷ +85°C (Industrial version)
Resolution HDMI: Up to 3840 x 2160 @30Hz
Dimensions 70 x 70 mm (2.76” x 2.76”)
LVDS, VGA: Up to 1920 x 1200 @ 60Hz
2 x external S-ATA Gen3 Channel *Measured at any point of SECO standard heatspreader for this product, during
Mass Storage SD interface any and all times (including start-up). Actual temperature will widely depend on
Optional eMMC drive soldered onboard application, enclosure and/or environment. Upon customer to consider application-
Gigabit Ethernet interface specific cooling solutions for the final system to keep the heatspreader temperature
Networking in the range indicated.
Intel® I210 or I211 Controller (MAC + PHY)
www.seco.com www.seco.com
14Qseven ®
Qseven ®
Qseven® standard module with the Intel® Atom™ E3800 and Celeron®
Q7-974 families (formerly Bay Trail) SoC
x86 performance on a low-power module
HIGHLIGHTS
CPU
CONNECTIVITY
Intel® Atom™ E3800 and Celeron® families
6x USB 2.0; 1x USB 3.0; 3x PCI-e x1
of System-on-Chip
GRAPHICS MEMORY
Integrated Intel® HD Graphics controller up to 8GB Dual-Channel DDR3L 1333MHz
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Biomedical/ HMI Industrial Measuring
Medical devices Automation and Instruments
Control
FEATURES
Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP PCI-e 3 x PCI-e x1 lanes
Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
Audio HD Audio interface
Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
Processor
Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
Serial Ports 1 x Serial port (TTL interface)
Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP I2C Bus
Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP LPC Bus
Other SM Bus
Max Cores 4
Interfaces Thermal / FAN management
SPI interface
Max Thread 4
Power Management Signals
Soldered on-board DDR3L memory Power
E3845, E3827, J1900, N2930: up to 8GB Dual-Channel +5VDC ± 5%
Supply
DDR3L @ 1333MHz
Memory Microsoft® Windows 7 (32 / 64 bit)
E3826: up to 8GB Dual-Channel DDR3L @ 1066MHz
Microsoft® Windows 8.1 (32 / 64 bit)
N2807: up to 4GB Single-Channel DDR3L @ 1333MHz
Microsoft® Windows 10 (32 / 64 bit)
E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz
Microsoft® Windows 10 IoT
Integrated Intel® HD Graphics 4000 series controller Operating
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Dual independent display support System
Graphics Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats Microsoft® Windows Embedded Compact 7
HW encoding of H.264, MPEG2 and MVC formats Linux (32 / 64 bit)
HDMI or Multimode Display Port interface Yocto
Video Embedded Display Port or 18 / 24 bit dual channel LVDS Operating 0°C ÷ +60°C (Commercial version)
Interfaces interface Temperature* -40°C ÷ +85°C (Industrial version)
Additional VGA interface (optional external adapter is required)
Dimensions 70 x 70 mm (2.76” x 2.76”)
HDMI: Up to 1920x1080p@60Hz
Video
Display Port, eDP, CRT: Up to 2560x1600@60Hz
Resolution *Measured at any point of SECO standard heatspreader for this product, during
Optional LVDS interface: Up to 1920x1200@60Hz
any and all times (including start-up). Actual temperature will widely depend on
Up to 2 x external SATA channels application, enclosure and/or environment. Upon customer to consider application-
Mass Storage SD interface specific cooling solutions for the final system to keep the heatspreader temperature
Optional SATA Flash Drive soldered on-board in the range indicated.
Networking Gigabit Ethernet interface
1 x USB 3.0 Host port
USB
6 x USB 2.0 Host ports (one shared with USB 3.0 interface)
www.seco.com
15Qseven ®
®
Qseven® standard module with the Intel® Atom™ E3800 and Celeron®
Q7-A36 families (formerly Bay Trail) SoC, with eMMC and Camera Interface
Mobile-oriented with eMMC and Camera Interface
HIGHLIGHTS
CPU CONNECTIVITY
Intel® Atom™ E3800 and Celeron® families 6x USB 2.0; 1x USB 3.0; 3x PCI-e x1
GRAPHICS MEMORY
Integrated Intel® HD Graphics 4000 Series controller up to 8GB Dual-Channel DDR3L 1333MHz
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
HMI Industrial In-vehicle Portable
Automation infotainment Devices
and Control systems
FEATURES
Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP PCI-e 3 x PCI-e x1 lanes
Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
Audio HD Audio interface
Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
Processor Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
Serial Ports 1 x Serial port (TTL interface)
Intel® Atom™ E3805, Dual Core @ 1.33GHz, 1MB Cache, 3W TDP
Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP I2C Bus
Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP LPC Bus
Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP Other SM Bus
Interfaces Thermal / FAN management
Max Cores 4
SPI interface
Power Management Signals
Max Thread 4
Power
Soldered on-board DDR3L memory +5VDC ± 5%
Supply
E3845, E3827, J1900, N2930: up to 8GB Dual-Channel
Microsoft® Windows 7 (32 / 64 bit)
DDR3L 1333MHz
Memory Microsoft® Windows 8.1 (32 / 64 bit)
E3826: up to 8GB Dual-Channel DDR3L 1066MHz
Microsoft® Windows 10 (32 / 64 bit)
N2807: up to 4GB Single-Channel DDR3L 1333MHz
Microsoft® Windows 10 IoT
E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz Operating
Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
Integrated Intel® HD Graphics 4000 series controller (not for E3805) System
Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
Dual independent display support Microsoft® Windows Embedded Compact 7
Graphics
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats Linux (32 / 64 bit)
HW encoding of H.264, MPEG2 and MVC formats Yocto
HDMI or Multimode Display Port interface Operating 0°C ÷ +60°C (Commercial version)
Video
Embedded Display Port or 18 / 24 bit dual channel LVDS interface Temperature* -40°C ÷ +85°C (Industrial version)
Interfaces
Optional Camera interface
Dimensions 70 x 70 mm (2.76” x 2.76”)
HDMI: Up to 1920x1080p@60Hz
Video
Display Port, eDP: Up to 2560x1600@60Hz
Resolution *Measured at any point of SECO standard heatspreader for this product, during
Optional LVDS interface: Up to 1920x1200@60Hz
any and all times (including start-up). Actual temperature will widely depend on
2 x external SATA channels application, enclosure and/or environment. Upon customer to consider application-
Mass Storage SD interface specific cooling solutions for the final system to keep the heatspreader temperature
Optional eMMC Drive soldered on-board in the range indicated.
