Conference program Creating a smarter future. Dresden, Germany, 11 - 12 April 2018 - Smart Systems Integration
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International Conference and Exhibition
on Integration Issues of Miniaturized Systems
Conference program
Creating a smarter future.
Dresden, Germany,
11 – 12 April 2018
smartsystemsintegration.com
N O W AT /registration
REGISTER nt egration.com
ts ys te m si
www.smar
Co-organizer:
Part of the activities of:
In cooperation with:
2|3
Welcome to the
12th Smart Systems Integration
Smart systems integration has become a driving force New trends and technologies applied in industry are
behind almost all product innovation. Smart-enabled summarized in the SME session. The advantages of
solutions can be found in almost every application field: ecosystems, e.g. Research Fab Microelectronics Germany,
transportation, health, manufacturing, the Internet of are presented in a special session as well.
Things (IoT), energy, natural resources and security. Smart
systems are developed by using key enabling technologies The IOSENSE Spring School and a LifeWear Workshop
and by integrating the knowledge from a variety of provided by TU Dresden organized by Mesago Messe
disciplines. They benefit from the progress in nanoelec- Frankfurt takes place as co-located events next to the
tronics and nanotechnologies, but also from design Smart Systems Integration 2018 at the Hilton Dresden.
methods and tool development.
The pre-conference field trip to the Smart Systems Hub
EPoSS – the European Platform on Smart Systems in Dresden on Tuesday, April 10th 2018, completes the
Integration has published its 2017 update of its Strategic program. Attendees visit SAP as well as the IoT testbed
Research Agenda, defining research and industry and the test track for autonomous driving at Dresden
priorities for the next 15 years to come. Additionally, this University of Applied Sciences (HTW).
was also the input for the ECSEL MASRIA 2017.
The day after the conference, a trip to Chemnitz is
The Smart Systems Integration Conference and Exhibition organized to visit the Smart Systems trail “smart sensor
serves as a communication platform for academia, and production systems for industrial IoT“ of the Smart
research and industry and enables the exchange of know- Systems HUB including the Smart Systems Campus in
how in the field of smart systems integration. The confer- Chemnitz, the E3 factory as well as other companies.
ence addresses the application fields of smart systems
as well as smart systems themselves, starting from the The 12th Smart Systems Integration Conference 2018 will
design via new building blocks for sensing, data process- show a snapshot of the international work in the field of
ing, actuating, networking, and smart powering up to smart systems integration on an application and a basic
heterogeneous integration of the different building blocks research level. I’m looking forward to meeting you in
and manufacturing of the systems. For the first time, a Dresden.
session addresses embedded software – self-X systems.
X stands for learning, organizing, adaptive but also for
optimizing and repairing.
As in previous years, EPoSS - the European Technology
Platform on Smart Systems Integration - is organizing
two special sessions on the first day of the conference.
Prof. Dr. Thomas Otto
Participation in these sessions is open to all interested Fraunhofer Institute for Electronic Nano Systems, DE
delegates. Conference chair, Smart Systems Integration 2018
4|5
Discover innovations.
N O W AT
Find solutions. Share visions. REGISTER
www.s m ar ts ys te m sintegration.co
m/registratio
n
Why to attend Conference dinner
The event features application-oriented as well as scientific sessions This year the traditional conference dinner on 11 April 2018 is taking place at
and addresses the complete value-added chain of smart systems. Moreover a paddle steamer. We invite you to enjoy an adventure river cruise on the
an overview of special European programs focusing on smart systems Elbe and a fantastic springtime buffet. The dinner offers the opportunity for
integration is given. intensive discussions and networking in a relaxed atmosphere. During the
dinner the Best Paper and Best Poster Award of SSI 2017 will be presented.
Who should attend
SSI targets researchers, developers and users in equal measure. It is the After-conference field trip
platform for smart systems integration experts and managers from the Friday, 13 April 2018 8:00 – 14:00 hrs
automation, automotive, aerospace, telecommunication, medical technology, The after-conference field trip is organized by the Fraunhofer Institute
logistics, RFID and life sciences industry sectors. for Electronic Nano Systems, Chemnitz, co-organizer of Smart Systems
Integration.Participants of the guided tour have the chance to visit the Smart
Systems trail »Sensor and production systems for industrial IoT« in Chemnitz.
Conference highlights The tour includes the visit of:
Keynotes by Agilion GmbH - Industrial Supply Chain Tracking, Vehicle Tracking and
T-Systems Multimedia Solutions GmbH People Tracking
STMicroelectronics SA EDC Electronic Design Chemnitz GmbH - customer and application
Technical University Dresden specific electronic systems and integrated circuits
University of Applied Sciences Dresden Chemnitz University of Technology – Virtual Reality
Delft University of Technology and Harvest Imaging Fraunhofer IWU – E³ production, efficient tools for the digitalization
in production
Special sessions Fraunhofer ENAS – Smart monitoring systems, presentation
Two EPoSS sessions Fraunhofer lighthouse project »Go Beyond 4.0«
System Integration Technologies
Design of smart integrated systems A shuttle bus brings participants to the visited facilities and back to Hilton
SME session Dresden. Within the tour snacks and beverages are offered.
