PRODUCT GUIDE 2019

 
 
PRODUCT GUIDE 2019
PRODUCT
GUIDE
      2019
PRODUCT GUIDE 2019
PRODUCT GUIDE 2019
PRO DUCT GUIDE
PRODUCT GUIDE 2019
PRODUCT GUIDE 2019
INDEX

Qseven®                          ETX®
Q7-B03               p. 14       ETX-A61                 p. 50
Q7-974               p. 15
Q7-A36               p. 16
Q7-C25               p. 17       Single Board Computer
Q7-C26               p. 18       SBC-B68-eNUC            p. 54
Q7-928               p. 19       SBC-A80-eNUC            p. 55
Q7-922               p. 20       SBC-C41-pITX            p. 56
μQseven®                         SBC-A44-pITX            p. 57
                                 SBC-992-pITX            p. 58
μQ7-A76-J            p. 22
                                 SBC-C61                 p. 59
μQ7-962              p. 23
                                 SBC-C20                 p. 60
μQ7-A75-J            p. 24
                                 SBC-C43                 p. 61
Carrier Board
                                 SBC-C23                 p. 62
CQ7-A42              p. 25       SBC-A62-J               p. 63
 Development Kit                 SBC-B08                 p. 64
                                 SBC-984                 p. 65
Q7 DEV KIT 2.0       p. 26
Q7 STARTER KIT 2.0   p. 27
                                 Modular HMI & Boxed Solutions
SMARC                            SYS-A62-10
                                 SYS-B08-7
                                                         p. 68
                                                         p. 69
SM-B69               p. 30       SYS-B68-IPC             p. 70
SM-C12               p. 31       SYS-A90-IPC             p. 71
SM-B71               p. 32
Carrier Board

CSM-B79              p. 33


COM Express™
COMe-B75-CT6         p. 36
COMe-A98-CT6         p. 37
COMe-C55-CT6         p. 38
COMe-C24-CT6         p. 39
COMe-A41-CT6         p. 40
COMe-A81-CT6         p. 41
COMe-C08-BT6         p. 42
COMe-B09-BT6         p. 43
COMe-953-BT6         p. 44
Carrier Board

CCOMe-C30            p. 45
CCOMe-965            p. 46
PRODUCT GUIDE 2019
SECO GROUP: YOUR TECHNOLOGY PARTNER

        SECO group designs and manufactures embedded systems all in-house.

    SECO offers a wide range of standard modules, SBCs, systems and custom solutions to leverage
  innovative, state-of-the-art technologies. Thanks to its drive for continuous evolution and relying on its
 strong know-how, SECO responds to new challenging market demands with cutting edge solutions, and
                                  a strong focus on the Internet of Things.




SECO AT A GLANCE




SECO STRENGTHS

                              Product reliability:
                                                                       Design: creativity and innovation with a strong
        Product validation & verification support
                                                                       x86 & ARM R&D department
                         Product design support

                Reliable and safe                                                   In-house manufacturing
              embedded solutions                             KNO
                                                       TY       W
                                                     LI
                                               A




                                                                 -H




 Process reliability in terms
                                             QU




                                                                                             System integration
                                                                   OW




    of cost, time, resources
                                                                     I
                                                 Y




                                                                                             Partnership with
                                                                      N




        Customer oriented                               GROUP
                                              LIT




                                                                       N




        process & services                                                                   the most important
                                                                        OV




                                                                                             technological players
                                            BI




                                                         I   AT
                                                               ION
                                                     FLEX
      Experience in a broad range                                                   Collaboration with important
               of vertical markets                                                  research institutes


                            Products expertise:
                       Modules, boards, systems                              To study the future in order to anticipate
                                                                             and intercept the needs of the customer
PRODUCT GUIDE 2019
KNOW-HOW

                DESIGN                           MANUFACTURING                                SYSTEMS
                                                          In-house manufacturing.
                  Extensive experience in                                                           Design and integration
                                                          Lean Manufacturing
                  Micro Computer design,                                                            of Micro Computers with
                                                          employed to reduce
                  both Hardware and                                                                 video interfaces and
                                                          waste and accelerate the
                  Software-wise                                                                     mechanical design
                                                          time to market




 Analysis & Design         FPGA design            BIOS             Hardware            Software             Mechanical
                                               Engineering        Engineering        development            Engineering
                                              & Development      & Development                             & Development




   Signal Integrity     Drivers Engineering       BSP              Firmware          Validation &              Thermal
                          & Development                           Development        Verification              Analysis




PRODUCT LINES

              STANDARD                             SEMI-CUSTOM                           FULL-CUSTOM
              PRODUCTS                              SOLUTIONS                             SOLUTIONS

         MODULAR SOLUTIONS                    CUSTOM CARRIER BOARDS +                 END-TO-END “TAILORED”
                                                MODULAR SOLUTIONS                          SOLUTIONS:
                                                                                        Full support from concept
                                                                                       development to the complete
                                                                                              system solution
        Qseven®                 COM
                              Express™



                                                     MODULAR HMI &
        SMARC                 ETX /XTX
                                 ®                  BOXED SOLUTIONS



     SINGLE BOARD COMPUTERS




   Embedded NUC™              Pico-ITX



Beyond the long-established and consistent hardware product portfolio, SECO GROUP offers custom design,
system integration, and a range of multi-sector, customer centric services, such as BIOS customization,
surface treatments, PCB specific certifications for industry requirements like transportation, amongst others.
SECO GROUP manages the entire production cycle in-house, from the development and design stage to
manufacturing to mass distribution. SECO GROUP always aims to serve as a true collaborative technology
partner for its customers’ special projects.
PRODUCT GUIDE 2019
SERVICES

 YOUR TECHNOLOGY PARTNER FOR CUSTOMIZED COMPUTING PLATFORMS
| Design review | Off-the shelf SBCs customization | Carrier board design for modular computing platforms |
| Full custom SBC design | x86, ARM & FPGA know-how | Secure your design & production in our HQ - Italy |




        Design Review           x86, ARM, FPGA Know-How &            Secure your design and          Let us design your product
                                    cross-platform design                  production




          YOUR TECHNOLOGY PARTNER FOR SOFTWARE CUSTOMIZATION
   | Customized BIOS | Firmware & driver development | BSP development | Long-term support |




         BIOS tuning                 Linux BSP & Android            Firmware & driver support    We take care of your project,
                                         development                                                 with lifetime support




            YOUR TECHNOLOGY PARTNER FOR SYSTEMS AND ASSEMBLY

| Software pre-installed on your system | Assembly services | Design and production of your boxed solution |
                 | Touch-display solutions | Design and production of your final product |




     Software preloaded                Boxed solutions                    Touch displays                 Displays assembly




 YOUR TECHNOLOGY PARTNER FOR THE INDUSTRIAL INTERNET OF THINGS
            EVERYTHING YOU NEED TO POWER YOUR IoT PRODUCT, FROM DEVICE TO CLOUD




   Prototyping Tools      Industrial IoT Hardware          Connectivity           IoT Device Cloud               IoT Apps
PRODUCT GUIDE 2019
PARTNERSHIPS

  WORLDWIDE SILICON VENDORS                                                                  OPERATING SYSTEMS




                 STANDARDS & CONSORTIUM




CERTIFICATIONS

                              Certified UNI                UNI EN ISO 14001
                              EN ISO - 9001:2015           (in progress)




MAIN FIELDS OF APPLICATION

 SECO’s solutions today can be found at the heart of the most sophisticated and diverse products throughout
 various industries, such as traditional uses in industrial automation, biomedical devices, digital signage and
 across more modern applications like the Internet of Things and robotics.




 Automation          Automotive                      Avionics              Biomedical/Medical    Digital signage -        Edge           E - health
                                                                                devices           Infotainment          Computing        Telecare




   Energy              Fitness                       Gaming                       HMI                Home                 Home           Industrial
                      Equipment                                                                    Automation         Entertainment   Automation and
                                                                                                                                          Control




 Info Kiosks       Internet of Things                In-Vehicle                Measuring         Mobile devices         Multimedia    PDA Electronics
                                                   Infotainment               instruments                                devices
                                                      Systems




Point of Sales         Portable                      Robotics                 Surveillance            Telco            Thin clients   Transportation
                       devices




  Vending         Visual Computing                   Wireless                  Makers &                       maker boards
                                                   Technologies                Education                      by SECO
PRODUCT GUIDE 2019
Qseven
     ®
QSEVEN® STANDARD ADVANTAGES




                     Cost effective                    Low power                          Compact
                    solution for high                 consumption                        form factor
                    volume projects




                                                                        High speed                       Qseven:
      Low profile                   Excellent for
                                                                        MXM edge                       70 x 70 mm
        design                      IoT projects
                                                                        connector                       μQseven:
                                                                                                       40 x 70 mm




               COMPUTER-ON-MODULE APPROACH

           | Design investment limited to the carrier board | Consolidated Standard form factor |
         | Scalable and future-proof | Long-term availability | ARM and x86 cross-compatibility |
| Multi-vendor solution | Highly configurable | Innovative and upgradable | Accelerated time-to-market |




                                                    SECO is one of the founding members of SGET and
                                                    a co-founder of the Qseven® standard
Qseven
                                                  Qseven®
                                                           ® Features
                                                          standard     Overview
                                                                   specifications

                                                                          70 mm - 2,76”



                                                                                                                           Qseven
                                                                                                                         70 mm - 2,76”




                                        x86




                                                                                                                          μQseven
                                Also available                                                                           40 mm - 1,57”
                                  in Industrial
                           temperature range,
                              -40°C ÷ +85°C




                                                                                                    ®




                                                                                                        Audio
                                                                                                                    GBE




                                     Qseven® Rev. 2.1 Supported Features
The Qseven® mandatory and optional features. The table shows the minimum and maximum required
configuration of the feature set.

