Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC

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Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
From Technologies to Market

    Advanced RF
 System-in-Package
for Cellphones 2019

                                          Sample
                                          © 2019
Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
TABLE OF CONTENTS

o Introduction                          3   o RF SiP packaging                   81       o Market forecasts                 189
     • Methodology                              • Technology & trends                        • Cellphone forecast by type & air
     • Report synergies                         • Interconnection trends                        standards
     • Objectives, scope, definitions           • Challenges & requirements for 5G           • RF components packaging market
                                                                                                at wafer-level & SiP level
     • Advanced packaging platforms             • Antenna in package
                                                                                             • RF SiP Forecasts in units & market
                                                • Roadmap
                                                                                                   • By cellphones category
o Executive summary           _______18         • EMI Shielding
                                                                                                   • By air standards
                                            o Packaging substrate materials for                    • By types of SiP modules
                                              5G                           150
o Market drivers and dynamics _45                                                            • Wafer starts for RF SiP
   • Evolution of cellular networks                                                          • Interconnects trend forecast
   • Nature of 5G                          o Players and supply chain          170           • OSATs vs IDMs packaging market
   o Disruptions and opportunities             • Player landscape and positioning               trend

o RF SiP in smartphones                 66     • Company strategies                       o Conclusion                                                     221
     o Architectures
     o Trend for 5G                                                                       o Yole Développement presentation
                                                                                                                       225

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Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
ABOUT THE AUTHOR
   Biography & contact

            Santosh Kumar
            Santosh Kumar is currently working as Principal Analyst and Director Packaging, Assembly & Substrates, Yole Korea. He is
            involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main
            interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-
            out / fan-in WLP, flip chip, and 3D/2.5D packaging.
            He received the bachelor and master degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University
            of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has
            presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.
            contact: kumar@yole.fr

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Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
COMPANIES CITED IN THE REPORT

                                                    (non-exhaustive list)

     Amkor (J-Devices, Nanium), Acco, Apple, ASE Group, AT&T, Avago Technologies, Broadcom, Cavendish Kinetics, Cisco, Deca
     Technologies, Ericsson, GLOBALFOUNDRIES, Google, HiSilicon, Huawei, Infineon, Intel, JCET/STATS ChipPAC, Lenovo, LG,
     Marvell, Mediatek, Nepes, NXP Semiconductors (Freescale), Murata, NTT Docomo, ON Semiconductor, OPPO, Panasonic,
     Peregrine Semiconductor/Murata, Powertech Technology, Qorvo (RFMD, Triquint), Qualcomm (RF360), Samsung, Skyworks
                   Solutions, Soitec, Spreadtrum, SPIL, Sprint, TDK-EPCOS, TSMC, Wisol, Xiaomi, ZTE and more…

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Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
REPORT METHODOLOGY

       Market forecast methodology

                                              Market segmentation methodology

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Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
REPORT METHODOLOGY

       Technology analysis methodology                       Information collection

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Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
WHO SHOULD BE INTERESTED IN THIS REPORT?
RF component manufacturers                                                    Mobile phone OEMs
    •   Evaluate market potential of future technologies and products             •   Evaluate market potential of future technologies and products to
                                                                                      differentiate your products
    •   Understand the differentiated value of your products and
        technologies in this market                                               •   Evaluate the benefits of using these new technologies in your end
                                                                                      system, design architectures for the next generation of systems
    •   Build a roadmap for modules: which type of modules? When?
                                                                                  •   Screen potential new suppliers able to provide new functionalities,
    •   Identify new business opportunities                                           or cost and size savings
    •   Identify potential strategic partners or technology providers
    •   Monitor and benchmark your competitor’s advancements
                                                                              R&D centers
                                                                                  •   Assess market potential and trends about future technologies and
RF foundries, material and equipment suppliers,                                       products
packaging houses                                                                  •   Distinguish the best candidates for technology transfer
    •   Understand what are the components and technologies that will
        drive the volumes in 2023
    •   Identify new business opportunities and prospects                     Financial & strategic investors
                                                                                  •   Understand the structure and value chain of RF cellular
                                                                                      technology
RF and component specialists (manufacturers,                                      •   Estimate the potential of new technologies such as SOI, RF
fabless), transceiver, modem, software vendors…                                       MEMS,…
    •   Spot new opportunities and define diversification strategies linked       •   Get the list of the main key players and emerging start-ups of this
        to RF components                                                              industry worldwide

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Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
KEY FEATURES OF THIS REPORT
The “RF SiP for Cellphones 2019” is the update of the of the “Advanced RF SiP for Cellphones 2017”
report.The objectives of the report are as follows:
 Market overview
     o Drivers and dynamics for 5G flavors: 5G mmWave and 5G sub 6 GHz
     o Disruptions and opportunities thereof
     o Focus on various SiP architectures in RF Front-End of cellphones
     o Focus on both cellular and connectivity RF Front End modules
     o Market forecast to include both wafer level & SiP level revenue
     o RF Front End SiP forecast in Revenue,Wafers, Units by
                                                                    Technology trends and forecasts
              o Cell phone category/type                                o RF Front-End multi-die System-in-Package challenges and technology
              o By cellular & Wi-Fi standards                              requirements for 5G sub 6 GHz and 5G mmWave (>24 GHz) bands
              o By various types of RF Front End SiPs                   o 5G SiP packaging roadmaps for smartphone Front-End
     o Interconnects trends forecsat for RF SiP                         o Packaging trends for both cellular & connectivity modules
                                                                        o Antenna in Package (AiP) trends for 5G mmWave
                                                                        o Substrate trends for 5G mmWave
 Supply chain analysis
                                                                        o Shielding trends
     • Supply chain changes in the new 5G era                           o RF SiP Revenue,Wafer and Unit forecasts
     • RF SiP assembly detailed supply chain of various players
     • Strategies and outlook of current RF SiP manufacturers
     • New entries and supply chain disruptions for mmWave packaging
     • Substrate supply chain

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Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
WHAT IS NEW COMPARED TO 2017 REPORT (1/2) ?
   • In 2017 RF SiP report, only PAMiD module forecast is covered. The current report extend the RF Front End SiP
     scope to include all RF Front End SiP for both cellular & connectivity function in cell phone:
        • Cellular
                  • PAMiD (Power Amplifier Module with Integrated Duplexer)
                  • PAM (Power Amplifier Module)
                  • Rx DM (Receive Diversity Module)
                  • ASM (switchplexer) (Antenna Switch Module)
                  • Antennaplexers (multiplexer)
                  • LMM (Low noise amplifier - multiplexer module)
                  • MMMB PA (Multi-Mode, Multi-Band Power Amplifier)
                  • mmW FEM
        • Connectivity
                  • WiFi FEM
                  • WiGig FEM

