TAMURA ELSOLD PRODUCT CATALOGUE 2018/2019
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PRODUCT CATALOGUE 2018/2019
TABLE OF CONTENTS
COMPANY 4
TAMURA ELSOLD® SN100 MA-S 8
Our Products 12
TAMURA ELSOLD® INJECTIN FOR IMKS® 14
TAMURA ELSOLD® BARS 16
TAMURA ELSOLD® Lead-free Bars 16
TAMURA ELSOLD® Leaded Bars 17
TAMURA ELSOLD® SOLID WIRE 18
TAMURA ELSOLD® Lead-free Solid Wire 18
TAMURA ELSOLD® SN100 MA-S Solid Wire 19
TAMURA ELSOLD ® Leaded Solid Wire 19
TAMURA ELSOLD® FLUX CORED WIRE 20
TAMURA ELSOLD® SN100 MA-S Flux Cored Solder wire 21
TAMURA ELSOLD® Fluxes for Flux Cored Wire 22
TAMURA ELSOLD® Leaded Flux Cored Wire 22
TAMURA ELSOLD® Lead-free Flux Cored Wire 22
TAMURA ELSOLD® DEOXIDATION TABLETS 23
TAMURA ELSOLD® FLUXES 24
TAMURA ELSOLD® Fluxes – Electronic 25
TAMURA ELSOLD® Fluxes – Solar industry 25
TAMURA ELSOLD® Rework Flux – Liquid 26
TAMURA ELSOLD® Rework Flux – Pasty / Tacky Flux / Paste Flux 27
TAMURA ELSOLD® SOLDER PASTE 28
TAMURA ELSOLD® Solder Paste 28
TAMURA Solder Pastes 30
TAMURA Solder Paste with Flux GTS-VR1 31
TAMURA ALLOY #287 32
TAMURA ELSOLD® CERTIFICATION 34
TAMURA ELSOLD® RECYCLING PROGRAMME 34
TAMURA ELSOLD® SERVICE 35
2/ /3
COMPANY
Since 1954 onwards ELSOLD® GmbH & Co. KG has developed from the JL Goslar Group into
an independent profit centre in the areas of production, development, and sales of solder
products. The actual company foundation took place in December 2010. Since then ELSOLD®
has established itself as a leading manufacturer of innovative soldering products for the
electrotechnical and electronic industry as well as for the automotive and solar industries
all over the world.
At the end of 2017, ELSOLD® became a member of the Tamura Group, headquartered in
Tokyo. Tamura will support with global market strength and know-how to further develop
and expand at the Ilsenburg site.
Since the first quarter of 2018 we are officially registered as TAMURA ELSOLD GmbH in
the commercial register. Together we are expanding our sales network in Europe and Asia.
Our products stand for high quality, which meets the finest connection geometries of today‘s
components: optimum solderability and high recyclability. Due to these properties, we are
the only supplier of brazing alloys and fluxes for the European space industry.
4/ /5
RELIABILITY PHILOSOPHY
Thanks to our 60 years of experience, we know the A traditional company with strong local
needs and requirements of the electrical, solar and roots, that thinks and does business glo-
electronics industries for modern soldering technolo- bally. Long lasting relationships with our
17 gies like no other company. Our lead-free materials reli- customers, partners and colleagues are an
ably meet all of the same requirements that are placed elementary component of our past and fu-
on lead-containing materials. Through constant cont- ture development.
act with our customers, we know what the industry is
dealing with on a daily basis and focus on solutions that We handle the current challenges facing us
lead to success and the highest quality in Germany and as a manufacturer of soldering products with
worldwide. in-house production by providing high quality
products and reliable delivery; but in particu-
lar, by permanently enhancing products and
processes on the basis of the latest techno-
logies. In doing so, we are, and remain able
to compete in a highly competitive market.
ECO-FRIENDLY
At TAMURA ELSOLD® we see the environment as our
most important asset. With our products we want to
contribute to its protection.
The EU Regulation on the Restriction of the Use of
Hazardous Substances in Electrical and Electronic
Equipment (RoHS) has been in force since July 2006.
It prohibits the placing on the market of new equip-
ment containing more than 0.1% by weight of lead per
homogeneous material.
STRONG IN THE REGION. With our lead-free solder products, we play our part
in protecting the environment and ensure that elec-
SUCCESSFUL IN THE WORLD. trical and electronic equipment complies with EU
regulations. At the same time, our TAMURA ELSOLD®
Recycling Service offers our customers the opportunity
to take back scrap metal and process it directly into
recyclable, high-purity metal.
6/ /7
TAMURA ELSOLD ® SN100(Ag) MA-S LESS DROSS - MORE PROFT FACTOR 15X *
LEAD-FREE ALLOYS
TAMURA ELSOLD ® SN100(Ag) MA-S MICRO-ALLOYED SOLDER WITH NI, GE AND P Micro
-alloy
ing N
In addition to a complete range of high quality solder alloys, TAMURA ELSOLD now offers a world class innovation the micro-alloyed
® i, Ge
Speci
TAMURA ELSOLD® SN100(Ag) MA-S. This solder is manufactured via a revolutionary process called “Frischen“ or “Freshening”, al
micro production
-alloy
which can be described as an ultra-grade cleaning operation. This proprietary technique results in a highly pure and highly stabile
ing N process,
solder alloy with a much lower tendency to oxidise solder equipment. Typical solder defects such as bridging and solder spikes are i, Ge,
P
almost non-existent. Compared with Sn99.3Cu0.7, our new lead free micro-alloy solder boasts the lowest amount of dross formation
whilst soldering, thereby making it extremely economical.
The following graphs show the enormous potential for slowing down production soldering losses and reducing costs. The numerous
advantages of the revolutionary TAMURA ELSOLD® SN100 MA-S can be summarised as follows: good solderability; fine-grained &
shiny solder joints; reduced erosion of solder pot & solder tools; reduced leaching; and the lowest dross formation resulting in the
best cost effciency.
Sn99.3Cu0.7 SN100** TAMURA ELSOLD® SN100 MA-S
FEATURES: MICRO-ALLOYED, LEAD-FREE SN100(Ag) MA-S ALLOYS
PRODUCT BENEFITS
The special manufacturing process of SN100 MA-S eliminates unwanted impurities leading to a highly pure and stabile alloy which
shows a reduced tendency to oxidise. This proprietary manufacturing process guarantees an outstanding level of purity without
Good solderability Reduced leaching
contamination. Such alloys show a high stability and remains liquid with a low-viscosity, thereby reducing typical solder defects
Fine-grained and shiny solder joints Lowest dross formation
such as solder peaks and solder bridging. The soldering results are outstanding and quality fluctuations are kept to an absolute
Reduced erosion of solder pot and solder tools Best cost efficiency minimum.
HIGHLIGHT
PRODUCT PORTFOLIO: LEAD-FREE SN100(Ag) MA-S BARS MICRO-ALLOYED
SN100(AG) MA-S BARS
ALLOY COMPOSITION MELTING RANGE
[°C]
All important Sn(Ag)Cu alloys
SN100 MA-S Sn99.3Cu0.7NiGeP 227 Highest purity (first melt)
SN100 MA-S Refill Sn99.8Cu0.2NiGeP 232–234 Excellent solderability and wettability
Lowest oxidation
SN100 MA-S Refill Plus Sn99.8Cu0.2NiGeP 232–234
Lowest dross formation
SN100Ag0.3 MA-S Sn99.0Ag0.3Cu0.7NiGeP 217–227
SN100Ag1 MA-S Sn98.3Ag1Cu0.7NiGeP 217–223
SN100Ag3 MA-S Sn96.5Ag3Cu0.5NiGeP 217–219
FRESHENING of SN100 MA-S Reduction of Impurities One simple look at the molten solder bath surface after 8 hours and
DELIVERY FORM DIMENSIONS [MM] WEIGHT before dross removal clearly shows the difference between SN100
[APPROX. KG] 0,006 MA-S and SnCu0.7.
0,005
Concentration [%]
Triangular bar 8/10 x 400 0.2
0,004
Bars 20 x 20 x 335 1 0,003
Ingots 50 x 20 x 490 3 0,002
0,001
0,000
ALL LEAD-FREE SN100(AG) MA-S ALLOYS ARE ALSO AVAILABLE AS SOLID WIRE AND FLUX CORED WIRE.