Networking Gigabit Ethernet interface
1 x USB 3.0 Host port
USB
6 x USB 2.0 Host ports (one shared with USB 3.0 interface)
www.seco.com www.seco.com
16Qseven ®
Qseven ®
Qseven® Rel. 2.1 compliant module with NXP i.MX 8M
Q7-C25 Applications Processors
Qseven® solution for next generation embedded systems
HIGHLIGHTS
CONNECTIVITY
CPU
2x USB 3.0; CSI camera connector; 1x CAN Bus;
NXP i.MX 8M Applications Processors
2xI2C Bus; 8x GPI/Os
GRAPHICS MEMORY
Integrated GPU, supports 2 independent displays up to 8GB soldered down DDR4-2400 memory
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Digital Signage - Home Multimedia Transportation Vending
Infotainment Automation devices
FEATURES
NXP i.MX 8M Family based on ARM Cortex®-A53 cores + Audio I2S Audio Interface
general purpose Cortex®-M4 processor:
• i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz 1x UART Tx/Rx/RTS/CTS
Processor Serial Ports
• i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz 1x CAN Bus (TTL level)
• i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no
CSI camera connector
VPU
2x I2C Bus
Soldered Down DDR4-2400 memory, 32-bit interface, up to Other SPI interface
Memory
8GB Interfaces 8 x GPI/Os
Integrated Graphics Processing Unit, supports 2 Power Management Signals
independent displays Watchdog
Embedded VPU, supports HW decoding of HEVC (H.265), Power +5VDC ±5%
Graphics H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, Supply +3.3V_RTC
VP8, VP9, JPEG
Operating Linux
Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan,
System Android
DirectX, Open VG 1.1
Operating 0°C ÷ +60°C (Commercial version)
Video HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
Temperature* -40°C ÷ +85°C (Industrial version)
Interfaces 18- / 24-bit Dual Channel LVDS interface
Video HDMI: up to 4096 x 2160p60 Dimensions 70 x 70 mm (2.76” x 2.76”)
Resolution LVDS: up to 1920 x 1080 @ 60Hz
eMMC 5.0 drive soldered on-board *Measured at any point of SECO standard heatspreader for this product, during
Mass Storage SD 4-bit interface any and all times (including start-up). Actual temperature will widely depend on
QSPI Flash soldered-onboard application, enclosure and/or environment. Upon customer to consider application-
specific cooling solutions for the final system to keep the heatspreader temperature
Networking 1 x Gigabit Ethernet interface in the range indicated.
2 x USB 2.0 Host Ports
USB 2 x USB 3.0 Host Ports
1 x USB 2.0 OTG port
PCI-e 2x PCI-e x1 ports
www.seco.com
17Qseven ®
®
Q7-C26 Qseven® Rel. 2.1 compliant module with NXP i.MX 8 Applications Processors
Take advantage of the wide scalability offered by Qseven® form factor
and the i.MX 8 family
HIGHLIGHTS
CONNECTIVITY
CPU
1x USB 3.0; PCI-e x1 Gen3; CSI camera connector;
NXP i.MX 8 Applications Processors
Boot select signal
GRAPHICS MEMORY
Integrated GPU, supports 2 independent displays soldered down LPDDR4-3200 memory
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Biomedical/ Digital Signage - Industrial Smart Vision Vending
Medical devices Infotainment automation and
control
FEATURES
NXP i.MX 8 Family: Audio I2S Audio Interface
• i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53
cores + 2x Cortex®-M4F cores 1x UART Tx/Rx/RTS/CTS
Processor Serial Ports
• i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 1x CAN Bus (TTL level)
cores + 2x Cortex®-M4F cores
CSI camera connector
• i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
2x I2C Bus
Memory Soldered Down LPDDR4-3200 memory, 64-bit interface SPI interface
Other
8 x GPI/Os
Interfaces
Integrated Graphics Processing Unit, supports 2 independent Boot select signal
displays. Power Management Signals
Embedded VPU, supports HW decoding of HEVC/H.265, Watchdog
Graphics
AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, Power +5VDC ±5%
HW encoding of AVC/H.264 Supply +3.3V_RTC
Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11
Operating Linux
Video HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2 System Android
Interfaces Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface
Operating 0°C ÷ +60°C (Commercial version)
Video HDMI: Up to 4Kp60 Temperature* -40°C ÷ +85°C (Industrial version)
Resolution LVDS: Up to 1080p
1x SATA Gen3 interface (alternative to 1x PCI-e x1 port) Dimensions 70 x 70 mm (2.76” x 2.76”)
eMMC 5.1 drive soldered on-board
Mass Storage *Measured at any point of SECO standard heatspreader for this product, during
SD 4-bit interface
QSPI Flash soldered-on-board any and all times (including start-up). Actual temperature will widely depend on
application, enclosure and/or environment. Upon customer to consider application-
Networking 1 x Gigabit Ethernet interface specific cooling solutions for the final system to keep the heatspreader temperature
in the range indicated.