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Advanced RF System-in-Package for Cellphones 2019 - From Technologies to Market - OIC
WHAT IS NEW COMPARED TO 2017 REPORT (2/2) ?
   • Packaging trend covering both wafer level packaging & SiP
   • Interconnect trends for various components in RF SiP
   • RF Front End SiP forecast in revenue, wafers, units by
              o Cell phone category/type
              o By cellular & Wi-Fi standards
              o By various types of RF Front End SiPs
   • Antenna in Package (AiP) trends for 5G mmWave application
   • Substrate trends for 5G
   • RF SiP assembly detailed supply chain of various players including substrate supply chain
   • Packaging roadmap and challenges for 5G sub 6Ghz & mmWave applications

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SYSTEM INTEGRATION LEVELS

    LEVEL 3:
       End
Device/Equipment
                                             iPhone X
                                                                                          LEVEL 1+2:
                                                                                  Semiconductor Package + Board

                                                                Semiconductor
    LEVEL 2:                                                      package
Device/Equipment                                                                                          Si dies
     board

                                               iPhone X PCB

  LEVEL 1:
Semiconductor
  Packaging
                                 Broadcom RF SiP
                                  in the iPhone X

  LEVEL 0:
Semiconductor                                                           Package Substrate                            Board (PCB)
  Die/Wafer

                   Power amplifier in           Semiconductor
                   Broadcom RF SiP                  wafer
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KEY TERM DEFINITIONS
   • NOTE:
      • From a logical viewpoint, the following terms are highly interchangeable and their usage is unfortunately not consistent
        throughout the industry
      • In order to avoid confusion and enable systematic segmentation, Yole Développement uses the following definitions

   • Module: A fairly general term that usually refers to separate circuit(s)/die(s) or component(s) that form a whole due to
     functional purpose or special features
   • MCM: Multi-Chip-Module, a module containing multiple packages as final components (often, the whole module can be again
     overmolded, lided or differently encapsulated)
   • MCP: Multi-Chip-Package, any package with multiple dies, with or without integrated passives
   • SiP: System-in-Package, strictly speaking, needs to be a type of system, containing 2 or more dies with different functionality, with
     or without integrated passives. By definition, an SiP would be a type of multi-die package
   NOTE: In this report, a System-In-Package is viewed from a packaging perspective, where the main challenge is integrating multiple dies,
   regardless of their functionality. Therefore, in order to simplify and keep the emphasis on packaging technologies, the decision has been taken
   to treat all multi-die packages as SiP, even if they do not strictly adhere to a definition of a system. In that sense, it would be fully correct just
   to use the term multi-die packages but due to the commonly rooted usage of the term SiP in the industry, in this report SiP is used instead of
   multi-die package. For example multiple dies of the same functionality in one package would still be considered as SiP. Furthermore, while it’s
   often the case that SiPs include also passives, lack of passives would not change the SiP definition.

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KEY TERM DEFINITIONS
   • PCB: Printed Circuit Board, abbreviation commonly used for system boards – Yole Développement makes a distinction between
     PCB (boards) and semiconductor package substrates (also sometimes referred to as IC substrates)
   • Substrate: While a substrate can be considered on various system levels, (i.e. a transistor Si bulk substrate), the term substrate
     is here used for semiconductor package substrates (sometimes referred to also as IC substrate), which are package components
     between the die and PCB built using semi-additive processing and lamination/build up technology, namely WB/FC package
     substrates within FC CSP/BGA or WB CSP/BGA packages
   • Thin film RDL: Particular form of redistribution layer formed by thin film technologies, refers to RDLs of Fan-In and Fan-Out
     WLP/PLP
   • Interposer: Technically, any kind of substrate/RDL has the function of “interposing” between the die and PCB, however for
     practical purposes, the term interposer is used for additional interconnect components on top of a substrate, namely Si and
     Glass interposers
   • Front-End Module (FEM): A multi die package, placed between the transceiver and the antenna that typically consists of filters,
     duplexers and switches, not necessarily a power amplifier
   • Power-Amplifier Module (PAM): Essentially, a multi-die package of amplifiers but can integrate all components of a FEM as well
   NOTE: For easier understanding and due to common usage in the industry, in this report FEM refers to a multi-die package that also contains
   a power amplifiers. Therefore, the term FEM is used for multi-die packages that contain filters, switches, duplexers and power amplifiers
   (FEMiD or PAMiD can be formal variations of the term FEM)

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SCOPE OF THE REPORT

                                                                      Focus of the report

                Mobile phones

                    Mobile Infrastructure

RF Front-             RF front-end components (PA, LNA, filters, switches, antenna tuners)
                                                                                                                                      Main focus
End SiP
packaging for         RF Front-End packaging (FEM SiPs)
mobiles
                      2G, 3G, 4G, 5G technologies

                   Modems, transceivers, baseband processors, Wi-fi & Bluetooth modules…

                Antennas, IPDs, …

                                 Topics NOT included in the report

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RF PACKAGING OVERVIEW
            >1000W
Power (W)

                                                                                                          Power modules
            100-1000W

                                                                                                          Ceramic lid with Cu flange

                                                           Over molded plastic with Cu flange
            1-100W

                        Plastic leadframe (QFN) packages
                                                                                      Ceramic leadframe
                                                                                       (QFN) packages

                                                                          2.5D interposer
                              QFN                    WB/FC CSP                                       WL CSP                         FO WLP
            100
                                                                                                                                                           Frequency (GHz)

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RF PACKAGING OVERVIEW
            >1000W
Power (W)

                                                                                                    Power modules
            100-1000W

                                                                                                                                               Focus of this report!
                                                                                                                                                Advanced packages
                                                                                                                                                 for RF devices in
                                                                                                                                                smartphone Front-
                                                                                                    Ceramic lid with Cu flange
                                                                                                                                                       Ends
                                                 Over molded plastic with Cu flange
            1-100W

                        Plastic leadframe
                        (QFN) packages                                          Ceramic leadframe
                                                                                 (QFN) packages

                                                                    2.5D interposer
                                QFN             WB/FC CSP                                   WL CSP                          FO WLP
            100
                                                                                                                                                   Frequency (GHz)

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CELLULAR TECHNOLOGY DEVELOPMENT
     From 2G to 5G: Less than a 30 years’ journey
                                                         Other standards from IEEE family
                                                         including WiMAX and iBurst
                                                                                                 TDD-
                                          CDMA2000       EV-DO Rev                                LTE-
CDMA          CDMA2000 1xRTT               1xEV-DO         A/B/C           TDD-LTE              Advanced          LTE-A
                                                                                                                                 5G sub-6GHz              5G mmWave
                                         TD-SCDMA        TD-HSPA                                                   Pro

GSM         GPRS            EDGE         TD-CDMA                                                 FDD-
                                                                            FDD-LTE               LTE-
                                          WCDMA          HSPA    HSPA+                          Advanced
                                         All belong
                                         to UMTS                                                                                 Will be a globally
                                         technology                                                                              unified standard!

