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OPTO 2021 CALL FOR PAPERS
2021
IMPORTANT NEWS:
OPTO Photonics West moves
to 6-11 March
CALL FOR
PAPERS
Submit abstracts by 26 August 2020
6–11 March 2021
The Moscone Center spie.org/opto21call
San Francisco, California, USA #PhotonicsWest
Conferences and Courses
6–11 March 2021
Two Exhibitions
The Moscone Center BiOS Expo: 6–7 March 2021
San Francisco, California, USA Photonics West: 9–11 March 2021
Present your work at OPTO 2021
The optoelectronics, photonic materials and devices conference
2021 OPTO technical tracks
Explore these technical areas to find the right conference to submit your research.
• Optoelectronic Materials and Devices APPLICATION TRACKS
• Photonic Integration Increase the visibility of your paper
• Nanotechnologies in Photonics by including it in an appropriate
application track.
• MOEMS-MEMS in Photonics
• Translational Research
• Advanced Quantum and Optoelectronic • Brain
Applications • 3D Printing
• Semiconductor Lasers, LEDs, and • COVID-19 Research
Applications
• Displays and Holography
• Optical Communications:
Devices to Systems
Submit abstracts by 26 August 2020
spie.org/opto21call
ii SPIE PHOTONICS WEST 2021 • spie.org/opto21call
Plan to Participate
SPIE OPTO addresses the most current developments and research in a broad
range of optoelectronic technologies and their integration into a variety of industrial
and non-industrial applications. Topics to be covered include optoelectronic
materials and devices, photonic integration, nanotechnologies, MEMS/MOEMS,
advanced quantum and optoelectronic applications, semiconductor lasers,
light-emitting devices, packaging, displays, holography, optical networks, and
communications.
SPIE OPTO is an exciting fast-growing networking forum where researchers from
a wide spectrum of optoelectronic and photonic disciplines converge to exchange
ideas, challenge results, and learn new concepts. SPIE OPTO can help you take the
next step to further your professional development through its courses, conference
programs, and industrial exhibition.
Make connections with industry leaders on the exhibition floor and gain valuable
insight from outstanding course instructors, prominent plenary and keynote
speakers, and exciting networking events.
We look forward to your help in disseminating relevant research contributions for
more effective impact on our everyday life in the societies around the world.
Symposium Chairs Symposium Co-Chairs
Sailing He Sonia M. García-Blanco
KTH Royal Institute of Univ. Twente (Netherlands)
Technology (Sweden) and
Zhejiang Univ. (China)
Yasuhiro Koike Bernd Witzigmann
Keio Univ. (Japan) Univ. Kassel (Germany)
Tel: +1 360 676 3290 • help@spie.org • #PhotonicsWest 1
Contents
OPTOELECTRONIC MATERIALS AND OE205 Photonic Instrumentation
DEVICES Engineering VIII (Soskind, Busse) . . . . . . 24
Program Track Chairs: James G. Grote, Photonics OE106 Terahertz, RF, Millimeter, and
Engineering Consultant (USA); Shibin Jiang, Submillimeter-Wave Technology and
AdValue Photonics, Inc. (USA) Applications XIV (Sadwick, Yang). . . . . . 26
OE101 Physics and Simulation of Optoelectronic
Devices XIX (Witzigmann, Osiński, NANOTECHNOLOGIES IN PHOTONICS
Arakawa). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Program Track Chair: Ali Adibi, Georgia Institute of
OE102 Physics, Simulation, and Photonic Technology (USA)
Engineering of Photovoltaic Devices X OE301 Photonic and Phononic Properties of
(Freundlich, Collin, Hinzer) . . . . . . . . . . . . . 6 Engineered Nanostructures XI
OE103 Optical Components and Materials XVIII (Adibi, Lin, Scherer). . . . . . . . . . . . . . . . . . . 28
(Jiang, Digonnet) . . . . . . . . . . . . . . . . . . . . . 7 OE302 High Contrast Metastructures X
OE104 Organic Photonic Materials and (Chang-Hasnain, Fan, Zhou) . . . . . . . . . . . 29
Devices XXIII (Shensky, Rau, Sugihara) . . 8 OE303 Quantum Dots, Nanostructures,
OE105 Ultrafast Phenomena and and Quantum Materials: Growth,
Nanophotonics XXV (Betz, Elezzabi) . . . . 9 Characterization, and Modeling XVIII
OE106 Terahertz, RF, Millimeter, and (Huffaker, Eisele). . . . . . . . . . . . . . . . . . . . . 30
Submillimeter-Wave Technology and OE401 Advanced Fabrication Technologies for
Applications XIV (Sadwick, Yang). . . . . . . 11 Micro/Nano Optics and Photonics XIV
OE107 Gallium Nitride Materials and Devices XVI (von Freymann, Blasco, Chanda) . . . . . . . . 31
(Fujioka, Morkoç, Schwarz) . . . . . . . . . . . . . 15 OE506 Quantum Sensing and Nano Electronics
OE108 Oxide-based Materials and Devices XII and Photonics XVIII (Razeghi). . . . . . . . . 46
(Rogers, Look, Teherani) . . . . . . . . . . . . . . . 17
OE109 2D Photonic Materials and Devices IV
MOEMS-MEMS IN PHOTONICS
(Majumdar, Torres, Deng). . . . . . . . . . . . . . . 18 Program Track Chairs: Holger Becker, microfluidic
ChipShop GmbH (Germany); Georg von Freymann,
Technische Univ. Kaiserslautern (Germany)
PHOTONIC INTEGRATION
Program Track Chairs: Yakov Sidorin, Quarles & OE401 Advanced Fabrication Technologies for
Brady LLP (USA); Jean-Emmanuel Broquin, Micro/Nano Optics and Photonics XIV
IMEP-LAHC (France) (von Freymann, Blasco, Chanda). . . . . . . . . 31
OE201 Integrated Optics: Devices, Materials, OE402 MOEMS and Miniaturized Systems XX
and Technologies XXV (García-Blanco, (Zappe, Piyawattanametha, Park). . . . . . . 33
Cheben) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 OE403 Emerging Digital Micromirror Device
OE202 Smart Photonic and Optoelectronic Based Systems and Applications XIII
Integrated Circuits XXIII (He, Vivien) . . . . 21 (Ehmke, Lee). . . . . . . . . . . . . . . . . . . . . . . . . 35
OE203 Silicon Photonics XVI (Reed, Knights) . . 23 BO307 Microfluidics, BioMEMS, and Medical
Microsystems XIX (Gray, Becker, Rapp). . 37
OE204 Optical Interconnects XXI
(Schröder, Chen) . . . . . . . . . . . . . . . . . . . . . 24 BO505 Adaptive Optics and Wavefront
Control for Biological Systems VII
(Bifano, Gigan, Ji) . . . . . . . . . . . . . . . . . . . . 38
Important news: Photonics West moves to 6-11 March
The new 2021 dates provide more space at The Moscone
Center to accommodate the program and the exhibition as
we implement new meeting guidelines and requirements.
We will be working hard to ensure a safe and productive
opportunity to meet together, following health and
government guidelines. We hope you will plan to join us –
a few weeks later than usual – in 2021.