Pre-conference field trip For further details and bookings, please contact Dr. Martina Vogel by e-mail
to Martina.Vogel@enas.fraunhofer.de.
Tuesday, 10 April 2018 14:30 – 18:30 hrs
The pre-conference field trip on Tuesday, 10 April 2018 shows two trails of
Registration to the pre-conference field trip as well as the dinner and the
the Smart Systems Hub in Dresden, which belongs to the digital HUB
after field trip is required due to limited capacities!
initiative in Germany. In enabling sustainable networking between the
scientific community, established companies, and founders, the hub
contributes to the transformation of exciting ideas into innovative products
and services. The focus is on developing the hardware, software, and
connectivity components needed to foster intelligent solutions and facilitate
the Internet of Things.
Participants of the guided tour have the chance to visit:
The Smart Systems HUB office at SAP with introduction to the HUB as
well as presentation of digital factory as SAP
The University of Applied Sciences Dresden (HTW)
Visit of test track for autonomous driving as well as IoT testbed. At the
IoT testbed different production modules are installed e.g. CNC machine,
different robotic working, big data cluster for sensor data. To the
demonstrators belong e.g. condition monitoring solutions, indoor-
localization and navigation as well as cloud based IoT-platform.
A shuttle bus brings participants to the visited facilities and back to Hilton
Dresden. Within the tour snacks and beverages are offered.
6|7
Conference program
Wednesday, 11 April 2018
09:00 hrs elcome
W
Prof. Dr. Thomas Otto, Fraunhofer Institute for Electronic Nano Systems ENAS, DE
Keynote I – III
Chair: Prof. Dr. Thomas Otto, Fraunhofer Institute for Electronic Nano Systems ENAS, DE
09:10 hrs 09:40 hrs 10:10 hrs
Keynote I: Machine Learning and Artificial eynote II: Key Technologies for the
K Keynote III: Fog Computing - a New
Intelligence: From Hype to Customer Value Automobile of the Future and links to other Technology for Co-Working Robotics and
Christoph Kögler, T-Systems Multimedia smart electronics domains Industry 4.0
Solutions GmbH, DE Dr. Jochen Langheim, STMicroelectronics SA, FR Prof. Dr. Uwe Aßmann, Technical University
Dresden, DE
10:40 hrs – 11:05 hrs COFFEE BREAK
The special sessions by EPoSS, the poster presentations and the exhibition
are free of charge to all participants, exhibitors and registered visitors.
Printing Processes System Integration Technologies I EPoSS Session I:
Dr. Larraitz Añorga, IK4-Cidetec, ES Rolf Aschenbrenner, Fraunhofer Institute for Smart Manufacturing – A Pan-European
Prof. Dr. Reinhard R. Baumann, Fraunhofer Reliability and Microintegration IZM, DE Perspective
Institute for Electronic Nano Systems ENAS, DE Louis Le Fur, Airbus Group Innovations, FR
11:05 hrs 11:05 hrs 11:05 hrs – 12:45 hrs
Launch to the market a NOMINATED Development of micro dispense and jetting Today, progress in manufacturing is driven
truly portable Electrochemical BEST PAPER process of battery electrodes for the fabrica- by sophisticated communication technologies
AWARD 2018
Biosensor for Sulphite tion of substrate integrated micro batteries and Industry 4.0. Integrated electronic compo-
Analysis in Food Industry Dr. Robert Hahn, Fraunhofer Institute for nents and Smart Systems Integration are the
Dr. Larraitz Añorga, Fundacion Cidetec, ES Reliability and Microintegration IZM, DE backbone of such progress. With the combina-
tion of human flexibility and experience on
11:30 hrs 11:30 hrs the one hand as well as the potential of
Open-access pilot line to accelerate Novel chip embedding and interconnection process and factory automation on the other
industrial uptake of hybrid printed technology for mm-wave System-in- hand, major breakthroughs in the manufactu-
Package (SiP) applications ring environment are achievable. In this light,
electronics
Christof Landesberger, Fraunhofer Research this session will examine opportunities for
Dr. Maarten Cauwe, Imec Cmst, BE
Institution for Microsystems and Solid State Smart Systems in manufacturing by combining
Technologies EMFT, DE current industrial innovations with ongoing
research undertaken at universities and RTOs
on a pan-European level.
