Status of the CMOS image sensor industry - 2016 report sample - From Technologies to Market - Yole Développement

Status of the CMOS image sensor industry - 2016 report sample - From Technologies to Market - Yole Développement
                                                   to Market

  Status of the
CMOS image sensor
  2016 report sample

                       Authors: P. Cambou JL. Jaffard   © 2016
Status of the CMOS image sensor industry - 2016 report sample - From Technologies to Market - Yole Développement
Executive Summary
Status of the CMOS image sensor industry - 2016 report sample - From Technologies to Market - Yole Développement

   Provide a clear understanding of applications and related technologies.

   Ecosystem identification and analysis:
           •   Determination of the applications range
           •   Technical market segmentation
           •   Economic requirements by segment
           •   Key players per market and analysis                                                                    Market
           •   Market size and market forecast in $M and Munits

   Analysis and description of market and technologies involved:
           •   Major actors on a global basis                                                                         Techno
           •   Detailed applications per market segment
           •   Technology identification for different products and processes
           •   Competing technologies
           •   Main technical challenges

                                                                                ©2016 | | Status of the CMOS image sensor industry | Sample   3
   Yole’s market forecast model is based on the following elementary structured blocks:


                                                                      ©2016 | | Status of the CMOS image sensor industry | Sample   4
    From wafer to first packaged sensor

Analysis at the
     level                                                                                      Courtesy of Xiaomi                         Courtesy of Apple

                  Courtesy of Sony   Courtesy of Omnivision      Courtesy of On Semi

                                                                                                  Courtesy of Valeo                     Courtesy of Tesla

                     Wafer            Die                     Sensors                  Modules                                    Systems

                                                                                       ©2016 | | Status of the CMOS image sensor industry | Sample   5
   o GOSSARY                                             2
   o TABLE OF CONTENT                                    3    3- ECOSYSTEM                                                             52
   o REPORT OBJECTIVES                                   5         • Recent consolidation
                                                                   • M&A activity
   o METHODOLOGY                                         7
                                                                   • Ecosystem mapping
   o COMPANY CITED                                      13         • Geographic mapping
   o EXECUTIVE SUMMARY                                  14
   1 - INTRODUCTION                                     30    4- PLAYER & RANKINGS                                    61
         • Historical perspective                                   • Revenue rankings
         • Market segmentation                                      • Volume rankings
         • 2015 CIS market landscape by application                 • Revenue breakdown per player
         • 2015 CIS market landscape by player                      • Revenue market share in mobile
                                                                    • Revenue market share in digital photography
   2- MARKET FORECAST                                    39         • Revenue market share in tablets
        • Revenue breakdown                                         • Revenue market share in laptop PC
        • 2010 - 2021 CIS volume shipment (in Munits)               • Revenue market share in automotive
        • 2009 - 2020 CIS revenue forecast (in $M)                  • Revenue market share in security & surveillance
        • 2009 - 2020 Wafer production (in 12”wafer eq.)            • Revenue market share in medical X ray
        • BSI penetration forecast                                  • Revenue market share in machine vision
        • 200mm (8”) to 300mm (12”) transition forecast

                                                                                   ©2016 | | Status of the CMOS image sensor industry | Sample   6
   5 – MOBILE MARKET TREND                            78
        • Consumer tech device forecast                            • 2010 - 2021 Medical CIS market forecast
        • 2010 - 2021 Mobile market forecast                       • 2010 - 2021 Security & surveillance market forecast
        • Market drivers                                           • 2010 - 2021 Machine vision market forecast
        • Resolution mix
        • Dual camera trend                                   8- TECHNOLOGY TREND                                                   128
        • Number of camera per smartphone forecast                  • Image sensor specifications
                                                                    • BSI technologies
   6- CONSUMER MARKET TREND                             101         • Samsung S7 focus
        • 2010 - 2021 Consumer photography market forecast          • PDAF and LDAF approaches
        • 2010 - 2021 Action camera market forecast                 • Key advances
        • 2010 - 2021 VR & AR market forecast
        • 2010 - 2021 Wearable & smartwatch market forecast   9- CONCLUSIONS                                                        152
        • 2010 - 2021 Personal robotics market forecast