0 10 20 30 40 50 60 SN100 MA-S SnCu0.7
Time [min]
* Factor 15 x less solder dross taken after 8 hours in a dynamic solder bath at 290 °C. **Competitive alloy according to No. 403 of EN ISO 9453 ELSOLD® SN100 MA-S
also fulfils the requirements of this standard, but with better performance
8/ /9
LONG-TERM STABILITY OF SN100 MA-S
In addition to the well known positive characteristics of SnCu/SnAgCu alloys, it is the outstanding cost/performance ratio that ma-
kes SN 100 MA-S truly stand out. When using lead-free alloys in an open or atmosphere wave solder machine, the dross formation
can be larger than the required amount of solder in the product. This means that the manufacturing process of a product requires up
to 3 times the amount of solder that ends up being built into the product. With TAMURA ELSOLD® SN100 MA-S, the dross formation
is so reduced that the same product can be manufactured with a much lower solder requirement.
These enormous savings have an even greater payoff when using cost intensive silver alloys. A solder bath analysis will clearly
substantiate that the value added outstanding properties of TAMURA ELSOLD® SN100 MA-S remain stabile over a very long period
of time. The solder bath remains stable. The concentration of all elements remain stable in the observed period of time. In fact, only
a very slight amount of Germanium (6 ppm) and Phosphor (20 ppm) could be observed, which can be perfectly balanced by use of
specially developed refill and refill plus alloys.
TYPICAL ANALYSIS OF SN100 MA-S
COMPOSITION TYPICAL ANALYSIS RESULTS LIMITS (MAX.) ACCORDING
TO EN IO 9453 [%]
COMPARISON OF DROSS QUANTITIES Sn – Tin Rest Residual
Cu – Copper 0.70 0.5–0.9
The tremendous advantage of SN100 MA-S can best be seen using a dynamic wave
Ni – Nickel 0.03 Undetermined
soldering process. At 290 °C the dross formation on the wave can be reduced by a factor
of 15. This means not only fantastic savings due to using less expensive solder, but also Ge – Germanium 0.006 Undetermined With OLD®
ELS
savings due to a reduced service requirement of the wave soldering machine. URA
P – Phosphorus 0.004 Undetermined TAM -S alloys
MA 70%
Based on the positive effects of “Freshening” and the influence of the micro-alloy
Ag – Silver 0.02 0.10 up to ste.*
a
additives, dross formation with SN100 MA-S is reduced up to 93% compared to non- Pb – Lead 0.03 0.10 less w
“freshening“ SnCu0.7 alloys without micro-additives, when used in wave soldering in an Sb – Antimony 0.003 0.10
open or atmosphere machine.
Cd – Cadmium 0.0005 0.002
Zn – Zinc 0.0005 0.001
Al – Aluminium 0.0005 0.001
Bi – Bismuth 0.02 0.10
DROSS FORMATION IN 8 HOURS AT 290 °C As – Arsenic 0.01 0.03
(DYNAMIC SOLDER BATH) Fe – Iron 0.002 0.02
Co – Cobalt 0.002 Undetermined
SN100 MA-S 1.5% Au – Gold 0.001 0.05
Sn99.3Cu0.7 22.6% In – Indium 0.004 0.10
* Factor 15x less solder dross taken after 8 hours in a dynamic solder bath at 290 °C.
10 / / 11
OUR PRODUCTS
The TAMURA ELSOLD® delivery program offers you an extensive selection of all materials for
the production of safe, soldered joints for all known soldering processes (reflow, wave, selective,
robot and hand soldering).
Solder paste Recycling
Solder wire TAMURA ELSOLD® lead-free alloys
Solder bars TAMURA ELSOLD® leaded alloys
Fluxes for electronic and solar industry TAMURA ELSOLD® high-temperature alloys
Analysis of solder bath
TAMURA ELSOLD FACTOR ®
YOU CAN BE
We are constantly researching the improvement of our products in order to create added value
for you. With our TAMURA ELSOLD® Factor campaign, we make it easy for you to choose us
and our products. Here we fill your RoHS compliant solder bath free of charge in exchange with
SURE OF
THIS JOINT.
TAMURA ELSOLD® SN100 MA-S so you can convince yourself of our quality at no extra cost.
For more information, please contact our technical consultant who will advise you on your
processes and savings potential. The contact details can be found at the end of the brochure.
12 / / 13
TAMURA ELSOLD ® INJECTIN ®
FOR IMKS ® PROCESS ALLOY
OPTIMISATION OF FLUIDITY OF SOLDER ALLOY
Fluidity is a fundamental material property for injection moulding. This property is optimised by alloy and process development
of TAMURA ELSOLD® InjecTin®. Fluidity, characterised by fluidity length, is significantly improved by special TAMURA ELSOLD®
production process and use of micro-alloying elements, especially by a content of Nickel and Germanium optimised for the IMKS®
process, in comparison to standard soldering alloy Sn99.3Cu0.7.
To sum up, TAMURA ELSOLD® InjecTin® is the material which fulfils all requirements of the innovative IMKS® process: lowest dross
formation; longest lifetime of machines by non-aggressive metal; and highest fluidity for best injection results.
Micro-alloyed with Ni, Ge & P Fine microstructure improved
Special production process mechanical properties and
for best properties smooth surfaces
Best fluidity Longer lifetime of crucible
Lowest oxidation and dross formation and machine components
MADE OF SOLDER
MATERIALS FOR AN INNOVATIVE, INTEGRATIVE PROCESS TECHNOLOGY
The IMKS® process, the integrated metal plastic injection moulding, mainly developed by Krallmann group, is an innovative solution
of modern production technology. Process chains are shortened; production becomes faster and more economic; new scopes of
design and technical solutions are possible.
ALLOY MELTING TEMPERATURE [°C] ADVANTAGE
InjecTin® Sn99.3Cu0.7 227 Highest cost-effectiveness
InjecTin® Sn96.5Ag3.0Cu0.5 217–219 Highest reliability
DELIVERY FORMS DIMENSIONS (MM) WEIGHT (KG)
Application - demonstration of direct integration Bars 25 x 12 x 400 0.8
Tool with IMKS injection molding unit of conductive paths and electronic components
in plastic parts Triangular bars 8/10 x 400 0.2
Wire/Spool Ø: 1.5 | 3.0 | 4.0 1 | 4 | 10
Metallic structures, as conductive paths, are integrated into plastic parts, and electronic components as resistors or LED are
connected directly within the primary shaping process and within one single machine. Cables, pcbs, pressed screens and their
production, placement and connection processes are not necessary anymore if the electrical function is directly integrated.
Furthermore, the necessary space and the resulting limitations of design are omitted. In cooperation with Krallmann group.
14 / / 15
TAMURA ELSOLD ® BARS
TAMURA ELSOLD® alloys comply with standards DIN EN 29453, DIN EN 61190-1-3 and TAMURA ELSOLD® in-house standards.
Further forms available upon request, such as thick and wide rods, flat tapes, thin rods and bars, threads, solid wire etc. All alloys
can be supplied in deoxidised form upon request. Lead-free solder is also available as TAMURA ELSOLD® MA (micro-alloyed).
TAMURA ELSOLD ® LEAD-FREE BARS
ALLOY MELTING RANGE [°C] WORKING TEMPERATURE [°C]
Sn99.3Cu0.7 227 255–285 LEADED BARS
Sn99.3Cu0.7 MA 227 255–285
Increasing miniaturisation, stricter requirements with regard to long-term reliability of complex electronic
Sn99.3Cu0.7P 227 255–400
products, components and related extended performance features thereof create the highest demands for
Sn96.5Ag3.0Cu0.5 217–219 255–285 soldering quality. TAMURA ELSOLD® soft solders are therefore produced only from carefully selected vir-
gin-grade base metals. TAMURA ELSOLD® soft solders cover the entire range of electronic applications:
Sn95.5Ag3.8Cu0.7 217 255–285
machine solders, high temperature solders, special solders (low-melting alloys, solders for static baths).