11:55 hrs 11:55 hrs
Inkjet printing of patterned nanocarbon Reactive bonding with oxide based
absorber layers for pyroelectric infrared de- reactive multilayers
tectors Klaus Vogel, Fraunhofer Institute for Electronic
Christian Zeiner, Technische Universität Chem- Nano Systems ENAS, DE
nitz, DE
12:20 hrs 12:20 hrs
Developing a Roll-to-Roll integration & con- Reactive joining of sensitive materials for
version process for smart labels within the MEMS devices: characterization of joint
FMCG and pharmaceutical sectors quality
Tim Marsden, CPI - Centre for Process Irina Spies, Hahn-Schickard, DE
Innovation, UK
12:45 hrs – 13:45 hrs LUNCH BREAK
8|9
Conference program
Wednesday, 11 April 2018
Advanced Technologies System Integration Technologies II EPoSS Session II:
Prof. Dr. P. J. French, Delft University of The Automated World – Technology
Technology, NL Trends for the Digital Society
Jean-Philippe Polizzi, CEA-LETI, FR
13:45 hrs 13:45 hrs 13:45 hrs - 15:25 hrs
Post-CMOS MEMS Capacitive Pressure Sen- 3D Wire - a novel approach for 3D Chips Within the megatrend of digitisation, new
sor: compatible porous ALD Interconnection for Harsh Environment concepts and approaches are developed in
membrane for Sacrificial Layer Release Applications all industry sectors to respond to societal
and Diaphragm Sealing Jan Bickel, Hochschule für Technik und needs and to conceive new products and
Christian Walk, Fraunhofer Institute for Wirtschaft Berlin, DE services. By pushing innovation, digitisation
Microelectronic Circuits and Systems IMS, DE creates diverse opportunities and paths for
14:10 hrs 14:10 hrs the development of Smart Systems.
Mechanically coupled capacitive ultrasonic Fabrication of 3D Ceramic Interconnect This session will thus focus on Smart Systems
transducer Devices by Laser Induced Selective solutions for those application areas that are
Marcel Krenkel, Fraunhofer Institute for Metallization massively affected by automation and are
Photonic Microsystems IPMS, DE Eugen Ermantraut, University of Stuttgart, DE strongly benefitting from Smart Systems de-
velopment such as health, transport, communi-
14:45 hrs 14:45 hrs cations, energy, water, textiles, agriculture and
Fabrication and operation of Selective over molding of a CMos TSV food, thereby answering societal challenges.
protein-powered biocomputation using wafer with the flexible 3D integration of
nanostructured networks Sensors and Components
Dr. Christoph Meinecke, Technische Ton van Weelden, Boschman Technologies
Universität Chemnitz, DE B.V., NL
15:00 hrs 15:00 hrs
Analysis of resonance frequency and A Functional 3D- and Inkjet-Printed
sensitivity on III-Nitride SAW based Housing for a Capacitive Position Sensor
temperature sensors in a Spectrometer Application
Ioana Giangu, IMT Bucharest, RO Lisa-Marie Faller, Alpen-Adria-Universität
Klagenfurt, AT
15:25 hrs – 15:55 hrs COFFEE BREAK
15:25 hrs – 16:30 hrs POSTER SESSION
The poster presenters will be available at their posters for questions and discussions.
SME session Self-X Systems Ecosystems
Dr. Markus Riester, meisterwerk ventures Christoph Kögler, T-Systems Multimedia Dr. Michael Scholles, Fraunhofer Institute
GmbH, DE, Solutions GmbH, DE for Photonic Microsystems IPMS, DE
Youri Ponomarev, Analog Devices, BE Wolfgang Dettmann, Infineon Technologies AG, DE Dr. Rolf Slatter, Sensitec GmbH, DE
16:30 hrs 16:30 hrs 16:30 hrs
Development of a new vacuum gauge based The Learning of the OpenLicht System, a Standardisation of Smart Systems
on Si MEMS structure self-learning Lighting System at the Edge Building Blocks: A requirement for a glob-
Stepan Konakov, Gyrooptics, RU of the Network ally competitive Cooperative Foundry
Kay Bierzynski, Infineon Technologies AG, DE Petra Weiler, VDI/VDE Innovation + Technik
GmbH, DE
16:50 hrs 16:55 hrs 16:50 hrs
Solmates Pulsed Laser Deposition systems Computing within Materials: Research Fab Microelectronics Germany –
enable the integration of critical novel thin Self-Adaptive Materials and a novel cooperation concept for jointly
film materials for the MEMS Self-organizing Agents technology development
& 5G market Dr. Stefan Bosse, Universität Bremen, DE Jörg Amelung, Research Fab Microelectronics