                                                              10- COMPANY PROFILE                                                   155
   7- OTHER MARKET TREND                             112
        • 2010 – 2021 Computing market forecast
        • 2010 – 2021 Automotive market forecast
        • Automotive market drivers

                                                                                  ©2016 | | Status of the CMOS image sensor industry | Sample   7

     Almalence, Ambarella, Apple, Agilent, Arm, Axis, Basler, Bosch, Brigates, BYD, Caeleste, Canon, Clairpixel, Cmosis, Cognex,
    Continental, Core Photonics, Crysview, CSEM, Dongbu HiTek, DXO, Dynamax, e2v, Espros, Evg, Excelitas, Fairchild Imaging,
   Flir, Forza Silicon, Fotonic, Foxconn, Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given Imaging, GoPro, Grace Valley, Hamamatsu,
          Hassellblad, Heliotis, Himax imaging, Honneywell, Hoya, HTC, Huawei, SK Hynix, Image Lab, Imec, Infineon, Invisage,
    Invensense, JVC Altasens, Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LFoundry, LG, Luxima, Lytro, Magna,
    Magneti Marelli, Mantis Vision, Medigus, Melexis, Mesa Imaging, Micron, Microsoft, Mobileye, Mobotix, Movidius, New Imaging
       Technologies, Nikon, NXP, Nvidia, Odos Imaging, Omnivision, Omron, ON Semi, Panasonic, Pelican Imaging, PerkinElmer,
   Philips, Pixart, PixelPlus, Pelco, PMD Technologies, Point Grey Research, Pyxalis, Raytrix, Rosnes, Samsung, Sanei Hytech, SETi,
       Sharp, SiliconFile, Sirona, Soft Kinetic, SK Hynix, SMIC, Siemens, Socionext, Softkinetics, Soitec, Sony, STMicroelectronics,
   SuperPix, Teledyne Dalsa, Teradyne, Tessera, Toshiba, Trixell, Tsmc, Toshiba Teli, TowerJazz, Tridicam, UMC, Valeo, Videantis,
                                        Viimagic, WLCSP, Xiaomi, X-Fab, XinTec, ZTE and more …

                                                                                        ©2016 | | Status of the CMOS image sensor industry | Sample   8
   Biography & contact

           Pierre Cambou
           From 1999, Pierre Cambou has been part of the imaging industry. Pierre took several positions at Thomson TCS which became
           Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 he founded a start-up called Vence Innovation (now Irlynx) in
           order to bring to market a disruptive infrared Man to Machine interaction technology. He has an Engineering degree from
           Université de Technologie de Compiègne and a Master of Science from Virginia Tech. More recently he graduated from Grenoble
           Ecole de Management’s MBA. He joined Yole Développement as Imaging Activity Leader in 2014.

           Jean-Luc Jaffard
           From 1966 Jean-Luc Jaffard paved the way of imaging activity at STMicroelectronics being at the forefront of the emergence and
           growth of this business. At STMicroelectronics Imaging Division he was successively appointed as Research Development and
           Innovation Director managing a large multidisciplinary and multicultural team and later on promoted to Deputy General
           Manager and Advanced Technology Director in charge of identifying and developing breakthrough Imaging Technologies and to
           transform them into innovative and profitable products. In 2010 he was appointed STMicroelectronics Intellectual Property
           Business Unit Director. In January 2014 he created the Technology and Innovation branch of Red Belt Conseil.