Sn97Ag3 221–232 255–285
Sn96Ag4 221–238 255–285
Sn96.5Ag3.5P 221 255–320
TAMURA ELSOLD ® LEADED BARS
DELIVERY FORM DIMENSIONS [MM] WEIGHT [APPROX. KG]
ALLOY MELTING RANGE [°C] WORKING TEMPERATURE [°C]
Triangular bars 8/10 x 400 0.2
Sn63Pb37 183 240–260
Bars 20 x 20 x 335 1
Sn63Pb37P 183 240–260
Ingots 50 x 20 x 490 3
Sn60Pb40P 183–190 240–260
Pb95Sn3Ag2 304–310 > 450
Pb95Sn3Ag2P 304–310 > 450
Pb92Sn8(Sb) 280–305 > 450
ADVANTAGES OF TAMURA ELSOLD ® BARS
Bi50Pb31.3Sn18.7 * 96 150–180
Available in all common lead-free and leaded alloys
Highest purity, virgin grade
DELIVERY FORM DIMENSIONS [MM] WEIGHT [APPROX. KG]
Excellent soldering and wetting properties
Minimal oxides
Minimal dross generation Triangular bars 8/10 x 400 0.2
Also available as micro-alloyed (SAC) SC Bars 50 x 20 x 490 4
Bars 50 x 18 x 600 4.5
Thin bars * 2/3 x 400 0.2
ADVANTAGES MICRO-ALLOYED SOLDERS
Fine-grained structure facilitates visual inspection
Low erosion of copper allows lead-free tinning of thin wire and circuit paths, multiple joints and repairs
Significant cost saving though low metallurgical attack on material, soldering tips and equipment
Triangular bars Extruded bars
* Bi50Pb31.3Sn18.7 available as thin bars only
16 / / 17
TAMURA ELSOLD ® SN100 MA-S SOLID WIRE
ALLOY MELTING RANGE [°C]
SN100 MA-S 227–230
SN100Ag0.3 MA-S 217–227
SN100Ag1 MA-S 217–223
SN100Ag3 MA-S 217–219
TAMURA ELSOLD ® LEADED SOLID WIRE
TAMURA ELSOLD SOLID WIRE
ALLOY MELTING RANGE [°C] WORKING TEMPERATURE [°C]
®
Sn63Pb37 183 240–260
Modern manufacturing technology, i.e. selective soldering, demands ultimate quality solid wires by
using virgin grade base metals. TAMURA ELSOLD® produces solid wires of highest purity. We gu- Sn63Pb37P 183 240–260
arantee consistent best product quality. Ongoing quality control of each and every production lot is Sn64Pb36P 183 240–260
recorded and filed. Our customers including the European Aerospace industry can fully rely on TAMURA Sn60Pb39.86Cu0.14P(HTF) 183–190 240–260
ELSOLD®, we are the only approved supplier of solid soft solder material with ECCS certification.
Pb95Sn3Ag2P 299–305 > 450
Our modern production process permits the manufacture of all required alloys with or without lead,
alloys for low and high temperature, and also solder alloys for static baths, for soft soldering processes
in all areas of the electronic industry. ADVANTAGES OF ELSOLD ® SOLID WIRE
Available in all common lead-free and leaded alloys Minimal oxides
Highest purity, virgin grade
TAMURA ELSOLD LEAD-FREE SOLID WIRE
® Minimal dross generation
Excellent soldering and wetting properties Also available as micro-alloyed (SAC) SC
ALLOY MELTING RANGE [°C] WORKING TEMPERATURE [°C]
Sn99.3Cu0.7 227 255–285
Sn99.3Cu0.7 MA 227 255–285 ADVANTAGES MICRO-ALLOYED SOLDERS
Sn97Cu3 230–250 255–285 Fine-grained structure facilitates visual inspection
Sn97Ag3 221–232 255–285 Low erosion of copper allows lead-free tinning of thin wire and circuit paths, multiple joints and repairs
Significant cost saving though low metallurgical attack on material, soldering tips and equipment
Sn96.5Ag3.5 221 255–285
Sn96.2Ag3.8 221–238 255–285
Sn96.5Ag3Cu0.5 217–219 255–285
The list above shows a selection of our most sought after products. Of course you can order the alloy you require.
Sn95.5Ag3.8Cu0.7 217 255–285
Diameters available up to 8.0mm
Special dimensions available on request
ALL LEAD-FREE SOLDERS ARE ALSO AVAILABLE AS TAMURA ELSOLD ® MA Standard coil sizes: 500g | 1kg | 4kg | 10kg | 25kg
MICRO-ALLOYED.
18 / / 19TAMURA ELSOLD ® FLUX CORED SOLDER WIRE
TYPE X3, X4 AND X5
The new TAMURA ELSOLD® flux cored solder wire X-Series offer an op-
timal process stability and consequently an efficient assembly of electro-
nic components. During soldering X-Series wire shows a fast and reliable
wetting and a significantly reduced spattering, even at high temperatures
up to 500 °C, combined with bright, transparent, and very safe residues.
Up to 90% less spattering of
TAMURA ELSOLD® X3, X4 and X5
than competitor flux cored wire
tested according to IPC-TM-650
) ) ) 1) ) ) 1) ) ) ) 1) 1) 1) ) 1) )
( L0 ( L0 (L0 ( M ( L0 (L1 ( M (L0 (L0 (L0 ( M ( M ( M ( L0 M (H1
A1 A2 A3 A4 01 A2 A2 81 F1 F2 F3 S1 S2 X3 X 4( X5
– – – –
P– E– E– E–
®
– S – – – – D ® ®
rU
S
rU
S
rU
S S U J P D D D E E E L D LD
rU or or rJ or or or rD rD rD SO OL LS
O
t ito tito tito ito tit tit ito tit tit tit ito ito ito EL LS E
pe pe pe et pe pe et pe pe pe p et et et A A
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m m m p m
Co
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om om
p
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p UR UR UR
Co Co Co Com Co C C C C M M M
TA TA TA
HIGHLIGHTS TAMURA ELSOLD ® SN100 MA-S X-SERIES
Fine-grained & shiny solder joints
Lowest copper leaching
Reduced erosion of solder tools
Uniform material usage in the whole process chain with SN100 MA-S ingots, bars,
solid wire and solder pastes
Up to 90% less spattering than conventional cored wire
Best results even at highest soldering temperatures
High corrosion resistance
Fast and reliable wetting
TAMURA ELSOLD ® FLUX
Bright, transparent ductile residues (no brittle spalling)
CORED SOLDER WIRE
TAMURA ELSOLD ® SN100(Ag)
Cored solder wire – the oldest solder medium – has been used for many years in the electronic
MA-S FLUX CORED SOLDER WIRE
industry. Cored solder wire permits the simultaneous application of solder and flux to the soldering
point. Despite development of solder paste which serves the same purpose, cored solder wire
has defended its position. It is still preferred for applications such as manual and repair soldering ALLOY MELTING RANGE
processes, and automatic soldering. [°C]
SN100 MA-S 227–230
TAMURA ELSOLD® cored solder wire is available in many types and is unchallenged because of
its variety. Besides the purity of the base metals, the particular innovation is the constant adapta- SN100Ag0.3 MA-S 217–227
tion of solder paste composition to production parameters and process. Rosin and activator must SN100Ag1 MA-S 217–223
be adapted to higher or changed process temperatures. TAMURA ELSOLD® produces top quality
cored solder wire by choosing suitable flux constituents along with strictly monitored production SN100Ag3 MA-S 217–219
conditions.
20 / / 21TAMURA ELSOLD ® FLUXES FOR FLUX CORED WIRE
FLUX TYPE CLASSIFICATION STANDARD FLUX CONTENT NO CLEAN The list above shows a selection of our most sought after products. Of course you can order your alloy with the flux you require.
EN 61190-1-1 [%] For custom-made orders, the flux fraction can be selected from 0.5% to 3.5% in steps of 0.5%.