   2G         2.5G        2.75G/Pre-3G       3G           3.5G             3.9G/Pre-4G              4G               4.5G                Pre-5G                   5G

It takes around 10 years between two cellular generations, including a long transition phase with intermediate technologies.

1992            1997            2001              2007              2010                 2013                       2018                          2020

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APPLICATION MAPPING

                                             Cloud Computing
                                                                           Autonomous Vehicle

                                                                                                                                                      Frequency(GHz)
                                                    Advanced AI assistant               Medical Robot            MMWAVE
                                                                                                                 (>24GHZ)
5G use cases                                                                            Robotic Service
extend far                                                     Wireless VR
                                                                                                                                                  SUB-6
beyond mobile
phone, from IoT                                                                                                                                   GHZ
to autonomous                                                                                 Drone Delivery
vehicle, creating
                                   New Gaming Content
                                                                      AR
                                                                                                                     Real-time Translation                             SUB-1
new challenges
for the network                                                                                                                      Smart City                        GHZ
in terms of data                                                                    360° Video Telepresence
rate and latency                                                                                                                        Industrial Automation
                                                                   4K video streaming
agility.            20                                                                                        Smart Grid
                         15                                                                                                                    2025
                              10                                     Connected                                                           2024
                                                                                                                                  Asset Tracking
                                   5                                                                                                2023
                                         4                           Wearable                   Agriculture
                                                                                                                               2022
                                               3                                                                  Port Management
                                                        2                          Connected Home                       2021
                                                               1                                                 2020
                                                                        0.5                              2019
                                                            Remote Surveillance
                                                                               0.3                2018
                                                                         Shared Utilities 0
                                                                                         2017

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DIFFERENT PATH, DIFFERENT USE CASES

                                                                            Mobile broadband
                                                            Cat 21          Mostly video driven
                                                                            Mass market

Mobile broadband
driven by down/up link
data rate race required
for video: multi Giga bit
UE devices and routers
penetrating the market.
IoT devices spread
through various market
segments (consumer,
industrial, automotive,
health, …) mostly
driven by the data
quest.                                                                      IoT devices
                                                                            Data centric (tracking, health, survey, …)
                                                                            Plenty of different use cases
                                                                            Huge market potential

                            Courtesy of U-Blox

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SMARTPHONE COMPONENTS FOUND IN SiP                                                                                                                  In SiP                Not in SiP

                GPS

            Antenna
                                                  Front End                                              PMU
  Tuner      Switch            PA
            Module                                 Module
                                                                                                                               Battery              Touchscreen                  LCD
                                                                                                         PMU
                                                                    Transceiver      Modem

                                         Front End            LNA
                                          Module                                                     USB/charger
                                                                                                                                                        TS                      Display
      Antenna              Front                                                                                                                     controller                 Driver
                                           Filter /
       Switch               End                               LNA
                                          Duplexer
      Module               Module
                                                                                                                              Pressure                               Gyro

                                                                                                                              3-axis
                                                                                                                          accelerometer                            Compass
                                                                        Application processor
                  PA                WiFi/BT/FM                                                                               6-axis IMU                           Barometer
                                                                                (PoP)

                                                                                                                                                                   Heart rate
                WiFi FEM

                                                                                                                     Camera                    Audio
                                                                                                                                                                         MEMS mic
                  NFC                  NFC                                                                            Back                     codec
                 booster             controller
                                                                          Memory                   ISP
                                                                                                                     Camera
                                                                                                                                                                         MEMS mic
                                                                                                                      Front
                                                                          storage
                                                                                                LED Flash
                                                                                                                    LED Flash
                                                                                                  driver

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RF FRONT-END MODULE DEFINITION
         Front-End Module with Integrated Duplexer (FEMiD) and Power Amplifier Module with Integrated Duplexer (PAMiD)

An RF
FEM can
include power
amplifiers (PA)
or low noise
amplifiers
(LNA), filters,
switches and
an antenna
tuner.
                                     RF FEM in a cellular handset
                                   Courtesy of Qualcomm, modified by Yole

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RF SIP PACKAGING

                                     SMT

                                                                   Wire
                      BGA/LGA
                                                                   bond

    Various
    process
                                      SiP
 modules used                      assembly
in SiP assembly

                      Inspection
                                                                Molding
                        & Test

                                   Shielding

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MOBILE RF FEM PACKAGE TREND

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RF FRONT END ARCHITECTURE- HIGH END PHONE (5G MM WAVE)

                                                             mmWave baseband
                                                             modem
                                                                                                            Enveloppe
                                                                                                            Tracker
                                                                                                                                         SiP technology                                                           Antenna+RF
                                                                                                                                     LNA            Filter                                                        transceiver+PMIC
                                                                                                                                                                           mmWave AiP
                                                                                                                               PA               Filter

                                                                                                                               5G PAM
•   RF front end has                                                                                                                                                                              Tuner
                                                                                                                   3G/LTE PAM MHB
    been complexified
    since integration of                Baseband
    new technologies                    Modem
                                                                                                            3G/LTE LB PAM
    such as Carrier                                                                                                                                          Multiplexer                          Tuner

                                                                                                                                                                                                                               4x4 MIMO DL
    Aggregation, MIMO                                                Transceiver                                                                             CA
    and later on dual                                                (integrated with PMIC)                2G PAM
    connectivity.
    mmWave                                                                                                                                                                                        Tuner
    connectivity will                                                                                                                                                 Antennaplexer
    add another RF                                                                                                                                                    MIMO
                                                                                                                      Filter
    path to the UE.                                                                                 LNA
                                                                                                                  Filter                                                                           Tuner
                           GPS module                                                         Diversity receive
                                                                                                                                                                               May be shared

                                                                                                                                                                                                    2x2 MIMO DL
                                                   Wi-Fi/BT module                      Diversity receive

                                                                                     Diversity receive

                                                                                                                                                                                        May be integrated

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INTERCONNECTS IN RF SIP

                                                               Interconnects
                                                                  in RF SiP

                                                Flip-chip                                                  TSV + RDL+                          TSV + Wire
                                                                              Wire-bond
                                                ( Bump)                                                      Flip-chip                            bond

                                                                                Power Amplifiers,                  BAW Filters                     Power Amplifiers
                                                                                 Switches, Filters
   Different          Cu pillar                                 Au bump
                                               Solder
interconnects         (plated)                                (plated/stud)
    in SiP
                 Power Amplifiers, BAW                                  SAW filters,
                 Filters, Switches                                      BAW filters

                Paste printing           Ball drop          Plated

                     Filters                 Filters

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TECHNOLOGY TOOLBOX FOR RF SIP FOR 5G MOBILE