                              ARM/RISC            X86 Based                                                      ARM/RISC          X86 Based
System I/O Interface            Based                Min         Max Config.              System I/O Interface     Based              Min      Max Config.
                              Min Config.          Config.                                                       Min Config.        Config.
PCI Express lanes                     0            1 (x1 link)        4                   I²C Bus                    1                   1         1

Serial ATA channels                   0                0              2                   SPI Bus                    0                   0         1

USB 2.0 ports                         3                4              8                   CAN Bus                    0                   0         1

USB 3.0 ports                         0                0              3                   Watchdog Trigger           1                   1         1
                                                                 Dual Channel             Power Button               1                   1         1
LVDS channels                         0                0
                                                                   24 bits
Embedded                                                                                  Power Good                 1                   1         1
                                      0                0              2
DisplayPort
                                                                                          Reset Button               1                   1         1
DisplayPort, TMDS                     0                0              1
                                                                                          LID Button                 0                   0         1
High Definition
                                      0                0              1
Audio / I2S                                                                               Sleep Button               0                   0         1
Ethernet 10/100                                                   1 (Gigabit
                                      0                0                                  Suspend To RAM
Mbit/Gigabit                                                      Ethernet)                                          0                   0         1
                                                                                          (S3 mode)
UART                                  0                0              1
                                                                                          Wake                       0                   0         1
Low Pin Count bus                     0                0              1
                                                                                          Battery low alarm          0                   0         1
Secure Digital I/O 4-bit
                                      0                0              1
for SD/MMC cards                                                                          Thermal control            0                   0         1
System Management
                                      0                1              1                   FAN control                0                   0         1
Bus
Qseven                  ®
                             ®




                                   Qseven® Rel. 2.1 compliant module with the Intel® Atom™ X Series,
     Q7-B03                        Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors


     High graphics performance and extreme temperature for low power designs
                                                           HIGHLIGHTS

                                                                    CPU
                                                                                                                                      CONNECTIVITY
                                                                    Intel® Atom™ X Series, Intel® Celeron® J / N Series and
                                                                                                                                      2x USB 3.0; 4x PCI-e; 6x USB 2.0
                                                                    Intel® Pentium® N Series


                                                                    GRAPHICS                                                          MEMORY
                                                                    Integrated Gen9-LP Graphics controller                            up to 8GB Dual-Channel DDR3L-1866


                                                              Available in Industrial Temperature Range




     DEVELOPMENT     SAMPLING        PRODUCTION




                                                                                                                                                                                         Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
     MAIN FIELDS OF APPLICATION




      Automotive     Biomedical/          Digital         Gaming               HMI              Industrial          Internet of        Mobile           Multimedia          Visual
                       Medical          Signage -                                                                     Things           devices           devices          Computing
                       devices        Infotainment
     FEATURES
                      Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz),                                         6 x USB 2.0 Host Ports
                      2MB L2 Cache, 6.5W TDP                                                                           2 x USB 3.0 Host Ports (*)
                      Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz),                       USB
                      2MB L2 Cache, 9.5W TDP                                                                           (*) Second USB 3.0 Host port can be exploited only using
                      Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz),                                         Qseven® Rel. 2.1 compliant Carrier boards
                      2MB L2 Cache, 12W TDP                                                                            4 x PCI-e Root Ports (including the PCI-e port used for Gigabit
                      Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz),                        PCI-e
        Processor                                                                                                      Ethernet controller)
                      2MB L2 Cache, 6W TDP
                      Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz),                        Audio             HD Audio interface
                      2MB L2 Cache, 6W TDP
                      Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz),                       Serial Ports      1 x UART, TTL interface
                      2MB L2Cache, 10W TDP
                      Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz),                                         I2C Bus
                      2MB L2Cache, 10W TDP                                                                             LPC Bus
                                                                                                                       SM Bus
        Max Cores     4                                                                              Other
                                                                                                                       SPI interface
                                                                                                     Interfaces
                                                                                                                       Watch Dog Timer
        Max Thread    4                                                                                                Thermal / FAN management
                                                                                                                       Power Management Signals
        Memory        Dual Channel Soldered Down DDR3L-1866 memory, up to 8GB
                                                                                                     Power
                                                                                                                       +5VDC and +5VSB (optional)
                      Integrated Gen9-LP Graphics controller, with 18 Execution Units                Supply
        Graphics      4K HW decoding and encoding of HEVC(H.265), H.264, VP8,                                          Microsoft® Windows 10 Enterprise (64 bit)
                      SVC, MVC                                                                                         Microsoft® Windows 10 IoT Core
                                                                                                     Operating
                      eDP interface or Single/Dual Channel 18/24bit LVDS interface                                     Wind River Linux (64 bit)
        Video                                                                                        System
                      through eDP-to-LVDS bridge                                                                       Yocto (64 bit)
        Interfaces                                                                                                     Android (planning)
                      HDMI or DP++ interface
                      DP:             Up to 4096 x 2160 @60HZ                                        Operating      0°C ÷ +60°C (Commercial version)
        Video         eDP:            Up to 3840 x 2160 @60Hz                                        Temperature* -40°C ÷ +85°C (Industrial version)
        Resolution    HDMI:           Up to 3840 x 2160 @30Hz
                                                                                                     Dimensions        70 x 70 mm (2.76” x 2.76”)
                      LVDS, VGA:      Up to 1920 x 1200 @ 60Hz
                     2 x external S-ATA Gen3 Channel                                           *Measured at any point of SECO standard heatspreader for this product, during
        Mass Storage SD interface                                                              any and all times (including start-up). Actual temperature will widely depend on
                     Optional eMMC drive soldered onboard                                      application, enclosure and/or environment. Upon customer to consider application-
                      Gigabit Ethernet interface                                               specific cooling solutions for the final system to keep the heatspreader temperature
        Networking                                                                             in the range indicated.
                      Intel® I210 or I211 Controller (MAC + PHY)




     www.seco.com                                                                                                                                              www.seco.com

14
Qseven                  ®
                                                                                                                                                  Qseven                    ®




                                              Qseven® standard module with the Intel® Atom™ E3800 and Celeron®
Q7-974                                        families (formerly Bay Trail) SoC


x86 performance on a low-power module
                                                     HIGHLIGHTS

                                                                CPU
                                                                                                                               CONNECTIVITY
                                                                Intel® Atom™ E3800 and Celeron® families
                                                                                                                               6x USB 2.0; 1x USB 3.0; 3x PCI-e x1
                                                                of System-on-Chip


                                                                GRAPHICS                                                       MEMORY
                                                                Integrated Intel® HD Graphics controller                       up to 8GB Dual-Channel DDR3L 1333MHz


                                                        Available in Industrial Temperature Range




DEVELOPMENT     SAMPLING       PRODUCTION




                                                                                                                                                                                       Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION




                                               Biomedical/                HMI               Industrial           Measuring
                                              Medical devices                            Automation and         Instruments
                                                                                             Control
FEATURES
                 Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP                      PCI-e          3 x PCI-e x1 lanes
                 Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
                 Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
                                                                                                 Audio          HD Audio interface
                 Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
   Processor
                 Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
                                                                                                 Serial Ports   1 x Serial port (TTL interface)
                 Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
                 Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP                                 I2C Bus
                 Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP                                 LPC Bus
                                                                                                 Other          SM Bus
   Max Cores     4
                                                                                                 Interfaces     Thermal / FAN management
                                                                                                                SPI interface
   Max Thread    4
                                                                                                                Power Management Signals
                 Soldered on-board DDR3L memory                                                  Power
                 E3845, E3827, J1900, N2930: up to 8GB Dual-Channel                                             +5VDC ± 5%
                                                                                                 Supply
                 DDR3L @ 1333MHz
   Memory                                                                                                       Microsoft® Windows 7 (32 / 64 bit)
                 E3826: up to 8GB Dual-Channel DDR3L @ 1066MHz
                                                                                                                Microsoft® Windows 8.1 (32 / 64 bit)
                 N2807: up to 4GB Single-Channel DDR3L @ 1333MHz
                                                                                                                Microsoft® Windows 10 (32 / 64 bit)
                 E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz
                                                                                                                Microsoft® Windows 10 IoT
                 Integrated Intel® HD Graphics 4000 series controller                            Operating
                                                                                                                Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
                 Dual independent display support                                                System
   Graphics                                                                                                     Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
                 HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats                                      Microsoft® Windows Embedded Compact 7
                 HW encoding of H.264, MPEG2 and MVC formats                                                    Linux (32 / 64 bit)
                 HDMI or Multimode Display Port interface                                                       Yocto
   Video         Embedded Display Port or 18 / 24 bit dual channel LVDS                          Operating    0°C ÷ +60°C (Commercial version)
   Interfaces    interface                                                                       Temperature* -40°C ÷ +85°C (Industrial version)
                 Additional VGA interface (optional external adapter is required)
                                                                                                 Dimensions     70 x 70 mm (2.76” x 2.76”)
                 HDMI:                           Up to 1920x1080p@60Hz
   Video
                 Display Port, eDP, CRT:         Up to 2560x1600@60Hz
   Resolution                                                                              *Measured at any point of SECO standard heatspreader for this product, during
                 Optional LVDS interface:        Up to 1920x1200@60Hz
                                                                                           any and all times (including start-up). Actual temperature will widely depend on
                Up to 2 x external SATA channels                                           application, enclosure and/or environment. Upon customer to consider application-
   Mass Storage SD interface                                                               specific cooling solutions for the final system to keep the heatspreader temperature
                Optional SATA Flash Drive soldered on-board                                in the range indicated.
   Networking    Gigabit Ethernet interface
                 1 x USB 3.0 Host port
   USB
                 6 x USB 2.0 Host ports (one shared with USB 3.0 interface)




