Leadership pays Proven path to new security-driven applications - www.infineon.com/payment - Infineon Technologies
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Opportunities
››Chance to tap into higher value cards
››Faster route to multi-application business models
››New form factors
Challenges
››Master the shift towards
contactless cards
››Avoid proprietary lock-in
››Roll out EMV rapidly and in
high volumes
Success factors
››Partner with experience in contactless and multi-application space,
e.g. eGovernment, eTransport
››Open standards
››Speed
››New form factors compliant with strict certification requirements
2Changing needs of a
changing market
Payment cards are facing new challenges. They are evolving to include addition-
al applications such as transport ticketing and this calls for more robust technol-
ogies. The mobile trend also demands more convenient contactless solutions.
Traditional, contact-based cards must transition quickly and efficiently to con-
tactless schemes offering strong contactless performance to support speed-criti-
cal applications such as ticketing.
These new payment cards with additional applications involving multiple
stakeholders are far more complex to implement. Know-how and experience
across different applications are essential to master this complexity. Proven
expertise can also help accelerate time to market and enable a speedy transition
to new payment standards supporting global interoperability such as EMV and
CIPURSE™.
Mastering rising requirements for payment cards
The road to success lies in chip technologies designed to meet evolving security,
flexibility and performance needs, delivered by an experienced partner who can
offer proven implementation support and enable rapid roll-out.
Storing payment credentials, security chips must be built on robust, fraud-re-
sistant architectures designed to international security standards – ideally open
standards such as EMV, PBOC or RuPay. In addition, they must support various
online and offline authentication methods, interfaces and application schemes
for multi-application functionality. In short, service providers need tailored solu-
tions that are secure, flexible, powerful, easy to use and – above all – capable of
building user trust.
Rising payment and banking card ICs
3,279
Units Shipped (Million) 3,151
3,023
CAGR | 2012-2019: +13% 2,861
2,644
2,226
1,853
1,393
2012 2013 2014 2015 2016 2017 2018 2019
Source: IHS Smart Cards Semiconductors Report, 2015. Edition - July 2015
3Applications
››Contact-based, dual interface and contactless payment cards
››Online and offline (DDA/CDA) data authentication
››Mobile Payment
4Shaping tomorrow’s
payment market
As a leading provider of security chips for payment applications, like credit
and debit cards we offer a broad range of solutions that empower our
customers with the benefits of speed, flexibility and responsiveness. Our
entire portfolio is designed to reduce complexity and conserve resources
while giving our customers a head-start on current market trends such as
the migration to EMV.
5Fastest time to market
Our SOLID FLASH™ technology offers a future-proof memo- concept. This smart design accelerates time to market by
ry concept to meet rising demand for increasingly differen- more than 50% compared with ROM-based solutions; it
tiated smart card functionality. It combines the advantages also significantly reduces planning and logistics complexity.
of a flexible flash memory with a sophisticated security
SOLID FLASH™
SOLID FLASH™ – combines the advantages of a flexible flash memory
with a dedicated security concept.
Faster time to market Reduced complexity
SOLID Prototyping Savings > 50% Reduced by > 50%
Development & Learning Lead times Logistics
FLASH™ cycles
Logistics
Complexity & Risks
Prototyping Planning Process Complexity & Risks
ROM Development & Learning Lead times Planning Process
cycles
ROM SOLID FLASH™
6Benefits
››Improved long-term robustness of dual interface (DIF)
payment cards
››Simplified card design and manufacturing – up to five
times faster than conventional technologies
››Increased manufacturing yield by elimination of direct
antenna-to-module connection
››Significant reduction in electrostatic discharge (ESD)
impact of dual interface cards
Easy transition from
contact-based to contactless
Our “Coil on Module” technology gives card manufacturers rapid access to
the growing market for contactless solutions without having to invest in new
manufacturing equipment. CoM uses radio frequency instead of a physical link
between the module and the antenna. It improves the performance, robustness
and reliability of the final product.
Coil on Module
Chip module with antenna
at the rear side of the module
Chip card antenna
Using our chip modules,
dual-interface cards can be
manufactured faster and more
efficient than ever before.
Radio communication between
chip card antenna and chip module antenna
7Broadest portfolio
in the industry
We have the broadest portfolio in the industry. This portfolio reflects our com-
mitment to enabling, innovating and simplifying the global migration to the EMV
standard.
SLC 32P answers the rising performance demands of today’s contactless appli-
cations and supports all contactless transmission protocols. It is the solution of
choice for multi-application cards.