4 x USB 2.0 Host Ports
USB 1 x USB 3.0 Host Port
1 x USB 2.0 OTG port
PCI-e Up to 2x PCI-e x1 Gen3 ports
www.seco.com www.seco.com
18Qseven ®
Qseven ®
Q7-928 Qseven® standard module with NXP i.MX 6 Processor
Optimal balance of performance and power
HIGHLIGHTS
CPU
CONNECTIVITY
Single-, Dual- and Quad- Core (ARM® Cortex® -A9
2x serial ports; CAN port
Cores)
GRAPHICS MEMORY
2D/3D dedicated graphics processors up to 4GB DDR3L on-board
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Automotive Avionics Digital Energy Industrial Robotics Surveillance Transportation
Signage - Automation
Infotainment and Control
FEATURES
NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors AC’97 Audio interface
Audio
- i.MX6S Solo - Single core up to 1GHz I2S
- i.MX6DL Dual Lite - Dual core up to 1GHz per core 2 x Serial ports (TTL interface)
Processor Serial Ports
- i.MX6D Dual - Dual core up to 1GHz per core CAN port interface
- i.MX6DP DualPlus - Dual core up to 1GHz per core
- i.MX6Q Quad - Quad core up to 1GHz per core I2C Bus
Other LPC Bus
Max Cores 4 Interfaces SM Bus
Power Management Signals
Memory Up to 4GB DDR3L on-board (up to 2GB with i.MX6S) Power
+5VDC ± 5%
Dedicated 2D Hardware accelerator Supply
Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D Linux
Operating
Dedicated Vector Graphics accelerator supports OpenVG™ Yocto
System
(only i.MX6D, i.MX6DP and i.MX6Q) Microsoft® Windows Embedded Compact 7
Graphics
Enhanced 2D and 3D graphics with i.MX6DP Operating 0°C ÷ +60°C (Commercial version)
Supports up to 3 independent displays with i.MX6D, i.MX6DP
Temperature* -40°C ÷ +85°C (Industrial version)
and i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S Dimensions 70 x 70 mm (2.76” x 2.76”)
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24
Video bit interface *Measured at any point of SECO standard heatspreader for this product, during
Interfaces HDMI Interface 1.4 any and all times (including start-up). Actual temperature will widely depend on
Video Input Port / Camera Connector application, enclosure and/or environment. Upon customer to consider application-
specific cooling solutions for the final system to keep the heatspreader temperature
Video LVDS, up to 1920x1200
in the range indicated.
Resolution HDMI, up to 1080p
On-board eMMC drive, up to 32 GB
SD / MMC / SDIO interface
Mass Storage
1 x μSD Card Slot on-board
1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
Networking Gigabit Ethernet interface
1 x USB OTG interface
USB
4 x USB 2.0 Host interfaces
PCI-e 1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
www.seco.com
19Qseven ®
®
Q7-922 Qseven® standard module with NVIDIA® Tegra® T30 Processor
High performance graphics, low power solution
HIGHLIGHTS
CPU
CONNECTIVITY
ARM® CORTEX -A9 Quad MPCore® CPU, 1.3 GHz
6x USB 2.0
per core
GRAPHICS MEMORY
NVIDIA GeForce Ultra low power GPU up to 2GB DDR3L on-board soldered memory
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Digital Signage - Gaming Thin client
Infotainment
FEATURES
NVIDIA® Tegra® T30 with Quad ARM® CORTEX-A9 MPCore® I2C, SM Bus, LPC, SPI
Processor
CPU, 1.3GHz per Core Other One Wire Interface
Interfaces Thermal Cooling Interface
Max Cores 4 Power management signals
Memory Up to 2 GB DDR3 on-board soldered memory Power
+5VDC ± 5%
Supply
Embedded NVIDIA® ULP GeForce® GPU Operating
Graphics Integrated High Definition Audio-Video Processor Linux
System
Dual independent display support
Operating 0°C ÷ +60°C (Commercial version)
LVDS Single / Dual Channel 18 / 24 Bit interface Temperature* -20°C ÷ +70°C (Extended version)
Video
HDMI 1.4a Interface
Interfaces
Video Input Port / Camera Connector Dimensions 70 x 70 mm (2.76” x 2.76”)
Video HDMI: up to 1920 x 1080p
*Measured at any point of SECO standard heatspreader for this product, during
Resolution LVDS: up to 2048 x 1536
any and all times (including start-up). Actual temperature will widely depend on
Up to 16 GB on-board soldered eMMC drive application, enclosure and/or environment. Upon customer to consider application-
1 x SATA Channel specific cooling solutions for the final system to keep the heatspreader temperature
Mass Storage
microSD Slot on-board in the range indicated.