New abstract submission date: 26 August
Stay Up to Date via Email
Sign up to receive emails about SPIE Photonics West.
spie.org/signup
2 SPIE PHOTONICS WEST 2021 • spie.org/opto21call
CALL FOR PAPERS
ADVANCED QUANTUM AND DISPLAYS AND HOLOGRAPHY
OPTOELECTRONIC APPLICATIONS Program Track Chair: Liang-Chy Chien, Kent State
Program Track Chair: David L. Andrews, Univ. of Univ. (USA)
East Anglia (United Kingdom) OE701 Emerging Liquid Crystal Technologies
OE501 Quantum Computing, Communication, XVI (Chien, Muševič, Tabiryan) . . . . . . . . . 52
and Simulation (Hemmer, Migdall) . . . . . 39 OE702 Advances in Display Technologies XI
OE502 Optical and Quantum Sensing and (Lee, Wang, Yoon) . . . . . . . . . . . . . . . . . . . 53
Precision Metrology (Shahriar, Scheuer).40 OE703 Ultra-High-Definition Imaging
OE503 Complex Light and Optical Forces XV Systems IV (Miyata, Yatagai, Koike) . . . . . 54
(Galvez, Rubinsztein-Dunlop, Andrews). . 42 OE704 Practical Holography XXXV:
OE504 Photonic Heat Engines: Science and Displays, Materials, and Applications
Applications III (Seletskiy, Epstein, (Bjelkhagen, Lee). . . . . . . . . . . . . . . . . . . . . 55
Sheik-Bahae) . . . . . . . . . . . . . . . . . . . . . . . . 44
OE505 AI and Optical Data Sciences II OPTICAL COMMUNICATIONS:
(Jalali, Kitayama) . . . . . . . . . . . . . . . . . . . . 45 DEVICES TO SYSTEMS
OE506 Quantum Sensing and Nano Electronics Program Track Chair: Benjamin Dingel, Nasfine
and Photonics XVIII (Razeghi). . . . . . . . . 46 Photonics, Inc. (USA)
OE303 Quantum Dots, Nanostructures, OE801 Broadband Access Communication
and Quantum Materials: Growth, Technologies XV (Dingel, Tsukamoto,
Characterization, and Modeling XVIII Mikroulis) . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
(Huffaker, Eisele). . . . . . . . . . . . . . . . . . . . . 30 OE802 Metro and Data Center Optical Networks
and Short-Reach Links IV (Srivastava,
SEMICONDUCTOR LASERS, LEDS, AND Glick, Akasaka) . . . . . . . . . . . . . . . . . . . . . . 58
APPLICATIONS OE803 Next-Generation Optical Communication:
Program Track Chair: Klaus P. Streubel, OSRAM Components, Sub-Systems, and
GmbH (USA) Systems X (Li, Nakajima) . . . . . . . . . . . . . . 60
OE601 Vertical-Cavity Surface-Emitting Lasers OE106 Terahertz, RF, Millimeter, and
XXV (Lei, Choquette) . . . . . . . . . . . . . . . . . 48 Submillimeter-Wave Technology and
OE602 Novel In-Plane Semiconductor Applications XIV (Sadwick, Yang) . . . . . . . 11
Lasers XX (Belyanin, Smowton) . . . . . . . . 49 OE203 Silicon Photonics XVI (Reed, Knights) . . 23
OE603 Light-Emitting Devices, Materials, OE204 Optical Interconnects XXI
and Applications XXV (Kim, Krames, (Schröder, Chen) . . . . . . . . . . . . . . . . . . . . . 24
Strassburg). . . . . . . . . . . . . . . . . . . . . . . . . . 50 LA402 Free-Space Laser Communications
OE101 Physics and Simulation of XXXIII (Hemmati, Boroson). . . . . . . . . . . . . 61
Optoelectronic Devices XIX
(Witzigmann, Osiński, Arakawa) . . . . . . . . 5
General Information. . . . . . . . . . . . . . . . . . . . . . . . . . . 63
OE107 Gallium Nitride Materials and
Submission of Abstracts. . . . . . . . . . . . . . . . . . . . . . . 64
Devices XVI (Fujioka, Morkoç, Schwarz) . . 15
Application Tracks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
CO-LOCATED WITH
7–9 March 2021
Learn more: spie.org/XR21call
Submit your abstract today: spie.org/opto21call
SPIE International Headquarters SPIE Europe Office
PO Box 10 2 Alexandra Gate
Bellingham, WA 98227-0010 USA Ffordd Pengam, Cardiff, CF24 2SA UK
Tel: +1 360 676 3290 / Fax: +1 360 647 1445 Tel: +44 29 2089 4747 / Fax: +44 29 2089 4750
help@spie.org /SPIE.org info@spieeurope.org / SPIE.org
Tel: +1 360 676 3290 • help@spie.org • #PhotonicsWest 3
OPTO: THE OPTOELECTRONICS,
PHOTONIC MATERIALS AND
DEVICES CONFERENCE
EXECUTIVE ORGANIZING COMMITTEE
Ali Adibi, Georgia Institute of Technology (USA) Spiros Mikroulis, Huawei Technologies Co., Ltd.
Youichi Akasaka, Fujitsu Labs. of America, Inc. (Germany)
(Japan) Seizo Miyata, Tokyo Univ. of Agriculture and
David L. Andrews, Univ. of East Anglia (United Technology (Japan)
Kingdom) Hadis Morkoç, Virginia Commonwealth Univ. (USA)
Yasuhiko Arakawa, The Univ. of Tokyo (Japan) Igor Muševič, Jožef Stefan Institute (Slovenia)
Markus Betz, Technische Univ. Dortmund Kazuhide Nakajima, Nippon Telegraph and
(Germany) Telephone Corp. (Japan)
Hans I. Bjelkhagen, Glyndwr Univ. (United Marek Osiński, The Univ. of New Mexico (USA)
Kingdom) and Hansholo Consulting Ltd. (United Ileana Rau, Univ. Politehnica din Bucuresti
Kingdom) (Romania)
Jean-Emmanuel Broquin, IMEP-LAHC (France) Manijeh Razeghi, Northwestern Univ. (USA)
Lynda E. Busse, U.S. Naval Research Lab. (USA) Graham T. Reed, Optoelectronics Research Ctr.
Connie J. Chang-Hasnain, Univ. of California, (United Kingdom)
Berkeley (USA) David J. Rogers, Nanovation (France)
Pavel Cheben, National Research Council Canada Halina Rubinsztein-Dunlop, The Univ. of
(Canada) Queensland (Australia)
Ray T. Chen, The Univ. of Texas at Austin (USA) Laurence P. Sadwick, InnoSys, Inc. (USA)
Liang-Chy Chien, Kent State Univ. (USA) Axel Scherer, Caltech (USA)
Stéphane Collin, Ctr. de Nanosciences et de Jacob Scheuer, Tel Aviv Univ. (Israel)
Nanotechnologies (France) Henning Schröder, Fraunhofer-Institut für
Hui Deng, Univ. of Michigan (USA) Zuverlässigkeit und Mikrointegration IZM
Michel J. F. Digonnet, Stanford Univ. (USA) (Germany)
Benjamin B. Dingel, Nasfine Photonics, Inc. (USA) Ulrich T. Schwarz, Technische Univ. Chemnitz
Holger Eisele, Technische Univ. Berlin (Germany) (Germany)
Abdulhakem Y. Elezzabi, Univ. of Alberta (Canada) Denis V. Seletskiy, Polytechnique Montréal
Richard I. Epstein, ThermoDynamic Films LLC (Canada)
(USA) Selim M. Shahriar, Northwestern Univ. (USA)
Jonathan A. Fan, Stanford Univ. (USA) Mansoor Sheik-Bahae, The Univ. of New Mexico
Alexandre Freundlich, Univ. of Houston (USA) (USA)
Hiroshi Fujioka, Institute of Industrial Science, The William M. Shensky, CCDC–Army Research Lab.