                                               Double side
                                                assembly

                         Low loss materials                    Double side mold

  Packaging         Antenna in
                                                                         Embedded active
                      package
 innovations        integration
                                                                           & passives
  needed at
various levels

                            Miniaturized                         Conformal &
                              passive                           compartmental
                            components                            shielding

                                              Thin substrate

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ANTENNA KEY PARAMETERS

                                                  Effective area

                      Polarization                                                         Gain

 Antenna
                                                   Antenna
parameters                                            key
                                                  parameters

                                     Efficiency                        Bandwidth

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ANTENNA FOR 5G MM-WAVE SMARTPHONES

Considerations
for antenna for
 5G mm-Wave
 smartphones

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SUBSTRATE MATERIALS FOR MM WAVE APPLICATION
      Key parameters for 5g substrate
                                                                  Stability of Electrical
                                                                      and Physical
                                                                   Properties against
                                                                   Temperature and
                                                                   Humidity Variation

                                   Manufacturing
                                                                                                              Design Rule
                                   Supply Chain
                                                                                                               Capability
                                    Readiness

   Various
 parameters
have to keep
 in mind to
    select
substrate for
     5G                 Panel Size, Process
 application             Throughput and
                               Cost
                                                                                                                   Multilayer Capability

                                              Electrical Properties
                                                                                        Process tolerances
                                                 vs. Frequency

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RF FRONT-END ECOSYSTEM COMPLEXITY

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CELLPHONE AIR INTERFACE STANDARD DEVELOPMENT

Despite a slow
down in mobile
market growth,
RF Front-End
market is still
expected to
increase
because of
complexity
encountered in
LTE-A Pro and
5G sub 6.

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ASSEMBLY / PACKAGING MARKET FOR RF SIP FOR MOBILE

                   Included in                        Component available as
                                                                                    Cap wafer                              RDL/
                  market forecast                     SMT component in SiP                                 TSV                             Bumping               Dicing
                                                      assembly / Flip-chip           bonding                               UBM

                                      Wafer level         BAW filters                        SAW filters                        Filters / Switches / IPDs

 Assembly of                         Prior to SiP
   various RF                        assembly
components in       Assembly of RF
  SiP basically      components
 consists of 2
process: Wafer
level assembly                                        Component available as
   & SiP level                                                                          Wafer                    Wafer
                                                      bare die (in wafer form) in                                                     Inspection
    assembly                                          SiP assembly / wire-bond
                                                                                       grinding                  dicing
                                                      process

                   Included in         SiP level
                                                    SMT           Wire bond             Molding                 Shielding             BGA/LGA                  Test
                  market forecast

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TOTAL ASSEMBLY MARKET FORECAST FOR RF SIP IN MOBILE

Total assembly
  / packaging
market for the
    RF SiP in
  mobile will
 grow at 11%
   CAGR to
  reach from
$XX B in 2017
 to $XX B by
     2023

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RF FEM MARKET FORECAST
      By cellular & connectivity air standards (in $M)

    Limited
 adoption of
5G mmWave,
 in terms of
   revenue.
 RF FEM SiP
 supporting
 5G mmW
and 5G sub6
will grow at
  CAGR of
111% & 51%
respectively

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RF FEM SIP PACKAGING MARKET FORECAST
      By smartphone type (in $M)

In 2023, high-end
   smartphone
 contributes XX
  % RF FEM SiP
assembly market,
followed by low-
 end smartphone
   (XX %) and
      luxury
smartphone (XX
        %)

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INTERCONNECT TREND IN RF SIP FOR MOBILE
    %age in terms of interconnects units counts

XXXXX

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RELATED REPORTS

                  Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019   37
Source: Wikimedia Commons

 Yole Développement
     From Technologies to Market

                                   © 2019
YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE

Life Sciences                                                    Semiconductor                              Semiconductor
& Healthcare                                                       & Software                                  & Software
o   Microfluidics                                                                             o   Package,Assembly & Substrates
o   BioMEMS & Medical Microsystems                                                            o   Semiconductor Manufacturing
o   Inkjet and accurate dispensing                                                            o   Memory
o   Solid-State Medical Imaging & BioPhotonics                                                o   Software & Computing
o   BioTechnologies
                                                    Life                         Photonics,
                                                 Sciences &                       Sensing
                                                 Healthcare
                                                                                 & Display

Power                                                                                                           Photonics,
& Wireless                                                                                               Sensing & Display
o    RF Devices & Technologies                                                                o   Solid-State Lighting
o    Compound Semiconductors & Emerging Materials             Power & Wireless                o   Display
o    Power Electronics                                                                        o   MEMS, Sensors & Actuators
o    Batteries & Energy Management                                                            o   Imaging
                                                                                              o   Photonics & Optoelectronics

                                                                                                   ©2019 | www.yole.fr | About Yole Développement   2
4 BUSINESS MODELS

o   Consulting and Analysis
      •   Market data & research,
          marketing analysis
      •   Technology analysis
                                               o   Syndicated reports
      •   Strategy consulting
                                                     •   Market & technology reports
      •   Reverse engineering & costing
                                                     •   Patent investigation and patent
      •   Patent analysis
                                                         infringement risk analysis        o   Monitors
      •   Design and characterization                                                            •   Monthly and/or Quarterly
                                                     •   Teardowns & reverse costing
          of innovative optical systems                                                              update
                                                         analysis
      •   Financial     services      (due                                                       •   Excel database covering supply,
                                                     •   Cost simulation tool
          diligence, M&A with our                                                                    demand, and technology
                                                             www.i-Micronews.com/reports                                               o      Media
          partner)                                                                               •   Price, market, demand and
                                 www.yole.fr                                                         production forecasts                        •    i-Micronews.com website
                                                                                                 •   Supplier market shares                      •    @Micronews e-newsletter
                                                                                                                                                 •    Communication & webcast
                                                                                                                                                      services
                                                                                                         www.i-Micronews.com/reports
                                                                                                                                                 •    Events: TechDays, forums,…
                                                                                                                                                                  www.i-Micronews.com

                                                                                                                                           ©2019 | www.yole.fr | About Yole Développement   3
6 COMPANIES TO SERVE YOUR BUSINESS
                                                        Yole Group of Companies

 Market, technology and strategy      Manufacturing costs analysis             IP analysis
            consulting             Teardown and reverse engineering        Patent assessment
                                         Cost simulation tools
            www.yole.fr                                                      www.knowmade.fr
                                            www.systemplus.fr

                                    Design and characterization of
                                                                      Innovation and business maker           Due diligence
                                     innovative optical systems
                                                                             www.bmorpho.com                      www.yole.fr
                                              www.piseo.fr

                                                                                                      ©2019 | www.yole.fr | About Yole Développement   4
OUR GLOBAL ACTIVITY
                               Europe office
                                  Frankfurt

