Packaging for mmWave Communications - Listen to webinar recording - INEMI
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Greetings from Georgia Tech Packaging for mmWave Communications Listen to webinar recording Madhavan Swaminathan John Pippin Chair in Microsystems Packaging & Electromagnetics School of Electrical & Computer Engg. School of Materials Science & Engg (Joint Appt.) Director, 3D Systems Packaging Research Center (PRC) www.prc.gatech.edu
Outline ❑ PRC – An Introduction ❑ mmWave Package Integration ❑ mmWave design & Machine Learning ❑ Path Forward ❑ Summary 2 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Packaging Research Center - An Introduction ❑ Graduated NSF Engineering Research Center (in its 27th year) ❑ Research, Education & Workforce development in advanced packaging and system integration. ❑ Design, Materials, Process, Assembly, Reliability, Thermal & System Integration. ❑ Center team: ▪ 29 faculty from five schools (ECE, MSE, ME, ChBE, CS) ▪ 11 research/administrative staff Collaborators ▪ Industry: 40+ ▪ 50+ graduate/undergraduate ▪ 14 Univs students ▪ SRC, DARPA, DoD, NSF, iNEMI ▪ Visiting engineers. 3 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Wireless Communication ❑ Applications emerging in Augmented Reliability, Virtual Reality, Teleportation, eHealth …. ❑ Pervasive Connectivity: 106 devices/km2 (5G) to 107 devices/km2 (6G) ❑ Capacity: 20Gbps (5G) to 1Tbps (6G) ❑ Unmanned mobility: Autonomous transportation with high reliability & low latency ❑ Intelligent Communications! Marco Giordani, Michele Polese, Marco Mezzavilla, Sundeep Rangan, and Michele Zorzi, “Towards 6G Networks: Use Cases and Technologies”, IEEE Communications Magazine 2020 4 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Path Loss Courtesy: IEEE AP Magazine, Vol. 57, No. 1, Feb. 2015 Marco Giordani, Michele Polese, Marco Mezzavilla, Sundeep Rangan, and Michele Zorzi, “Towards 6G Networks: Use Cases and Technologies”, IEEE Communications Magazine 2020 https://www.androidauthority.com/what-is-5g-mmwave-933631/ ❑ Path Loss, absorption loss, …. need to be compensated using antenna & RF circuitry! 5 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Backhaul Link & Access point Requirements Transmitter arrays 100m Path Loss 100m = 133dB @140GHz Handset antennas EIRP Courtesy: ComSenTer +71dBm Courtesy: Shahriar Shahramian Bell Labs – Nokia (numbers modified) 1 Free space Channel Loss Ant. Gain -133dB Ant. Gain +36dBm +36dBm 128-QAM 3 2 SINR 30dB (BW=8GHz) Tx Radio Package Package Rx Radio Signal Tx Psat Loss Tx Power -62dBm Rx Power Loss Rx NF 37dBm 1-2dB +35dBm -26dBm 1-2dB 8dB ❑ Heterogeneous Integration platform using Advanced Packaging is a key enabler! 6 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
IC Technologies (1) Constant TX element Pout ▪ Antenna elements large ▪ Die size consumed by TxRx ▪ Antenna in Package (AiP) ▪ Antenna in Package (AiP) (2) Constant TX element necessary! necessary! efficiency (3) Element size ~ (1/freq) (4) Constant RX element NF ❑ Antenna in Package (AiP) is a necessary technology! Courtesy: Prof. H. Wang, ECE, GT 7 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Advanced Packaging & Heterogeneous Integration State of the Art PRC Focus PRC Focus S. Ravichandran & M. Swaminathan, Heterogeneous Integration for AI Applications: Status & Future Needs, Microwave Magazine (Under Review) 8 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Heterogeneous Integration Platform CTE ppm/C ❑ Materials with Silicon like properties that maximize chip and board level reliability and support larger body sizes required! ❑ CTE in the range of 7-9 ppm/C with low surface roughness, Young’s Modulus and zero moisture absorption required. ❑ Glass Interposer is a good candidate! 