                                                                                         ©2016 | | Status of ©2015
                                                                                                                         the CMOS  image sensor
                                                                                                                               |       industry
                                                                                                                                             | Camera Module| Industry
                                                                                                                                                               Sample    9
Body sample

        © 2016
          Forecast over the years

                    We are raising our                                                            Historical revenue forecast (in $M)
                    forecast for CMOS                                                 2010 Fcst       2012 Fcst      2014 Fcst         2015 Fcst          2016 Fcst
                    Image Sensors

                    Mostly driven by                           20 000
                    smartphone camera                          18 000
                    crase and the renewal
 Our goal is to     of applications in the                     16 000

predict +/-10% in   consumer space, CIS                        14 000
  5 years time      market keeps its                           12 000
                    momentum while
                    passing the $10B            Revenue ($M)
                                                               10 000

                    landmark                                    8 000

                                                                6 000
                    The main reason for
                    this forecast increase is                   4 000

                    the early introduction of                   2 000

                    dual cameras in                                0
                    smartphones                                         2007   2008   2009    2010    2011   2012   2013   2014    2015    2016    2017      2018     2019   2020   2021

                                                                                                                           ©2016 | | Status of the CMOS image sensor industry | Sample   11

              • When Yole Développement presented its first report in 2010, the imaging industry was at a turning point as CMOS
                image sensor revenues were breaking the 50% threshold in respect to CCD.

              • Since last year, the industry has reached the $10B landmark and has become a key technology for major
                semiconductor companies such as Sony, Samsung,On Semi and now SK Hynix.

Imaging has
 become a     • Mobile remains the key application market for CIS, it is demanding in term of volume and performances therefore
   mature       ASP are kept at a good level for the top notch technology. The industry has reached $10.3B in 2015 and with 10.4%
  industry      CAGR forecasted for the 2015-2021 period, and will reach $18.8B in 2021.

              • Currently the most dynamic CIS markets are mobile and automotive. New features and performance are needed to
                serve those markets.

                                                                                      ©2016 | | Status of the CMOS image sensor industry | Sample   12
           2015 CIS market landscape by player

                     Leveraging its                                                                                           2015 - CIS market landscape
                                                                                                                                        by player
                     technology leadership                                        1 000
                     roothed in digital                                                                       High End
                     photography and                                                                          Players
                                                                                                                 High End
                     applied to mobile                                                         Teledyne Dalsa
                     markets and benefiting                                                     Hamamatsu
                                                                                   100                                                                                                                       $0.2B
                     from resolution                                                         Fairchild
   Sony is now       increases of mobile                                                             Canon
taking the lead in   secondary camera,

                                               Average Selling Price ($)
                                                                                          AMS Cmosis
     volume          Sony grabbed both                                                             e2v
                                                                                    10                        Sharp                                                 Samsung
                     revenue and volume                                                                          On Semi                                                                          Sony
                     leadership in 2015                                                                  Panasonic
                     SK Hynix confirmed it                                                            STMicro

                     was able to supply this                                         1

                     technologically                                                                     Pixelplus
                                                                                                                                                                              Galaxycore             Key Players
                                                                                                                                                                                                        Key Players
                     demanding market as                                                   Himax                                                                                  SK Hynix
                     it proved itslelf an                                                 Superpix
                                                                                                                 2nd Tier Players

                     alternative to                                                  0
                                                                                                                     2nd Tier Players

                     Galaxycore                                            -100              100                      300                500                700                 900                1 100               1 300
                                                                                                                                        Volume Shipment (M units)

                                                                                                                                                  ©2016 | | Status of the CMOS image sensor industry | Sample      13
    by market

                                                                                                      2015 CIS Revenue breakdown
                                                                                                               by market
                                                                                                      Security                                 Industrial/Space/Defence
                                                                                                       3,8%                                               2,6%
                                         2014     2015    CAGR2015-2021
              Mobile                   $5,908    $6,665   12%
              Consumer                 $1,611    $1,401    1%
CIS Revenue   Computing                $1,187    $1,052   -3%
breakdown     Automotive                $279      $537    23%
              Medical                     $29       $34   15%
                                        $140      $388    11%                                                          2014                                           2015
              nce                        $146     $271    10%                                                        $9,300M                                       $10,348M
              TOTAL                   $9,300    $10,348 10,4%              Consumer