Paris

Nantes
                                                                  Yole Korea       Yole Inc.
                                   HQ in Lyon
                                                                        Seoul       Phoenix
Vénissieux
                                                                  Yole Japan
                                                                       Tokyo
Nice                                                                              Palo Alto

             40%
                                                                   Greater
                                                                   China office
                                                                      Hsinchu

             of our business
                                                                                               30%
                                                30%
                                                                                               of our business

                                                of our business

                                                                                               ©2019 | www.yole.fr | About Yole Développement   5
ANALYSIS SERVICES - CONTENT COMPARISON
              High

                                     Technology
                                     and Market
                                       Report
           Breadth of the analysis
                                     Leadership
                                      Meeting

                                                   Q&A        Meet the    Custom
                                                  Service     Analyst     Analysis

                     Low

                                                  Depth of the analysis                    High
                                                                                     ©2019 | www.yole.fr | About Yole Développement   6
SERVING THE ENTIRE SUPPLY CHAIN

               Integrators, end-
               users and software
               developers

Our analysts   Device manufacturers
   provide
   market
   analysis,
 technology
 evaluation,   Suppliers: material, equipment,
and business
 plans along
               OSAT, foundries…
  the entire
supply chain

               Financial investors, R&D centers

                                                  ©2019 | www.yole.fr | About Yole Développement   7
SERVING MULTIPLE INDUSTRIAL FIELDS

                                  Industrial       Medical
   We work                       and defense       systems
    across
   multiples
industries to
 understand                    Energy
the impact of                management                 Automotive
 More-than-
    Moore
technologies
 from device                                     Mobile phone
  to system                     Transportation        and
                                   makers         consumer
                                                  electronics
                                                                From A to Z…

                                                                      ©2019 | www.yole.fr | About Yole Développement   8
REPORTS COLLECTION
   o Over the course of more than 20 years, Yole Développement has grown to become a group of companies. Together with System Plus Consulting and KnowMade, we now
     provide marketing, technology and strategy consulting, media and corporate finance services, reverse costing, structure, process and cost analysis services and well as
     intellectual property (IP) and patent analysis. Together, our group of companies is collaborating ever closer and therefore will offer, in 2019, a collection of over 125 reports
     and 10 new monitors. Combining respective expertise and methodologies from the three companies, they cover:

          •    MEMS & Sensors                                •    Power electronics
          •    RF devices & technologies                     •    Compound semiconductors
          •    Medical technologies                          •    Solid state lighting
          •    Semiconductor Manufacturing                   •    Displays
          •    Advanced packaging                            •    Software
          •    Memory                                        •    Imaging
          •    Batteries and energy management               •    Photonics

   o If you are looking for:
          • An analysis of your product market and technology
          • A review of how your competitors are evolving
          • An understanding of your manufacturing and production costs
          • An understanding of your industry’s technology roadmap and related IPs
          • A clear view supply chain evolution
          Our reports and monitors are for you!                                                                                                                      www.i-Micronews.com

   o Our team of over 70 analysts, including PhD and MBA qualified industry veterans from Yole Développement, System Plus Consulting and KnowMade, collect information,
     identify trends, challenges, emerging markets, and competitive environments. They turn that information into results and give you a complete picture of your industry’s
     landscape. In the past 20 years, we have worked on more than 2,000 projects, interacting with technology professionals and high-level opinion makers from the main
     players of their industries and realized more than 5,000 interviews per year.
   WHAT TO EXPECT IN 2019?
   In 2019 we will extend our offering with a new ‘monitor’ product which provides more updates on your industry during the year. The Yole Group of Companies is also building
   on and expanding its investigations of the memory industry. Moreover, in parallel, the Yole Group reaffirms its commitment to a new collection of reports mixing software and
   hardware and is increasing its involvement in displays, radio-frequency (RF) technology, advanced substrates, batteries and compound semiconductors. Discover our 2019
   program right now, and ensure you get a true vision of the industry. Stay tuned!

                                                                                                                                              ©2019 | www.yole.fr | About Yole Développement   9
OUR 2019 REPORTS COLLECTION (1/4)
  18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

  Market – Technology – Strategy – by Yole Développement
  Yole Développement (Yole) offers market reports including quantitative market forecasts,
  technology trends, company strategy evaluation and indepth application analyses. Yole will   The markets targeted are :
  publish more than 55 reports in 2019, with our partner PISEO contributing to some of
  the lighting reports.                                                                        • Mobile & Consumer
  Reverse Costing® – Structure, Process and Cost Analysis – by                                 • Automotive & Transportation
  System Plus Consulting
  The Reverse Costing® report developed by System Plus Consulting provides full                • Medical
  teardowns, including detailed photos, precise measurements, material analyses,
  manufacturing process flows, supply chain evaluations, manufacturing cost analyses and       • Industrial
  selling price estimations. The reports listed below are comparisons of several analyzed
  components from System Plus Consulting. More reports are however available, and over
  60 reports will be released in 2019.The complete list is available at www.systemplus.fr.
                                                                                               • Telecom & Infrastructure

  Patent Reports – by KnowMade                                                                 • Defense & Aerospace
  More than describing the status of the IP situation, these analyses provide a missing link
  between patented technologies and market, technological and business trends. They offer
                                                                                               • Linked reports are dealing with the same topic to provide
  an understanding of the competitive landscape and technology developments from a
  patent perspective. They include key insights into key IP players, key patents and future
                                                                                               • a more detailed analysis.
  technology trends. For 2019 KnowMade will release over 15 reports.

                                                                                                                             ©2019 | www.yole.fr | About Yole Développement   10
OUR 2019 REPORTS COLLECTION (1/5)
      18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
 MEMS & SENSORS                                                                             RF DEVICES AND TECHNOLOGIES
 o MARKET AND TECHNOLOGY REPORT                                                             o MARKET AND TECHNOLOGY REPORT
      • Status of the MEMS Industry 2019 - Update                                                • RF GaN Market: Applications, Players, Technology,
      • Status of the Audio Industry 2019 - New                                                    and Substrates 2019 - Update
      • Uncooled Infrared Imagers and Detectors 2019 – Update                                    • 5G’s Impact on RF Front-End Module and Connectivity
      • Consumer Biometrics:Technologies and Market Trends 2018                                    for Cell Phones 2019 – Update
      • MEMS Pressure Sensor Market and Technologies 2018                                        • 5G Impact on Wireless Infrastructure 2019
      • Gas & Particle Sensors 2018                                                              • Radar and V2X Market & Technology for Automotive 2019 - Update
 o STRUCTURE, PROCESS & COST REPORT                                                              • Advanced RF Antenna Market & Technology 2019 - New
      • MEMS & Sensors Comparison 2019                                                           • RF Standards and Technologies for Connected Objects 2018
      • MEMS Pressure Sensor Comparison 2018                                                o STRUCTURE, PROCESS & COST REPORT
      • Particle Sensors Comparison 2019                                                         • RF Front-End Module Comparison 2019 - Update
      • Miniaturized Gas Sensors Comparison 2018                                                 • Automotive Radar RF Chipset Comparison 2018
 o PATENT REPORT                                                                            o PATENT REPORT
      • MEMS Foundry Business Portfolio 2019 - New                                               • Antenna for 5G Wireless Communications 2019 - New
      • Miniaturized Gas Sensors 2019 - New                                                      • RF Front End Modules for Cellphones 2018
                                                                                                 • RF Filter for 5G Wireless Communications: Materials and Technologies 2019
 PHOTONIC AND OPTOELECTRONICS                                                                    • RF GaN : Materials, Devices and Modules 2018
 o MARKET AND TECHNOLOGY REPORT
      • Photonic Integrated Circuit 2019 - New
      • LiDARs for Automotive and Industrial Applications 2019 - Update
      • Silicon Photonics 2018
 o PATENT REPORT
      • Silicon Photonics for Data Centers: Optical Transceiver 2019 - New
      • LiDAR for Automotive 2018