9 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Antenna in Package (AiP) Digital Hybrid FOV B. Yang, et al., TMTT, 2018 X. Gao, et al., IEEE SAC, 2016. 384 Element W-Band Phased Array ❑ Massive MIMO ❑ High Gain Antenna Elements ❑ Large Antenna Arrays Sub- ❑ Array Full Field of View (FOV) ❑ Beam Forming Technology critical ▪ Analog ▪ Digital ▪ Hybrid S. Shahramian et al. JSSC 2019 10 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Heterogeneous Integration for Wireless Communication Courtesy: JUMP, ASCENT ❑ Glass based Packaging (Chip Last & Chip First) Courtesy: Atom Watanabe, PRC ❑ Use of High Frequency Polymer materials (Dry and Liquid films; Low Dk/Df) ❑ Use of Glass (High Dk/Low Df) for advanced waveguides & chip embedding ❑ Double sided packaging w/ integrated components ❑ Electronics beneath the antenna to reduce form factor & loss ❑ Thermal management from back side of chip ❑ Direct assembly on PCB 11 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Hybrid Beamforming Tx Antenna Array Goal: Gain=36dBi; Large FoV; D-Band 2 1 3 Phase Shifter Beamformer 8 4 ❑ Building Block: 2x2 sub-array ❑ Large Arrays using 2x2 sub-array ❑ Ex: 256 antenna elements using 64 (8x8) sub- arrays: Gain~25-28dBi ▪ 8 basic beams 7 ▪ Active beamformers steer the beam in 2D within each 1/8 (azimuth) of the half space 5 ❑ 64x32 elements (32x16 sub-array): Gain~36dBi Courtesy: K. Huang, PRC, 2020 6 12 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Antenna Arrays on Glass ❑ Fan-out panel-level ❑ 4 x 4 patch Antenna Array ❑ Comparison packaging on glass 16.2 dBi ❑ Polymer build-up layers 560µm 840µm on glass core substrate 1.1mm ❑ Moderately low 1.1mm permittivity and loss tangent ❑ Recently fabricated at GT–PRC Material Dk Df Glass (AGC EN-A1) 5.4 0.005 Polymer (ABF GL102) 3.3 0.0044 Kai-Qi Huang yet al, ECTC 2021 13 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Antenna Integration (Receive) – 5G n257-n261 (a) 24.25 GHz E-plane, (b) 24.25 GHz H-plane, Tong Hong et al, IEEE AWPL, 2020 (c) 40 GHz E-plane, and (d) 40 GHz H-plane 14 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Linear Arrays 1x4 array 1x2 Array 1x4 Array 1x4 Array 1x2 Array Single element Courtesy: Serhat Erdogan, Under Fabrication 15 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Power Dividers Courtesy: Muhammad Ali, Ph.D. Thesis, 2020. 16 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Energy Harvesting ❑ Lower band: 24 – 30 GHz ▪ Pin = 10 dBm, 24 GHz; RF-DC: 17.7% ❑ Higher band: 37 – 40 GHz ▪ Pin = 10 dBm, 40 GHz ▪ RF-DC: 23.3% Tong Hong et al, Ph.D. Thesis, 2020 17 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Package Interconnect Loss 5G-NR E-Band
Passive Component Integration – Diplexer (RF Front End) Diplexer Diplexer Hairpin n257 and n260 Edge-coupled n257, n258 and n260 Diplexer - Hairpin n257 and n260 Diplexer – Edge-coupled n257, n258 and n260 RF Front End Muhammad Ali et al, IEEE ECTC 2020 19 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
RF Front End (cont.) ❑ Fabrication and characterization of Integrated Passive Devices ❑ Integrated Diplexer and coupler ❑ Path-1: RF Source -> Amplifier -> Diplexer (band n257) -> Coupler (Thru) -> Antenna Input ❑ Path-2: RF Source -> Amplifier -> Diplexer (band n257) -> Coupler (Coupled) -> Power Detector ❑ EVM extraction 20 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Integrated Passive Component Performance π/4 DQPSK 64-QAM • 3GPP-defined maximum EVM : 17.5% • 3GPP-defined maximum EVM : 8% • EVM < 2% • EVM < 5.6% Discrimination based on EVM Signature 21 