4-bit SD / MMC interface
Networking Gigabit Ethernet interface
USB 6 x USB 2.0 Host ports
1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
PCI-e
(with support for 2 x PCI-e x1 devices)
Audio HD Audio Interface
2 serial ports (Tx, Rx signals)
Serial Ports
CAN Bus Interface
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20μQseven
μQseven ®®
μQseven® standard module with the Intel® Atom™ E3800 and Celeron®
μQ7-A76-J families (formerly Bay Trail)
Smallest x86 standard module at proprietary costs
HIGHLIGHTS
CPU CONNECTIVITY
Intel® Atom™ E3800 and Celeron® families 4x USB 2.0; 1x USB 3.0; 3x PCI-e x1; LPC Bus
GRAPHICS MEMORY
Integrated Intel® HD Graphics 4000 Series controller up to 4GB Single Channel DDR3L memory
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Biomedical/ Industrial Internet of PDA Robotics Surveillance Transportation
Medical Automation Things Electronics
devices and Control
FEATURES
Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP I2C Bus
Processor Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP LPC Bus
Other
Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP SM Bus
Interfaces
Thermal / FAN management
Max Cores 2 Power Management Signals
Max Thread 2 Power
+5VDC ± 5%
Supply
Soldered on-board DDR3L memory Microsoft® Windows 7
Memory E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz Microsoft® Windows 8.1
N2807: up to 4GB Single-Channel DDR3L @ 1333MHz Microsoft® Windows 10
Integrated Intel® HD Graphics 4000 series controller Microsoft® Windows 10 IoT
Operating
Dual independent display support Microsoft® Windows Embedded Standard 7
Graphics System
HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats Microsoft® Windows Embedded Standard 8
HW encoding of H.264, MPEG2 and MVC formats Microsoft® Windows Embedded Compact 7
Linux
Video Multimode Display Port interface
Yocto
Interfaces 18 / 24 bit dual channel LVDS interface
Operating
Video DP++ (HDMI compatible): Up to 2560x1600@60Hz 0°C ÷ +60°C
Temperature*
Resolution LVDS interface: Up to 1920x1200@60Hz
2 x external SATA channels Dimensions 40 x 70 mm (1.57” x 2.76”)
Mass Storage SD interface
Optional eMMC drive soldered on-board *Measured at any point of SECO standard heatspreader for this product, during
any and all times (including start-up). Actual temperature will widely depend on
Networking Gigabit Ethernet interface application, enclosure and/or environment. Upon customer to consider application-
specific cooling solutions for the final system to keep the heatspreader temperature
1 x USB 3.0 Host port
USB in the range indicated.
4 x USB 2.0 Host ports (one shared with USB 3.0 interface)
PCI-e 3 x PCI-e x1 lanes Gen2
Audio HD Audio interface
Serial Ports 1 x Serial port (TTL interface, Tx / Rx only)
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22μQseven ®
μQseven ®
μQ7-962 μQseven® standard module with NXP i.MX 6 Processor
Optimal balance of performance and size
HIGHLIGHTS
CPU CONNECTIVITY
Single-, Dual- and Quad- Core (ARM® Cortex® -A9 Cores) 4x USB 2.0; 2x Serial ports; CAN Bus
GRAPHICS MEMORY
2D/3D dedicated graphics processors up to 2GB DDR3L on-board
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Automation Biomedical/ HMI PDA Wireless
Medical Electronics Technologies
devices
FEATURES
NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors I2C Bus
Other
- i.MX6S Solo - Single core up to 1GHz SM Bus
Interfaces
Processor - i.MX6DL Dual Lite - Dual core up to 1GHz per core Power Management Signals
- i.MX6D Dual - Dual core up to 1GHz per core Power
- i.MX6Q Quad - Quad core up to 1GHz per core +5VDC ± 5%
Supply
Max Cores 4 Operating Linux
System Yocto
Memory Up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
Operating 0°C ÷ +60°C (Commercial version)
Dedicated 2D Hardware accelerator Temperature* -40°C ÷ +85°C (Industrial version)
Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
Dimensions 40 x 70 mm (1.57” x 2.76”)
Dedicated Vector Graphics accelerator supports OpenVG™
Graphics
(only i.MX6D and i.MX6Q)
Supports up to 3 independent displays with i.MX6D and i.MX6Q *Measured at any point of SECO standard heatspreader for this product, during
Supports 2 independent displays with i.MX6DL and i.MX6S any and all times (including start-up). Actual temperature will widely depend on
application, enclosure and/or environment. Upon customer to consider application-
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 specific cooling solutions for the final system to keep the heatspreader temperature
Video
bit interface in the range indicated.
Interfaces
HDMI Interface 1.4
Video LVDS up to 1920x1200
Resolution HDMI up to 1080p
Up to 8 GB eMMC drive soldered on-board
SD / MMC / SDIO interface
Mass Storage
1 x External SATA Channel (only available with i.MX6D and
i.MX6Q)
Networking Gigabit Ethernet interface
1 x USB OTG interface
USB
4 x USB 2.0 Host interfaces
PCI-e 1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
Audio I2S / AC’97 Audio interface
2 x Serial ports (TTL interface)
Serial Ports
CAN port interface
www.seco.com
23μQseven
μQseven ®®
μQ7-A75-J μQseven® standard module with NXP i.MX 6 Processor
Small, flexibile OTS module at proprietary costs
HIGHLIGHTS
CPU CONNECTIVITY
Single and Dual Core Lite (ARM Cortex™A9 Cores) FastEthernet; GPI/Os
GRAPHICS MEMORY
2D/3D dedicated graphics processors up to 1GB DDR3L on-board
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
HMI Internet of PDA Wireless
Things Electronics Technologies
FEATURES
NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors On the card edge connector, many pins can be used as
Processor - i.MX6S Solo - Single core up to 1GHz General Purpose I / Os or to implement some(*) of the
- i.MX6DL Dual Lite - Dual core up to 1GHz per core following extra functionalities:
- Additional SD interface
Max Cores 2 - Up to 4 UARTs
- CAN interface
Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) Other
Memory - Watchdog(s)
32-bit I/F Interfaces
- I2C interfaces
Dedicated 2D Hardware accelerator - PWM outputs
Graphics Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D - SPI interface
Supports 2 independent displays - Additional Audio interface
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit (*) not all the combinations are allowed simultaneously
Video Power Management Signals
interface
Interfaces
HDMI Interface Power +5VDC ± 5%
Video LVDS, resolution up to 1920x1200 Supply Optional Low Power RTC
Resolution HDMI, resolution up to 1080p Operating Linux
On-board eMMC drive, up to 8 GB System Yocto
Mass Storage SD / MMC / SDIO interface Operating 0°C ÷ +60 °C (Commercial temp.)