                                                                                                                 ©2016 | | Status of the CMOS image sensor industry | Sample   14
    by player

                                                                                       2015 CIS Revenue market share
                                                                                                 by player
                                                                                             PixartPixelplus   Other             Yole Développement © May 2016
                                                  YoY                              STMicro    2%      1%        5%
                  Company     2014               Growth                              2%
                                       (in $M)                            Galaxycore
               1    Sony      $2,779   $3,645      31%              SK Hynix
    2015       2  Samsung     $1,825   $1,930       6%                 3%                                                                                   Sony
CIS Revenue    3 Omnivision   $1,378   $1,250      -9%       Panasonic
  ranking      4  On Semi      $670     $810       21%
               5   Canon       $482     $404      -16%    Toshiba
               6   Toshiba
               7 Panasonic
                                                   38%       Canon
                                                                                                               2014                                        2015
               8  SK Hynix     $200     $325       63%
               9 Galaxycore    $325     $275      -15%
                                                                                                          $9,300M                                       $10,348M
              10 STMicro       $260     $200      -23%        On Semi
              11    Pixart     $166     $170        2%
              12 Pixelplus     $114     $130       14%
                    Other      $498     $523        5%
                              $9,300   $10,348                           Omnivision                                                                   Samsung
                                                                           12%                                                                          19%

                                                                                                      ©2016 | | Status of the CMOS image sensor industry | Sample   15
         The mobile camera will become a multi sensor optronics interface

                             # of sensors

                                                                                                                                Embedded 3D
                                                                                      Embedded 3D                               The world becomes interactive

                                            Photography                               computational
                        3+ sensors                                                    New embedded 3D imaging
Technology is                               & video             Courtesy of Sony
almost ready                                Catching up with
                                            DSLR and video
 Players are                                cameras
                         3 sensors
working on
 the killer
                         2 sensors                                                                                                  • Dual Main & sub
                                                                            • Main & sub                                              camera
                                                                              camera                                                • 3D mapping
                                                                                                      • Dual main or
                                                                            • Range finder                                          • VR localization
                                                                                                        sub camera
                                                                            • LED Flash               • 3D sensing
                         1 sensor
                                                          • Main & sub                                • LED Illuminator
                                                          • LED Flash
                                                                                              Courtesy of Panono                                    Courtesy of Microsoft

                                             2012              2014                2016          2018                  2020                     2022
                                                                                                                ©2016 | | Status of ©2015
                                                                                                                                                the CMOS   image sensor
                                                                                                                                                      |       industry
                                                                                                                                                                    | Camera Module |Industry
                                                                                                                                                                                      Sample    16
     Dual camera rollout scenario

                  Dual camera
                  (%)                                                                    Breaking the 20%
                                                                                         threshold means Apple
                                                    Samsung should
                                                                                         or Samsung have
                                                                                         integrated at least one
                                iPhone 7 & 7S                                            dual camera
The question is                 with dual camera
no more if but
    when?                       Front or back ?


                                       P9 (Rear 13+13Mp)             Next HW updates
                                                                     for Apple
                                       G5 (Rear 16+8Mp)
                                                                                             Yole Développement © May 2016

                                2016        2017          2018       2019         2020                    2021

                                                                             ©2016 | | Status of the CMOS image sensor industry | Sample   17
         Light field imaging has many intermediaries

                       Processing x                                                                               Interactive
                       Complexity                                                                                   World
                                                                                          - Virtual                                                     Mix Reality
                                                                                           Reality 3D/Sphere            3D
                                                         - Enhanced videocall
                                                              - Morphing                             Video
                                                      Sphere Video
                         - Video/Movies                              3D         Video
                           - Videochat
box is open
                           2D      Video
                                                                                                        virtual world
                                                                                                       with interaction
                                                                                                                                  - Object Mapping
                                                                                                                                  -Smart environment
                                              Photosphere                                  - Photosphere                              interaction
                            2D      Photo                                                       3D

                                                                - Photosphere

                                          - Picture                                  3D                                        4D                       Evolution
                                   2D      - Selfie
                                                                                                      ©2016 | | Status of the CMOS image sensor industry | Sample   18
          Disruptive vision sensing technology is transforming all markets