                                                                                                                                                        www.seco.com

                                                                                                                                                                                  15
Qseven                  ®
                             ®




                                                     Qseven® standard module with the Intel® Atom™ E3800 and Celeron®
     Q7-A36                                          families (formerly Bay Trail) SoC, with eMMC and Camera Interface


     Mobile-oriented with eMMC and Camera Interface
                                                             HIGHLIGHTS

                                                                      CPU                                                              CONNECTIVITY
                                                                      Intel® Atom™ E3800 and Celeron® families                         6x USB 2.0; 1x USB 3.0; 3x PCI-e x1



                                                                      GRAPHICS                                                         MEMORY
                                                                      Integrated Intel® HD Graphics 4000 Series controller             up to 8GB Dual-Channel DDR3L 1333MHz


                                                                Available in Industrial Temperature Range




     DEVELOPMENT     SAMPLING        PRODUCTION




                                                                                                                                                                                        Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
     MAIN FIELDS OF APPLICATION




                                                              HMI             Industrial          In-vehicle          Portable
                                                                             Automation         infotainment          Devices
                                                                             and Control           systems
     FEATURES
                      Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP                      PCI-e             3 x PCI-e x1 lanes
                      Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
                      Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
                                                                                                      Audio             HD Audio interface
                      Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
        Processor     Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
                                                                                                      Serial Ports      1 x Serial port (TTL interface)
                      Intel® Atom™ E3805, Dual Core @ 1.33GHz, 1MB Cache, 3W TDP
                      Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP                                      I2C Bus
                      Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP                                    LPC Bus
                      Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP                  Other             SM Bus
                                                                                                      Interfaces        Thermal / FAN management
        Max Cores     4
                                                                                                                        SPI interface
                                                                                                                        Power Management Signals
        Max Thread    4
                                                                                                      Power
                      Soldered on-board DDR3L memory                                                                    +5VDC ± 5%
                                                                                                      Supply
                      E3845, E3827, J1900, N2930: up to 8GB Dual-Channel
                                                                                                                        Microsoft® Windows 7 (32 / 64 bit)
                      DDR3L 1333MHz
        Memory                                                                                                          Microsoft® Windows 8.1 (32 / 64 bit)
                      E3826: up to 8GB Dual-Channel DDR3L 1066MHz
                                                                                                                        Microsoft® Windows 10 (32 / 64 bit)
                      N2807: up to 4GB Single-Channel DDR3L 1333MHz
                                                                                                                        Microsoft® Windows 10 IoT
                      E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz                            Operating
                                                                                                                        Microsoft® Windows Embedded Standard 7 (32 / 64 bit)
                      Integrated Intel® HD Graphics 4000 series controller (not for E3805)            System
                                                                                                                        Microsoft® Windows Embedded Standard 8 (32 / 64 bit)
                      Dual independent display support                                                                  Microsoft® Windows Embedded Compact 7
        Graphics
                      HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats                                         Linux (32 / 64 bit)
                      HW encoding of H.264, MPEG2 and MVC formats                                                       Yocto
                      HDMI or Multimode Display Port interface                                        Operating    0°C ÷ +60°C (Commercial version)
        Video
                      Embedded Display Port or 18 / 24 bit dual channel LVDS interface                Temperature* -40°C ÷ +85°C (Industrial version)
        Interfaces
                      Optional Camera interface
                                                                                                      Dimensions        70 x 70 mm (2.76” x 2.76”)
                      HDMI:                              Up to 1920x1080p@60Hz
        Video
                      Display Port, eDP:                 Up to 2560x1600@60Hz
        Resolution                                                                               *Measured at any point of SECO standard heatspreader for this product, during
                      Optional LVDS interface:           Up to 1920x1200@60Hz
                                                                                                 any and all times (including start-up). Actual temperature will widely depend on
                     2 x external SATA channels                                                  application, enclosure and/or environment. Upon customer to consider application-
        Mass Storage SD interface                                                                specific cooling solutions for the final system to keep the heatspreader temperature
                     Optional eMMC Drive soldered on-board                                       in the range indicated.
        Networking    Gigabit Ethernet interface
                      1 x USB 3.0 Host port
        USB
                      6 x USB 2.0 Host ports (one shared with USB 3.0 interface)




     www.seco.com                                                                                                                                               www.seco.com

16
Qseven                   ®
                                                                                                                                                  Qseven                        ®




                                               Qseven® Rel. 2.1 compliant module with NXP i.MX 8M
Q7-C25                                         Applications Processors


Qseven® solution for next generation embedded systems
                                                         HIGHLIGHTS

                                                                                                                                CONNECTIVITY
                                                                CPU
                                                                                                                                2x USB 3.0; CSI camera connector; 1x CAN Bus;
                                                                NXP i.MX 8M Applications Processors
                                                                                                                                2xI2C Bus; 8x GPI/Os


                                                                GRAPHICS                                                        MEMORY
                                                                Integrated GPU, supports 2 independent displays                 up to 8GB soldered down DDR4-2400 memory


                                                          Available in Industrial Temperature Range




DEVELOPMENT     SAMPLING       PRODUCTION




                                                                                                                                                                                         Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION




                                     Digital Signage -       Home                Multimedia           Transportation        Vending
                                      Infotainment         Automation             devices


FEATURES
                 NXP i.MX 8M Family based on ARM Cortex®-A53 cores +                            Audio             I2S Audio Interface
                 general purpose Cortex®-M4 processor:
                 • i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz                                               1x UART Tx/Rx/RTS/CTS
   Processor                                                                                    Serial Ports
                 • i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz                                               1x CAN Bus (TTL level)
                 • i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no
                                                                                                                  CSI camera connector
                 VPU
                                                                                                                  2x I2C Bus
                 Soldered Down DDR4-2400 memory, 32-bit interface, up to                        Other             SPI interface
   Memory
                 8GB                                                                            Interfaces        8 x GPI/Os
                 Integrated Graphics Processing Unit, supports 2                                                  Power Management Signals
                 independent displays                                                                             Watchdog
                 Embedded VPU, supports HW decoding of HEVC (H.265),                            Power             +5VDC ±5%
   Graphics      H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6,                        Supply            +3.3V_RTC
                 VP8, VP9, JPEG
                                                                                                Operating         Linux
                 Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan,
                                                                                                System            Android
                 DirectX, Open VG 1.1
                                                                                                Operating      0°C ÷ +60°C (Commercial version)
   Video         HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
                                                                                                Temperature* -40°C ÷ +85°C (Industrial version)
   Interfaces    18- / 24-bit Dual Channel LVDS interface
   Video         HDMI:        up to 4096 x 2160p60                                              Dimensions        70 x 70 mm (2.76” x 2.76”)
   Resolution    LVDS:        up to 1920 x 1080 @ 60Hz
                eMMC 5.0 drive soldered on-board                                           *Measured at any point of SECO standard heatspreader for this product, during
   Mass Storage SD 4-bit interface                                                         any and all times (including start-up). Actual temperature will widely depend on
                QSPI Flash soldered-onboard                                                application, enclosure and/or environment. Upon customer to consider application-
                                                                                           specific cooling solutions for the final system to keep the heatspreader temperature
   Networking    1 x Gigabit Ethernet interface                                            in the range indicated.