Internal SPI Flash for booting Temperature* -40°C ÷ +85°C (Industrial version)
Networking FastEthernet (10 / 100 Mbps) interface Dimensions 40 x 70 mm (1.57” x 2.76”)
1 x USB OTG interface *Measured at any point of SECO standard heatspreader for this product, during
USB
1 x USB 2.0 Host interface any and all times (including start-up). Actual temperature will widely depend on
application, enclosure and/or environment. Upon customer to consider application-
PCI-e 1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
specific cooling solutions for the final system to keep the heatspreader temperature
in the range indicated.
Audio I2S / AC’97 Audio interface
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24Qseven ®
Qseven ®
Carrier Board Carrier Board
CQ7-A42 Carrier Board for Qseven® Rev. 2.0 Compliant modules on 3.5” Form factor
Feature rich for fast Time-to-market
HIGHLIGHTS
3.5” Form Factor Carrier Board for Qseven® Modules
Multiport Video Interfaces
Connectivity oriented
Embedded industrial interfaces
Available in Industrial Temperature Range
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
DEVELOPMENT SAMPLING PRODUCTION
FEATURES
LVDS Dual Channel 24-bit + backlight connectors or 2 x eDP Power +12VDC Mini-fit Standard ATX power connector
Video
connectors Supply Coin cell battery Holder for CMOS and RTC
Interfaces
Multimode Display Port or HDMI Connector Operating
-40°C ÷ +85°C (Industrial temperature range)
1 x SATA connector with HDD Power connector Temperature*
Mass Storage 1 x mSATA Slot
microSD Slot on combo microSD + SIM connector Dimensions 146 x 102 mm (5.75” x 4.02”)
Networking Up to 2 x Gigabit Ethernet connectors *All carrier board components must remain within the operating temperature at
any and all times, including start-up; carrier operating temperature is independent
1 x USB 3.0 Host port on type-A socket of the module installed. Please refer to the specific module for more details. Actual
2 x USB 2.0 Host ports on double Type-A sockets temperature will widely depend on application, enclosure and/or environment.
USB 2 x USB 2.0 Host ports on internal pin header Upon customer to consider specific cooling solutions for the final system.
1 x USB 2.0 OTG port on micro-AB socket (USB port shared
with miniPCI-e slot)
PCI-e miniPCI-e slot Full / Half Size, combined with SIM card slot
Audio Audio interface on internal pin header
4-wire RS-232 / RS-422 / RS-485 configurable serial port on
DB9 male connector
Serial Ports 2 x RS-232 Full-modem serial ports on internal header (need
LPC interface from Qseven® module)
CAN interface on PCB terminal block
SPI internal pin header
LPC Bus internal pin header
SM Bus / I2C GPIO expander, makes available 16 x GPIOs on
internal pin header
Front Panel Header
Other
1 x 28 pin connector for additional features (I2C, ACPI
Interfaces
signals, SM Bus, Watch Dog, Thermal Management)
+12V Tachometric FAN connector
Optional Debug USB port on miniB socket
Optional MFG connector for JTAG programming of Qseven®
module
www.seco.com
25Qseven ®
®
Development Kit
Kit
Q7 DEV KIT 2.0
Cross Platform Development Kit for Qseven® philosophy, compatible with both x86 and
ARM Rev. 2.0 Qseven® modules
Everything you need for flexible development
DEVELOPMENT KIT CONTENTS
The Development kit contains the following material: Module not included. Must be purchased separately
Cross Platform Carrier Board CQ7-A30
LVDS optional Display
One 12VDC Notebook Power Adapter
Add-on modules for LVDS / eDP and HDMI / DP
Cable kit
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
SCHEMATICS
PUBLICLY AVAILABLE
DEVELOPMENT SAMPLING PRODUCTION
FEATURES OF CQ7-A30
Video HDMI / Display Port interface on PCI-e x16 slot Power +12VDC
Interfaces LVDS / eDP interface on PCI-e x8 slot Supply Coin cell battery Holder for CMOS and RTC
SATA Female 7p connector with dedicated Power connector, Operating
interface shared with mSATA Slot 0° C ÷ 60° C
Temperature*
SATA Male 7+15p connector
Mass Storage Dimensions 345 x 170 mm (13.58” x 6.69”)
SD / MMC Card Slot
SPI Flash Socket
I2C EEPROM Socket *All carrier board components must remain within the operating temperature at
any and all times, including start-up; carrier operating temperature is independent
Networking Gigabit Ethernet connector of the module installed. Please refer to the specific module for more details. Actual
temperature will widely depend on application, enclosure and/or environment.
1 x USB 3.0 Host Type-A socket Upon customer to consider specific cooling solutions for the final system.