                                                                      Systems                                     Industrial
                  Generation of images                 Automotive                                                 Military
                  are less and less                    & Transport                                                & Scientific
                  intended for human
                  usage                             Video
                                               Camcorders                       Low Volumes
Robotics and      Machines have great                                                                1B units
technologies      for autonomy &                                       >1M units
will transform    interaction                                                                                                          Mobile Phones
 the imaging                              Security &
                  CIS sensors are a key Surveillance                                                         >100M units
   landscape                                                                       >10M units
                  part of this technology
                                             DSLR & DSC                                   High Volumes

                                                                                            Consumer          Notebook & tablets

                                                                     Viewer & Gaming

                                                                                         ©2016 | | Status of the CMOS image sensor industry | Sample   19
      • NEPCON Japan                                 • ECTC
        January 13-15, 2016 – Tokyo, Japan             May 31-June 3, 2016 – Las Vegas, USA

      • CS International
        March 1-2, 2016 – Brussels, Belgium          • Sensors Expo & Conf
                                                       June 21-23, 2016 – San José, USA
      • Image Sensors
        March 15-17, 2016 – London, UK               • SEMICON West
                                                       July 12-15, 2016 – San Francisco, USA
      • International Conference and Exhibition on
        Device Packaging
        March 15-17, 2016 – Fountain Hills, USA      • LED Professional Symposium – LpS
                                                       September 20-23, 2016 – Bregenz, Austria
      • Lab-on-a-Chip European Congress
        March 15-16, 2016 – Madrid, Spain            • SEMICON Europa
                                                       October 25-27, 2016 – Grenoble, France
      • APEC
        March 20-24, 2016 – Long Beach, USA
                                                     • SEMICON Japan
      • PCIM Europe                                    December 14-16, 2016 – Tokyo, Japan
        May 10-12, 2016 – Nuremberg, Germany
                                                     *Non exhaustive list

                                                                     ©2016 | | Status of the CMOS image sensor industry | Sample   20
 Status of the CMOS image sensor industry 2016: new dynamics in market and technology