                 2 x USB 2.0 Host Ports
   USB           2 x USB 3.0 Host Ports
                 1 x USB 2.0 OTG port
   PCI-e         2x PCI-e x1 ports




                                                                                                                                                        www.seco.com

                                                                                                                                                                                    17
Qseven                     ®
                                ®




     Q7-C26                                          Qseven® Rel. 2.1 compliant module with NXP i.MX 8 Applications Processors

     Take advantage of the wide scalability offered by Qseven® form factor
     and the i.MX 8 family
                                                             HIGHLIGHTS

                                                                                                                                     CONNECTIVITY
                                                                     CPU
                                                                                                                                     1x USB 3.0; PCI-e x1 Gen3; CSI camera connector;
                                                                     NXP i.MX 8 Applications Processors
                                                                                                                                     Boot select signal


                                                                     GRAPHICS                                                        MEMORY
                                                                     Integrated GPU, supports 2 independent displays                 soldered down LPDDR4-3200 memory


                                                               Available in Industrial Temperature Range




     DEVELOPMENT       SAMPLING       PRODUCTION




                                                                                                                                                                                        Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
     MAIN FIELDS OF APPLICATION




                                            Biomedical/       Digital Signage -       Industrial           Smart Vision          Vending
                                           Medical devices     Infotainment        automation and
                                                                                       control
     FEATURES
                        NXP i.MX 8 Family:                                                           Audio             I2S Audio Interface
                        • i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53
                        cores + 2x Cortex®-M4F cores                                                                   1x UART Tx/Rx/RTS/CTS
        Processor                                                                                    Serial Ports
                        • i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53                                       1x CAN Bus (TTL level)
                        cores + 2x Cortex®-M4F cores
                                                                                                                       CSI camera connector
                        • i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
                                                                                                                       2x I2C Bus
        Memory          Soldered Down LPDDR4-3200 memory, 64-bit interface                                             SPI interface
                                                                                                     Other
                                                                                                                       8 x GPI/Os
                                                                                                     Interfaces
                        Integrated Graphics Processing Unit, supports 2 independent                                    Boot select signal
                        displays.                                                                                      Power Management Signals
                        Embedded VPU, supports HW decoding of HEVC/H.265,                                              Watchdog
        Graphics
                        AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part,                     Power             +5VDC ±5%
                        HW encoding of AVC/H.264                                                     Supply            +3.3V_RTC
                        Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11
                                                                                                     Operating         Linux
        Video           HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2                           System            Android
        Interfaces      Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface
                                                                                                     Operating      0°C ÷ +60°C (Commercial version)
        Video           HDMI:        Up to 4Kp60                                                     Temperature* -40°C ÷ +85°C (Industrial version)
        Resolution      LVDS:        Up to 1080p
                        1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)                     Dimensions        70 x 70 mm (2.76” x 2.76”)
                        eMMC 5.1 drive soldered on-board
        Mass Storage                                                                            *Measured at any point of SECO standard heatspreader for this product, during
                        SD 4-bit interface
                        QSPI Flash soldered-on-board                                            any and all times (including start-up). Actual temperature will widely depend on
                                                                                                application, enclosure and/or environment. Upon customer to consider application-
        Networking      1 x Gigabit Ethernet interface                                          specific cooling solutions for the final system to keep the heatspreader temperature
                                                                                                in the range indicated.
                        4 x USB 2.0 Host Ports
        USB             1 x USB 3.0 Host Port
                        1 x USB 2.0 OTG port
        PCI-e           Up to 2x PCI-e x1 Gen3 ports




     www.seco.com                                                                                                                                             www.seco.com

18
Qseven                    ®
                                                                                                                                                      Qseven                ®




Q7-928                                          Qseven® standard module with NXP i.MX 6 Processor



Optimal balance of performance and power
                                                        HIGHLIGHTS

                                                                 CPU
                                                                                                                                  CONNECTIVITY
                                                                 Single-, Dual- and Quad- Core (ARM® Cortex® -A9
                                                                                                                                  2x serial ports; CAN port
                                                                 Cores)


                                                                 GRAPHICS                                                         MEMORY
                                                                 2D/3D dedicated graphics processors                              up to 4GB DDR3L on-board


                                                           Available in Industrial Temperature Range




DEVELOPMENT       SAMPLING      PRODUCTION




                                                                                                                                                                                       Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION




                  Automotive        Avionics            Digital           Energy             Industrial         Robotics         Surveillance      Transportation
                                                      Signage -                             Automation
                                                    Infotainment                            and Control
FEATURES
                  NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors                                            AC’97 Audio interface
                                                                                                 Audio
                  - i.MX6S Solo - Single core up to 1GHz                                                           I2S
                  - i.MX6DL Dual Lite - Dual core up to 1GHz per core                                              2 x Serial ports (TTL interface)
   Processor                                                                                     Serial Ports
                  - i.MX6D Dual - Dual core up to 1GHz per core                                                    CAN port interface
                  - i.MX6DP DualPlus - Dual core up to 1GHz per core
                  - i.MX6Q Quad - Quad core up to 1GHz per core                                                    I2C Bus
                                                                                                 Other             LPC Bus
   Max Cores      4                                                                              Interfaces        SM Bus
                                                                                                                   Power Management Signals
   Memory         Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)                               Power
                                                                                                                   +5VDC ± 5%
                  Dedicated 2D Hardware accelerator                                              Supply
                  Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D                                    Linux
                                                                                                 Operating
                  Dedicated Vector Graphics accelerator supports OpenVG™                                           Yocto
                                                                                                 System
                  (only i.MX6D, i.MX6DP and i.MX6Q)                                                                Microsoft® Windows Embedded Compact 7
   Graphics
                  Enhanced 2D and 3D graphics with i.MX6DP                                       Operating    0°C ÷ +60°C (Commercial version)
                  Supports up to 3 independent displays with i.MX6D, i.MX6DP
                                                                                                 Temperature* -40°C ÷ +85°C (Industrial version)
                  and i.MX6Q
                  Supports 2 independent displays with i.MX6DL and i.MX6S                        Dimensions        70 x 70 mm (2.76” x 2.76”)
                  1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24
   Video          bit interface                                                            *Measured at any point of SECO standard heatspreader for this product, during
   Interfaces     HDMI Interface 1.4                                                       any and all times (including start-up). Actual temperature will widely depend on
                  Video Input Port / Camera Connector                                      application, enclosure and/or environment. Upon customer to consider application-
                                                                                           specific cooling solutions for the final system to keep the heatspreader temperature
   Video          LVDS, up to 1920x1200
                                                                                           in the range indicated.
   Resolution     HDMI, up to 1080p
                  On-board eMMC drive, up to 32 GB
                  SD / MMC / SDIO interface
   Mass Storage
                  1 x μSD Card Slot on-board
                  1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
   Networking     Gigabit Ethernet interface
                  1 x USB OTG interface
   USB
                  4 x USB 2.0 Host interfaces
   PCI-e          1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)




                                                                                                                                                              www.seco.com

                                                                                                                                                                                  19
Qseven                     ®
                                ®




     Q7-922                                           Qseven® standard module with NVIDIA® Tegra® T30 Processor



     High performance graphics, low power solution
                                                            HIGHLIGHTS

                                                                     CPU
                                                                                                                                 CONNECTIVITY
                                                                     ARM® CORTEX -A9 Quad MPCore® CPU, 1.3 GHz
                                                                                                                                 6x USB 2.0
                                                                     per core


                                                                     GRAPHICS                                                    MEMORY
                                                                     NVIDIA GeForce Ultra low power GPU                          up to 2GB DDR3L on-board soldered memory




     DEVELOPMENT       SAMPLING       PRODUCTION




                                                                                                                                                                                    Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
     MAIN FIELDS OF APPLICATION




                                                              Digital Signage -       Gaming              Thin client
                                                               Infotainment


     FEATURES
                        NVIDIA® Tegra® T30 with Quad ARM® CORTEX-A9 MPCore®                                        I2C, SM Bus, LPC, SPI
        Processor
                        CPU, 1.3GHz per Core                                                      Other            One Wire Interface
                                                                                                  Interfaces       Thermal Cooling Interface
        Max Cores       4                                                                                          Power management signals

        Memory          Up to 2 GB DDR3 on-board soldered memory                                  Power
                                                                                                                   +5VDC ± 5%
                                                                                                  Supply
                        Embedded NVIDIA® ULP GeForce® GPU                                         Operating
        Graphics        Integrated High Definition Audio-Video Processor                                           Linux
                                                                                                  System
                        Dual independent display support
                                                                                                  Operating    0°C ÷ +60°C (Commercial version)
                        LVDS Single / Dual Channel 18 / 24 Bit interface                          Temperature* -20°C ÷ +70°C (Extended version)
        Video
                        HDMI 1.4a Interface
        Interfaces
                        Video Input Port / Camera Connector                                       Dimensions       70 x 70 mm (2.76” x 2.76”)
        Video           HDMI:        up to 1920 x 1080p
                                                                                             *Measured at any point of SECO standard heatspreader for this product, during
        Resolution      LVDS:        up to 2048 x 1536
                                                                                             any and all times (including start-up). Actual temperature will widely depend on
                     Up to 16 GB on-board soldered eMMC drive                                application, enclosure and/or environment. Upon customer to consider application-
                     1 x SATA Channel                                                        specific cooling solutions for the final system to keep the heatspreader temperature
        Mass Storage
                     microSD Slot on-board                                                   in the range indicated.
                     4-bit SD / MMC interface
        Networking      Gigabit Ethernet interface