All of our contactless SLC 32P products support the open CIPURSE™ standard for
secure, cost-effective handling of payment, access and ticketing applications.
The CIPURSE™ standard is non-proprietary, interoperable and capable of sup-
porting multi-functional cards and infrastructure convergence.
8Benefits
››Optimized for payment applications such as VSDC, M/Chip, PBOC
››Ready for multi-application and public transport cards
››Fast personalization capabilities
››Support for Type A, B and C (Felica™)
Card Card
Dual- Contact- Multi-
Authentication Authentication
Interface based application
methods online
Current solutions require an own
OS development with hardware
qualification for each function
Operating Operating Operating Operating Operating
System 1 System 1 System 2 System 3 System 4
Hardware Hardware Hardware Hardware Hardware
Platform 1 Platform 2 Platform 3 Platform 4 Platform 5
Multi-
application
All card e.g. payment All Interfaces
authentication and transport Contactbased,
methods contactless,
The Infineon platform SLC 32P
Dual-Interface
allows integration of all functions
with only one OS solution
Operating
System
SLC 32P
Platform
The latest generation of our SLC 32P security controller family was
designed specifically to conserve resources and save time by offering
one platform for all applications.
9Proven partner with
leading, future-proof
payment portfolio
Understanding our customers’ needs
By building long-standing relationships with our customers, we have de-
veloped a profound understanding of global and regional requirements
for payment solutions. These close ties have fostered the trust that
enabled us to secure major market shares around the world. Our local
technical and marketing experts work closely with our customers to find
the right solution for each market segment and application challenge.
Our customers value our in-depth experience, technical support capabil-
ities and strong commitment to innovation – not to mention the choice
that comes with the world’s largest, most diversified one-stop offering.
They also appreciate our speed and agility – demonstrated through fast
delivery times and benchmark time-to-market.
Exceptional network of partnerships
We have formed an exceptional and established network of partnerships
and alliances with players in the banking and credit card industry as
well as with industry and certification bodies such as EMVCo, Master-
Card, Visa, Global Platform, BCTC, NFC Forum, Smart Card Alliance,
Multos Consortium and OSPT Alliance.
Impressive track record
Our broad and expanding footprint of successful reference projects
illustrates our customers’ trust in our leading and established platforms
and tools. To date, we have already sold more than five billion chips for
payment applications. Our customers know they can rely on an unbro-
ken supply track record and the experience we have gained leading the
payment market for more than ten years.
Infineon’s CoM was recognized with the 2013 Global
Frost & Sullivan New Product Innovation Leadership Award:
“… (Infineon) has developed a complete solution for Dual
Interface cards that bridge the gap from today’s contact-based
applications to tomorrow’s contactless world.”
Jean-Noel Georges, Frost & Sullivan Global Program Director,
Digital Identification, ICT about Infineon’s CoM
101/3 of India’s chip based (EMV)
payment cards feature an Infineon
4 out of 10 payment SOLID FLASH™ chip
cards in 2014
contain an Infineon
SOLID FLASH™
security chip
75% of payment cards in
Australia are dual-interface
cards – Infineon is the leading
supplier of the chips for these
cards
8 out of 10 dual interface
cards in Visa & MasterCard
projects in 2014 have an
Infineon chip inside
Every 2nd French
citizen holds a payment
card with an Infineon
chip inside
Today more than
50% of US payment
cards have an Infineon
chip inside
11Where to Buy
Infineon Distribution Partners and Sales Offices:
www.infineon.com/WhereToBuy
Service Hotline
Infineon offers its toll-free 0800/4001 service hotline as one central number,
available 24/7 in English, Mandarin and German.
› Germany .................... 0800 951 951 951 (German/English)
.
›
› China, mainland ....... 4001 200 951 (Mandarin/English)
.
›
› India .......................... 000 800 4402 951 (English)
.
›
› USA ............................ 1-866 951 9519 (English/German)
.
›
› Other countries ......... 00* 800 951 951 951 (English/German)
.
›
› Direct access ............. +49 89 234-0 (interconnection fee, German/English)
.
›
* Please note: Some countries may require you to dial a code other than “00” to access this international number,
please visit www.infineon.com/service for your country!
Mobile Product Catalog
Mobile app for iOS and Android.
More information:
www.infineon.com/payment
Contact us: dsscustomerservice@infineon.com
www.infineon.com Please note!
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