                                                                             Update : 2018 version still available                         ©2019 | www.yole.fr | About Yole Développement   11
OUR 2019 REPORTS COLLECTION (2/5)
      18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

 IMAGING                                                                                       MICROFLUIDICS
 o MARKET AND TECHNOLOGY REPORT                                                                o MARKET AND TECHNOLOGY REPORT
      • Status of the CIS Industry 2019: Technology                                                 • Status of the Microfluidics Industry 2019 - Update
        and Foundry Business - Update                                                               • Next Generation Sequencing & DNA Synthesis - Technology,
      • Imaging for Automotive 2019 - Update                                                          Consumables Manufacturing and Market Trends 2019 - New
      • Neuromorphic Technologies for Sensing 2019 - Update                                         • Organ-on-a-Chip Market & Technology Landscape 2019 - Update
      • Status of the CCM and WLO Industry 2019 - Update                                            • Point-of-Need Testing Application of Microfluidic Technologies 2018
      • Machine Vision for Industry and Automation 2018                                             • Liquid Biopsy: from Isolation to Downstream Applications 2018
      • Sensors for Robotic Vehicles 2018                                                           • Chinese Microfluidics Industry 2018
 o STRUCTURE, PROCESS & COST REPORT                                                            o PATENT REPORT
      • Compact Camera Modules Comparison 2019                                                      • Microfluidic Manufacturing Technologies 2019 – New
      • CMOS Image Sensors Comparison 2019
 o PATENT REPORT                                                                               INKJET AND ACCURATE DISPENSING
      • Facial & Gesture Recognition Technlogies in Mobile Devices 2019 - New                  o MARKET AND TECHNOLOGY REPORT
      • Apple iPhone X Proximity Sensor & Flood Illuminator 2018                                    • Inkjet Printheads - Dispensing Technologies
                                                                                                      & Market Landscape 2019 - Update
 MEDICAL IMAGING AND BIOPHOTONICS                                                                   • Emerging Printing Technologies
 o MARKET AND TECHNOLOGY REPORT                                                                       for Microsystem Manufacturing 2019 - New
      • X-Ray Detectors for Medical, Industrial                                                     • Piezoelectric Materials from Bulk to Thin Film 2019 - New
      • and Security Applications 2019- New                                                         • Inkjet Functional and Additive Manufacturing for Electronics 2018
      • Microscopy Life Science Cameras: Market and Technology Analysis 2019                   o STRUCTURE, PROCESS & COST REPORT
      • Ultrasound technologies for Medical, Industrial                                             • Piezoelectric Materials from Bulk to Thin Film Comparison 2019
        and Consumer Applications 2018
 o PATENT REPORT
      • Optical Coherence Tomography Medical Imaging 2018

                                                                                Update : 2018 version still available                          ©2019 | www.yole.fr | About Yole Développement   12
OUR 2019 REPORTS COLLECTION (3/5)
      18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
 BIOTECHNOLOGIES                                                                        MEMORY
 o MARKET AND TECHNOLOGY REPORT                                                         o MARKET AND TECHNOLOGY REPORT
      • CRISPR-Cas9 Technology: From Lab to Industries 2018                                  • Status of the Memory Business 2019 - New
 o PATENT REPORT                                                                             • MRAM Technology and Business 2019 - New
      • Personalized Medicine 2019 – New                                                     • Emerging Non Volatile Memory 2018
                                                                                        o STRUCTURE, PROCESS & COST REPORT
 BIOMEMS & MEDICAL MICROSYSTEMS                                                              • Memory Comparison 2019
 o MARKET AND TECHNOLOGY REPORT                                                         o PATENT REPORT
      • Medical Wearables: Market & Technology Analysis 2019 - New                           • Magnetoresistive Random-Access Memory (MRAM) 2019 - New
      • Neurotechnologies and Brain Computer Interface 2018                                  • 3D Non-Volatile Memory 2018
      • BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences
        & Healthcare 2018                                                               ADVANCED PACKAGING
 o PATENT REPORT
                                                                                        o MARKET AND TECHNOLOGY REPORT
      • 3D Cell Printing 2019 - New                                                          • Fan Out Packaging Technologies and Market Trends 2019 - Update
      • Circulating Tumor Cells Isolation 2019 - New                                         • 3D TSV Integration and Monolithic Business Update 2019 - Update
      • Nanopore Sequencing 2019 - New                                                       • Advanced RF SiP for Cellphones 2019 - Update
                                                                                             • Status of Advanced Packaging 2019 - Update
 SOFTWARE AND COMPUTING                                                                      • Status of Advanced Substrates 2019 - Update
 o MARKET AND TECHNOLOGY REPORT                                                              • Panel Level Packaging Trends 2019 - Update
     • Artificial Intelligence Computing For Automotive 2019 - New
                                                                                             • System in Package (SiP) Technology and Market Trends 2019 - New
     • Hardware and Software for Artificial Intelligence (AI)
                                                                                             • Trends in Automotive Packaging 2018
       in Consumer Applications 2019 - Update
                                                                                             • Thin-Film Integrated Passive Devices 2018
     • From Image Processing to Deep Learning 2019 - Update
                                                                                        o STRUCTURE, PROCESS & COST REPORT
     • xPU (Processing Units) for Cryptocurrency, Blockchain, HPC
       and Gaming 2019 – New                                                                 • Advanced RF SiP for Cellphones Comparison 2019