        USB             6 x USB 2.0 Host ports
                        1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
        PCI-e
                        (with support for 2 x PCI-e x1 devices)
        Audio           HD Audio Interface
                        2 serial ports (Tx, Rx signals)
        Serial Ports
                        CAN Bus Interface




     www.seco.com                                                                                                                                       www.seco.com

20
μQseven
     μQseven                       ®®




                                                     μQseven® standard module with the Intel® Atom™ E3800 and Celeron®
     μQ7-A76-J                                       families (formerly Bay Trail)


     Smallest x86 standard module at proprietary costs
                                                             HIGHLIGHTS

                                                                         CPU                                                             CONNECTIVITY
                                                                         Intel® Atom™ E3800 and Celeron® families                        4x USB 2.0; 1x USB 3.0; 3x PCI-e x1; LPC Bus



                                                                         GRAPHICS                                                        MEMORY
                                                                         Integrated Intel® HD Graphics 4000 Series controller            up to 4GB Single Channel DDR3L memory




     DEVELOPMENT       SAMPLING      PRODUCTION




                                                                                                                                                                                          Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
     MAIN FIELDS OF APPLICATION




                              Biomedical/         Industrial           Internet of           PDA               Robotics         Surveillance   Transportation
                                Medical          Automation              Things           Electronics
                                devices          and Control
     FEATURES
                       Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP                                      I2C Bus
        Processor      Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP                                       LPC Bus
                                                                                                         Other
                       Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP                                           SM Bus
                                                                                                         Interfaces
                                                                                                                           Thermal / FAN management
        Max Cores      2                                                                                                   Power Management Signals

        Max Thread     2                                                                                 Power
                                                                                                                           +5VDC ± 5%
                                                                                                         Supply
                       Soldered on-board DDR3L memory                                                                      Microsoft® Windows 7
        Memory         E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz                                              Microsoft® Windows 8.1
                       N2807: up to 4GB Single-Channel DDR3L @ 1333MHz                                                     Microsoft® Windows 10
                       Integrated Intel® HD Graphics 4000 series controller                                                Microsoft® Windows 10 IoT
                                                                                                         Operating
                       Dual independent display support                                                                    Microsoft® Windows Embedded Standard 7
        Graphics                                                                                         System
                       HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats                                           Microsoft® Windows Embedded Standard 8
                       HW encoding of H.264, MPEG2 and MVC formats                                                         Microsoft® Windows Embedded Compact 7
                                                                                                                           Linux
        Video          Multimode Display Port interface
                                                                                                                           Yocto
        Interfaces     18 / 24 bit dual channel LVDS interface
                                                                                                         Operating
        Video          DP++ (HDMI compatible):           Up to 2560x1600@60Hz                                         0°C ÷ +60°C
                                                                                                         Temperature*
        Resolution     LVDS interface:                   Up to 1920x1200@60Hz
                     2 x external SATA channels                                                          Dimensions        40 x 70 mm (1.57” x 2.76”)
        Mass Storage SD interface
                     Optional eMMC drive soldered on-board                                         *Measured at any point of SECO standard heatspreader for this product, during
                                                                                                   any and all times (including start-up). Actual temperature will widely depend on
        Networking     Gigabit Ethernet interface                                                  application, enclosure and/or environment. Upon customer to consider application-
                                                                                                   specific cooling solutions for the final system to keep the heatspreader temperature
                       1 x USB 3.0 Host port
        USB                                                                                        in the range indicated.
                       4 x USB 2.0 Host ports (one shared with USB 3.0 interface)
        PCI-e          3 x PCI-e x1 lanes Gen2

        Audio          HD Audio interface

        Serial Ports   1 x Serial port (TTL interface, Tx / Rx only)




     www.seco.com                                                                                                                                                 www.seco.com

22
μQseven                        ®
                                                                                                                                              μQseven                      ®




μQ7-962                                         μQseven® standard module with NXP i.MX 6 Processor



Optimal balance of performance and size
                                                     HIGHLIGHTS

                                                               CPU                                                               CONNECTIVITY
                                                               Single-, Dual- and Quad- Core (ARM® Cortex® -A9 Cores)            4x USB 2.0; 2x Serial ports; CAN Bus



                                                               GRAPHICS                                                          MEMORY
                                                               2D/3D dedicated graphics processors                               up to 2GB DDR3L on-board


                                                         Available in Industrial Temperature Range




DEVELOPMENT       SAMPLING      PRODUCTION




                                                                                                                                                                                      Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION




                                            Automation      Biomedical/             HMI                 PDA               Wireless
                                                              Medical                                Electronics        Technologies
                                                              devices
FEATURES
                  NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors                                            I2C Bus
                                                                                                Other
                  - i.MX6S Solo - Single core up to 1GHz                                                           SM Bus
                                                                                                Interfaces
   Processor      - i.MX6DL Dual Lite - Dual core up to 1GHz per core                                              Power Management Signals
                  - i.MX6D Dual - Dual core up to 1GHz per core                                 Power
                  - i.MX6Q Quad - Quad core up to 1GHz per core                                                    +5VDC ± 5%
                                                                                                Supply
   Max Cores      4                                                                             Operating          Linux
                                                                                                System             Yocto
   Memory         Up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
                                                                                                Operating    0°C ÷ +60°C (Commercial version)
                  Dedicated 2D Hardware accelerator                                             Temperature* -40°C ÷ +85°C (Industrial version)
                  Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
                                                                                                Dimensions         40 x 70 mm (1.57” x 2.76”)
                  Dedicated Vector Graphics accelerator supports OpenVG™
   Graphics
                  (only i.MX6D and i.MX6Q)
                  Supports up to 3 independent displays with i.MX6D and i.MX6Q            *Measured at any point of SECO standard heatspreader for this product, during
                  Supports 2 independent displays with i.MX6DL and i.MX6S                 any and all times (including start-up). Actual temperature will widely depend on
                                                                                          application, enclosure and/or environment. Upon customer to consider application-
                  1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24                specific cooling solutions for the final system to keep the heatspreader temperature
   Video
                  bit interface                                                           in the range indicated.
   Interfaces
                  HDMI Interface 1.4
   Video          LVDS         up to 1920x1200
   Resolution     HDMI         up to 1080p
                  Up to 8 GB eMMC drive soldered on-board
                  SD / MMC / SDIO interface
   Mass Storage
                  1 x External SATA Channel (only available with i.MX6D and
                  i.MX6Q)
   Networking     Gigabit Ethernet interface
                  1 x USB OTG interface
   USB
                  4 x USB 2.0 Host interfaces
   PCI-e          1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

   Audio          I2S / AC’97 Audio interface
                  2 x Serial ports (TTL interface)
   Serial Ports
                  CAN port interface




                                                                                                                                                          www.seco.com

                                                                                                                                                                                 23
μQseven
     μQseven                     ®®




     μQ7-A75-J                                      μQseven® standard module with NXP i.MX 6 Processor



     Small, flexibile OTS module at proprietary costs
                                                         HIGHLIGHTS

                                                                 CPU                                                             CONNECTIVITY
                                                                 Single and Dual Core Lite (ARM Cortex™A9 Cores)                 FastEthernet; GPI/Os



                                                                 GRAPHICS                                                        MEMORY
                                                                 2D/3D dedicated graphics processors                             up to 1GB DDR3L on-board


                                                           Available in Industrial Temperature Range




     DEVELOPMENT     SAMPLING      PRODUCTION




                                                                                                                                                                                   Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
     MAIN FIELDS OF APPLICATION




                                                         HMI            Internet of            PDA               Wireless
                                                                          Things            Electronics        Technologies


     FEATURES
                      NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors                                        On the card edge connector, many pins can be used as
        Processor     - i.MX6S Solo - Single core up to 1GHz                                                       General Purpose I / Os or to implement some(*) of the
                      - i.MX6DL Dual Lite - Dual core up to 1GHz per core                                          following extra functionalities:
                                                                                                                     - Additional SD interface
        Max Cores     2                                                                                              - Up to 4 UARTs
                                                                                                                     - CAN interface
                      Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo)                     Other
        Memory                                                                                                       - Watchdog(s)
                      32-bit I/F                                                                  Interfaces
                                                                                                                     - I2C interfaces
                      Dedicated 2D Hardware accelerator                                                              - PWM outputs
        Graphics      Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D                                   - SPI interface
                      Supports 2 independent displays                                                                - Additional Audio interface
                      1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit                                 (*) not all the combinations are allowed simultaneously
        Video                                                                                                      Power Management Signals
                      interface
        Interfaces
                      HDMI Interface                                                              Power            +5VDC ± 5%
        Video         LVDS, resolution up to 1920x1200                                            Supply           Optional Low Power RTC
        Resolution    HDMI, resolution up to 1080p                                                Operating        Linux
                     On-board eMMC drive, up to 8 GB                                              System           Yocto
        Mass Storage SD / MMC / SDIO interface                                                    Operating    0°C ÷ +60 °C (Commercial temp.)
                     Internal SPI Flash for booting                                               Temperature* -40°C ÷ +85°C (Industrial version)
        Networking    FastEthernet (10 / 100 Mbps) interface                                      Dimensions       40 x 70 mm (1.57” x 2.76”)
                      1 x USB OTG interface                                                 *Measured at any point of SECO standard heatspreader for this product, during
        USB
                      1 x USB 2.0 Host interface                                            any and all times (including start-up). Actual temperature will widely depend on
                                                                                            application, enclosure and/or environment. Upon customer to consider application-
        PCI-e         1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
                                                                                            specific cooling solutions for the final system to keep the heatspreader temperature
                                                                                            in the range indicated.
        Audio         I2S / AC’97 Audio interface




     www.seco.com                                                                                                                                       www.seco.com