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Filters & Diplexers – Dimensional Details Structure Physical Dimensions (mm3) Electrical Dimensions (λ03) Hairpin Filter for N257 4.64×2.11×0.202 0.43×0.20×0.019 Hairpin Filter for N258 4.75×2.20×0.202 0.44×0.21×0.019 Hairpin Filter for N260 4.14×1.72×0.202 0.54×0.22×0.026 Interdigital Filter for N257 2.98×2.62×0.202 0.28×0.34×0.019 Interdigital Filter for N258 2.94×2.76×0.202 0.27×0.26×0.019 Interdigital Filter for N260 3.12×2.17×0.202 0.41×0.28×0.026 Diplexer - Hairpin N257 & N260 8.42×1.70×0.202 0.90×0.18×0.022 Diplexer - Hairpin N258 & N260 8.71×2.02×0.202 0.93×0.22×0.022 Diplexer - Interdigital N257 & N260 5.09×2.62×0.202 0.54×0.28×0.022 Diplexer - Interdigital N258 & N260 5.10×2.77×0.202 0.55×0.30×0.022 Branch-Line Coupler 4.24×1.86×0.202 0.45×0.20×0.022 Coupled-Line Coupler 3.91×0.78×0.202 0.42×0.08×0.022 Note: 1. For the filters, physical dimensions are normalized by the wavelength corresponding to band frequency of 28 and 39 GHz 5G bands. The corresponding wavelengths are 10.71 mm and 7.7 mm, respectively. All diplexers and 2. For diplexers and couplers, the physical dimensions are normalized by the wavelength corresponding to 32.125 GHz (center of 24.25-40 GHz). The corresponding wavelength is 9.34 mm. couplers are smaller than 0.21λ02 22 Courtesy: Muhammad Ali, Ph.D. Thesis, 2020. GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
D-Band Interconnects Microstrip & CPW Microstrip & CPW Substrate Integrated Waveguide (SIW) Waveguide X (Ongoing Work) Microstrip & CPW ▪ RF Interconnects ▪ Microstrip (MS) & CPW ▪ Waveguide Interconnects ▪ Mode: Quasi TEM ▪ Substrate Integrated Waveguides (SIW) ▪ Mode: TE10 ABF TGV Glass 100um ABF 23 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Substrate Integrated Waveguides (SIW) 1. Bare Glass Panel Guided Wave 2. Drill through-glass-via (TGV) Conductor backed CPW Feed SIW 3. Laminate dielectric Transition (Matching) 100/200um TGV 4. Drill via-in-via and blind vias 5. Metallize RDL and TGVs using SAP Vias insulated Mutee Rehman et al, IMS 2021 24 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Radio on Glass Module (128 Element Linear Array) ❑ 16 Slot Antenna Array w/ WR-6 Waveguide Interface M. Elkhouly et al. RFIC 2020 25 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
3D Integration (2D Arrays) Phase Shifter ❑ Chip embedding a key enabler! ❑ Heterogeneous Integration (CMOS, InP, ….) – multiple die thicknesses. ❑ Seamless continuation of chip wiring to minimize parasitics. ❑ Heat removal from bottom side (75 – 200 W/cm2) & top side. 26 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Assembly Loss Wirebond Flip chip Rao Tummala, McGraw Hill, 2019 Serhat et al, ECTC, 2021 Chip Embedding Micro-vias Measurement imulation Dielectric (ABF) . PA . CMOS Glass Tx . 0.15dB d ) . Ag-epoxy . . ❑ RDL to Chip loss reduction! . ❑ 0.15dB lower than Flip chip re uenc ) ❑ 1.65dB lower than Wirebond 27 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Chip First w/ Chip Last Assembly 100um Vertical Interconnect 100um interconnect between die To Antenna In cavity Heat Sink Die4 Min. RDL/Passives Distance Die1 Die2 Glass Core Cavity Two Dies in Cavity Fan-Out Wafer Level Packaging Comparison Courtesy: S. Ravichandran, PRC, 2020 28 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Chip First (Dies in Cavity) 0.54 dB @ 140GHz Courtesy: S. Ravichandran, PRC, 2020 Courtesy: X. Jia, PRC, 2021 ❑ Single die or Multiple dies in cavity ❑ No Assembly w/ Fine I/O Pitch (20-40um) ❑ Minimum Die Shift (2um) ❑ Double Sided 29 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Thermal Management 8x8 array module Max Chip Ambient Convection Heat Spreader Temperature Temperature Coefficient Area 54oC 22oC 500 W/m2K 40 mm x 40 mm ❑ Use of thermal vias defeats integration. Increases thermal resistance. ❑ Cu Heat Spreaders & Heat Sinks can be used. (150W/cm2) ❑ Use of high conductivity and ultra thin Thermal Interface Materials is a key enabler!30 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