1 x USB 3.0 OTG micro-AB socket
USB 2 x USB 2.0 Host ports on internal pin header (alternative to
USB 3.0 port #0)
Up to 4 x USB 2.0 Host ports on quad Type-A socket
PCI-e x4 interface on dedicated PCI-e x16 slot shared with 3 x
PCI-e
PCI-e x1 slots + miniPCI-e slot (selection via jumper)
Embedded HD Audio Codec, Realtek ALC888
2 x Triple HD Audio jacks
Audio
2 S / PDIF connectors (In & Out)
Audio Expansion Slot
CAN Bus (both TTL interface and with CAN transceiver)
Serial Ports 3 x RS-232 only ports
2 x RS-232 / RS-422 / RS-485 configurable serial ports
Feature Connector, with I2C , SM Bus, Watchdog, Thermal
and Power Management Signals
LPC Bus Header
SPI Pin Header
Other SIM Card slot
Interfaces 4 x 7-segment LCD displays for POST codes
PS / 2 Mouse / keyboard pin header
2 x tachometric FAN connectors
Debug Port on mini-B USB connector
Power, Reset, LID and Sleep Buttons
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26Qseven ®
Qseven ®
Development Kit Development Kit
Q7 STARTER KIT 2.0
Cross Platform Starter Kit compatible with both x86 and ARM Rev. 2.0 Qseven® modules:
a complete package including the basic components necessary to start developing
Quickly “start” prototyping for short Time-to-market
STARTER KIT CONTENTS
Carrier board for Qseven® Rev. 2.0 compliant Module not included. Must be purchased separately
modules CQ7-A42 (DP or HDMI version)
HD Audio module
I2S Audio module
One 12VDC Notebook Power Adapter
Cable kit
Adapter for mounting a microQ7 module on
standard Qseven carrier boards
Available in Industrial Temperature Range
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
SCHEMATICS
PUBLICLY AVAILABLE
DEVELOPMENT SAMPLING PRODUCTION
FEATURES OF CQ7-A42
LVDS Dual Channel 24-bit + backlight connectors or 2 x eDP Power +12VDC Mini-fit Standard ATX power connector
Video
connectors Supply Coin cell battery Holder for CMOS and RTC
Interfaces
Multimode Display Port or HDMI Connector Operating
-40°C ÷ +85°C (Industrial temperature range)
1 x SATA connector with HDD Power connector Temperature*
Mass Storage 1 x mSATA Slot
microSD Slot on combo microSD + SIM connector Dimensions 146 x 102 mm (5.75” x 4.02”)
Networking Up to 2 x Gigabit Ethernet connectors *All carrier board components must remain within the operating temperature at
any and all times, including start-up; carrier operating temperature is independent
1 x USB 3.0 Host port on type-A socket of the module installed. Please refer to the specific module for more details. Actual
2 x USB 2.0 Host ports on double Type-A sockets temperature will widely depend on application, enclosure and/or environment.
USB 2 x USB 2.0 Host ports on internal pin header Upon customer to consider specific cooling solutions for the final system.
1 x USB 2.0 OTG port on micro-AB socket (USB port shared
with miniPCI-e slot)
PCI-e miniPCI-e slot Full / Half Size, combined with SIM card slot
Audio Audio interface on internal pin header
4-wires RS-232 / RS-422 / RS-485 configurable serial port on
DB9 male connector
Serial Ports 2 x RS-232 Full-modem serial ports on internal header (need
LPC interface from Qseven® module)
CAN interface on PCB terminal block
SPI internal pin header
LPC Bus internal pin header
SM Bus / I2C GPIO expander, makes available 16 x GPIOs on
internal pin header
Front Panel Header
Other
1 x 28 pin connector for additional features (I2C, ACPI
Interfaces
signals, SM Bus, Watch Dog, Thermal Management)
+12V Tachometric FAN connector
Optional Debug USB port on miniB socket
Optional MFG connector for JTAG programming of Qseven®
module
www.seco.com
27SMARC
SMARC STANDARD ADVANTAGES
Extreme Low profile
low power design design
Dedicated battery Up to four Dual Ethernet SMARC
management display Compact
signals interfaces 82×50 mm
COMPUTER-ON-MODULE APPROACH
| Design investment limited to the carrier board | Consolidated Standard form factor |
| Scalable and future-proof | Long-term availability | ARM and x86 cross-compatibility |
| Multi-vendor solution | Highly configurable | Innovative and upgradable | Accelerated time-to-market |
SMARC SUPPORTED FEATURES
System I/O interface # of interfaces System I/O interface # of interfaces
PCI Express lanes 4 I²C Bus 5
Serial ATA channels 1 SPI Bus 2
USB 2.0 ports 6 CAN Bus 2
USB 3.0 ports 2 Watchdog Timer 1
LVDS channels Boot selection signals 3
2
embedded DisplayPort GPIOs 12 (some with alternate functions)
1 dedicated DP++ Reset out and Reset in
DP++ / HDMI
1 shared DP++ / HDMI Power button in
Camera interfaces 2 MIPI CSI Power source status
System and Power Module power state status
High Definition Audio / I2S 1 I2S + 1 shared I2S / HD Audio
management signals System management pins
Ethernet 10/100/1000 Mbps 2 Battery and battery charger
UARTs 2 x 4-Wire + 2 x 2-Wire management pins
Secure Digital I/O 4-bit 1 Carrier Power On control
SECO is one of the founding
members of SGETSMARC
SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N