                                                                         Update : 2018 version still available                       ©2019 | www.yole.fr | About Yole Développement   13
OUR 2019 REPORTS COLLECTION (4/5)
      18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
 SEMICONDUCTOR MANUFACTURING                                                         SOLID STATE LIGHTING
 o MARKET AND TECHNOLOGY REPORT                                                      o MARKET AND TECHNOLOGY REPORT
      • Nano Imprint Lithography 2019 - New                                               • Status of the Solid State Light Source Industry 2019 - New
      • Equipment and Materials for Fan Out Packaging 2019 - Update                       • Edge Emitting Lasers (EELS) 2019 - New
      • Equipment for More than Moore: Thin Film Deposition                               • Light Shaping Technologies 2019 - New
        & Etching 2019 - New                                                              • Automotive Advanced Front Lighting Systems 2019 - New
      • Wafer Starts for More Than Moore Applications 2018                                • VCSELs - Technology, Industry and Market Trends 2019 - Update
      • Polymeric Materials at Wafer-Level                                                • IR LEDs and Laser Diodes – Technology, Applications,
        for Advanced Packaging 2018                                                         and Industry Trends 2018
      • Bonding and Lithography Equipment Market                                          • Automotive Lighting 2018: Technology, Industry and Market Trends
        for More than Moore Devices 2018                                                  • UV LEDs - Technology, Manufacturing and Application Trends 2018
 o STRUCTURE, PROCESS & COST REPORT                                                       • LiFi: Technology, Industry and Market Trends 2018
      • Wafer Bonding Comparison 2018                                                o STRUCTURE, PROCESS & COST REPORT
 o PATENT REPORT                                                                          • VCSEL Comparison 2019
      • Hybrid Bonding for 3D Stack 2019 – New                                       o PATENT REPORT
                                                                                          • VCSELs 2018

                                                                                     DISPLAY
                                                                                     o MARKET AND TECHNOLOGY REPORT
                                                                                          • Next Generation 3D Display 2019 - New
                                                                                          • Next Generation Human Machine Interaction (HMI)in Displays 2019 - New
                                                                                          • Micro-and Mini-LED Displays 2019 - Update
                                                                                          • QD and Wide Color gamut (WCG)
                                                                                            Display Technologies 2019 - Update
                                                                                          • Displays & Optical Vision Systems for VR,AR & MR 2018
                                                                                     o PATENT REPORT
                                                                                          • MicroLED Displays : Intellectual Property Landscape 2018
                                                                      Update : 2018 version still available                         ©2019 | www.yole.fr | About Yole Développement   14
OUR 2019 REPORTS COLLECTION (5/5)
      18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
 POWER ELECTRONICS                                                                    BATTERY & ENERGY MANAGEMENT
 o MARKET AND TECHNOLOGY REPORT                                                       o MARKET AND TECHNOLOGY REPORT
      • Power SiC: Materials, Devices and Applications 2019 - Update                       • Status of the Rechargeable Li-ion Battery Industry 2019 - New
      • Power Electronics for EV/HEV and e-mobility:                                       • Li-ion Battery Packs for Automotive and Stationary Storage
        Market, Innovations and Trends 2019 - Update                                         Applications 2019 - Update
      • Status of the Power Electronics Industry 2019 - Update                        o PATENT REPORT
      • Discrete Power Packaging : Material Market                                         • Battery Energy Density Increase: Materials
        and Technology Trends 2019 - New                                                     and Emerging Technologies 2019 - New
      • Status of the Power ICs Industry 2019 - Update                                     • Solid-State Batteries 2019 - New
      • Status of the Passive Components for the Power Electronics                         • Status of the Battery Patents 2018
        Industry 2019 - Update
      • Status of the Inverter Industry 2019 - Update                                 COMPOUND SEMI.
      • Status of the Power Module Packaging Industry 2019 - Update                   o MARKET AND TECHNOLOGY REPORT
      • Wireless Charging Market Expectations                                              • Emerging Compound Semiconductor
        and Technology Trends 2018                                                           Market & Technology Trends 2019 - New
      • Power GaN 2018: Epitaxy, Devices, Applications                                     • Status of the Compound Semiconductor Industry 2019 - New
        and Technology Trends                                                              • InP Materials, Devices and Applications 2019 - New
 o STRUCTURE, PROCESS & COST REPORT                                                        • GaAs Wafer and Epiwafer Market: RF, Photonics,
      • Automotive Power Module Packaging Comparison 2018                                    LED and PV Applications 2018
      • GaN-on-Silicon Transistor Comparison 2019                                     o PATENT REPORT
      • SiC Transistor Comparison 2019                                                     • GaN-on-Silicon Substrate: Materials, Devices
 o PATENT REPORT                                                                             and Applications 2019 - Update
      • Power SiC : Materials, Devices and Modules 2019 - New
      • Power GaN : Materials, Devices and Modules 2019 – Update

                                                                       Update : 2018 version still available                         ©2019 | www.yole.fr | About Yole Développement   15
OUR 2019 MONITORS COLLECTION (1/2)
   Get the most updated overview of your market to monitor your strategy
  Yole Développement, System Plus Consulting and KnowMade, all part of the Yole Group of Companies, are launching a collection of 10 monitors in 2019. The monitors aim to
  provide updated market, technology and patent data as well dedicated quarterly analyses of the evolution in your industry over the previous 12 months. Furthermore, you can
  benefit from direct access to the analyst for an on-demand Q&A and discussion session regarding trend analyses, forecasts and breaking news.
  Topics covered will be compact camera modules (CCMs), advanced packaging, compound semiconductors, microfluidics, batteries, RF and memory.

  MARKET MONITOR by Yole Développement                                                          o COMPOUND SEMI. – NEW
                                                                                                  This monitor will describe how the compound semiconductor industry is evolving. It
  A FULL PACKAGE:                                                                                 will offer a close look at GaAs, InP, SiC, GaN and other compounds of interest
  The monitors will provide the evolution of the market in units, wafer area and revenues.        providing wafer volumes, revenues, application breakdowns and momentum.
  They will also offer insights into what is driving the business and a close look at what is     Frequency: Quarterly, starting from Q3 2019
  happening will also be covered in it.
                                                                                                o CAMERA MODULE – NEW
  The following deliverables will be included in the monitors:                                    This monitor will provide the evolution of the imaging industry, with a close look at
          • An Excel database with all historical and forecast data                               image sensor, camera module, lens and VCM. Volumes, revenues and momentum of
                                                                                                  companies like Sony, Samsung, Omnivision and OnSemi will thus be analysed.
          • A PDF slide deck with graphs and comments/analyses covering the expected              Frequency: Quarterly, starting from Q3 2019
            evolutions
                                                                                                o MEMORY – UPDATE
   o ADVANCED PACKAGING – NEW                                                                     For the memory industry you can have access to a quaterly monitor, as well as an
     This monitor will provide the evolution of the advanced packaging platforms. It will         additional service, a monthly pricing. Both services can be bought seprately:
     cover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP),
                                                                                                     • DRAM Service: Including a quarterly monitor and monthly pricing.
     Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5D
     and 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q3            • NAND Service: Including a quarterly monitor and monthly pricing.
     2019

  REVERSE TECHNOLOGY MONITOR by System Plus Consulting
    o SMARTPHONES – NEW
     To stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone Reverse
     Technology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at the
     beginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.