C3 | C3 Plus ROL0 2.5 | 3.5 √ Standard coil sizes: 0.50kg | 1.00kg | 2.50kg | 4.00kg
3064 | 3064 BF ROM1 2.2 | 3.3 (√) Special coil sizes available upon request
All cored solder wire are available with a diameter of 0.3mm upwards
TS-1 ROM1 2 √
Diameters are subject to standard tolerances as per DIN 12224-1
A3 | A4 ROH1 2.5 | 3.5 –
X3 REL0 3 √
X4 REM1 3 √
X5 REH1 3 –
RS-1 REM0 0.7 √
Z0 ORL0 2.5 √
Z1 ORM1 2.5 (√)
105-19 ORM1 1.4 –
T ORM1 3 –
H ORM0 2.5 (√)
AI-S ROH1 2.5 | 3.5 –
HIGHLIGHT: TAMURA ELSOLD ® FLUX CORED WIRE
FOR SOLDERING ALUMINUM
Direct soldering of aluminum-to-aluminum, and aluminum-to-copper joints
TAMURA ELSOLD LEADED ®
TAMURA ELSOLD LEAD-FREE ® No special equipment or processes necessary, use of conventional soldering irons
Reduced risk of corrosion due to protection effect of rosin basis
FLUX CORED WIRE FLUX CORED WIRE If required: Liquid flux Al-L available
ALLOY MELTING RANGE [°C] ALLOY MELTING RANGE [°C]
Sn63Pb37 183 Sn99.3Cu0.7 227
Sn60Pb40 183–190 Sn96.5Ag3.0Cu0.5 217–219
Sn60Pb39Cu1 183–190 Sn95.8Ag3.5Cu0.7 217
Sn62Pb36Ag2 179 Sn97Cu3 230–250 TAMURA ELSOLD ®
Sn60Pb36Ag4
Pb91Sn8Sb1
178–180
280–305
Sn95Sb5
Sn97Ag3
230–240
221–230
DEOXIDATION TABLETS
Deoxidisation tablets (for solder baths with or without lead)
To reduce dross formation
The oxidation of the solder is slowed down by a very thin protective layer
ALL LEAD-FREE SOLDERS ARE ALSO AVAILABLE AS TAMURA ELSOLD ® MA Recommended dosage: 3 to 5 tablets for every 10kg of solder
MICRO-ALLOYED.
PRODUCT
Deoxidation tablets,
HIGHLIGHT: NO-CLEAN FLUX CORED SOLDER WIRE C3 PLUS bottle with 50 tablets
LEAD FREE
Deoxidation tablets,
Quick wetting Thermal stable flux
bottle with 800 tablets
Low, elastic residues Fulfils all global standards
Non-corrosive flux residues For all soldering applications
Short soldering time Excellent solderability
22 / / 23TAMURA ELSOLD ® FLUXES - ELECTRONIC
ELECTRONIC SOLID BASIS BASIS EN APPLICATION
FLUX CONTENT [%] 61190-1-1
1003NC 5.9 Rosin-free, Solvent based ORL0 Tinning of cables in dip
organic soldering process
TAMURA ELSOLD ® FLUXES 1004NC 2.0 Organic Solvent based ORL0 Tinning of cables in dip
soldering process
2000NC 2.9 With rosin, Solvent based ORL0 General electronics
TAMURA ELSOLD® supplies a complete range of high-qua- organic
lity fluxes, specially manufactured to meet the toughest
2000M NC 2.9 With rosin, Solvent based ORL0 General electronics,
industry requirements. In addition to the solder alloy, the
organic automotive electronics,
most important factor in ensuring a soldering process of a telecom; leaded and
consistently high quality is the flux. It must prepare the sur- lead-free solder alloys
face to be soldered for the actual soldering process as well
promote wetting. Furthermore, following soldering, the flux 2001NC 2.3 With rosin, Solvent based ORL0 Wave soldering, lead-free
should have largely evaporated - without leaving behind any organic
resistance-lowering or corrosive residues on the circuit boards. 2001M NC 1.9 Organic Solvent based ORL0 General electronics
3002M NC 2.9 Organic Water based, ORL0 General electronics, automotive
VOC-free electronics,telecom;
standard and lead-free
solder alloys, Sprayflux
3003NC 2.9 Organic Water based, ORL0 Wave soldering, lead-free,
VOC-free low residues
1025 NC 2.4 Rosin-free, Solvent based ORL0 General electronics, automotive,
organic wave soldering, selective solde-
ring, rework
1026 NC 2.4 Rosin-free, organic Solvent based ORL0 See 1025 NC, for foaming
1027 NC 3.3 Rosin-free, organic Solvent based ORL0 See 1025 NC, higher activity
3007 NC 3.5 Rosin-free, organic Water based, ORL0 General electronics, automotive,
VOC-free wave soldering, selective solde-
ring, rework
TAMURA ELSOLD ® FLUXES FOR SOLAR INDUSTRY
Particularly developed for solar module production
All fluxes are halide-free
Approved by notable manufacturers Delivery of our fluxes in 5L,
10L or 20L canisters.
HIGHLIGHT: TAMURA ELSOLD ® FLUXES
1025 NC AND 3007 NC TAMURA ELSOLD ® FLUXES - SOLAR INDUSTRY
Very good wetting and reliable hole filling SOLAR FLUX SOLID PRODUCT BASIS PRODUCT BASIS EN APPLICATION
CONTENT [%] 61190-1-1
Lowest residues
Highest safety against corrosion and electro-migration 1004S 2 Rosin-free, organic Solvent based ORL0 Soldering processes in
Suitable for wave, selective and rework soldering solar industry
Special SIR test, developed by Fraunhofer IZM/ZVE, for selective soldering fluxes, passed
3007 NC: VOC-free 2001S 1.7 Rosin-free, organic Solvent based ORL0 Soldering processes in
solar industry
3003S 2 Rosin-free, organic Water based, ORL0 Soldering processes in
VOC-free solar industry
3003 SW-1 2.3 Rosin-free, organic Water based, ORL0 Soldering processes in
VOC-free solar industry
24 / / 25HIGHLIGHT: REWORK FLUX SOLUTIONS
TAMURA ELSOLD® supplies a complete range of high-quality fluxes, specially manufactured to meet the
toughest industry requirements. In addition to the solder alloy, the most important factor to ensure a solder
rework process of a consistent and reliable quality is the flux. It must prepare the surface to be soldered for
the actual rework process and promote proper wetting. Furthermore, following reflow the flux should have
evaporated without leaving any resistance-lowering or corrosive residues on the circuit boards.
TAMURA ELSOLD ® REWORK FLUX – LIQUID
NAME EN 61190-1-1 ACID NUMBER PACKAGING
TAMURA ELSOLD® 200R ORL0 24mg KOH/g Filled Flux Pen
TAMURA ELSOLD® 200R ORL0 24mg KOH/g Flux Bottle 25ml
TAMURA ELSOLD® 400R ROL0 70mg KOH/g Filled Flux Pen
TAMURA ELSOLD® 400R ROL0 70mg KOH/g Flux Bottle 25ml
TEST METHOD TEST RESULT IPC-TEST METHOD
Copper Mirror Test Passed IPC-TM-650 2.3.32
Silver Chromate Paper Test Passed IPC-TM-650 2.3.33
Halide, quantitative 0.0% IPC-TM-650 2.3.35 TAMURA ELSOLD ® REWORK FLUX – PASTY / TACKY FLUX /
SIR test Passed IPC-TM-650 2.6.3.3 PASTE FLUX
Corrosion Test Passed IPC-TM-650 2.6.15
FLUX TYPE EN 61190-1-1 APPLICATION
PACKAGING [CC]
AP-10 No Clean ROL1 Leaded and high-lead content solder
HIGHLIGHTS TAMURA ELSOLD FLUX PASTE AL-P ®
AP-20 No Clean REL0 Lead-free solder, especially reliable
FOR SOLDERING OF ALUMINUM AP-40 No Clean REL0 High Reliability, as well as for
leaded and lead-free alloys
Soldering of aluminum alloys
Highest activity due to solder forming reaction NC 559 AS No Clean REL0 Especially light residue
Reduced melting temperature for a wide field of applications, soldering processes and best performance SM-388 No Clean REL0 Lead-free and lead-containing
processes
NWS 4200 Water soluble REL0 Lead-free and lead-containing
processes
REWORK FLUX SOLUTIONS
Al-P Water soluble INH1 For soldering of aluminum and
The pasty fluxes from TAMURA ELSOLD® (gel flux / tacky flux) like AP 40 are suitable for a wide range of rework applica- aluminum alloys
tions. Pasty fluxes combine the advantages of SMD (Surface Mounted Device) adhesives and fluxes. Due to this fact, the
components are held in position until the rework process is finished. The fluxes are effective with existing solder depots
as well as the separate dispensing of solder. The flux is highly adhesive, has excellent wetting properties, a broad process
latitude, and a high degree of compatibility with all standard circuit board surfaces e.g. perfect for rework-applications. This TAMURA ELSOLD® Coloured Tacky Fluxes are aviala-
applies to leaded and lead-free alloys and processes. To fulfil the requirements of improved controllability, as in automatic ble in neon yellow and neon pink. Delivery forms:
optical inspections, Colored Tacky Fluxes contain neon colouring agents. Different types and concentrations were tested to Syringes: 10cc | 30cc
develop a formulation, which enables an optimal visibility of the applied flux as well as a good inspection of the residues Cans: 90g | 180g
after soldering. Cartridges: 150g
26 / / 27TAMURA ELSOLD ® SOLDER PASTE
TAMURA ELSOLD® Solder Paste provides excellent wetting behaviour over a wide range of temperature
profiles. At the same time, the solder paste not only has best slump characteristics but also excellent
adhesion. Storage and durability is not critical because it is a special and modified synthetic materi-
al. Further advantages: minimal shrinking, high printing speeds, high activity on all surfaces, useful
for high speed printing. Repeatability, constant and excellent printing results mean that PCB by PCB.