Univ. of Tokyo (Japan) (USA)
Enrique J. Galvez, Colgate Univ. (USA) Yakov Sidorin, Quarles & Brady LLP (USA)
Sonia M. García-Blanco, Univ. Twente Yakov Soskind, Apple Inc. (USA)
(Netherlands) Atul K. Srivastava, NTT Electronics America, Inc.
Madeleine Glick, Columbia Univ. (USA) (USA)
James G. Grote, Photonics Engineering Consultant Okihiro Sugihara, Utsunomiya Univ. (Japan)
(USA) Nelson V. Tabiryan, BEAM Engineering for
Sailing He, KTH Royal Institute of Technology Advanced Measurements Co. (USA)
(Sweden) and Zhejiang Univ. (China) Ferechteh H. Teherani, Nanovation (France)
Philip R. Hemmer, Texas A&M Univ. (USA) Carlos M. Torres, Naval Information Warfare Ctr.
Karin Hinzer, Univ. of Ottawa (Canada) Pacific (USA)
Diana L. Huffaker, Cardiff Univ. (United Kingdom) Katsutoshi Tsukamoto, Osaka Institute of
Bahram Jalali, Univ. of California, Los Angeles Technology (Japan)
(USA) Laurent Vivien, Ctr. for Nanoscience and
Shibin Jiang, AdValue Photonics, Inc. (USA) Nanotechnology, CNRS, Univ. Paris-Sud, Univ.
Ken-ichi Kitayama, The Graduate School for the Paris-Saclay (France)
Creation of New Photonics Industries (Japan) Qiong-Hua Wang, Beihang Univ. (China)
Andrew P. Knights, McMaster Univ. (Canada) Bernd Witzigmann, Univ. Kassel (Germany)
Yasuhiro Koike, Keio Univ. (Japan) Tianxin Yang, Tianjin Univ. (China)
Jiun-Haw Lee, National Taiwan Univ. (Taiwan) Toyohiko Yatagai, Utsunomiya Univ. Ctr. for
Seung-Hyun Lee, Kwangwoon Univ. (Korea, Optical Research & Education (Japan)
Republic of) Tae-Hoon Yoon, Pusan National Univ. (Korea,
Guifang Li, CREOL, The College of Optics and Republic of)
Photonics, Univ. of Central Florida (USA) Weimin Zhou, U.S. Army Combat Capabilities
Shawn-Yu Lin, Rensselaer Polytechnic Institute Development Command (USA)
(USA)
David C. Look, Wright State Univ. (USA)
Arka Majumdar, Univ. of Washington (USA)
Alan L. Migdall, National Institute of Standards and
Technology (USA)
4 SPIE PHOTONICS WEST 2021 • spie.org/opto21call
OPTOELECTRONIC MATERIALS AND DEVICES Physics and Simulation of Optoelectronic Devices XIX (OE101) Conference Chairs: Bernd Witzigmann, Univ. Kassel (Germany); Marek Osiński, The Univ. of New Mexico (USA); Yasuhiko Arakawa, The Univ. of Tokyo (Japan) Program Committee: Hiroshi Amano, Nagoya Univ. (Japan); Toshihiko Baba, Yokohama National Univ. (Japan); Jing Bai, Univ. of Minnesota, Duluth (USA); Enrico Bellotti, Boston Univ. (USA); Guillermo Carpintero, Univ. Carlos III de Madrid (Spain); Weng W. Chow, Sandia National Labs. (USA); Alexandre Freundlich, Univ. of Houston (USA); Michael D. Gerhold, U.S. Army Research Office (USA); Frédéric Grillot, Télécom ParisTech (France); Stephan W. Koch, Philipps-Univ. Marburg (Germany); Kathy Lüdge, Technische Univ. Berlin (Germany); Cun-Zheng Ning, Arizona State Univ. (USA); Joachim Piprek, NUSOD Institute LLC (USA); Marc Sciamanna, CentraleSupélec (France); Volker J. Sorger, The George Washington Univ. (USA); Ikuo Suemune, Hokkaido Univ. (Japan); Cheng Wang, ShanghaiTech Univ. (China); Kaikai Xu, Univ. of Electronic Science and Technology of China (China) This conference targets existing, and new physical • dynamics and noise in diode lasers and and mathematical methods as applied to optoelec- systems: gain switching; passive and actively tronics, as well as recent advances in new materials mode-locked diode lasers; self-pulsations; chaos and devices. Its objective is to bring together exper- and instabilities in diode lasers and laser arrays; imentalists, theorists, computational specialists, and effects of injected light and optical feedback; development engineers to provide an interdisciplin- coherence of lasers and laser arrays ary forum to discuss physical understanding and • numerical simulation methods: heterolayer state-of-the-art computational analysis of active and transport simulation; ab-initio and multi-scale passive optoelectronic materials and devices. Theo- simulation of materials for optoelectronics; retical and experimental papers are solicited on the computational electromagnetics; multi-scale and following and related topics: multi-physics methods • optoelectronic device modeling: lasers, light- • modeling techniques for fiber and integrated emitting diodes, photodetectors, modulators, optical devices: eigenvalue techniques, finite solar cells difference, finite element and Fourier transform • materials for optoelectronic devices: wide methods, high-order propagation methods, bandgap materials; band structure, band wide-angle and vector wave equations, models offsets, gain and recombination in II-VI and of guided-wave reflection III-nitride structures, materials for mid-infrared • advances in waveguides and waveguide optoelectronic devices, photonics synthetic devices: pulse propagation in active matter waveguides, waveguide structures for routing, • plasmonic materials and structures: theory and switching and high brightness devices; tapered application in optoelectronic devices waveguides; waveguide-fiber coupling; • 2D materials and their application in photonics: nonlinear and high-power effects in waveguides electronic band structure, luminescent and fibers; gratings; soliton propagation. properties, device strategies • physics of nanostructures: quantum well, quantum wire, and quantum dot lasers and surface plasmon devices; hybrid nano structures, lattice mismatch and strain effects; Coulomb effects and macroscopic theories; carrier and quantum transport, capture, and dynamics; hole burning, gain suppression and non-equilibrium effects; coherent effects; polarization phenomena • micro- or nano-cavity effects and photonic crystals: applications for LEDs and lasers; thresholdless laser; novel VCSEL structures; polariton lasers • quantum communications: semiconductor quantum bits; single-photon devices; entangled states; quantum cryptography; optically-probed spin dynamics; cavity quantum electrodynamics, superconducting optoelectronics • neuromorphic computing: modeling and concepts for photonic neural networks Tel: +1 360 676 3290 • help@spie.org • #PhotonicsWest 5