                                                                                                                                             ©2019 | www.yole.fr | About Yole Développement   16
OUR 2019 MONITORS COLLECTION (2/2)
   Get the most updated overview of your market to monitor your strategy
 PATENT MONITOR by KnowMade                                                                   o Li-ion Batteries
                                                                                                Anodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made of
 A FULL PACKAGE:                                                                                Lithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium Nickel
 Starting at the beginning of the year, the KnowMade monitors include the following             Cobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), Lithium
 deliverables:                                                                                  Metal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytes
                                                                                                including liquid, polymer/gel, and solid inorganics; ceramic and other separators;
 •   An Excel file including the monthly IP database of:                                        battery cells including thin film/microbattery, flexible, cylindrical and prismatic; and
        • New patent applications                                                               battery packs and systems.
        • Newly granted patents                                                               o Post Li-ion Batteries
        • Expired or abandoned patents                                                          Battery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium-
        • Transfer of IP rights through re-assignment and licensing                             air, and magnesium-ion, and their supply chains, including electrodes, electrolytes,
        • Patent litigation and opposition                                                      battery cells and battery packs/systems.

 •   Quarterly report including a PDF slide deck with the key facts & figures of the          o Solid-State Batteries
     quarter: IP trends over the three last months, with a close look to key IP players and     Supply chain including electrodes, battery cells, battery packs/systems and
     key patented technologies.                                                                 electrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials,
                                                                                                including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs,
 o GaN for Power & RF Electronics                                                               sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets.
   Wafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductor
   devices such as transistors, and diodes, devices and applications including converters,    o RF Acoustic Wave Filters
   rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits      Including Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, Bulk
   (MMICs), packaging, modules and systems.                                                     Acoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly-
                                                                                                Mounted Resonator (BAW-SMR), and Packaging.
 o GaN for Optoelectronics & Photonics
   Wafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices such          o RF Power Amplifiers
   as LEDs and lasers; and applications including lighting, display, visible communication,     Including Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wave
   photonics, packaging, modules and systems.                                                   technology.
                                                                                              o RF Front-End Modules
                                                                                              o Microfluidics
                                                                                                From components to chips and systems, including all applications.

                                                                                                                                               ©2019 | www.yole.fr | About Yole Développement   17
MICRONEWS MEDIA

  o   About Micronews Media                                     ONLINE                              ONSITE                               INPERSON
        To meet the growing demand for market,
                                                           @Micronews e-newsletter
        technological and business information,
                                                               i-Micronews.com
        Micronews Media integrates several tools able                                                   Events                                 Webcasts
                                                             i-Micronewsjp.com
        to reach each individual contact within its            FreeFullPDF.com
        network.We will ensure you benefit from this.
                                                                                           Brand visibility, networking
                                                                                                                                      Targeted audience
                                                                                                    opportunities
                                                                                                                                  involvement equals clear,
                                                        Unique, cost-effective ways          Today's technology makes it
                                                                                                                                 concise perception of your
                                                         to reach global audiences.          easy for us to communicate
                                                                                                                                     company’s message.
                                                            Online display advertising           regularly, quickly, and
                                                                                                                                      Webcasts are a smart,
                                                         campaigns are great strategies       inexpensively – but when
                                                                                                                                        innovative way of
                                                               for improving your            understanding each other is
                                                                                                                                   communicating to a wider
                                                          product/brand visibility. They    critical, there is no substitute
                                                                                                                                  targeted audience. Webcasts
                                                           are also an efficient way to     for meeting in-person. Events
                                                                                                                                   create very useful, dynamic
                                                         adapt with the demands of the      are the best way to exchange
                                                                                                                                      reference material for
                                                        times and to evolve an effective     ideas with your customers,
                                                                                                                                     attendees and also for
                                                          marketing plan and strategy.        partners, prospects while
                                                                                                                                    absentees, thanks to the
                                                                                           increasing your brand/product
                                                                                                                                      recording technology.
                                                                                                         visibility.
                                                        Benefit from the i-Micronews.com
                                                        traffic generated by the 11,200+     Several key events planned for      Gain new leads for your business
                                                           monthly unique visitors, the        2018 on different topics to           from an average of 340
                                                           10,500+ weekly readers of       attract 120 attendees on average           registrants per webcast
                                                            @Micronews e-newsletter

                                                                                 Contact: Camille Veyrier (veyrier@yole.fr), Marketing & Communication Director

                                                                                                                        ©2019 | www.yole.fr | About Yole Développement   18
CONTACT INFORMATION
   o CONSULTING AND SPECIFIC ANALYSIS, REPORT                                o FINANCIAL SERVICES (in partnership with Woodside
     BUSINESS                                                                  Capital Partners)
       •   North America:                                                        •   Jean-Christophe Eloy, CEO & President
                                                                                     Email: eloy@yole.fr - +33 4 72 83 01 80
              •   Steve LaFerriere, Senior Sales Director for Western US &
                  Canada                                                         •   Ivan Donaldson,VP of Financial Market Development
                  Email: laferriere@yole.fr – + 1 310 600-8267                       Email: ivan.donaldson@yole.fr - +1 208 850 3914
              •   Troy Blanchette, Senior Sales Director for Eastern US &    o CUSTOM PROJECT SERVICES
                  Canada
                                                                                 •   Jérome Azémar, Technical Project Development Director
                  Email: troy.blanchette@yole.fr – +1 704 859-0453
                                                                                     Email: azemar@yole.fr - +33 6 27 68 69 33
       •   Japan & Rest of Asia:
              •   Takashi Onozawa, General Manager, Asia Business            o GENERAL
                  Development (India & ROA)
                  Email: onozawa@yole.fr - +81 34405-9204                        •   Camille Veyrier, Director, Marketing & Communication
                                                                                     Email: veyrier@yole.fr - +33 472 83 01 01
              •   Miho Othake, Account Manager (Japan)
                                                                                 •   Sandrine Leroy, Director, Public Relations
                  Email: ohtake@yole.fr - +81 3 4405 9204
                                                                                     Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55
              •   Itsuyo Oshiba, Account Manager (Korea & Singapore)
                                                                                 •   Email: info@yole.fr - +33 4 72 83 01 80
                  Email: oshiba@yole.fr - +81-80-3577-3042
       •   Greater China: Mavis Wang, Director of Greater China Business
           Development
           Email: wang@yole.fr - +886 979 336 809
       •   Europe: Lizzie Levenez, EMEA Business Development Manager                                              Follow us on
           Email: levenez@yole.fr - +49 15 123 544 182
       •   RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
           Email eloy@yole.fr - +33 4 72 83 01 80
                                                                                                                      ©2019 | www.yole.fr | About Yole Développement   19
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