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and technology trends.                                                           at the stage in progress, and to take legal action for damages.
                                                                                                                                                       6.5 In the context of annual subscriptions, the person of contact
1. SCOPE                                                                                                                                                    shall decide who within the Buyer, shall be entitled to access
1.1 The Contracting Parties undertake to observe the following             4. LIABILITIES                                                                  on line the reports on In this respect, the
     general conditions when agreed by the Buyer and the Seller.            4.1 The Buyer or any other individual or legal person acting on                Seller will give the Buyer a maximum of 10 password, unless
     ANY ADDITIONAL, DIFFERENT, OR CONFLICTING                                   its behalf, being a business user buying the Products for its              the multiple sites organization of the Buyer requires more
     TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS                                 business activities, shall be solely responsible for choosing the          passwords. The Seller reserves the right to check from time
     ISSUED BY THE BUYER AT ANY TIME ARE HEREBY                                  Products and for the use and interpretations he makes of the               to time the correct use of this password.
     OBJECTED TO BY THE SELLER, SHALL BE WHOLLY                                  documents it purchases, of the results he obtains, and of the         6.6 In the case of a multisite, multi license, only the employee
     INAPPLICABLE TO ANY SALE MADE HEREUNDER AND                                 advice and acts it deduces thereof.                                        of the buyer can access the report or the employee of the
     SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.                         4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable        companies in which the buyer have 100% shares. As a matter
1.2 This agreement becomes valid and enforceable between the                    pecuniary loss, caused by the Products or arising from a                   of fact the investor of a company, the joint venture done with
     Contracting Parties after clear and non-equivocal consent                   material breach of this agreement                                          a third party etc..cannot access the report and should pay a
     by any duly authorized person representing the Buyer. For              4.3 In no event shall the Seller be liable for:                                 full license price.
     these purposes, the Buyer accepts these conditions of sales                 a) damages of any kind, including without limitation, incidental
     when signing the purchase order which mentions “I hereby                    or consequential damages (including, but not limited to,              7. TERMINATION
     accept Yole’s Terms and Conditions of Sale”. This results in                damages for loss of profits, business interruption and loss of        7.1 If the Buyer cancels the order in whole or in part or postpones
     acceptance by the Buyer.                                                    programs or information) arising out of the use of or inability            the date of mailing, the Buyer shall indemnify the Seller for
1.3 Orders are deemed to be accepted only upon written                          to use the Seller’s website or the Products, or any information            the entire costs that have been incurred as at the date of
     acceptance and confirmation by the Seller, within [7 days] from             provided on the website, or in the Products;                               notification by the Buyer of such delay or cancellation. This
     the date of order, to be sent either by email or to the Buyer’s             b) any claim attributable to errors, omissions or other                    may also apply for any other direct or indirect consequential
     address. In the absence of any confirmation in writing, orders              inaccuracies in the Product or interpretations thereof.                    loss that may be borne by the Seller, following this decision.
     shall be deemed to have been accepted.                                 4.4 All the information contained in the Products has been                7.2 In the event of breach by one Party under these conditions
2. MAILING OF THE PRODUCTS                                                       obtained from sources believed to be reliable. The Seller                  or the order, the non-breaching Party may send a notification
2.1 P roducts are sent by email to the Buyer:                                   does not warrant the accuracy, completeness adequacy or                    to the other by recorded delivery letter upon which, after a
     • within [1] month from the order for Products already                      reliability of such information, which cannot be guaranteed to             period of thirty (30) days without solving the problem, the
     released; or                                                                be free from errors.                                                       non-breaching Party shall be entitled to terminate all the
     • within a reasonable time for Products ordered prior to               4.5 All the Products that the Seller sells may, upon prior notice
                                                                                                                                                            pending orders, without being liable for any compensation.
     their effective release. In this case, the Seller shall use its best        to the Buyer from time to time be modified by or substituted
     endeavours to inform the Buyer of an indicative release date                with similar Products meeting the needs of the Buyer. This            8. MISCELLANEOUS
     and the evolution of the work in progress.                                  modification shall not lead to the liability of the Seller,           All the provisions of these Terms and Conditions are for the
2.2 Some weeks prior to the release date the Seller can propose                 provided that the Seller ensures the substituted Product is           benefit of the Seller itself, but also for its licensors, employees
     a pre-release discount to the Buyer                                         similar to the Product initially ordered.                             and agents. Each of them is entitled to assert and enforce those
     The Seller shall by no means be responsible for any delay in           4.6 In the case where, after inspection, it is acknowledged that          provisions against the Buyer.
     respect of article 2.2 above, and including incases where a                 the Products contain defects, the Seller undertakes to replace        Any notices under these Terms and Conditions shall be given in
     new event or access to new contradictory information would                  the defective products as far as the supplies allow and without       writing. They shall be effective upon receipt by the other Party.
     require for the analyst extra time to compute or compare                    indemnities or compensation of any kind for labor costs,              The Seller may, from time to time, update these Terms and
     the data in order to enable the Seller to deliver a high quality            delays, loss caused or any other reason. The replacement is           Conditions and the Buyer, is deemed to have accepted the latest
     Products.                                                                   guaranteed for a maximum of two months starting from the              version of these terms and conditions, provided they have been
2.3 The mailing of the Product will occur only upon payment                     delivery date. Any replacement is excluded for any event as set       communicated to him in due time.
        by the Buyer, in accordance with the conditions contained                out in article 5 below.
        in article 3.                                                       4.7 T
                                                                                 he deadlines that the Seller is asked to state for the mailing       9. GOVERNING LAW AND JURISDICTION
2.4. The mailing is operated through electronic means either by                of the Products are given for information only and are not             9.1 
                                                                                                                                                           Any dispute arising out or linked to these Terms and
      email via the sales department or automatically online via an             guaranteed. If such deadlines are not met, it shall not lead to            Conditions or to any contract (orders) entered into in
      email/password. If the Product’s electronic delivery format               any damages or cancellation of the orders, except for non                  application of these Terms and Conditions shall be settled
      is defective, the Seller undertakes to replace it at no charge            acceptable delays exceeding [4] months from the stated                     by the French Commercial Courts of Lyon, which shall have
      to the Buyer provided that it is informed of the defective                deadline, without information from the Seller. In such case only,          exclusive jurisdiction upon such issues.
      formatting within 90 days from the date of the original                   the Buyer shall be entitled to ask for a reimbursement of its first    9.2 French law shall govern the relation between the Buyer and
      download or receipt of the Product.                                       down payment to the exclusion of any further damages.                       the Seller, in accordance with these Terms and Conditions.
Yole Développement
 From Technologies to Market