OPTOELECTRONIC MATERIALS AND DEVICES Physics, Simulation, and Photonic Engineering of Photovoltaic Devices X (OE102) Conference Chairs: Alexandre Freundlich, Univ. of Houston (USA); Stéphane Collin, Ctr. de Nanosciences et de Nanotechnologies (France); Karin Hinzer, Univ. of Ottawa (Canada) Program Committee: Urs Aeberhard, ETH Zürich (Switzerland); Abderraouf Boucherif, Univ. de Sherbrooke (Canada); Gavin C. Conibeer, The Univ. of New South Wales (Australia); Olivier Durand, Fonctions Optiques pour les Technologies de l’information (France); Jean-François Guillemoles, Institut Photovoltaïque d’Ile-de-France (France), NextPV LIA (Japan); Oliver Höhn, Fraunhofer-Institut für Solare Energiesysteme ISE (Germany); Seth M. Hubbard, Rochester Institute of Technology (USA); Laurent Lombez, Institut Photovoltaïque d’Ile-de-France (France), NextPV LIA (Japan); Ian R. Sellers, The Univ. of Oklahoma (USA); Samuel D. Stranks, Univ. of Cambridge (United Kingdom); Masakazu Sugiyama, The Univ. of Tokyo (Japan); Robert J. Walters, Packet Digital (USA); Peichen Yu, National Chiao Tung Univ. (Taiwan) This conference attempts to capture basic research • quantum- and nano-structured devices with a and breakthroughs in the application of photonic/ particular focus on deciphering the science at novel device architectures and the development of play in photogeneration, recombination, and advanced modeling and simulation techniques to carrier transport in quantum well/quantum dot feed the innovation pipeline leading to revolutionary and wire devices and practically viable high-efficiency photovoltaic • novel materials for PV absorbers (perovskites, (PV) technologies. The conference also aims at pro- and related materials), polycrystalline viding an interdisciplinary forum to enhance inter- semiconductor (CdTe, CIGS, CZTS), hybrid actions between physicists, photonic engineers, and organic/inorganic heterostructure devices, and photovoltaic device specialists at both the experi- advances in transparent conducting oxides mental and theoretical levels. • defect-tolerant PV designs and application Theoretical or experimental papers are sought to ad- of photonics to enhance defect tolerance dress recent advances in basic material/device phys- (dislocations, radiation defects, grain- ics, simulation, demonstration, and optimization of: boundaries, points defects) of solar cells • advanced light management concepts and • contributions dealing with advanced, scalable architectures, including new approaches micro/nano-fabrication technique, the to spectral engineering (i.e. luminescent development of low-cost fabrication of material concentrators, up-down converters), light and devices, are also of relevance. concentration, surface texturing and light Finally, the conference also welcomes new and trapping (i.e. ordered and disordered patterning, emerging methods in simulation of PV and micro/nano- engineered ARs), as well as hybrid photonic/PV devices, including but not synergistic hybrid/multifunctional designs limited to 3D-drift diffusion and RCWA models, • non-conventional PV converters, in particular integrated ab-initio and multi-scale simulation application of advanced photonics to enable techniques. unique conversion mechanisms. Examples include application of photonics to enable the demonstration of advanced quantum confined or nanostructured concepts, intermediate band concepts, multiple exciton generation, thermophotonics or hot-carrier effects • advanced single and multi-junction devices leveraging on innovative materials or/and photonic architectures. In particular the simulation or/and demonstration of cross- cutting photonic engineering approaches for enhancing the performance, reliability and functionality of these devices • advanced optical characterization techniques, including photoluminescence, electroluminescence and cathodoluminescence, ellipsometry, reflectometry, and time-resolved measurements. Correlative and multi-scale characterization techniques are also welcome 6 SPIE PHOTONICS WEST 2021 • spie.org/opto21call
CALL FOR PAPERS
Optical Components and Materials XVIII (OE103)
Conference Chairs: Shibin Jiang, AdValue Photonics, Inc. (USA); Michel J. F. Digonnet, Stanford Univ.
(USA)
Program Committee: Jean-Luc Adam, Univ. de Rennes 1 (France); Joel Bagwell, Brandywine Photonics
(USA); Rolindes Balda, Univ. del País Vasco (Spain); Robert P. Dahlgren, NASA Ames Research Ctr. (USA);
Angel Flores, Air Force Research Lab. (USA); Jesse A. Frantz, U.S. Naval Research Lab. (USA);
Leonid B. Glebov, CREOL, The College of Optics and Photonics, Univ. of Central Florida (USA);
Seppo K. Honkanen, Univ. of Eastern Finland (Finland), Microsoft HoloLens (Finland); Jacques Lucas,
Univ. de Rennes 1 (France); Yasutake Ohishi, Toyota Technological Institute (Japan); Aydogan Ozcan,
Univ. of California, Los Angeles (USA); Giancarlo C. Righini, Istituto di Fisica Applicata “Nello Carrara”
(Italy); Setsuhisa Tanabe, Kyoto Univ. (Japan); John M. Zavada, Polytechnic Institute of New York Univ.
(USA); Jun Zhang, CCDC–Army Research Lab. (USA)
Active and passive optical components are playing • nonlinear frequency converters
key roles in current optical communication networks, • photonic-bandgap fibers and devices
optical sensors, and medical optical devices. Exten- • plasmonic devices and technologies
sive research continues to be carried out to improve • sub-wavelength optical elements
their performance and functionality, and to reduce
• photosensitivity in fibers and planar waveguides
their size and cost. Areas of research that are particu-
larly active include high-power fiber lasers, switches, • photosensitivity in glasses and polymers
filters, ultra-short-pulse fiber lasers, as well as ma- • filters, reflectors, and other grating-based
terial research in rare-earth-doped glasses, semicon- devices
ductors, and nano-particles for enabling innovative • fiber and waveguide Bragg gratings
photonic devices. There is also significant activity in • long-period fiber gratings
developing components in lightwave circuits, which • modeling glass structure and defects arising
will ultimately reduce manufacturing cost while in- from UV irradiation
tegrating multiple active and passive functions on a • novel passive and active components for dense
single chip. WDM
The purpose of this conference is to bring together • tunable filters and add-drop filters
researchers and engineers from academia and indus- • device packaging, testing, and reliability
try to discuss recent developments in these rapidly • devices for optical interconnect
advancing fields. Suggested topics include: • detectors
• rare-earth-doped devices and materials • SWIR photodetectors
• rare-earth-doped or metal-doped glasses, • single-photon detectors
crystals, polymers, semiconductors, hybrid • silicon-based photodetectors
materials, and fibers
• low-noise detection architectures
• spectroscopy of rare-earth ions and other laser
• unique detector materials and special spectral
species
regions
• graphene and carbon nanotubes
• progress in MEMS-based detectors
• new materials for mode-locking
• detectors with gain.