Dr. Matthijn Dekkers, Solmates B. V. , NL Germany (FMD), DE
17:10 hrs 17:20 hrs 17:10 hrs
nCapsulate added value Management strategy: towards a holistic Optimized Ecosystem for effective
for system assembly platform for runtime adaptation and Transfers of Research and Business
Ignas van Dommelen, Sencio BV, NL reconfiguration of Building Automation Opportunities - The Bavarian Way :00 hrs
18:30 hrs – 22
Systems Dr. Klaus Funk, Zentrum Digitalisierung dinner
17:30 hrs Tuan Linh Mai, Technische Universität Bayern, DE Conference
Ensuring sensor reliability Dresden, DE 17:30 hrs
by System Level Testing The gateone-project: a digital innovation
Ingolf Leidert, SPEKTRA Schwingungs- hub accelerating innovation through
technik und Akustik GmbH Dresden, DE ecosystem design and product trajectory
Dr. Régis Hamelin, Blumorpho, FR
10 | 11
Conference program
Thursday, 12 April 2018
Keynote IV – V
09:00 hrs 09:30 hrs
Keynote IV: From SMART to SMARTER: Keynote V: Assistive Robotics for public
Recent Developments in CMOS Image and AAL applications
Sensors Prof. Hans-Joachim Böhme, University of
Prof. Dr. Albert J.P. Theuwissen, Delft University Applied Sciences Dresden, DE
of Technology, NL and Harvest Imaging, BE
10:00 hrs – 10:30 hrs COFFEE BREAK
Smart Production New Materials for Micro and Nano Design of smart
Wolfgang Gessner, VDI/VDE Innovation + Tech- Systems integrated systems I
nik, DE Dr. Chris Merveille, IKERLAN, ES Dr. Christian Hedayat, Fraunhofer Institute for
Prof. Dr. Charles Cané, IMB-CNM (CSIC), ES Uwe Schwarz, X-FAB MEMS Foundry GmbH, DE Electronic Nano Systems ENAS, DE
10:30 hrs 10:30 hrs 10:30 hrs
CoDesign for the Integration NOMINATED Sputter Epitaxy of Pb(Zr,Ti)O3 and Generic Integrated Forensic NOMINATED
of Energy Harvesters and BEST PAPER Pb(Mg1/3,Nb2/3)O3-PbTiO3 Thin Films on Toolbox (GIFT) for on-site BEST PAPER
AWARD 2018 AWARD 2018
Antennas for highly Si for High-Performance Piezoelectric CBRN investigation
integrated CPS MEMS Dr. Eric Moore, University College
Carsten Brockmann, Fraunhofer Institute for Dr. Shinya Yoshida, Tohoku University, JP Cork Tyndall National Institute, IE
Reliability and Microintegration IZM, DE
10:55 hrs 10:55 hrs 10:55 hrs
Robust Magnetic Sensors NOMINATED Enhanced optoelectronic property of Impact of Inter-Wafer WINNER
BEST PAPER BEST PAPER
for availability-oriented ultra-thin Al–doped ZnO layers by inserting Variations on MEMS’ AWARD 2017
AWARD 2018
Product Service Systems nano-Ag particles on roughed surface of Fingerprints
Dr. Rolf Slatter, Sensitec GmbH, DE seed layer Oliver Willers, Robert Bosch GmbH, DE
Prof. Yen-Sheng Lin, I-Shou University, TW
11:20 hrs 11:20 hrs 11:20 hrs
Autonomous robots and NOMINATED Scaling up Integration of Carbon A new generation of low-cost and highly
BEST PAPER
the Internet of Things in AWARD 2018
Nanotubes into Micro-Electro-Mechanical reliable CO2 gas sensors
underground mining Systems Matthias Eberl, Infineon Technologies AG, DE
Frederic Güth, TU Bergakademie Simon Böttger, Technische Universität
Freiberg, DE Chemnitz, DE
11:45 hrs 11:45 hrs 11:45 hrs
Smart system for WINNER Integration of one-dimensional gas Super-Low-Power ChipDesign for Smart
BEST POSTER
Clutch-brake monitoring AWARD 2017
sensitive nanostructures grown via Sensors
Kepa Mayora, Ikerlan Scoop, ES chemical vapor deposition into Dr. Gerd Teepe, Globalfoundries Dresden
microdevices Module Two LLC & Co. KG, DE
Prof. Dr. Carles Cané, Instituto de
Microelectrónica de Barcelona IMB-CNM
(CSIC), ES
12:10 hrs 12:10 hrs 12:10 hrs
Visualization and Process Control with Capacitive Humidity Sensor based Smart Models for MEMS Microphone
Real-Time production information and Nanograss Polyimide for Implementation in Transducers
IoT-based Maintenance workflows with Various Applications Guido Janßen, X-FAB Semiconductor
Augmented Reality in the digital Dr. Jamila Boudaden, Fraunhofer Foundries AG, DE
factory Research Institution for Microsystems and
Björn Schuster, N+P Informationssysteme Solid State Technologies EMFT, DE
GmbH, DE
12:35 hrs – 13:30 hrs LUNCH BREAK
13:30 hrs – 14:30 hrs POSTER SESSION
The poster presenters will be available at their posters for questions and discussions.