                       © 2016
    Yole Développement’s 30 analysts operate in the following areas

                                  Imaging        Photonics

                   MEMS &


                                Power                    Advanced Packaging
                              Electronics   Batteries / Energy
                                              Management                    ©2016 | | About Yole Développement   22

   o Consulting and Analysis                                   o Financial services
       •   Market data & research, marketing analysis             •   M&A (buying and selling)
       •   Technology analysis                                    •   Due diligence
       •   Strategy consulting                                    •   Fundraising
       •   Reverse engineering & costing                          •   Maturation of companies
       •   Patent analysis                                        •   IP portfolio management & optimization

   o Reports                                                 o Media
       • Market & Technology reports                              • website
       • Patent Investigation and patent infringement risk        •   @Micronews e-newsletter
         analysis                                                 •   Communication & webcast services
       • Teardowns & Reverse Costing Analysis                     •   Events
       • Cost Simulation Tool                                                              

                                                                                           ©2016 | | About Yole Développement   23

                                  M&A operations
                                   Due diligences

                          Innovation and business maker
         technology and
             strategy        Manufacturing costs analysis
                          Teardown and reverse engineering
                                Cost simulation tools

                                     IP analysis
                                 Patent assessment

                                                    ©2016 | | About Yole Développement   24
o MEMS & SENSORS                                                                                          − Deposition Technologies Equipment & Materials 2016
     − Gas Sensors and Combos 2016                                                                        − Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS 2016
     − Status of the MEMS Industry 2016*
     − Sensors for Cellphones and Tablets 2016                                                    o COMPOUND SEMICONDUCTORS
     − Market and Technology Trends of Inkjet Printheads: Towards New Printing Opportunities           − SiC Modules, Devices and Substrates for Power Electronics 2016*
       2016…                                                                                           − GaN Modules, Devices and Substrates for Power Electronics 2016*
     − Sensors for Biometry and Recognition 2016                                                       − Sapphire Applications & Market 2016: from LED to Consumer Electronics*
     − Finger Print Sensors Market and Technologies 2016                                               − RF GaN Technology and Market Analysis 2016
     − 3D Imaging & Sensing 2016**
     − Silicon Photonics 2016                                                                     o LED
     − Emerging Non Volatile Memories 2016*                                                               −   Sapphire Applications and Market 2016: From LED to Consumer Electronics*
                                                                                                          −   LED Packaging 2016
o IMAGING & OPTOELECTRONICS                                                                               −   Microdisplays and MicroLEDs
     − Status of the CMOS Image Sensor Industry 2016*                                                     −   UV LED Technology, Manufacturing and Applications Trends 2016*
     − Uncooled Infrared Imaging Technology & Market Trends 2016*                                         −   OLED for Lighting 2016
     − Imaging Technologies for Automotive 2016                                                           −   LED in Automotive Lighting 2016
     − Sensors for Drones & Consumer Robots 2016
     − 3D Imaging & Sensing 2016**                                                                o POWER ELECTRONICS
     − Silicon Photonics 2016                                                                          − Power Electronics in Electric and Hybrid Vehicles 2016
                                                                                                       − Status of Power Electronics Industry 2016*
o MEDTECH                                                                                              − Passive Components Technologies and Market Trends for Power Electronics 2016
     − BioMEMS 2016                                                                                    − SiC Modules, Devices and Substrates for Power Electronics 2016*
     − Point of Need Testing 2016: Application of Microfluidic Technologies                            − GaN Modules, Devices and Substrates for Power Electronics 2016*
                                                                                                       − Inverter Technologies Trends & Market Expectations 2016
o ADVANCED PACKAGING                                                                                   − Power Electronics for Renewable Energy 2016
     − FanOut WLP: Technology Trends and Business Update 2016*                                         − Thermal Management for LED and Power 2016
     − Embedded Die Packaging: Technology and Markets Trends 2016*                                     − RF GaN Technology and Market Analysis 2016
     − 2.5D & 3D IC Business Update 2016
     − Status of the Advanced Packaging Industry 2016*                                            o   BATTERY
     − Advanced Packaging for Wearables and Mobile Applications 2016                                    − Market Trends and Technologies in Battery Pack and Assembly 2016
     − Advanced Packaging in Emerging Markets: China 2016                                               − Innovative and Emerging Technologies in Energy Storage Market 2016
     − Supply Chain Readiness for Panel Manufacturing in Packaging 2016                                                                                                                     **To be confirmed