• nanoparticles
• quantum dots
• fiber amplifiers design and fabrication
• waveguide lasers and amplifiers
• UV to far-infrared fiber lasers
• cladding-pumped lasers and amplifiers
• Raman laser and amplifiers
• Brillouin lasers Save the date
• broadband fiber sources
• semiconductor-based lasers and amplifiers ABSTRACTS DUE: 26 AUGUST 2020
• optical switches, modulators, and other devices
• optical nonlinearities in fibers and waveguides AUTHOR NOTIFICATION: 2 NOVEMBER 2020
• lithium niobate bulk-optic and waveguide The contact author will be notified of acceptance
devices by email.
• thermal and UV poling of silica and other glasses
• electro-optic poled sol-gels MANUSCRIPTS DUE: 20 JANUARY 2021
• progress in lithium niobate electro-optic (Confs OE506, OE801, OE802, and OE803 Only)
modulators
MANUSCRIPTS DUE: 16 FEBRUARY 2021
(All Confs Except OE506, OE801, OE802, and
OE803)
PLEASE NOTE: Submission implies the intent of at least
one author to register, attend the conference, present the
paper as scheduled, and submit a full-length manuscript
for publication in the conference proceedings.
Submit your abstract today: spie.org/opto21call
Tel: +1 360 676 3290 • help@spie.org • #PhotonicsWest 7
OPTOELECTRONIC MATERIALS AND DEVICES
Organic Photonic Materials and Devices XXIII (OE104)
Conference Chairs: William M. Shensky III, CCDC–Army Research Lab. (USA); Ileana Rau, Univ. Politehnica
din Bucuresti (Romania); Okihiro Sugihara, Utsunomiya Univ. (Japan)
Program Committee: Chantal Andraud, Ecole Normale Supérieure de Lyon (France); Werner J. Blau,
Trinity College Dublin (Ireland); Ken Caster, Air Force Office of Scientific Research (USA); Fabrice Charra,
CEA (France); Beata J. Derkowska-Zielinska, Nicolaus Copernicus Univ. (Poland); Raluca Dinu, GigPeak,
Inc. (USA); Manfred Eich, Technische Univ. Hamburg-Harburg (Germany); James G. Grote, Photonics
and Electronics Engineering Research Consultant (USA); Alex K. Y. Jen, Univ. of Washington (USA);
Michael H. C. Jin, Johns Hopkins Univ. Applied Physics Lab., LLC (USA); Toshikuni Kaino, Tohoku Univ.
(Japan); François Kajzar, Univ. Politehnica din Bucuresti (Romania); Eunkyoung Kim, Yonsei Univ. (Korea,
Republic of); Jang-Joo Kim, Seoul National Univ. (Korea, Republic of); Junya Kobayashi, NTT Advanced
Technology Corp. (Japan); Yasuhiro Koike, Keio Univ. (Japan); Isabelle Ledoux-Rak, Lab. de
Photonique Quantique et Moléculaire (France); Kwang-Sup Lee, Hannam Univ. (Korea, Republic of);
Misoon Y. Mah, Asian Office of Aerospace Research and Development (Japan); Seth R. Marder, Georgia
Institute of Technology (USA); Antoni C. Mitus, Wroclaw Univ. of Science and Technology (Poland);
Jaroslaw Mysliwiec, Wroclaw Univ. of Science and Technology (Poland); Robert A. Norwood, Wyant
College of Optical Sciences (USA); Jean-Michel Nunzi, Queen’s Univ. (Canada); Shuji Okada, Yamagata
Univ. (Japan); Akira Otomo, National Institute of Information and Communications Technology (Japan);
Lada N. Puntus, Kotelnikov Institute of Radio Engineering and Electronics of RAS (Russian Federation);
Niyazi Serdar Sariciftci, Johannes Kepler Univ. Linz (Austria); Devanand K. Shenoy, U.S. Dept. of Energy
(USA); Kenneth D. Singer, Case Western Reserve Univ. (USA); Christopher E. Tabor, Air Force Research
Lab. (USA); Rebecca E. Taylor, Lockheed Martin Space Systems Co. (USA); Jeong-Weon Wu, Ewha
Womans Univ. (Korea, Republic of); Shiyoshi Yokoyama, Kyushu Univ. (Japan); Roberto Zamboni, Istituto
per la Sintesi Organica e la Fotoreattività (Italy); Wei Zhou, Virginia Polytechnic Institute and State Univ.
(USA)
For energy-saving and economic reasons, there is a • photochromic materials
growing interest in organic/polymeric photonic and • plasmonic NLO effects
electronic materials and devices that is generating • theoretical description of NLO processes
a revolution in optical communication, data trans- • nanophotonics and organic metamaterials
mission, storage, displays, and many other photonic
• photorefractive materials and processes
applications. Recent advances in optical intercon-
nection and electro-optic devices as well as planar • polymer optical waveguides and fibers
light-wave circuits, light-emitting and photovoltaic • organic field effect transistors
devices suggest that organic and polymeric materials • polymer lasers and amplifiers
will play a significant role in these areas. Organic-in- • biophotonics
organic hybrid materials and biophotonic materials • biopolymers
are of special concern for novel photonic device de- • hybrid organic-inorganic materials
velopment. The ability to solution process various or- • single-molecule spectroscopy
ganic and organic-inorganic hybrid materials opens • electro-optic materials for silicon photonics
them up to next-generation advanced processing
• organic-inorganic hybrid materials and devices
techniques, such as additive manufacturing and roll-
to-roll printing, which are usually not feasible with • flexible semiconductors
all inorganic photonic materials. Applications that • polymeric photonic crystals
require flexible and stretchable photonic devices are • printed optical materials and processes
also more viable with organic materials compared to • Rf organic materials properties.
most inorganic alternatives. Organic Photonic Mate-
rials and Devices XXIII will serve as a forum for the
dissemination and discussion of state-of-the-art re-
sults pertaining to organic/polymeric opto-electron-
ic, nanophotonic, and biophotonic materials and de-
vices, their manufacturability, and their applications.
The objective of this conference is to bring together
researchers and engineers from academia, industry,
and government laboratories who share a common
interest in organic/polymeric photonic materials and
devices. This conference will provide a forum for an
update on progress in the highly-connected and mul-
tidisciplinary subject of photonic technologies based
on organic/polymeric materials. Papers are solicited
in the following areas:
• organic light-emitting materials and devices
(OLEDs)
• polymer solar cells and photodetectors
• nonlinear optical polymer materials and devices
• multiphoton processes
• saturable-absorption and reverse-saturable
absorption
• charge transport in organic materials
8 SPIE PHOTONICS WEST 2021 • spie.org/opto21callCALL FOR PAPERS
Ultrafast Phenomena and Nanophotonics XXV
(OE105)
Conference Chairs: Markus Betz, Technische Univ. Dortmund (Germany); Abdulhakem Y. Elezzabi, Univ. of
Alberta (Canada)
Program Committee: Alan D. Bristow, West Virginia Univ. (USA); Keshav Dani, Okinawa Institute of
Science and Technology Graduate Univ. (Japan); Jeff Davis, Swinburne Univ. of Technology (Australia);
Kimberley C. Hall, Dalhousie Univ. (Canada); Rupert Huber, Univ. Regensburg (Germany); Robert A.
Kaindl, Arizona State Univ. (USA); Dai-Sik Kim, Ulsan National Institute of Science and Technology (Korea,
Republic of); Xiaoqin Li, The Univ. of Texas at Austin (USA); Christoph Lienau, Carl von Ossietzky Univ.