24
Qseven                   ®
                                                                                                                                            Qseven                    ®

Carrier Board                                                                                                                                          Carrier Board


CQ7-A42                                        Carrier Board for Qseven® Rev. 2.0 Compliant modules on 3.5” Form factor


Feature rich for fast Time-to-market


                                                                                                               HIGHLIGHTS


                                                                                                                 3.5” Form Factor Carrier Board for Qseven® Modules
                                                                                                                 Multiport Video Interfaces
                                                                                                                 Connectivity oriented
                                                                                                                 Embedded industrial interfaces

                                                                                                                   Available in Industrial Temperature Range




                                                                                                                                                                                 Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
                                                      DEVELOPMENT        SAMPLING    PRODUCTION




FEATURES
                  LVDS Dual Channel 24-bit + backlight connectors or 2 x eDP             Power           +12VDC Mini-fit Standard ATX power connector
   Video
                  connectors                                                             Supply          Coin cell battery Holder for CMOS and RTC
   Interfaces
                  Multimode Display Port or HDMI Connector                               Operating
                                                                                                      -40°C ÷ +85°C (Industrial temperature range)
                1 x SATA connector with HDD Power connector                              Temperature*
   Mass Storage 1 x mSATA Slot
                microSD Slot on combo microSD + SIM connector                            Dimensions      146 x 102 mm (5.75” x 4.02”)

   Networking     Up to 2 x Gigabit Ethernet connectors                             *All carrier board components must remain within the operating temperature at
                                                                                    any and all times, including start-up; carrier operating temperature is independent
                  1 x USB 3.0 Host port on type-A socket                            of the module installed. Please refer to the specific module for more details. Actual
                  2 x USB 2.0 Host ports on double Type-A sockets                   temperature will widely depend on application, enclosure and/or environment.
   USB            2 x USB 2.0 Host ports on internal pin header                     Upon customer to consider specific cooling solutions for the final system.
                  1 x USB 2.0 OTG port on micro-AB socket (USB port shared
                  with miniPCI-e slot)
   PCI-e          miniPCI-e slot Full / Half Size, combined with SIM card slot

   Audio          Audio interface on internal pin header
                  4-wire RS-232 / RS-422 / RS-485 configurable serial port on
                  DB9 male connector
   Serial Ports   2 x RS-232 Full-modem serial ports on internal header (need
                  LPC interface from Qseven® module)
                  CAN interface on PCB terminal block
                  SPI internal pin header
                  LPC Bus internal pin header
                  SM Bus / I2C GPIO expander, makes available 16 x GPIOs on
                  internal pin header
                  Front Panel Header
   Other
                  1 x 28 pin connector for additional features (I2C, ACPI
   Interfaces
                  signals, SM Bus, Watch Dog, Thermal Management)
                  +12V Tachometric FAN connector
                  Optional Debug USB port on miniB socket
                  Optional MFG connector for JTAG programming of Qseven®
                  module




                                                                                                                                                   www.seco.com

                                                                                                                                                                            25
Qseven                   ®
                              ®

     Development Kit
                 Kit


     Q7 DEV KIT 2.0
     Cross Platform Development Kit for Qseven® philosophy, compatible with both x86 and
     ARM Rev. 2.0 Qseven® modules

     Everything you need for flexible development
                                                            DEVELOPMENT KIT CONTENTS


                                                          The Development kit contains the following material:         Module not included. Must be purchased separately
                                                             Cross Platform Carrier Board CQ7-A30
                                                             LVDS optional Display
                                                             One 12VDC Notebook Power Adapter
                                                             Add-on modules for LVDS / eDP and HDMI / DP
                                                             Cable kit




                                                                                                                                                                                  Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
                                                                                                                      SCHEMATICS
                                                                                                                      PUBLICLY AVAILABLE


     DEVELOPMENT       SAMPLING      PRODUCTION




     FEATURES OF CQ7-A30
        Video          HDMI / Display Port interface on PCI-e x16 slot                         Power             +12VDC
        Interfaces     LVDS / eDP interface on PCI-e x8 slot                                   Supply            Coin cell battery Holder for CMOS and RTC
                     SATA Female 7p connector with dedicated Power connector,                  Operating
                     interface shared with mSATA Slot                                                       0° C ÷ 60° C
                                                                                               Temperature*
                     SATA Male 7+15p connector
        Mass Storage                                                                           Dimensions        345 x 170 mm (13.58” x 6.69”)
                     SD / MMC Card Slot
                     SPI Flash Socket
                     I2C EEPROM Socket                                                    *All carrier board components must remain within the operating temperature at
                                                                                          any and all times, including start-up; carrier operating temperature is independent
        Networking     Gigabit Ethernet connector                                         of the module installed. Please refer to the specific module for more details. Actual
                                                                                          temperature will widely depend on application, enclosure and/or environment.
                       1 x USB 3.0 Host Type-A socket                                     Upon customer to consider specific cooling solutions for the final system.
                       1 x USB 3.0 OTG micro-AB socket
        USB            2 x USB 2.0 Host ports on internal pin header (alternative to
                       USB 3.0 port #0)
                       Up to 4 x USB 2.0 Host ports on quad Type-A socket
                       PCI-e x4 interface on dedicated PCI-e x16 slot shared with 3 x
        PCI-e
                       PCI-e x1 slots + miniPCI-e slot (selection via jumper)
                       Embedded HD Audio Codec, Realtek ALC888
                       2 x Triple HD Audio jacks
        Audio
                       2 S / PDIF connectors (In & Out)
                       Audio Expansion Slot
                       CAN Bus (both TTL interface and with CAN transceiver)
        Serial Ports   3 x RS-232 only ports
                       2 x RS-232 / RS-422 / RS-485 configurable serial ports
                       Feature Connector, with I2C , SM Bus, Watchdog, Thermal
                       and Power Management Signals
                       LPC Bus Header
                       SPI Pin Header
        Other          SIM Card slot
        Interfaces     4 x 7-segment LCD displays for POST codes
                       PS / 2 Mouse / keyboard pin header
                       2 x tachometric FAN connectors
                       Debug Port on mini-B USB connector
                       Power, Reset, LID and Sleep Buttons




     www.seco.com                                                                                                                                     www.seco.com

26
Qseven                   ®
                                                                                                                                                  Qseven                      ®

Development Kit                                                                                                                                      Development Kit


Q7 STARTER KIT 2.0
Cross Platform Starter Kit compatible with both x86 and ARM Rev. 2.0 Qseven® modules:
a complete package including the basic components necessary to start developing

Quickly “start” prototyping for short Time-to-market
                                                      STARTER KIT CONTENTS


                                                           Carrier board for Qseven® Rev. 2.0 compliant                 Module not included. Must be purchased separately
                                                           modules CQ7-A42 (DP or HDMI version)
                                                           HD Audio module
                                                           I2S Audio module
                                                           One 12VDC Notebook Power Adapter
                                                           Cable kit
                                                           Adapter for mounting a microQ7 module on
                                                           standard Qseven carrier boards

                                                            Available in Industrial Temperature Range




                                                                                                                                                                                         Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
                                                                                                                       SCHEMATICS
                                                                                                                       PUBLICLY AVAILABLE


DEVELOPMENT       SAMPLING      PRODUCTION




FEATURES OF CQ7-A42
                  LVDS Dual Channel 24-bit + backlight connectors or 2 x eDP                      Power          +12VDC Mini-fit Standard ATX power connector
   Video
                  connectors                                                                      Supply         Coin cell battery Holder for CMOS and RTC
   Interfaces
                  Multimode Display Port or HDMI Connector                                        Operating
                                                                                                               -40°C ÷ +85°C (Industrial temperature range)
                1 x SATA connector with HDD Power connector                                       Temperature*
   Mass Storage 1 x mSATA Slot
                microSD Slot on combo microSD + SIM connector                                     Dimensions     146 x 102 mm (5.75” x 4.02”)

   Networking     Up to 2 x Gigabit Ethernet connectors                                     *All carrier board components must remain within the operating temperature at
                                                                                            any and all times, including start-up; carrier operating temperature is independent
                  1 x USB 3.0 Host port on type-A socket                                    of the module installed. Please refer to the specific module for more details. Actual
                  2 x USB 2.0 Host ports on double Type-A sockets                           temperature will widely depend on application, enclosure and/or environment.
   USB            2 x USB 2.0 Host ports on internal pin header                             Upon customer to consider specific cooling solutions for the final system.
                  1 x USB 2.0 OTG port on micro-AB socket (USB port shared
                  with miniPCI-e slot)
   PCI-e          miniPCI-e slot Full / Half Size, combined with SIM card slot