SM-B69 Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
High performance, low power and feature-rich
HIGHLIGHTS
CPU
CONNECTIVITY
Intel® Atom™ X Series, Intel® Celeron® J / N Series and
2x GbE; 2x USB 3.0; 6x USB 2.0; 4x PCI-e
Intel® Pentium® N Series (formerly Apollo Lake) Processors
GRAPHICS MEMORY
Integrated Gen9-LP HD Graphics controller Dual Channel Soldered Down LPDDR4-2400 memory
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Automotive Biomedical/ Digital Gaming HMI Industrial Internet of Mobile Multimedia Robotics Visual
Medical Signage - Things devices devices Computing
devices Infotainment
FEATURES
Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 6 x USB 2.0 Host Ports
USB
2MB L2 Cache, 12W TDP 2 x USB 3.0 Host Ports
Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz),
2MB L2 Cache, 9.5W TDP PCI-e 4 x PCI-e Root Ports
Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz),
HD Audio interface
2MB L2 Cache, 6.5W TDP Audio
I2S Audio interface
Intel® Pentium® N4200 Quad Core @1.1GHz (burst 2.5GHz),
Processor 2 x HS-UARTs
2MB L2 Cache, 6W TDP Serial Ports
Intel® Celeron® N3350 Dual Core @1.1GHz (burst 2.5GHz), 2 x UARTs
2MB L2 Cache, 6W TDP Up to 12x GPIOs
Intel® Celeron® J3455, Quad Core @ 1.5GHz (Burst 2.3GHz), I2C Bus
2MB L2Cache, 10W TDP SM Bus
Intel® Celeron® J3355, Dual Core @ 2.0GHz (Burst 2.5GHz), Other
2x SPI interfaces
2MB L2Cache,10W TDP Interfaces
LPC Bus
Max Cores 4 FAN management
Power Management Signals
Memory Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB Power
+5VDC and +3.3V_RTC
Supply
Up to 3 independent displays
Microsoft® Windows 10 Enterprise (64 bit)
Integrated Gen9-LP HD Graphics controller, with 18 Execution
Microsoft® Windows 10 IoT Core
Graphics Units Operating
Linux
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, System
Yocto
SVC, MVC
Android
eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
Operating 0°C ÷ +60°C (Commercial version)
through eDP-to-LVDS bridge
Video Temperature* -40°C ÷ +85°C (Industrial version)
HDMI or DP++ interface
Interfaces
DP++ interface Dimensions 50 x 82 mm
2 x CSI interfaces
HDMI, eDP: Up to 3840 x 2160 (4K) *Measured at any point of SECO standard heatspreader for this product, during
Video any and all times (including start-up). Actual temperature will widely depend on
DP++: Up to 4096 x 2160
Resolution application, enclosure and/or environment. Upon customer to consider application-
MIPI-DSI, LVDS: Up to 1920 x 1200
specific cooling solutions for the final system to keep the heatspreader temperature
1 x external S-ATA Gen3 Channel in the range indicated.
Mass Storage SD interface
Optional eMMC 5.0 drive soldered on-board
Up to 2 x Gigabit Ethernet interfaces
Networking
Intel® I210 or I211 Controller (MAC + PHY)
www.seco.com www.seco.com
30SMARC SMARC
SM-C12 SMARC Rel. 2.0 compliant module with NXP i.MX 8M Applications Processors
Standard solution for next generation multimedia applications
HIGHLIGHTS
CONNECTIVITY
CPU
WiFi + BT LE; CSI camera; QuadSPI interface;
NXP i.MX 8M Application Processors
12x GPI/Os
GRAPHICS MEMORY
Integrated Graphics Processing Unit, supports 2 Up to 4GB soldered down LPDDR4-3200 memory,
independent displays 32-bit interface
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Digital Signage - Home Multimedia Transportation Vending
Infotainment Automation devices
FEATURES
NXP i.MX 8M Family based on ARM Cortex®-A53 cores + 1x 4-lanes + 1x 2-lanes CSI camera interfaces
general purpose Cortex®-M4 processor: I2C Bus
• i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz SM Bus
Processor
• i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz Other 2x SPI interfaces
• i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no Interfaces QuadSPI interface
VPU 12 x GPI/Os
Soldered Down LPDDR4-3200 memory, 32-bit interface, Boot select signals
Memory Power Management Signals
up to 4GB
Integrated Graphics Processing Unit, supports 2 Power +5VDC
independent displays Supply +3.3V_RTC
Embedded VPU, supports HW decoding of HEVC (H.265), Operating Linux
Graphics H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, System Android
VP8, VP9, JPEG Operating 0°C ÷ +60°C (Commercial version)
Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, Temperature* -40°C ÷ +85°C (Industrial version)
DirectX, Open VG 1.1
HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4 Dimensions 50 x 82 mm (1.97” x 3.23”)
Video
18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
Interfaces
(factory alternatives) *Measured at any point of SECO standard heatspreader for this product, during
Video HDMI: Up to 4096 x 2160 @ 60 (4K) any and all times (including start-up). Actual temperature will widely depend on
Resolution MIPI-DSI, LVDS: Up to 1920 x 1080 @ 60Hz application, enclosure and/or environment. Upon customer to consider application-
specific cooling solutions for the final system to keep the heatspreader temperature
Optional SD 4-bit interface in the range indicated.