TAMURA ELSOLD® solder paste is suitable for closed rakel systems as well as for Fine Pitch printing.
HIGHLIGHT TLF-204-171AK (SAC T4 88.5%)
Excellent printability
TAMURA ELSOLD ® AP-10 AP-20 AP-40 TLF-204-171AK Eliminate cold slump
Best wetting and soldering behavior also for difficult surfaces as cutting edges of components
SOLDER PASTE ROL1 REL0 REL0 ROL0
Improve BGA Head in Pillow resistance
Dispens Print Dispens Print Dispens Print Dispens Print Good tackiness for a long time
SAC305 217–219 °C T3 87.0 88.5 87.0 88.5
T4 86.0 88.0 87.0 88.5 88.5
T5 86.0 87.5 87.0 88.5
HIGHLIGHT LEAD-FREE SOLDER PASTE AP-20
T6 86.0 87.0 87.0
Powder size T3 (45µm) to T6 (15µm)
SAC305 MA 217–219 °C T4 88.0 88.0 Non corrosive, halide-free residues
SN100Ag3 MA-S 217–219 °C T4 88.0 88.0 Excellent wetting at air and nitrogen atmosphere
Stable viscosity at room temperature for more then 70 days
SAC0307 217–227 °C T4 88.0
Tack time > 48 hours
SC07 227 °C T3 88.0 High thermal stability
BiSn42 139 °C T3 86.5 90.0 Also available as SN100Ag3 MA-S. Benefit from the well-known advantages
of MA-S (see from p. 8) also with solder pastes
BiSn42Ag1 137–139 °C T3 86.5 89.0
BiSn42Ag3 139 °C T3 87.0
Flux classification as per EN 61190-1-1
BiSn(Ag)-SAC305 150–200 °C T3 87.0 88.0
adjustable
Available powder types: 3 (25-45 m), 4 (20-38 m), 5 (15-25 m) and 6 (5-15 m) on request
Various metal levels available depending on the required viscosity
SnPb37 183 °C T3 87.0 90.0
Delivery forms:
T4 88.0 88.0
Syringes 10cc | 30cc
SnPb62Ag2 179 °C T3 87.5 90.0 90.0 Cans 250g | 500g
T4 87.5 90.0 Cartridges 600g | 1.2kg
Pro-Flow Cassettes 750g
PbSn5Ag2.5 287–296 °C T3 90.0
28 / / 29TAMURA SOLDER PASTES WITH HIGHLIGHT SOLDER PASTE
OUTSTANDING PROPERTIES HIGHLIGHT
HIGHLIGHT
HIGHLIGHT WITH
Lotpaste
Lotpaste
HIGHLIGHT
FLUX
mitmit
HIGHLIGHT
Lotpaste GTS-VR1
Flussmittel
Lotpaste
Flussmittel
mit
HIGHLIGHT GTS-VR1
mit
mit Flussmittel
GTS-VR1
Flussmittel
Lotpaste
Lotpaste mit GTS-VR1
Flussmittel
Flussmittel GTS-VR1
GTS-VR1
GTS-VR1
Basierend
Basierend aufauf innovativem
innovativem Harzsystem
Basierend
Harzsystem auf (REL1
innovativem
auf(REL1 || NoClean)
| NoClean) Harzsystem (REL1 || NoClean)
TAMURA
TAMURA LOTPASTEN
LOTPASTEN
TAMURA MIT
TAMURA
MIT
LOTPASTEN
TAMURA
TAMURA HERAUSRAGENDEN
LOTPASTEN
MIT MIT
HERAUSRAGENDEN
MIT HERAUSRAGENDEN
LOTPASTEN
LOTPASTEN MIT EIGENSCHAFTEN
HERAUSRAGENDEN
EIGENSCHAFTEN
EIGENSCHAFTEN
HERAUSRAGENDEN
HERAUSRAGENDEN EIGENSCHAFTEN
EIGENSCHAFTEN
EIGENSCHAFTEN
Basierend
Rissfreie
auf innovativem
Basierend
Flussmittelrückstände
Harzsystem
Basierend
auf innovativem
Rissfreie auch bei
(REL1
innovativem NoClean)
Harzsystem
Harzsystem
hohen
Flussmittelrückstände und
(REL1 (REL1
dynamischen
auch bei
NoClean)
| NoClean)
Belastungen
hohen und
Rissfreie Flussmittelrückstände
Rissfreie Flussmittelrückstände auch
Rissfreie
Rissfreie auchbei hohen und
bei hohen und
Flussmittelrückstände
Flussmittelrückstände
dynamischen
auch auch
bei hohen und dynamischen
beiBelastungen
dynamischen Belastungen
hohen
und dynamischen
dynamischen
Belastungen
Belastungen
Belastungen
SOLDER PASTE TLF-204-NH Verhinderung
Verhinderung von von
Verhinderung vonBasedrissbedingter
Verhinderung
rissbedingter
rissbedingter
on innovative
VerhinderungKorrosion
Korrosion von
Korrosion
resins
von(REL1und Elektromigration
rissbedingter
und Korrosion
Elektromigration
und Elektromigration
| NoClean)
rissbedingter Korrosion und Elektromigration
und Elektromigration
Unterstützung Verhinderung von rissbedingter Korrosion und Elektromigration
Unterstützung
Unterstützungderder Verbindungszuverlässigkeit
Unterstützung
Verbindungszuverlässigkeit
der Verbindungszuverlässigkeit
Unterstützung der durchdurch adhäsive
deratVerbindungszuverlässigkeit
adhäsive
durch Wirkung
stresses Wirkung
adhäsive
Verbindungszuverlässigkeit Wirkung durch adhäsive Wirkung
Absolutely halogen-free for maximum safety
Lotpaste TLF-204-NHLotpaste TLF-204-NH
Crack-free flux residues
Unterstützung also high dynamic
der Verbindungszuverlässigkeit durchdurch adhäsive
adhäsive Wirkung
Wirkung
Lotpaste
Lotpaste TLF-204-NH
Powder size TLF-204-NHμm) | Lotpaste
Lotpaste
T3 (25-41 contentTLF-204-NH
metalTLF-204-NH
88% | ROL0 | for printing | 500 g can undund mechanische
mechanische Stabilität
Stabilität
und mechanischePrevention undder
Stabilität
und der
der Rückstände
mechanische
Rückstände
crackRückstände
mechanische
undofmechanische Stabilität
Stabilität
induced Stabilität
derand
corrosion der Rückstände
Rückstände
der Rückstände
electromigration
Absolut
Absolut
Absolut
Absolut halogenfrei
halogenfrei
halogenfrei für für höchste
für höchste
halogenfrei höchste
für Sicherheit
Absolut
Sicherheit
höchste
Sicherheithalogenfrei für höchste Sicherheit
Sicherheit
Absolut Absolut halogenfrei
halogenfrei für höchstefür höchste Sicherheit
Sicherheit Improved joint reliability by adhesive effect and mechanical stability of residues
Korngröße
Korngröße T3 T3 (25-41
(25-41
T3 (25-41 µm)µm)
µm) || Metallgehalt
Korngröße
|| Metallgehalt 88% 88%
T3 || ROL0
(25-41
|| ROL0 || Für
µm)
| Für Druckprozesse
| Metallgehalt
Druckprozesse 500|| 500
|| 88%
500 g Dosen
g| ROL0
Dosen| Für Druckprozesse | 500 g Dosen
Korngröße
Korngröße (25-41
T3 µm) Metallgehalt
Metallgehalt
Korngröße 88%
Korngröße 88%
T3
T3 (25-41 ROL0 ROL0
| |Metallgehalt
(25-41
µm) Für
µm) Für
Druckprozesse
Druckprozesse
| Metallgehalt 88%
88% | ROL0 500
|g|Für
Dosen
gDruckprozesse
Dosen
ROL0 | Für Druckprozesse | 500 g Dosen
| 500 g Dosen Keine
Keine Rissbildung
Rissbildung
Keine im Flussmittelrückstand
imKeine
Rissbildung Keine Rissbildung
Flussmittelrückstand
im Flussmittelrückstand imbei
im
bei Flussmittelrückstand
bei bei bei
SOLDER PASTE TLF-204-GTS-VR1 Keine
Rissbildung
Rissbildung
im Flussmittelrückstand
Flussmittelrückstand bei
Thermowechselbelastung
Thermowechselbelastung
Thermowechselbelastung (1500 Zyklen