14:30 hrs – 15:00 hrs COFFEE BREAK
12 | 13
Conference program
Thursday, 12 April 2018
Smart Systems Application Test and Reliability Methodologies Design of smart integrated systems II
Dr. Rainer Günzler, Hahn-Schickard, DE Prof. Dr. Sven Rzepka, Fraunhofer Dr. Reinhard Neul, Robert Bosch GmbH, DE
Renzo Dal Molin, CAIRDAC SAS, FR Institute for Electronic Nano Systems ENAS, DE
Alfons Dehé, Hahn-Schickard, DE
15:00 hrs 15:00 hrs 15:00 hrs
Defect Detection in high Quality Security beyond Design: NOMINATED On Designing Wireless Building
BEST PAPER
Polymers used in the Smiconductor Embedding Roots-of-Trust in Automation Networks: Estimating the
AWARD 2018
Manufacturing Industry Silicon and Cryptographically Network Layer Impact of Functional
Dr. Christina Hirschl, CTR Carinthian Tech Securing the Supply Chain Designs
Research AG, AT from Design to Manufacturing Bastian Wollschlaeger, Technische
Rajeev Gulati, Data I/O Corporation, US Universität Dresden, DE
15:25 hrs 15:25 hrs 15:25 hrs
Considerations on Solar Energy A technology toolbox concept to improve New Advancements in Using Statistical
Harvesting for Smart Systems reliability evaluation Models as Part of a Standard MEMS
Astrid Della Mea, Alpen-Adria-Universität Daniel Hahn, Fraunhofer Institute for Relia- Design Flow
Klagenfurt, AT bility and Microintegration IZM, DE Christine Dufour, Coventor Inc., FR
Christof Hielscher, X-FAB Semiconductor
Foundries AG, DE
15:50 hrs 15:50 hrs 15:50 hrs
Development of a lab-on-chip electro- On the Thermo-Mechanical NOMINATED Characterization of a 2D micro-convey-
chemical immunosensor for detection of Risk Assessment of Complex BEST PAPER ance device based on digital actuators
AWARD 2018
Polycyclic Aromatic Hydrocarbons (PAH) Printed Circuit Boards (PCB) Dr. Zhichao Shi, Université de Technologie
in environmental water by Finite Element Modelling de Compiègne, FR
Shifa Felemban, University College Cork Tyn- and Warpage Measurements 16:15 hrs
dall National Institute, IE Jan Albrecht, Fraunhofer Institute for Improving the Selectivity of Vapor Trace
16:15 hrs Electronic Nano Systems ENAS, DE Detection System
UWB Radar sensor characterization for Prof. Dr. Drago Strle, University of Ljubljana,
obstacle detection with application to 16:15 hrs SL
the smart white cane Warpage Measurement on Bonded
Laurent Ouvry, CEA-Léti, FR Wafers Under Thermal Load
Bastian Tröger, FRT GmbH, DE
16:40 – END OF THE CONFERENCE
Full description of the presentations as well
as biographies of the speakers are available at
www.smartsystemsintegration.com/program
14 | 15
Poster session both conferen
ce days and
is
se ss io n ta kes place on bi to rs an d registered
This ants, exhi
to all particip
free of charge
11 April 2018, 15:25 hrs – 16:30 hrs visitors!
12 April 2018, 13:30 hrs – 14:30 hrs
Biomaterial based toxic gas sensor using microwave resonant cavity Deposition methods for C8-BTBT in flexible TFTs
Dr. Sahib Babaee Tooski, Azad University, IR Thorsten Meyers, Universität Paderborn, DE
The use of Virtual Reality and Augmented Reality in the winery Transducer Electronic Data Sheets on Smart Ultra Low Power Devices
Matteo Balderacchi, ValorItalia Spa, IT Tobias Mitterer, Alpen-Adria-Universität Klagenfurt, AT
Constructive solutions for RF-MEMS switch with thermo-electric actuating DNA analysis with a LED based illumination module
mechanism Dr. Christian Möller, CIS Forschungsinstitut für Mikrosensorik GmbH, DE
Angela Baracu, National Institute for Research and Development in
Non-invasive Blood Pressure monitoring integrated in a smart watch form factor
Microtechnology, RO
Brendan O`Flynn, University College Cork Tyndall National Institute, IE
Study of optimum thickness of self-buffer layer Ga-doped ZnO thin film deposited
Long Range LiDAR Characterisation for Obstacle Detection for use by the Visually
on PC flexible substrate
Impaired and Blind
Chien-Ting Chen, I-Shou University, TW
Dr. Rosemary O`Keeffe, University College Cork Tyndall National Institute, IE
Die-Level Patterning of Parylene F by Laser-Ablation for further Processing with
Analytical Modeling and Measurement of Vias in PCB-Technology up to 20 GHz
ALD Functional Layers
Paul Perlwitz, Fraunhofer Institute for Reliability and Microintegration IZM, DE
Özgü Dogan, Fraunhofer Institute for Microelectronic Circuits and Systems IMS, DE
Portable Sensor System for UV-Irradiation Measurements
Using fluidic simulation for parameter optimization in compression molding
Dmitry Petrov, Universität Paderborn, DE
of microelectronic packages