Mass Storage QSPI Flash soldered-onboard
eMMC 5.0 drive soldered on-board
1 x Gigabit Ethernet interface
Networking
Optional WiFi + BT LE module onboard
2 USB 3.0 Host ports
USB 2 USB 2.0 Host ports
1 USB 2.0 OTG port
PCI-e 2x PCI-e x1 ports
Audio I2S Audio Interface
Up to 2x UART Tx/Rx/RTS/CTS
Serial Ports 2x UART Tx/Rx
1x CAN Bus (TTL level)
www.seco.com
31SMARC
SM-B71 SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC
Flexibile ARM + FPGA Heterogeneous Processing in a Standard Form Factor
HIGHLIGHTS
CPU
CONNECTIVITY
Xilinx® Zynq® Ultrascale+™ CG/EG/EV MPSoCs in
PCI-e x4; 2x GbE; 2x CAN Bus; 2x SPI; 12x GPI/Os
C784 package
GRAPHICS MEMORY
Integrated ARM Mali-400 MP2 GPU Up to 8GB + 2GB DDR4 soldered down
Available in Industrial Temperature Range
DEVELOPMENT SAMPLING PRODUCTION
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION
Automotive Avionics Biomedical/ Industrial Internet of Robotics Telco Visual
Medical devices Automation and Things Computing
Control
FEATURES
Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG 2 x UART Tx/Rx/RTS/CTS
MPSoCs: Serial Ports 2 x UART Tx/Rx
Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit + 2 x CAN Bus
Dual-core ARM® Cortex®-R5 Real-Time Processing Unit 2x I2C Bus
Processor 2 x SPI interfaces
Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, Other
12 x GPI/Os
ZU4EV or ZU5EV MPSoCs: Interfaces
Boot select signals
Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit + Power Management Signals
Dual-core ARM® Cortex®-R5 Real-Time Processing Unit
Power +3÷+5.25VDC
Soldered Down DDR4-2400 memory Supply +3.3V_RTC
Memory Up to 8GB for Processing System Unit + up to 2GB for
Programmable Logic Operating Linux
System Android
Only on EG and EV MPSOcs:
Integrated ARM Mali-400 MP2 Graphics Processing Unit Operating 0°C ÷ +60°C (Commercial version)
Graphics Multicore 2D/3D acceleration at 667MHz Temperature* -40°C ÷ +85°C (Industrial version)
OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
On EV MPSoCs only, H.264/H.265 integrated video codec Dimensions 50 x 82 mm (1.97” x 3.23”)
18- / 24-bit Dual Channel LVDS interface *Measured at any point of SECO standard heatspreader for this product, during
Video
DP interface any and all times (including start-up). Actual temperature will widely depend on
Interfaces
2 x CSI interfaces application, enclosure and/or environment. Upon customer to consider application-
DP: Up to 4096 x 2160 specific cooling solutions for the final system to keep the heatspreader temperature
Video in the range indicated.
LVDS: Dependent on the IP implemented in the
Resolution
programmable logic
1 x external S-ATA Gen3 Channel
SD interface
Mass Storage
QSPI Flash soldered-onboard
Optional eMMC 4.51 drive soldered on-board
Networking Up to 2 x Gigabit Ethernet interfaces
1x USB 2.0 OTG
USB 2x USB 2.0 Host
2x USB 3.0 Host
PCI-e PCI-e x4 interface
Audio Dependent on the IP implemented in the programmable logic
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32SMARC SMARC
Carrier Board Carrier Board
CSM-B79 SMARC 2.0 evaluation carrier board
Cross Platform Philosophy Carrier Board for SMARC Rel. 2.0 compliant module
HIGHLIGHTS
Cross Platform Philosophy Carrier Board for SMARC
Rel. 2.0 compliant module, compatible with both x86
and ARM architectures
Improve the development experience of your SMARC
Rel. 2.0 compliant module
Available in Industrial Temperature Range
Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
DEVELOPMENT SAMPLING PRODUCTION
FEATURES
LVDS connector, interface shared with 2 x eDP/DSI connectors eSPI pin header + Flash Socket
Backlight control + LCD selectable voltages dedicated SPI pin header + Flash Socket
connector I2C EEPROM Socket
Video
DP++ dedicated connector 4 x 7-segment LCD displays for POST codes
Interfaces
HDMI connector (interface shared with USB 3.1 Type-C Feature pin header with 8x GPIOs, I2C, SM Bus, Watchdog
alternate mode port) Other and Power Management Signals
2x CSI Camera input interfaces Interfaces 4x GPIOs dedicated connector
SATA M 7p connector with dedicated power connector, FAN connector
Mass Storage interface shared with M.2 Socket 2 2242 / 2260 Key B SSD slot RTC Coin cell battery holder
microSD Card Slot Optional Debug USB port on mini-B Socket
Boot selection switches
2 x RJ-45 Gigabit Ethernet connectors JTAG connector
M.2 Socket1 2230 Key E Slot for WiFi Modules (interface
shared with PCI-e x 4 slot) 9-21V through dedicated Mini-Fit Jr 2x2 power connector or
Networking Power
M.2 Socket2 2260 Key E Slot for WWAN Modem Modules USB Type-C connector
Supply
(interface shared with PCI-e x 4 slot), connected to on-board 6-17V through 2/3/4 Cell Smart Battery Connector
microSIM slot Operating
-40°C ÷ +85°C
1 x USB 3.0 type A Socket Temperature*
1 x USB 2.0 type A Socket Dimensions 345 x 170mm (13.58” x 6.69”)
USB Ports 1 x USB OTG micro-AB Socket
1 x USB 3.1 Type-C Socket, with Alternate Mode and Power
Delivery functionality *All carrier board components must remain within the operating temperature at
PCI-e x4 slot, interface shared with 2 x PCI-e x1 Slot and M.2 any and all times, including start-up; carrier operating temperature is independent
PCI-e of the module installed. Please refer to the specific module for more details. Actual
Slots
temperature will widely depend on application, enclosure and/or environment.
Mic In Jack, Line Out Jack Upon customer to consider specific cooling solutions for the final system.
Audio Onboard I2S Audio Codec (TI TLV320AIC3204) + HD Audio
Codec (Cirrus Logic CS4207)
2 x CAN ports
2 x RS-232/RS-422/RS-485 configurable serial ports on
Serial Ports internal pin header
2 x Serial ports (Tx/Rx signals only, TTL level) on feature pin
header
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