|
Thermowechselbelastung |
-40 -40
Thermowechselbelastung
(1500 Zyklen
Thermowechselbelastung°C °C
|
(1500 Zyklen | -40(1500 |
125125
°C)
°C | 125 °C)
(1500 Zyklen
°C)Zyklen
Zyklen
(1500 || -40
| -40 °C -40 °C
| 125 || 125
°C°C) 125 °C)
°C)
Flux with innovative resin for crack-free, mechanically supporting residues
Lotpaste
Lotpaste
Lotpaste TLF-204-GTS-VR1
TLF-204-GTS-VR1
TLF-204-GTS-VR1
Powder sizeT4 Lotpaste
(20-36 μm) | metal contentTLF-204-GTS-VR1
Lotpaste 88.6% | REL1 | for printing | 500 g can
TLF-204-GTS-VR1 No cracks in flux residues at thermal cycling (1500 cycles | -40 °C | 125 °C)
Flussmittel
Lotpaste TLF-204-GTS-VR1
Flussmittel
Flussmittel mit mit
mit
Flussmittel innovativem
innovativem
mit
innovativem
innovativem Harzsystem
Flussmittel
Harzsystem
mit für
Harzsystem
Harzsystem
Flussmittel für
Flussmittel
für
mitrissfreie,
rissfreie,
rissfreie,
für
mitrissfreie,
innovativem
mechanisch
innovativem
mechanisch
mechanisch
mechanisch
innovativem
Harzsystem
stützende
Harzsystem
stützende
stützende
fürstützende
Harzsystem
Rückstände
fürRückstände
rissfreie,
fürRückstände
rissfreie,
mechanisch stützende Rückstände
Rückstände
rissfreie,
mechanisch
mechanisch
stützende
stützende
Rückstände
Rückstände
Korngröße
Korngröße T4 T4 (20-36
(20-36 µm) µm)
| | Metallgehalt
Korngröße
Metallgehalt 88,6%88,6%
T4| |
(20-36
REL1 REL1
| |
µm)
Für Für
| Druckprozesse
Metallgehalt
Druckprozesse 88,6%
| 500| 500
g| g Dosen
REL1
Dosen | Für Druckprozesse | 500 g Dosen
JET SOLDER PASTE
Korngröße
Korngröße
T4 (20-36
T4 (20-36
µm) µm)
| JDS-204G-HF11M
Metallgehalt
| Metallgehalt
88,6%
Korngröße
Korngröße 88,6%
T4 (20-36 |
T4µm)REL1
|
(20-36REL1
| µm) (UNDER
Für
| Für 88,6%DEVELOPMENT)
Druckprozesse
Druckprozesse
| Metallgehalt
| Metallgehalt | 500
| 88,6%| 500
g Dosen
g Dosen
| REL1
REL1 | Für | Für Druckprozesse
Druckprozesse | 500 g Dosen
| 500 g Dosen
For fast and exible jet-dispensing application
Jet-Lotpaste
Jet-Lotpaste
Jet-Lotpaste JDS-204G-HF11M
Stable jetting JDS-204G-HF11M Jet-Lotpaste
JDS-204G-HF11M
Jet-Lotpaste
Jet-Lotpaste (in(in Entwicklung)
JDS-204G-HF11M
Entwicklung)
(in Entwicklung)
JDS-204G-HF11M
JDS-204G-HF11M (in
(in Entwicklung)
(in Entwicklung)
Entwicklung)
Für Für schnelle
Für undund
FürExcellent
schnelle
schnelle
schnelle flexible
shape
flexible
undund Jet-Dispens-Applikation
offlexibleFür schnelle und flexible Jet-Dispens-Applikation
jetting dots
Jet-Dispens-Applikation
flexible Jet-Dispens-Applikation
FürJet-Dispens-Applikation
schnelle
Für schnelle
und flexible
und flexible
Jet-Dispens-Applikation
Jet-Dispens-Applikation
Stabile
Stabile Jet-Prozesse
Satellite-less
Stabile Jet-Prozesse
Stabile
Jet-Prozesse Stabile Jet-Prozesse
Jet-Prozesse Stabile Jet-Prozesse
Stabile Jet-Prozesse
Exzellente
Exzellente
Halogen-free
Exzellente
Exzellente Geometrie
Geometrie
Geometrie
Geometrieder der jet-dispensten
der Exzellente
der Exzellente
jet-dispensten
jet-dispensten Punkte
Geometrie
Punkte
jet-dispensten
Punkte
Punkte der jet-dispensten Punkte
Exzellente
GeometrieGeometrie
der jet-dispensten
der jet-dispensten
Punkte Punkte
Keine
Keine
Keine Satellitenbildung
Satellitenbildung
Keine
Satellitenbildung
Satellitenbildung Keine Satellitenbildung
Powder SizeT6 (5-15 μm) | metal
Keine content 83.5% | ROM0 | for jetting
Satellitenbildung
Keine Satellitenbildung
Halogenfrei
Halogenfrei
Halogenfrei
Halogenfrei Halogenfrei
Halogenfrei
Halogenfrei
Korngröße
Korngröße
Korngröße T6 T6
T6 (5-15
T6 (5-15
Korngröße (5-15 µm)µm)
µm)
(5-15 || Metallgehalt
Korngröße
|| Metallgehalt
µm) Metallgehalt 83,5%
83,5%
Metallgehalt T6 || ROM0
(5-15
|| ROM0 µm)Für|| ||Für
|| Für Jet-Dispensprozesse
Metallgehalt 83,5% | ROM0 | Für Jet-Dispensprozesse
Jet-Dispensprozesse GTS-VR1
GTS-VR1
GTS-VR1 GTS-VR1GTS-VR1 Konventionelles
Konventionelles
Konventionelles Harzflussmittel
Konventionelles
Harzflussmittel
Harzflussmittel
Konventionelles
Conventional rosin Harzflussmittel
Harzflussmittel
based flux
Korngröße T683,5%
Korngröße 83,5%
(5-15T6µm)ROM0
(5-15|ROM0
µm)
Metallgehalt Für
Jet-Dispensprozesse
Jet-Dispensprozesse
Metallgehalt
83,5% | 83,5%
ROM0 | ROM0 | Für Jet-Dispensprozesse
Für Jet-Dispensprozesse GTS-VR1
GTS-VR1 Konventionelles Harzflussmittel
Keine
Keine Rissbedingte
Rissbedingte Elektromigration
Keine Rissbedingte
Elektromigration Elektromigration
NEW DEVELOPMENT:
NEUENTWICKLUNG:
NEUENTWICKLUNG:
NEUENTWICKLUNG:JET PASTE JDS-204G-HF11M
Jet-Dispens-Paste
NEUENTWICKLUNG:
Jet-Dispens-Paste JDS-204G-HF11M
Jet-Dispens-Paste
JDS-204G-HF11M
Jet-Dispens-Paste JDS-204G-HF11M JDS-204G-HF11M Keine Rissbedingte Elektromigration
Keine
crackKeine
Rissbedingte
inducedRissbedingte
Elektromigration
Elektromigration
NEUENTWICKLUNG:
NEUENTWICKLUNG:
Jet-Dispens-Paste
Jet-Dispens-Paste
JDS-204G-HF11M
JDS-204G-HF11M No electromigration
Flexibles
Flexibles
Flexibles Jet-Dispensen
Jet-Dispensen
Jet-Dispensen statt
Flexibles
statt Drucken
Jet-Dispensen
Drucken
statt
Flexibles statt
statt Drucken
Drucken statt Drucken
Jet-Dispensen Drucken
Flexibles Jet-Dispensen
Flexible jet-dispensing instead of printing
GTS-VR1 Conventional rosin based fluxl
GTS-VR1
GTS-VR1
GTS-VR1 GTS-VR1 Konventionelles
Konventionelles
Konventionelles Harzflussmittel
Konventionelles
Harzflussmittel
Harzflussmittel
Konventionelles Harzflussmittel
Harzflussmittel
GTS-VR1
GTS-VR1 Konventionelles Harzflussmittel
Anwendung
Anwendung und
und
Anwendung Jet-Ergebnis
Anwendung
Jet-Ergebnis
und 0,4mm
0,4mm
Jet-Ergebnis
Anwendung 0,4mm
Anwendung pitch
undpitch
Jet-Ergebnis
pitch 0,4mm pitch
Application and jetting result: 0.4mmund
pitchJet-Ergebnis
und Jet-Ergebnis
0,4mm0,4mm
pitchpitch Höhere
Höhere Zuverlässigkeit
Zuverlässigkeit
Höhere und
Zuverlässigkeit und
Höhere Festigkeit
Festigkeit
und Festigkeit durch
Zuverlässigkeit
durch
durch stützende
und
stützende Wirkung
und Festigkeit
Wirkung derder
durch