Oldenburg (Germany); James Lloyd-Hughes, The Univ. of Warwick (United Kingdom); Torsten Meier,
Univ. Paderborn (Germany); Frank J. Meyer zu Heringdorf, Univ. Duisburg-Essen (Germany); Walter
Pfeiffer, Univ. Bielefeld (Germany); Pascal Ruello, Le Mans Univ. (France); Volker J. Sorger, The George
Washington Univ. (USA); Fabrice Vallee, Institut Lumière Matière (France); Kam Sing Wong, Hong Kong
Univ. of Science and Technology (Hong Kong, China)
Conference Cosponsor:
This conference covers ultrafast phenomena in bulk ULTRAFAST PLASMONICS
semiconductors, semiconducting and metallic nano- • active plasmonics
structures and devices with emphasis on ultrafast • THz plasmonics
optical and/or coherent phenomena. Manuscripts are • ultrafast dynamics in metallic nanostructures.
solicited in the following topics but not restricted to:
THZ SPECTROSCOPY
ULTRAFAST DYNAMICS IN SEMICONDUCTORS
• THz wave generation
AND HETEROSTRUCTURES
• field-resolved techniques
• carrier-carrier, carrier-phonon interactions
• THz time-domain spectroscopy
• polariton dynamics in microcavities
• strong-field THz physics.
• ultrafast acoustic phenomena.
ULTRAFAST PROCESSES IN DEVICES AND
COHERENT DYNAMICS OF OPTICAL EXCITATIONS
LASERS
• excitonic coherences and exciton dynamics
• ultrafast optical switching
• quantum interference effects
• wavelength conversions
• four-wave mixing, two-dimensional
• gain dynamics in lasers and amplifiers.
spectroscopy.
ULTRAFAST NANO-OPTICS
NON-LINEAR OPTICAL EFFECTS
• nanoemitters, nanoantennae
• optical frequency conversion
• nanolocalization of optical fields
• multi-photon processes, high-field physics
• coherent control in nanostructures
• high harmonic generation, attosecond physics
• semiconductor quantum dots and wires
• nonlinear and ultrafast processes at surfaces
and interfaces. • single-photon sources
• applications for quantum information
NON-EQUILIBRIUM CARRIER TRANSPORT processing.
• ballistic carrier transport
ULTRAFAST OPTICAL PROPERTIES OF
• tunneling phenomena
METAMATERIALS
• Bloch oscillations.
• photonic and phononic crystals
ULTRAFAST PHENOMENA CARBON • metal-semiconductor hybrid structures
NANOMATERIALS • negative-index materials
• dynamics in graphene and carbon nanotubes • epsilon-near-zero materials
• graphene plasmonics • metatronics.
• carbon-based quantum dots.
ULTRAFAST QUANTUM ELECTRONICS
ULTRAFAST PHENOMENA IN MONOLAYER • quantum dots in resonators
SEMICONDUCTORS • quantum entanglement
• nonlinear and dynamical processes in transition • color centers in wide bandgap materials
metal dichalcogenides (TMDs)
• single photon sources.
• optics in silicene, germanene and black
phosphorus ULTRAFAST PHOTOCURRENTS
• novel emerging 2D materials. • bulk material ultrafast phenomena
• ultrafast microscopy.
SPIN DYNAMICS AND SPIN MANIPULATION
• ultrafast optical spin manipulation
• spin coherence and relaxation
continued next page
• ultrafast magnetism
• spin injection and transport.
Tel: +1 360 676 3290 • help@spie.org • #PhotonicsWest 9OPTOELECTRONIC MATERIALS AND DEVICES
Ultrafast Phenomena and Nanophotonics XXV (OE105 continued)
BEST STUDENT PAPER AWARDS
All contributed papers of conference OE105 given
by a young scientist (PhD student or postdoc
within the first two years after graduation) are
eligible for the award. Note that this award is
for contributed papers only. Invited papers and
contributions to other symposia do not qualify.
To facilitate handing out the award during the
meeting, applications will be collected prior to the
meeting. To qualify for the award, applicants must:
• be a young scientist (PhD student or postdoc
within the first two years after graduation)
• be listed as a contributing author (not invited)
on an accepted paper within conference
OE105
• have conducted the majority of the work to
be presented
• submit your manuscript online by 16 February
2021
• present your paper as scheduled
• be present at the Awards Ceremony.
To Apply, qualified applicants must submit:
• slides of presentation (Powerpoint or PDF
document)
• additional information about the scientific
content of the presentation
• date of graduation if you have already
completed your PhD.
The presentation and the supplementary material
should be sent via email to Prof. Markus Betz
(please include your SPIE paper number) by 8
January 2021.
Save the date
ABSTRACTS DUE: 26 AUGUST 2020
AUTHOR NOTIFICATION: 2 NOVEMBER 2020
The contact author will be notified of acceptance
by email.
MANUSCRIPTS DUE: 20 JANUARY 2021
(Confs OE506, OE801, OE802, and OE803 Only)
MANUSCRIPTS DUE: 16 FEBRUARY 2021
(All Confs Except OE506, OE801, OE802, and
OE803)
PLEASE NOTE: Submission implies the intent of at least
one author to register, attend the conference, present the
paper as scheduled, and submit a full-length manuscript
for publication in the conference proceedings.
Submit your abstract today: spie.org/opto21call
10 SPIE PHOTONICS WEST 2021 • spie.org/opto21callCALL FOR PAPERS
Terahertz, RF, Millimeter, and Submillimeter-
Wave Technology and Applications XIV (OE106)
Conference Chairs: Laurence P. Sadwick, InnoSys, Inc. (USA); Tianxin Yang, Tianjin Univ. (China)
Program Committee: René Beigang, Technische Univ. Kaiserslautern (Germany); Jianji Dong, Huazhong
Univ. of Science and Technology (China); Frank Ellrich, Technische Hochschule Bingen (Germany);
Fabian Friederich, Fraunhofer-Institut für Techno- und Wirtschaftsmathematik ITWM (Germany);
Robert H. Giles, Univ. of Massachusetts Lowell (USA); R. Jennifer Hwu, InnoSys, Inc. (USA);
Mona Jarrahi, Univ. of California, Los Angeles (USA); Daniel Molter, Fraunhofer-Institut für Techno-
und Wirtschaftsmathematik ITWM (Germany); J. Anthony Murphy, National Univ. of Ireland, Maynooth
(Ireland); Créidhe O’Sullivan, National Univ. of Ireland, Maynooth (Ireland); Kyung Hyun Park, Electronics
and Telecommunications Research Institute (Korea, Republic of); Alessia Portieri, TeraView Ltd. (United
Kingdom); Marco Rahm, Technische Univ. Kaiserslautern (Germany); Jinghua Teng, Institute of Materials
Research and Engineering (Singapore); Michael Weibel, Joint Research and Development, Inc. (USA);
Maddy Woodson, Freedom Photonics, LLC (USA); Jiangfeng Zhou, Univ. of South Florida (USA)
This conference brings together researchers and en- This conference also includes hybrid technologies
gineers from academia, industry, and government including, for example, microwave to THz wearable
laboratories to explore and present work in the fre- devices of any type and form as well as microwave
quency range covering approximately less than 1 GHz to THz communications and data links, artificial in-
(300 mm) to greater than 3 THz (100 μm) as well as telligence, machine learning virtual reality and aug-
infrared including near, mid and far infrared. Papers mented reality in microwave to THz, GHz, mm-wave,
on RF and millimeter and infrared technology includ- sub-mm-wave, microwave and IRimaging, etc.