   Audio          Audio interface on internal pin header
                  4-wires RS-232 / RS-422 / RS-485 configurable serial port on
                  DB9 male connector
   Serial Ports   2 x RS-232 Full-modem serial ports on internal header (need
                  LPC interface from Qseven® module)
                  CAN interface on PCB terminal block
                  SPI internal pin header
                  LPC Bus internal pin header
                  SM Bus / I2C GPIO expander, makes available 16 x GPIOs on
                  internal pin header
                  Front Panel Header
   Other
                  1 x 28 pin connector for additional features (I2C, ACPI
   Interfaces
                  signals, SM Bus, Watch Dog, Thermal Management)
                  +12V Tachometric FAN connector
                  Optional Debug USB port on miniB socket
                  Optional MFG connector for JTAG programming of Qseven®
                  module




                                                                                                                                                        www.seco.com

                                                                                                                                                                                    27
SMARC
SMARC STANDARD ADVANTAGES



                                          Extreme                              Low profile
                                      low power design                           design




         Dedicated battery                Up to four                        Dual Ethernet               SMARC
           management                       display                                                     Compact
              signals                     interfaces                                                   82×50 mm




                          COMPUTER-ON-MODULE APPROACH
              | Design investment limited to the carrier board | Consolidated Standard form factor |
            | Scalable and future-proof | Long-term availability | ARM and x86 cross-compatibility |
   | Multi-vendor solution | Highly configurable | Innovative and upgradable | Accelerated time-to-market |




                              SMARC SUPPORTED FEATURES
System I/O interface                  # of interfaces               System I/O interface               # of interfaces
PCI Express lanes                             4                     I²C Bus                                     5
Serial ATA channels                           1                     SPI Bus                                     2
USB 2.0 ports                                 6                     CAN Bus                                     2
USB 3.0 ports                                 2                     Watchdog Timer                              1
LVDS channels                                                       Boot selection signals                      3
                                              2
embedded DisplayPort                                                GPIOs                       12 (some with alternate functions)
                                      1 dedicated DP++                                               Reset out and Reset in
DP++ / HDMI
                                    1 shared DP++ / HDMI                                                 Power button in
Camera interfaces                          2 MIPI CSI                                                 Power source status
                                                                    System and Power               Module power state status
High Definition Audio / I2S     1 I2S + 1 shared I2S / HD Audio
                                                                    management signals             System management pins
Ethernet 10/100/1000 Mbps                       2                                                  Battery and battery charger
UARTs                                2 x 4-Wire + 2 x 2-Wire                                           management pins
Secure Digital I/O 4-bit                        1                                                   Carrier Power On control




                                                                  SECO is one of the founding
                                                                  members of SGET
SMARC
                                   SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N
     SM-B69                        Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors


     High performance, low power and feature-rich
                                                            HIGHLIGHTS

                                                                     CPU
                                                                                                                                            CONNECTIVITY
                                                                     Intel® Atom™ X Series, Intel® Celeron® J / N Series and
                                                                                                                                            2x GbE; 2x USB 3.0; 6x USB 2.0; 4x PCI-e
                                                                     Intel® Pentium® N Series (formerly Apollo Lake) Processors


                                                                     GRAPHICS                                                               MEMORY
                                                                     Integrated Gen9-LP HD Graphics controller                              Dual Channel Soldered Down LPDDR4-2400 memory


                                                               Available in Industrial Temperature Range




     DEVELOPMENT      SAMPLING       PRODUCTION




                                                                                                                                                                                            Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
     MAIN FIELDS OF APPLICATION




      Automotive     Biomedical/        Digital       Gaming            HMI             Industrial         Internet of            Mobile      Multimedia        Robotics         Visual
                       Medical        Signage -                                                              Things               devices      devices                         Computing
                       devices      Infotainment
     FEATURES
                       Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz),                                           6 x USB 2.0 Host Ports
                                                                                                       USB
                       2MB L2 Cache, 12W TDP                                                                              2 x USB 3.0 Host Ports
                       Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz),
                       2MB L2 Cache, 9.5W TDP                                                          PCI-e              4 x PCI-e Root Ports
                       Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz),
                                                                                                                          HD Audio interface
                       2MB L2 Cache, 6.5W TDP                                                          Audio
                                                                                                                          I2S Audio interface
                       Intel® Pentium® N4200 Quad Core @1.1GHz (burst 2.5GHz),
        Processor                                                                                                         2 x HS-UARTs
                       2MB L2 Cache, 6W TDP                                                            Serial Ports
                       Intel® Celeron® N3350 Dual Core @1.1GHz (burst 2.5GHz),                                            2 x UARTs
                       2MB L2 Cache, 6W TDP                                                                               Up to 12x GPIOs
                       Intel® Celeron® J3455, Quad Core @ 1.5GHz (Burst 2.3GHz),                                          I2C Bus
                       2MB L2Cache, 10W TDP                                                                               SM Bus
                       Intel® Celeron® J3355, Dual Core @ 2.0GHz (Burst 2.5GHz),                       Other
                                                                                                                          2x SPI interfaces
                       2MB L2Cache,10W TDP                                                             Interfaces
                                                                                                                          LPC Bus
        Max Cores      4                                                                                                  FAN management
                                                                                                                          Power Management Signals
        Memory         Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB                        Power
                                                                                                                          +5VDC and +3.3V_RTC
                                                                                                       Supply
                       Up to 3 independent displays
                                                                                                                          Microsoft® Windows 10 Enterprise (64 bit)
                       Integrated Gen9-LP HD Graphics controller, with 18 Execution
                                                                                                                          Microsoft® Windows 10 IoT Core
        Graphics       Units                                                                           Operating
                                                                                                                          Linux
                       4K HW decoding and encoding of HEVC(H.265), H.264, VP8,                         System
                                                                                                                          Yocto
                       SVC, MVC
                                                                                                                          Android
                       eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
                                                                                                       Operating      0°C ÷ +60°C (Commercial version)
                       through eDP-to-LVDS bridge
        Video                                                                                          Temperature* -40°C ÷ +85°C (Industrial version)
                       HDMI or DP++ interface
        Interfaces
                       DP++ interface                                                                  Dimensions         50 x 82 mm
                       2 x CSI interfaces
                       HDMI, eDP:         Up to 3840 x 2160 (4K)                                 *Measured at any point of SECO standard heatspreader for this product, during
        Video                                                                                    any and all times (including start-up). Actual temperature will widely depend on
                       DP++:              Up to 4096 x 2160
        Resolution                                                                               application, enclosure and/or environment. Upon customer to consider application-
                       MIPI-DSI, LVDS:    Up to 1920 x 1200
                                                                                                 specific cooling solutions for the final system to keep the heatspreader temperature
                     1 x external S-ATA Gen3 Channel                                             in the range indicated.
        Mass Storage SD interface
                     Optional eMMC 5.0 drive soldered on-board
                       Up to 2 x Gigabit Ethernet interfaces
        Networking
                       Intel® I210 or I211 Controller (MAC + PHY)




     www.seco.com                                                                                                                                                    www.seco.com

30
SMARC                                                                                                                                                 SMARC

SM-C12                       SMARC Rel. 2.0 compliant module with NXP i.MX 8M Applications Processors



Standard solution for next generation multimedia applications
                                                           HIGHLIGHTS

                                                                                                                                  CONNECTIVITY
                                                                  CPU
                                                                                                                                  WiFi + BT LE; CSI camera; QuadSPI interface;
                                                                  NXP i.MX 8M Application Processors
                                                                                                                                  12x GPI/Os


                                                                  GRAPHICS                                                        MEMORY
                                                                  Integrated Graphics Processing Unit, supports 2                 Up to 4GB soldered down LPDDR4-3200 memory,
                                                                  independent displays                                            32-bit interface

                                                            Available in Industrial Temperature Range




DEVELOPMENT       SAMPLING      PRODUCTION




                                                                                                                                                                                         Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
MAIN FIELDS OF APPLICATION




                                       Digital Signage -       Home                Multimedia           Transportation        Vending
                                        Infotainment         Automation             devices