mmWave Design Flex on Glass Compressive Bending Tensile Bending H. M. Torun and M. Swaminathan, “A New Machine Learning Approach for Optimization and Tuning of Integrated Systems”, DesignCon 2018. ❑ Designs often times complex! Sridhar Sivapurapu, IEEE ECTC 2021 ❑ Including multi-physics interactions becomes essential. ❑ Generation of fast models necessary. ❑ Can Machine Learning (ML) help in Design & Design Optimization? 31 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Predictive Modeling ❑ Learn: = ( , ) ❑ Predict frequency response: ′ = ( − − , ) 32 O. W. Bhatti, N. Ambasan and, M. Swaminathan, IMS, 2021 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Invertible Neural Networks (INN) ❑ Forward Neural Networks for predictive modeling ▪ Given design parameters, obtain the performance. ❑ What if we can do the inverse? ▪ Given desired performance, what are the possible design parameters? ❑ Very useful for design space exploration. H. Yu, H. M. Torun, Mutee ur Rehman, M. Swaminathan, IMS 33 2020 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Air Filled Substrate Integrated Waveguide (SIW) ❑ Substrate integrated waveguides (SIW) are promising alternatives to conventional planar structures. ❑ Objective is to minimize transmission losses over D-band. ❑ No closed form equations are available even for cut-off frequency & wave impedance. ▪ EM driven optimization is required to design air cavity. ❑ Co-optimize air cavity shape, SIW geometry & microstrip-SIW transition (14 Parameters). 34 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Optimization (SIW) ❑ Deep Partitioning Tree (DPT-BO) optimized design has 34.5% and 29.5% less loss over D- band compared to PSO and ADD-MES-G. ❑ DPT-BO converged 1.35X and 1.42X faster compared to PSO & ADD-MES-G. ❑ DPT-BO is available as open source. H. M. Torun, M. Swaminathan, TMTT, 2019 35 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Moving forward …. Intelligent Digital/RF Convergence Market Courtesy: Unimicron, iNEMI ❑ Entering the (Big) Data Centric Era! ❑ Heterogeneous Integration needs to support: ❑ Data movement over longer distances: Wireless Communication (>100m) ❑ Data movement over shorter distances: Computer Processing (
Our Vision S. Ravichandran & M. Swaminathan, Heterogeneous Integration for AI Applications: Status & Future Needs, Microwave Magazine (Under Review) Rao Tummala, McGraw Hill, 2019 AI & HPC Automotive Wireless Space ❑ Holistic Approach towards Heterogeneous Integration using Advanced Packaging that includes design, materials, process, assembly, reliability, thermal management and system integration! 37 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Summary ❑ Wireless Communications in mmWave offers several opportunities ▪ High Datarate ▪ Pervasive Connectivity ▪ Unmanned mobility ▪ Intelligence …. ❑ Advanced Packaging is a key Technology enabler ▪ High antenna gain ▪ Reduced losses ▪ Thermal Management ▪ Heterogeneous Integration ❑ Wireless integration is just part of the puzzle ▪ Need to combine with wired interconnects, photonics, sensing …. 38 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
Thank You madhavan@ece.gatech.edu www.prc.gatech.edu 39 GT-3D Systems Packaging Research Center iNEMI Seminar Mar. 11, 2021
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