Marc Dreissigacker, TU Berlin, DE Deposition speed optimization for ZnO nanoparticle TFTs using doctor
blade process
Short Range LIDAR characterization for obstacle detection with application to a
Julia Reker, Universität Paderborn, DE
smart white cane
Gabriela Dudnik, CSEM Centre Suisse d´Electronique et de Microtechnique SA, CH Multipurpose Sensing Platform Based on Laser-Reduced Graphene Oxide for
Flexible and Ubiquitous Electronics
MEMS gas sensor based on nanostructured SnO2-ZnO layers
Dr. Almudena Rivadeneyra, Technische Universität München, DE
Bogdan Firtat, National Institute for Research and Development in Microtechnology, RO
Functional Integration - Structure-Integrated Wireless Sensor Technology
Impedance-Controlled Design and Connection Technology for Micromounting
Targeting Smart Mechanical Engineering Applications
and Hybrid Integration of High- Frequency and Mixed-Signal Systems with
Dr. Steffen Rülke, Fraunhofer Institute for Integrated Circuits IIS, DE
MID Technology (FREMISI)
Volker Geneiß, Fraunhofer Institute for Electronic Nano Systems ENAS, DE RFID units for a product based control of industrial production systems
Marco Schmidt, Fraunhofer Institute for Electronic Nano Systems ENAS, DE
Die Attach for High Power VCSEL Array Systems
Lena Goullon, Fraunhofer Institute for Reliability and Microintegration IZM, DE Smart and efficient Optimization of NED Actuators
David Schuffenhauer, Fraunhofer Institute for Photonic Microsystems (IPMS), DE
Stochastic Analyzes and Monte-Carlo Simulations of nonlinear and non-ideal
Mixed-Signal Phase-Locked Loops Active flow control in wind turbines - integration technologies and assessment
Dr. Christian Hangmann, Fraunhofer Institute for Electronic Nano Systems ENAS, DE of economic effects
Martin Schüller, Fraunhofer Institute for Electronic Nano Systems ENAS, DE
Challenges in transfer quantum dot sensitized solar cell on technical textiles
Kathleen Heinrich, Fraunhofer Institute for Electronic Nano Systems ENAS, DE Bond strength and stability of solderjet bumping packaging technique for
laser device miniaturization
New DC-50MBd SFP transceiver with real time monitoring capability cuts power
Brigitta Septriani, Fraunhofer Institute for Applied Optics and Precision Engineering IOF, DE
consumption by half and doubles fiber density for HVDC VBE system
Alek Indra, Broadcom Limited, SG Ontology-based microservices architecture for industrial assistant systems
Adrian Singer, Fraunhofer Institute for Machine Tools and Forming Technology IWU, DE
Vertical aligned carbon nanotube (CNT) films as absorption layers for IR applications
Mandar Kini, Chemnitz University of Technology, DE Using Intermittent Process to enhance the optoelectronic properties of
Ga-doped ZnO thin films
Investigation of high pressure Ag sintered joints manufactured with different tools
Kun-Ta Wang, Chiao Tung University, TW
Johannes Kripfgans, Fraunhofer Institute for Reliability and Microintegration IZM, DE
Multiscale residual stress analysis in thin film layers
Performance Analysis of a Novel Flexible NFC Tag for IoT Applications
Marie Weißbach, Fraunhofer Institute for Reliability and Microintegration IZM, DE
Sanjeev Kumar, University College Cork Tyndall National Institute, IE
Designed Ga doped-ZnO layer with nano-Ag particles to apply on plus sensor
Study of AZO/CuO nano-particles/AZO layer to deposit on PC flexible substrate
Wei-De Wu, I-Shou University, TW
Jhe-Wei Lai, I-Shou University, TW
Supervision Unit for Harsh Environments
Towards a portable smart spatial exploration system for environment perception
Dr. Heike Wünscher, CIS Forschungsinstitut für Mikrosensorik GmbH, DE
Dr. Suzanne Lesecq, CEA-Léti, FR
Ga doped-ZnO thin film with low cost intermittence process to apply on plus sensor
Jung-Yan Liu, I-Shou University, Taiwan
16 | 17
Co-located events
IoSense Spring School 2018 Workshop
Wednesday, 11 April 2018, 9:00 - 17:50 hrs »Life with Wearables in Smart Rooms«
Thursday, 12 April 2018, 9:00 - 16:40 hrs
The Spring School of the JU ECSEL project IoSense
demonstrates how to engineer innovative products in With the advent of standard sensor-actuator platforms
sensor-actuator networks. for wearable devices, such as smart watches, smartglasses,
smart clothing, and exoskeletons, people carry multiple
The IoSense project focuses on the availability of top sensor-based devices simultaneously. This trend imposes
innovative, competitive sensors and sensor systems completely new challenges to software engineering w.r.t.