FEATURES
                   NXP i.MX 8M Family based on ARM Cortex®-A53 cores +                                              1x 4-lanes + 1x 2-lanes CSI camera interfaces
                   general purpose Cortex®-M4 processor:                                                            I2C Bus
                   • i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz                                               SM Bus
   Processor
                   • i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz                             Other             2x SPI interfaces
                   • i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no                     Interfaces        QuadSPI interface
                   VPU                                                                                              12 x GPI/Os
                   Soldered Down LPDDR4-3200 memory, 32-bit interface,                                              Boot select signals
   Memory                                                                                                           Power Management Signals
                   up to 4GB
                   Integrated Graphics Processing Unit, supports 2                                Power             +5VDC
                   independent displays                                                           Supply            +3.3V_RTC
                   Embedded VPU, supports HW decoding of HEVC (H.265),                            Operating         Linux
   Graphics        H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6,                        System            Android
                   VP8, VP9, JPEG                                                                 Operating      0°C ÷ +60°C (Commercial version)
                   Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan,                       Temperature* -40°C ÷ +85°C (Industrial version)
                   DirectX, Open VG 1.1
                   HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4                          Dimensions        50 x 82 mm (1.97” x 3.23”)
   Video
                   18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
   Interfaces
                   (factory alternatives)                                                    *Measured at any point of SECO standard heatspreader for this product, during
   Video           HDMI:                 Up to 4096 x 2160 @ 60 (4K)                         any and all times (including start-up). Actual temperature will widely depend on
   Resolution      MIPI-DSI, LVDS:       Up to 1920 x 1080 @ 60Hz                            application, enclosure and/or environment. Upon customer to consider application-
                                                                                             specific cooling solutions for the final system to keep the heatspreader temperature
                Optional SD 4-bit interface                                                  in the range indicated.
   Mass Storage QSPI Flash soldered-onboard
                eMMC 5.0 drive soldered on-board
                   1 x Gigabit Ethernet interface
   Networking
                   Optional WiFi + BT LE module onboard
                   2 USB 3.0 Host ports
   USB             2 USB 2.0 Host ports
                   1 USB 2.0 OTG port
   PCI-e           2x PCI-e x1 ports

   Audio           I2S Audio Interface
                   Up to 2x UART Tx/Rx/RTS/CTS
   Serial Ports    2x UART Tx/Rx
                   1x CAN Bus (TTL level)




                                                                                                                                                           www.seco.com

                                                                                                                                                                                    31
SMARC

     SM-B71                       SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC



     Flexibile ARM + FPGA Heterogeneous Processing in a Standard Form Factor
                                                            HIGHLIGHTS

                                                                      CPU
                                                                                                                                     CONNECTIVITY
                                                                      Xilinx® Zynq® Ultrascale+™ CG/EG/EV MPSoCs in
                                                                                                                                     PCI-e x4; 2x GbE; 2x CAN Bus; 2x SPI; 12x GPI/Os
                                                                      C784 package


                                                                      GRAPHICS                                                       MEMORY
                                                                      Integrated ARM Mali-400 MP2 GPU                                Up to 8GB + 2GB DDR4 soldered down


                                                                Available in Industrial Temperature Range




     DEVELOPMENT       SAMPLING       PRODUCTION




                                                                                                                                                                                        Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
     MAIN FIELDS OF APPLICATION




                Automotive           Avionics        Biomedical/            Industrial            Internet of          Robotics             Telco               Visual
                                                    Medical devices      Automation and             Things                                                    Computing
                                                                             Control
     FEATURES
                        Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG                                       2 x UART Tx/Rx/RTS/CTS
                        MPSoCs:                                                                       Serial Ports    2 x UART Tx/Rx
                        Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +                               2 x CAN Bus
                        Dual-core ARM® Cortex®-R5 Real-Time Processing Unit                                           2x I2C Bus
        Processor                                                                                                     2 x SPI interfaces
                        Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG,                        Other
                                                                                                                      12 x GPI/Os
                        ZU4EV or ZU5EV MPSoCs:                                                        Interfaces
                                                                                                                      Boot select signals
                        Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +                               Power Management Signals
                        Dual-core ARM® Cortex®-R5 Real-Time Processing Unit
                                                                                                      Power           +3÷+5.25VDC
                        Soldered Down DDR4-2400 memory                                                Supply          +3.3V_RTC
        Memory          Up to 8GB for Processing System Unit + up to 2GB for
                        Programmable Logic                                                            Operating       Linux
                                                                                                      System          Android
                        Only on EG and EV MPSOcs:
                        Integrated ARM Mali-400 MP2 Graphics Processing Unit                          Operating      0°C ÷ +60°C (Commercial version)
        Graphics        Multicore 2D/3D acceleration at 667MHz                                        Temperature* -40°C ÷ +85°C (Industrial version)
                        OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
                        On EV MPSoCs only, H.264/H.265 integrated video codec                         Dimensions      50 x 82 mm (1.97” x 3.23”)

                        18- / 24-bit Dual Channel LVDS interface                                 *Measured at any point of SECO standard heatspreader for this product, during
        Video
                        DP interface                                                             any and all times (including start-up). Actual temperature will widely depend on
        Interfaces
                        2 x CSI interfaces                                                       application, enclosure and/or environment. Upon customer to consider application-
                        DP:            Up to 4096 x 2160                                         specific cooling solutions for the final system to keep the heatspreader temperature
        Video                                                                                    in the range indicated.
                        LVDS:          Dependent on the IP implemented in the
        Resolution
                                       programmable logic
                        1 x external S-ATA Gen3 Channel
                        SD interface
        Mass Storage
                        QSPI Flash soldered-onboard
                        Optional eMMC 4.51 drive soldered on-board
        Networking      Up to 2 x Gigabit Ethernet interfaces
                        1x USB 2.0 OTG
        USB             2x USB 2.0 Host
                        2x USB 3.0 Host
        PCI-e           PCI-e x4 interface

        Audio           Dependent on the IP implemented in the programmable logic




     www.seco.com                                                                                                                                             www.seco.com

32
SMARC                                                                                                                                          SMARC
Carrier Board                                                                                                                                            Carrier Board


CSM-B79                      SMARC 2.0 evaluation carrier board


Cross Platform Philosophy Carrier Board for SMARC Rel. 2.0 compliant module


                                                                                                                 HIGHLIGHTS


                                                                                                                   Cross Platform Philosophy Carrier Board for SMARC
                                                                                                                   Rel. 2.0 compliant module, compatible with both x86
                                                                                                                   and ARM architectures
                                                                                                                   Improve the development experience of your SMARC
                                                                                                                   Rel. 2.0 compliant module


                                                                                                                     Available in Industrial Temperature Range




                                                                                                                                                                                   Information subject to change. Please visit www.seco.com to find the latest version of this datasheet
                                                       DEVELOPMENT         SAMPLING    PRODUCTION




FEATURES
                  LVDS connector, interface shared with 2 x eDP/DSI connectors                             eSPI pin header + Flash Socket
                  Backlight control + LCD selectable voltages dedicated                                    SPI pin header + Flash Socket
                  connector                                                                                I2C EEPROM Socket
   Video
                  DP++ dedicated connector                                                                 4 x 7-segment LCD displays for POST codes
   Interfaces
                  HDMI connector (interface shared with USB 3.1 Type-C                                     Feature pin header with 8x GPIOs, I2C, SM Bus, Watchdog
                  alternate mode port)                                                     Other           and Power Management Signals
                  2x CSI Camera input interfaces                                           Interfaces      4x GPIOs dedicated connector
                SATA M 7p connector with dedicated power connector,                                        FAN connector
   Mass Storage interface shared with M.2 Socket 2 2242 / 2260 Key B SSD slot                              RTC Coin cell battery holder
                microSD Card Slot                                                                          Optional Debug USB port on mini-B Socket
                                                                                                           Boot selection switches
                  2 x RJ-45 Gigabit Ethernet connectors                                                    JTAG connector
                  M.2 Socket1 2230 Key E Slot for WiFi Modules (interface
                  shared with PCI-e x 4 slot)                                                              9-21V through dedicated Mini-Fit Jr 2x2 power connector or
   Networking                                                                              Power
                  M.2 Socket2 2260 Key E Slot for WWAN Modem Modules                                       USB Type-C connector
                                                                                           Supply
                  (interface shared with PCI-e x 4 slot), connected to on-board                            6-17V through 2/3/4 Cell Smart Battery Connector
                  microSIM slot                                                            Operating
                                                                                                        -40°C ÷ +85°C
                  1 x USB 3.0 type A Socket                                                Temperature*
                  1 x USB 2.0 type A Socket                                                Dimensions      345 x 170mm (13.58” x 6.69”)
   USB Ports      1 x USB OTG micro-AB Socket
                  1 x USB 3.1 Type-C Socket, with Alternate Mode and Power
                  Delivery functionality                                              *All carrier board components must remain within the operating temperature at
                  PCI-e x4 slot, interface shared with 2 x PCI-e x1 Slot and M.2      any and all times, including start-up; carrier operating temperature is independent
   PCI-e                                                                              of the module installed. Please refer to the specific module for more details. Actual
                  Slots
                                                                                      temperature will widely depend on application, enclosure and/or environment.
                  Mic In Jack, Line Out Jack                                          Upon customer to consider specific cooling solutions for the final system.
   Audio          Onboard I2S Audio Codec (TI TLV320AIC3204) + HD Audio
                  Codec (Cirrus Logic CS4207)
                  2 x CAN ports
                  2 x RS-232/RS-422/RS-485 configurable serial ports on
   Serial Ports   internal pin header
                  2 x Serial ports (Tx/Rx signals only, TTL level) on feature pin
                  header




                                                                                                                                                     www.seco.com

                                                                                                                                                                              33
Next part ... Cancel