ing advances in wireless communications, radar, lidar, Disciplines utilizing terahertz technology include
microwave and mm-wave photonics, metamaterials, physical chemistry (certain molecules or molecular
antennas, phased array radar, modulation, security, segments exhibit strong resonances in the 10 cm-1 to
monitoring, detection, imaging are encouraged. Pa- 100 cm-1 spectral region), military, and homeland se-
pers in photonic-related fields including, but not lim- curity (terahertz radiation can penetrate clothing and
ited to, radio over fiber (RoF) RF photonics including packing materials but is reflected by metals and oth-
photonic generation of microwave signals, photonic er materials), biomedical technology (tissue exhib-
processing of microwave signals, and photonic distri- its reflection and absorption properties that change
bution of microwave signals and semiconductor (in- dramatically with tissue characteristics), medical and
cluding Si, SiC, SOI, GaAs, GaN, InP, SiGe, diamond, dental, secure short-distance wireless communica-
graphene and other materials) RF, mm-wave and ter- tions (atmospheric water content prevents terahertz
ahertz devices and related applications are also en- radiation from traveling very far), astronomy (the
couraged, as well as the hybrid photonic systems and cold background of the universe exhibits a peak in
applications. Terahertz (THz) technology deals with this spectral region), space communications (where
the generation and utilization of electromagnetic en- the terahertz region is wide open for use) and other
ergy covering what is also known as the sub-millime- disciplines where new, yet-to-be-discovered applica-
ter wave region of the spectrum. In this region, which tions will undoubtedly come forth. Since the low en-
lies between the millimeter wave and far infrared ergy associated with terahertz radiation is expected
spectral regions, materials exhibit properties that can to be no more harmful than infrared or microwave
be exploited to advantage for use over a broad range radiation, safety issues are not expected to limit the
of important technologies and applications. Papers use of terahertz radiation at low-power levels.
on terahertz photonics including photonic genera-
tion and detection of terahertz waves to/or infrared, Papers on power supplies and electronic power con-
THz to/or infrared lasers are also encouraged. ditioners and associated power protection systems
including energy-efficient power supplies are also
This conference includes low- to high-power sources, encouraged.
detectors, amplifiers, systems, including both pho-
tonic and electronic modulated sources, detectors, Papers are solicited in the following and related ar-
and systems as well as nanodevices, nanomaterials, eas:
nanotechnology, nanostructures, etc. At THz fre- TERAHERTZ SOURCES
quencies, the primary difficulty encountered by sci- • solid-state sources, electron-beam sources,
entists and engineers working in this field is the lack vacuum electronics sources, frequency mixers,
of convenient and affordable sources and detectors frequency multipliers, parametric oscillators,
of terahertz radiation, but this difficulty is gradually hybrids, graphene, FET and HEMT sources, gas
changing as new sources and improved detectors are lasers, quantum cascade lasers and related
being developed as the technology continues to ma- sources, p-germanium sources, photoconductive
ture and broaden. At RF and millimeter frequencies, switches, resonant tunneling diodes, backward
more and more hybrid systems are being integrated wave oscillators
with photonic devices that enhance the functions, • novel stabilized photonic THz sources
specifications and stabilities tremendously compared
• fabrication processes
to their traditional counterpart systems. The purpose
of this conference is to gather scientists and engi- • high bandwidth devices, structures, sources,
neers from a diverse set of disciplines, who are in- detectors, sensors, etc.
terested in either learning more about terahertz and • wearables
sub-millimeter and millimeter wave and RF technolo- • systems and systems integration
gy and related and coupled technologies, or who are • THz pulse-induced ferroelectric behavior in
contributing to the field through their own research, materials
development, or manufacturing activities.
continued next page
Tel: +1 360 676 3290 • help@spie.org • #PhotonicsWest 11OPTOELECTRONIC MATERIALS AND DEVICES
Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and
Applications XIV (OE106 continued)
• using THz to control quantum properties • quantum dot-(QD) based including for QDs for
• measuring nonlinear effects in matter due to THz sensors, detectors and sources
radiation. • diamond-based
RF, SUB-MILLIMETER-WAVE, AND MILLIMETER- • graphene-based
WAVE SOURCES • other-based.
• power sources of all types in the range of 1 GHz ENHANCEMENTS, IMPROVEMENTS AND
to 300 GHz and 300 GHz and higher (i.e. from ADVANCES IN RF, MILLIMETER-WAVE AND SUB-
S-band to the higher end of the millimeter-wave MILLIMETER WAVE GENERATION, MODULATION
frequencies and all of the sub-millimeter-wave AND DETECTION
frequency region) • RF, millimeter-wave and sub-millimeter-wave
• novel stabilized photonic RF, millimeter-wave, integrated photonic devices
sub-millimeter-wave sources. • RF, millimeter-wave and sub-millimeter-wave
DETECTORS AND SENSORS and photonic integration process development
• bolometers and other thermal detectors, • RF, millimeter-wave and sub-millimeter-wave
Schottky and other mixers, thermopiles, performance characterization
quantum devices, antenna integrated detectors, • phased-array and single-element photonically-
heterodyne detection techniques, hybrid driven antennas
detection, direct detection techniques • phased-array and single-element antennas,
• transistor-based detectors including graphene, systems, concepts, approaches
silicon, III-V, II-VI, nitride-based, etc. • low-Vπ and wide-bandwidth modulators
• theoretical modeling • direct-driven millimeter-wave lasers and
• novel detectors and sensors amplifiers
• detector arrays. • millimeter-wave, sub-millimeter and THz
photonic crystal devices and applications
HIGH-POWER SOURCES, MODULES, AND
• RF, millimeter-wave, sub-millimeter-wave and
SYSTEMS
THz photonic up- and down-converters
• THz, RF, millimeter-wave and sub-millimeter-
• photonic phase locked loops
wave high-power sources
• RF, millimeter-wave, sub-millimeter-wave, and
• THz, RF, millimeter-wave and sub-millimeter-
THz MMICs
wave modules
• wearables
• THz, RF, millimeter-wave and sub-millimeter-
wave systems • RF, millimeter-wave, sub-millimeter-wave,
high power solid-state and electronic vacuum
• power supplies and support circuits, electronics,
devices.
optoelectronics, systems.