der stützende Wirkung der
Höhere Höhere
Zuverlässigkeit und stützende
Zuverlässigkeit Festigkeit Wirkung
Festigkeit
durchdurch stützende
stützende WirkungWirkung
der der
Flussmittelrückstände
Flussmittelrückstände
Flussmittelrückstände Flussmittelrückstände
Flussmittelrückstände
Flussmittelrückstände
Improved joint reliability and strength by adhesive effect and mechanical stability of residues
100 100
100 100 100
100
100
100
80 80
80 80 80
80
80
80
[N]
[N]
TLF-204-GTS-VR1
[N]
TLF-204-GTS-VR1 TLF-204-GTS-VR1
Scherfestigkeit[N]
Scherfestigkeit[N]
TLF-204-GTS-VR1
TLF-204-GTS-VR1 TLF-204-GTS-VR1
[N]
Scherfestigkeit[N]
Scherfestigkeit [N] TLF-204-GTS-VR1
shear strength [N]
60 60 60
Scherfestigkeit
Scherfestigkeit
60
Scherfestigkeit
60
Scherfestigkeit
60 60 TLF-204-GTS-VR1
60
40 40
40 40 40
40
40 40
20 20
20 20 Konventionelles
20
Konventionelles Harzflussmittel
Konventionelles Harzflussmittel
20 20Harzflussmittel
Konventionelles
Konventionelles
Harzflussmittel
Harzflussmittel
20 Konventionelles
Konventionelles
Harzflussmittel
Conventional rosinHarzflussmittel
based flux
00 00 0 0
0 0
< 2mm 00 500 500 010001000 5001500
500
0 500 20002000
1000
15001000 1000 1500
20001500 1500 2000
00 500 500 0 010001000 1500
1500 2000 200020002000
< 2 mm < 2 mm
Components <
< 22 mm
mm< 2 mm 500 1000 1500
Komponenten
Komponenten
Komponenten
Komponenten
Komponenten <
< 22 mm
mm < 2 mm
Zyklen
Zyklen
Zyklen -40 -40
Zyklen
-40 °C ||°C
°C
-40 || 125
125
°C
125 °C °C
°C
125 °C Zyklen -40 °C | 125 °C
Komponenten Komponenten
Komponenten
Zyklen Zyklen
-40-40
cycles |-40
°C °C125°C°C| °C
| 125 125 °C
29 // 29
29 29 // 29 /
29 /
29 / 30 // 30
// 30 30 / 30
/ 30
/ 30
30 / / 31FÜR ALLE LÖTPROZESSE UND HÖCHSTE ZUVERLÄSSIGKEIT
TAMURA ELSOLD SOLDER ALLOY #287
FOR ALL SOLDERING PROCESSES AND HIGHEST RELIABILITY
Lotpaste TLF-287-GTS-VR6
TAMURA
OLD LOTLEGIERUNG #287 SOLDER ALLOY #287
T4 (20-36 µm) | 89.0 % Metallanteil | REL1 | NoClean | für Druckprozesse | 500 g Dose
Rissfreie Flussmittelrückstände auch bei hohen und dynamischen Belastungen
Solder Paste TLF-287-GTS-VR6
PROZESSE UND
FOR HÖCHSTE
ALL
Verhinderung ZUVERLÄSSIGKEIT
SOLDERING
von rissbedingter
T4 (20-36 µm) | 89.0
PROCESSES
Korrosion und Elektromigration
% metal content | REL1 | NoClean | for printing | 500 g can
Unterstützung der Verbindungszuverlässigkeit durch adhäsive Wirkung und mechanische Stabilität der Rückstände
Crack-free flux residues also at high dynamic stresses
AND HIGHEST RELIABILITY
Perfekte Kombination von Lot und Flussmittel für höchste Zuverlässigkeit
Prevention of crack induced corrosion and electromigration
-GTS-VR6 Drähte
Improved joint reliability by adhesive effect and mechanical stability of residues
undcombination
Röhrenlote
Metallanteil | REL1 | NoClean Perfect
| für Druckprozesse | of
500solder
g Doseand flux for highest reliability
Massivdraht und Röhrenlote, empfohlen speziell mit den Flussmitteln C3+ (ROL0 | 3,0%) und X4 (REM1 | 3,0%)
kstände auch bei hohen und dynamischen Belastungen
SOLDER PASTE
Weitere
Wires TLF-287-GTS-VR6
Flussmitteltypen
and Fluxund Cored-gehalte auf Anfrage
Wires
edingter Korrosion und Elektromigration
T4 (20-36Lieferbare
μm) | 89.0Standardspulengrößen:
% metal content | REL1 |0.50 kg | 1.00
NoClean kg | 2.50| 500
| for printing kg | g4.00
can kg
bindungszuverlässigkeit durch Solid wire and
adhäsive flux cored
Wirkung und solder wire, especially
mechanische Stabilitätwith fluxes C3+ (ROL0 | 3,0%) and X4 (REM1 | 3,0%)
der Rückstände
Spulensondergrößen auf Anfrage
Crack-free flux residues also at high dynamic stresses
FurtherZuverlässigkeit
on Lot und Flussmittel für höchste flux types and content available upon request
Durchmesser
Prevention ab 0.6corrosion
of crack induced mm and electromigration
Lieferbare Standardspulengrößen: 0.50 kg | 1.00 kg | 2.50 kg | 4.00 kg
Improved joint reliability by adhesive effect and mechanical stability of residues
enlote Barren
Spulensondergrößen auf Anfrage
und ofStangen
Perfect combination of solder and flux for highest reliability
nlote, empfohlen speziell mitDiameter
den Flussmitteln0.6 mmC3+ or thicker
(ROL0 | 3,0%) und X4 (REM1 | 3,0%)
Dreikantstangen (8/10 x 400 mm | 0.2 kg) und Barren (20 x 20 x 335 mm | 1 kg)
en und -gehalteWIRES
auf Anfrage AND Geometrien
FLUX CORED WIRES
Weitere auf Anfrage
lengrößen: 0.50 kg | 1.00
Solid wire Bars
kg | 2.50
and flux kg | 4.00
cored kg wire, especially with fluxes C3+ (ROL0 | 3,0%) and X4 (REM1 | 3,0%)
solder
Erhöhte Badstabilität durch optimiertes Mikrolegierungskonzept der Legierung #287
uf Anfrage Triangular bars (8/10 x 400 mm | 0.2 kg) and bars (20 x 20 x 335 mm | 1 kg)
FurtherIdeal
flux types and content mit
in Kombination available
TAMURA uponELSOLD
request Lotbadanalyse-Service
m Standard spool Other geometries
sizes:: available
0.50 kg | 1.00 upon
kg | 2.50 kg |request
4.00 kg
Special spoolImproved bath upon
sizes available stability due to optimized microalloying concept of #287
request
gen Diameter of Perfectly
0.6 mm or combined
thicker with TAMURA ELSOLD solder bath analysis service
x 400 mm | 0.2 kg) und Barren (20 x 20 x 335 mm | 1 kg)
f Anfrage BARS
urch optimiertes Triangular bars (8/10 x 400 mm
Mikrolegierungskonzept der |Legierung
0.2 kg) and#287
bars (20 x 20 x 335 mm | 1 kg) SAC305 #287
it TAMURA ELSOLD Other geometries available upon request
Lotbadanalyse-Service
Schmelzbereich [°C] 217-219 209-226
Improved bath stability due to optimized microalloying concept of #287
SAC305 #287
Perfectly combined with TAMURA ELSOLD® solder bath analysis service
Zugfestigkeit [MPa] 41 99
Melting Range [°C] 217-219 209-226
Rissanteil [%] 95,6% 47,0%
3000 Zyklen
Tensile-40 | 125 °C[MPa]
Strength 41 99
SAC305 Crack #287
Ratio [%] 95.6% 47.0%
SAC305 Wettbewerbs #287
3000 Cycles-40 | 125 °C
Schmelzbereich [°C] 217-219 209-226 SACSbBiNi
Zugfestigkeit [MPa] 41 99