»Made in Europe« for »Internet of Sensor« applications in adaptivity, distribution, interaction, integration, data
smart mobility, society, energy, health care and production. handling, resiliency, security and software architecture.
Because in these devices, hardware and software interact
Participants are enabled to build platforms and tightly, new skills and processes are required when
complements for hardwaresoftware ecosystems so that designing solutions.
their future applications in the Internet of Sensors become
reality. The IoSense Spring School presents newest sensor The integration of wearable devices with other smart
technologies as well as ways how to create innovations devices installed in an environment requires that the
with them, extending the value chain with easy-to-build software architecture is highly dynamic. Therefore, there
software for sensor applications. is a need for a new paradigm of software development for
wearables in smart rooms, based on sensor nets, fog, and
Objectives and Scope edge computing. For wearables in smart rooms, software
The target of the IoSense Spring School is to show how engineering techniques must be established to improve
to engineer innovative products. The goal is to enable IoT their quality (e.g., re-usability, reliability,maintainability),
ecosystems based on hardware-software platforms and so that life with them becomes secure, safe and convenient.
complementing apps for exible and high-performance
data-aggregation and processing in sensor-actuator This trend suggests establishing a new joint community
networks. The future technology of IoSense covers of researchers from sensor nets, wearables, fog computing,
Innovative sensor and multi-sensor technologies for
and software engineering. The workshop Life with Wear-
heterogeneous application areas ables in Smart Rooms aims to bring together researchers
Highlighting new approaches for developing sensors
and practioneers from these communities, to present
using exible Frontend and Backend pilot lines current approaches w.r.t. software engineering of wearable
Design of sensor and app components for market needs
devices, gather requirements for future wearable systems
by involving customers early in the development process and develop a roadmap for software engineering for
Enabling external parties to built IoT ecosystems with
wearables in smart rooms.
IoSense technology
Closing the gap between chip manufacturing and
application developers for transforming existing value
chain approaches
14 | 15
EPoSS working Group Meetings
International Exhibition and Conference
During the SSI, the European Technology Platform on
for System Integration in Micro Electronics
Smart Systems Integration (EPoSS) will host the following
four meetings organised by its working group members: Nuremberg, 5 –7 June 2018
»Transport«, »Healthy Living and Applied MNBS«,
»Manufacturing & Robotics and Communications for
Smart Devices« and »Key Technologies«.
Nuremberg, the heart of
The exact time and place of the working group meetings
will be communicated on the EPoSS homepage in time. electronic manufacturing
Participation in the working group meetings is free of
charge and open to the public.
Exhibition Topics
For further information, please write an e-mail to
contact@smart-systems-integration.org Technologies and Processes
Materials and Components
Manufacturing
Manufacturing equipment
Reliability and Test
Software and Systems
Service and Consulting
smthybridpackaging.com20 | 21
Committee list
Conference chair Dr. E. Moore, University College Cork, Tyndall National Institute, IE
Prof. Dr. T. Otto, Fraunhofer ENAS, DE Dr. A. Muller, IMT, RO
Dr. A. Nebeling, Elmos, DE
Co-chair Prof. H.-E. Nilsson, Mid Sweden University, SE
Dr. G. Lugert, Siemens, EPoSS, DE Prof. Dr. H. Pereira Neves, Six Semiconductors, BR
J.-P. Polizzi, CEA-LETI, FR
Local co-chair Dr. Y. Ponomarev, Analog Devices, BE
Dr. W. Dettmann, Infineon Technologies AG, DE Dr. I. V. Popova, Gyrooptics, RU
Prof. Dr.-Ing. habil. K. Kabitzsch, Dresden University of Technology, DE Dr. M. Riester, meisterwerk ventures GmbH, DE
C. Kögler, T-Systems Multimedia Solutions GmbH, Silicon Saxony e. V., DE Dr. G. Righini, Instituto di Fisica Applicata Nello Carrara Firenze, IT
Prof. Dr. K.-D. Lang, Fraunhofer IZM, DE Prof. A. Rydberg, University of Uppsala, SE
Prof. Dr. S. Rzepka, Fraunhofer ENAS, DE
Dr. M. Scholles, Fraunhofer IPMS, DE
Scientific committee U. Schwarz, X-FAB MEMS Foundry, DE
L. Añorga, CIDETEC, ES Dr. R. Slatter, Sensitec GmbH, DE
R. Aschenbrenner, Fraunhofer IZM, DE T. Stärz, microFAB, DE