SIMULATIONS AND MODELING
TERAHERTZ, IR, RF, MILLIMETER-WAVE, AND
SUB-MILLIMETER-WAVE PASSIVE COMPONENTS • simulations and/or modeling of RF devices,
components, and/or systems
• metamaterials, plasmonics, and artificial
materials • simulations and/or modeling of millimeter-wave
devices, components, and/or systems
• optics, lenses, gratings, waveguides, photonic
crystal structures and metamaterials, couplers, • simulations and/or modeling of sub-millimeter-
wire guides, other components wave devices, components, and/or systems
• using graphene to control polarization of IR and • simulations and/or modeling of THz devices,
THz waves. components, and/or systems
• modeling of optical components, optical
MATERIALS FOR THZ AND GHZ DEVICES systems, imaging systems, wave propagation,
• metamaterials, plasmonics, and artificial modes, Gaussian beam characteristics, couplers,
materials antennas, performance limitations, software
• linear and nonlinear optical materials and designs
devices • artificial intelligence, machine learning,
• organic and inorganic source and modulator augmented reality, virtual reality.
materials and devices
SPECTROSCOPY AND FREQUENCY METROLOGY
• RF, millimeter-wave and sub-millimeter-wave
• terahertz and/or sub-millimeter spectroscopy,
materials, devices and fabrication processes
DNA segment identification, cell abnormalities,
• THz and/or GHz material systems including cancer identification and screening, imaging,
devices, detectors and sensors medical and dental detection
• silicon (Si)-based • infrared spectroscopy
• silicon carbide (SiC)-based • identification of biological and chemical
• silicon-on-insulator (SOI)-based detection and fingerprinting
• gallium arsenide (GaAs)-based • identification of hazardous, explosive, and/or
• gallium nitride (GaN)-based dangerous materials
• indium phosphide (InP)-based • identification of chemical or biological threats
• silicon germanium (SiGe)-based
12 SPIE PHOTONICS WEST 2021 • spie.org/opto21callCALL FOR PAPERS
• scalar and vector network analysis at sub- ASTRONOMY, SPACE AND OTHER AREAS OF
millimeter and terahertz frequencies PHOTONICS, LIGHT, AND MATTER
• measurement techniques at sub-millimeter, • imaging techniques, ultra-sensitive detection,
millimeter, and terahertz frequencies applications, programs
• identification of organic and inorganic • artificial intelligence, machine learning,
compounds using terahertz and/or sub- augmented reality, virtual reality, etc.
millimeter wave spectroscopy • satellite communications
• high-speed and/or high-resolution spectroscopic • space based electronics and devices
techniques, methods, approaches • satellite components and systems
• artificial intelligence, machine leaning, • space and satellite qualifications and testing
augmented reality, virtual reality, etc. • radiation hard electronics
• novel approaches, systems, designs, techniques, • high-energy physics and related topics
reflection, sensitivity, applications.
• fusion and related topics
BIOMEDICAL APPLICATIONS • fission and related topics.
• DNA identification, burn analysis, tissue
INNOVATIONS
abnormality identification, pharmaceutical,
dentistry, medical, clinical, commercial • new or novel terahertz, RF, millimeter-wave and
applications sub-millimeter, microwave concepts, systems,
applications
• cancer, burn, and/or water content detection;
high sensitivity, high contrast, etc. • new or novel developments in THz or sub-
millimeter waves including teaching, instruction,
• biological and/or physiological aspects and/
course offerings, simulations, conceptional and/
or related effects of RF, millimeter-wave, sub-
or experimental procedures, implementations,
millimeter-wave and/or THz
concepts, etc.
• artificial intelligence, machine learning,
• wearables, implantable, etc.
augmented reality, virtual reality, etc.
• imaging techniques, methods, hardware design, POWER SUPPLIES AND ELECTRONIC POWER
strategies, technologies and techniques. CONDITIONERS
• high-power power supplies
COMMUNICATION AND SENSING SYSTEMS
• low- and ultra-low-power power supplies
• terahertz, RF, millimeter-wave and sub-
millimeter-wave communications, media • low-noise power supplies
characteristics, wireless communications, • high- and ultra-efficient power supplies
inspection systems, detection systems, • associated power protection systems
screening systems • energy-efficient power supplies
• RF, millimeter, sub-millimeter-wave and • novel designs and architectures
microwave links • specialized power electronics
• RF, millimeter-wave, sub-millimeter-wave • portable power supplies
photonic communication and sensing systems • power supplies tailored for photonics and/or RF,
• Internet of things (IOT) sensors, detectors mm-wave and/or THz applications
and communication interfaces, protocols and • power supplies for lighting applications
implementations including but not limited to including solid state lighting such as LEDs,
wireless sensors and wireless communications. OLEDs and quantum dots.
IMAGING AND SECURITY ORGANIC ELECTRONICS
• RF imaging devices, components, and/or • DC and low frequency
systems • high frequency
• millimeter-wave imaging devices, components, • novel designs and architectures
and/or systems • passive and active addressable arrays
• sub-millimeter-wave imaging devices, • low power
components, and/or systems
• modulated configurations
• THz imaging devices, components, and/or
• sensing, detection, and/or emitting
systems
• organic light-emitting diodes and associated
• RF, millimeter-wave and sub-millimeter-wave
electronics
active and passive imaging systems
• lighting therapy using solid state lighting
• artificial intelligence, machine learning,
including microLEDs, LEDs, OLEDs and quantum
augmented reality, virtual reality, etc.
dots
• x-ray imaging including components, systems,
• solid state lighting including microLEDs, OLEDs
power supplies, applications, techniques, etc.
and quantum dots.
continued next page
Tel: +1 360 676 3290 • help@spie.org • #PhotonicsWest 13OPTOELECTRONIC MATERIALS AND DEVICES
Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and
Applications XIV (OE106 continued)
INFRARED DEVICES, COMMUNICATIONS, SMALL SATELLITES
SOURCES, SENSORS, AND DETECTORS • systems
• infrared amplifiers • components
• infrared imaging devices, components, and/or • detectors
systems • sensors
• infrared sources devices, components, and/or • instrumentation
systems • communications
• infrared sensors, detectors and/or associated • concepts
devices, components, and/or systems
• implementations.
• infrared communications devices, components,
and/or systems ADDITIVE MANUFACTURING AND 3D PRINTING
• infrared active and passive components and/or • additive manufacturing and/or 3D printing of/for
systems RF, microwaves, millimeter-waves, THz and/or
• infrared advances including components, infrared devices, systems, communications, etc.
systems, power supplies, applications, • additive manufacturing and/or 3D printing of/for
techniques, etc. electronics and materials
• infrared applications • 2D for electronics and/or materials for RF,
• wearables microwaves, millimeter-waves, THz, and/or
• artificial intelligence, machine learning, infrared
augmented reality, and virtual reality. • chip-level waveguides
• chip-level frequency comb generator
• nanotubes including graphene films for RF,
microwaves, millimeter-waves, THz, and/or
infrared
• other quantum technologies, devices, and
applications
• comb generators for use in electronics, RF,
microwaves, millimeter-waves, THz, and/or
infrared.
Save the date
ABSTRACTS DUE: 26 AUGUST 2020
AUTHOR NOTIFICATION: 2 NOVEMBER 2020
The contact author will be notified of acceptance
by email.
MANUSCRIPTS DUE: 20 JANUARY 2021
(Confs OE506, OE801, OE802, and OE803 Only)
MANUSCRIPTS DUE: 16 FEBRUARY 2021
(All Confs Except OE506, OE801, OE802, and
OE803)
PLEASE NOTE: Submission implies the intent of at least
one author to register, attend the conference, present the
paper as scheduled, and submit a full-length manuscript
for publication in the conference proceedings.
Submit your abstract today: spie.org/opto21call
14 SPIE PHOTONICS WEST 2021 • spie.org/opto21callYou can also read