o MANUFACTURING                                                                                   Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are available on
     − Inspection and Metrology Technology and Applications Trends in Advanced Packaging 2016**                               
     − Emerging Materials for Advanced Packaging 2016

                                                                                                                                                         ©2016 | | About Yole Développement         25
        − Sensors and Data Management for Autonomous Vehicles                                       o POWER ELECTRONICS
        − Sensors for Wearable Electronics And Mobile Healthcare                                         − Power Packaging Technology Trends and Market Expectations
        − Status of the MEMS Industry                                                                    − Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
        − Uncooled Infrared Imaging Technology & Market Trends                                             Electricity Storage Solutions
        − Infrared Detector Technology & Market Trends                                                   − Status of Chinese Power Electronics Industry
        − High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace & Industrial               − New Technologies and Architectures for Efficient Data Center
        − Emerging Non Volatile Memory (NVM) Technology & Market Trends                                  − IGBT Market and Technology Trends
                                                                                                         − Status of Power Electronics Industry
   o IMAGING & OPTOELECTRONICS                                                                           − SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
        − Camera Module Industry                                                                         − GaN and SiC Devices for Power Electronics Applications
        − Uncooled Infrared Imaging Technology & Market Trends
        − Status of the CMOS Image Sensors                                                              o ADVANCED PACKAGING
        − Infrared Detector Technology & Market Trends                                                       − Status of the Advanced Packaging Industry
                                                                                                             − Supply Chain Readiness for Panel Manufacturing in Packaging
   o MEDTECH                                                                                                 − Fan-in Wafer Level Packaging: Market and Technology Trends
        − Sample Preparation Automation Through Emerging Microfluidic Technologies                           − Flip Chip: Technologies and Markets Trends
        − 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and      − Fan-Out and Embedded Die: Technologies & Market Trends
          Medical Device Markets
        − Sensors for Wearable Electronics And Mobile Healthcare                                        o MANUFACTURING
                                                                                                             − Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED
   o COMPOUND SEMICONDUCTORS                                                                                   Applications
        − Sapphire Applications & Market 2015: from LED to Consumer Electronics                              − Emerging Non Volatile Memory (NVM) Technology & Market Trends
           − SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
           − GaN and SiC Devices for Power Electronics Applications
                                                                                                       Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are
   o LED                                                                                                                          available on
           −   LED Lighting Module Technology, Industry and Market Trends 2015
           −   UV LED - Technology, Manufacturing and Application Trends
           −   Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays
           −   Sapphire Applications & Market 2015: from LED to Consumer Electronics

                                                                                                                                                    ©2016 | | About Yole Développement   26
   •   Consulting and Specific Analysis
        •   North America: Steve LaFerriere, Director of Northern America Business Development
        •   Japan & Asia: Takashi Onozawa, Representative Director, Yole KK
        •   RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
   •   Report business
        •   North America: Steve LaFerriere, Director of Northern America Business Development
        •   Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
        •   Japan & Asia: Takashi Onozawa, Representative Director, Yole KK.
            Email:                                                                         Follow us on
        •   Korea: Hailey Yang, Business Development Manager, Korean Office
        •   Taiwan: Mavis Wang, Business Development Director
   •   Financial services
        •   Jean-Christophe Eloy, CEO & President
   •   General
        •   Email:

                                                                                                 ©2016 | | About Yole Développement   27
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