SAC305 competitor’s #287
SACSbBiNi
Rissanteil [%] 95,6% 47,0%
3000 Zyklen -40 | 125 °C
SAC305 Wettbewerbs #287
SACSbBiNi
Thermoschockbeständige Lotlegierung #287
- Der neue Maßstab für Zuverlässigkeit und Lebensdauer
Alloygeeignet
- Perfekt #287: High Heat Resistant
für Automotive Anwendungen Solderdurch höchsten
Risswiderstand
-The new Benchmark bei Thermoschockwechselbelastung
of Reliability and Lifetime
SAC305 #287
- Das gesamte Spektrum
-Perfectly Suited for Automotive an Lotprodukten:
Applications by
MELTING RANGE [°C] 217-219 209-226 Paste, Barren, Drähte & Röhrenlote
Highest Crack Resistance at Thermo Shock Cycle
TENSILE STRENGTH [MPa] 41 99
Thermoschockbeständige ALLOY Lotlegierung
#287:
- Verringerte
-The Full HIGH #287
HEAT RESISTANT
Polykristallisation
Range of Solder SOLDER
und Wachstumsgeschwindigkeit
Products: Paste, Bars, Wires & Flux Cored Wires
- Der neue Maßstab für Zuverlässigkeit und
-Reduced Lebensdauer
intermetallischer Phasen
Polycrystallization and Grwoth of Intermetallic Phases
CRACK RATIO [%] The new Benchmark of Reliability and Lifetime
3000 CYCLES -40 | 125 °C
95,6 % 47,0 % - Perfekt geeignet für Automotive Anwendungen
- Erhöhte
Perfectly -Improved
Suited Stabilität durch
Stability
for Automotive
höchsten
in allen
Applications Lötprozessen
inbyall Soldering
Highest durch
Processes
Crack Resistance optimierte
at Thermo Cycle Mikrolegierung
by Optimized
Shock Microalloying
Risswiderstand bei Thermoschockwechselbelastung
The Full Range of Solder Products: Paste, Bars, Wires & Flux Cored Wires
29 / - Das gesamte Spektrum an Lotprodukten:
Reduced Polycrystallization and Grwoth of Intermetallic Phases /3
Paste, Barren, Drähte & Röhrenlote
Improved Stability in all Soldering Processes by Optimized Microalloying
29 / - Verringerte Polykristallisation und Wachstumsgeschwindigkeit
intermetallischer Phasen
- Erhöhte Stabilität in allen Lötprozessen durch optimierte Mikrolegierung
32 / / 33
/ 30TAMURA ELSOLD ® CERTIFICATION
The TAMURA ELSOLD® production process complies
with the quality management standard ISO TS /
IATF 16949. Certification for this comprehensive CERTIFIED SOLDER
directive for the automotive industry was ALLOYS FOR
achieved in September 2007 and is still valid EUROPEAN SPACEFLIGHT –
(Certificate Registration No. 391568 IATF16).
TAMURA ELSOLD ® has implemented and maintains EXCLUSIVE BY ELSOLD ®
an Environmental Management System certified
according to ISO 14001 : 2015. TAMURA ELSOLD® As bars, wire and flux cored wire
products fulfil the standards DIN EN ISO 9453, DIN · Sn60Pb40
EN ISO 9454, DIN EN 61190 1-1 to 1-3; the key · Sn63Pb37
international standards and the TAMURA ELSOLD® · Sn62Pb36Ag2
works standards which are not covered by any · Sn96Ag4
official standard. Selected TAMURA ELSOLD®
TAMURA ELSOLD® also offers suitable
soft solders fulfil the ESA soldering standard
fluxes in liquid form (e.g. type 045) or for
ECSS-Q-ST-70-71C. All spacecraft launched into spa-
pastes (AP-10 or AP-40S) and cored solder
ce by ESA (European Space Agency) are soldered
TAMURA ELSOLD ® SERVICE
wire (type K or C3).
with TAMURA ELSOLD® soft solders because of their
high quality, high reliability and long service life.
Delivery Service Internet Service
TAMURA ELSOLD®s entire product range is produced Download technical data sheets for all im-
TAMURA ELSOLD ® in Ilsenburg. This results in short delivery times allo-
wing us to provide JIT deliveries upon special custo-
portant solder products from our website
www.tamura-elsold.com
RECYCLING PROGRAMME mer request.
Solder bath analysis
Technical support and application advice TAMURA ELSOLD® analyses submitted samples. The
The correct handling of dross and scrap solder , e.g. resulting from wave soldering, represents an economic, ecological and
In order to assure the quality of our customers customer is informed about the level of impurities
qualitative challenge for which TAMURA ELSOLD® offers an optimal solution in all respects with its recycling programme.
finished products, we attach great importance to pro- with a recommendation as how to proceed for further
In-house recycling processes and the direct reuse of scrap solder in soldering processes have been proven to have a negative
viding advice and support. Selecting the right sol- operation.
impact on soldering quality. Nonetheless, old scrap solder and metal contained in the dross represent a value. This is made
dering products and processing parameters with
economically viable by the TAMURA ELSOLD® Recycling Programme. You will receive an appropriate renumeration for taking
regard to the customers’ production equipment and Disposal of used soft soldering material
part, and the recycled metal is reused for other industries with lower requirements, thus achieving sustainability without
environmental issues is crucial for us. We dispose of your unusable old material (such as
compromising quality.
“Dross”) at fair conditions.
Changeover to lead-free materials
The changeover to lead-free materials creates costs
1) COLLECTION 2) ANALYSIS and raises questions about the reliability and difficul-
ties of lead-free material. We are pleased to offer our
Free metal buckets for collection and Free analysis of the delivered waste*· experience from successful changeover processes
shipment of lead-containing or lead-free Certificate of Specification after recycling already implemented in our customer base. Join us
metal waste*. upon your request. as a partner when it comes to the need for competent
answers to commercial and technical queries.
WE ARE HAPPY TO ADVISE YOU!
TAMURA ELSOLD ® GmbH Co.KG | Huettenstrasse 1 | 38871 Ilsenburg | Germany
Phone +49 (0) 394 52 48 79 0 | Fax +49 (0) 394 52 48 79 66
3) RENUMERATION
info@tamura-elsold.de | www.tamura-elsold.com
* solder material Fast and appropriate payment.
34 / / 35You can also read