Prof. Dr. R. R. Baumann, Fraunhofer ENAS, DE Prof. J. Tuovinen, JoyHaptics Ltd, FI
Prof. Dr. K. Bock, TU Dresden, DE J. Wolf, Fraunhofer IZM, DE
Dr. C. Bosshard, CSEM, CH
Dr. S. Brongersma, Holst Centre, IMEC, NL
Dr. B. Candaele, Thales, FR
Prof. Dr. C. Cané, Centro Nacional de Microelectrónica (CNM-IMB), ES Advisory committee
Dr. J. De Boeck, IMEC International, NL International members
Prof. Dr. A. Dehé, Hahn-Schickard, DE Prof. Dr. M. Esashi, Tohoku University, JP
M. Desmulliez, Heriot-Watt University, UK R. H. Grace, R. Grace Associates, US
K. Dyrbye, Grundfos Holding, DK
Dr. S. Finkbeiner, Bosch Sensortec, DE Members of EPoSS advisory committee
Prof. Dr. P. J. French, Delft University of Technology, NL R. Dal Molin, CAIRDAC SAS, FR
U. Gäbler, Infineon, DE R. Groppo, Ideas & Motion, IT
W. Gessner, VDI/VDE-IT, DE A. Korhonen, Murata Electronics, FI
Dr. R. Günzler, Hahn-Schickard, DE Dr. J. Langheim, STMicroelectronics, FR
Dr. C. Hedayat, Fraunhofer ENAS, DE Dr. R. Neul, Bosch, DE
Dr. H. Heinzelmann, CSEM, CH A. Nguyen-Dinh, Vermon, FR
Prof. Dr. C. Hierold, ETH, CH H. Rödig, Infineon Technologies, DE
Prof. Dr. K. Hiller, Chemnitz University of Technology, DE Dr. W. van Driel, Philips Electronics, NL
D. Holden, CEA-LETI, FR
Dr. J. Kiihamäki, VTT Technical Research Centre of Finland, FI
Prof. Dr. C. Kutter, Fraunhofer EMFT, DE
L. Le Fur, Airbus Group Innovations, FR
Dr. C. Merveille, IKERLAN, ES
Prof. Dr. W. Mokwa, RWTH Aachen, DE22 | 23
Registration
Conference package
Registration fees The conference fee includes participation in the conference
Until From parts booked, proceedings (USB-stick), lunch on the days
Until 28 February From 1 March
registered, coffee breaks and free admission to the e xhibition,
2018 2018
the poster s essions and the special session by EPoSS.
Full conference 999 EUR 1,215 EUR
Full conference university staff 685 EUR 840 EUR Opening hours registration counter
and research institutes staff* The conference counter will open 1 hour before the beginning
Full conference students 360 EUR 360 EUR of the conference.
One conference day 650 EUR 730 EUR
Conference dinner 85 EUR 85 EUR Venue
Pre-conference field trip 55 EUR 55 EUR Hilton Dresden
IoSense Spring School 180 EUR 300 EUR An der Frauenkirche 5
Workshop 270 EUR 450 EUR 01067 Dresden, Germany
www.hiltonhotels.de/deutschland/hilton-dresden
* University staff, research institute staff and students may only register for
the full conference at special rates and must enclose a copy of their university/ Accommodation and travel
research institute ID-card.
The Hilton hotel is located in the heart of Dresden’s Old Town,
For registration on-site a last-minute-fee of 30 EUR becomes due. directly opposite the famous Frauenkirche Church. You can
All fees plus legal VAT.
reach it easily by plane, car, train or by public transportation.
Registration terms Detailed information as well as a list of hotels with special
Registration for Smart Systems Integration 2018 is binding and only rates is available at smartsystemsintegration.com/travel
accepted online at smartsystemsintegration.com/registration.
Participation fees are due upon registration with payment by credit
card (VISA, Master/Eurocard and Amex) via the Saferpay gate-
way. An invoice for the fees will be issued by mail. Please note
participation is only allowed after full payment. Once the regis-
tration process is complete, you will receive an email registra-
tion confirmation including an entry voucher to the conference,
please make sure to bring this along. Your conference docu-
ments will be issued on-site at the conference counter.
Cancellations will be accepted in writing only. Cancellations
received by Mesago by 28 February 2018 will incur a processing
fee of 85 EUR. Thereafter if the participant does not attend,
the full fee will be due. If a participant is unable to attend, a
substitute can be nominated. Mesago reserves the right to
cancel the conference due to poor bookings or other reasons
beyond our control. No further claims beyond the reimburse-
ment of participation fees already paid will be accepted. The
program or speakers are subject to change and no claims may
be made in this respect.
The conference language is English.At a glance Register now
and ensure early
bird rates!
Exhibition
The SSI conference is accompanied by an international
exhibition with exhibitors from science and industry from all
over Europe. To have a look at the exhibitors please visit
www.smartsystemsintegration.com/exhibitorlist
Conference
The Smart Systems Integration Conference offers a
comprehensive market overview and the possibility to gain
high class expertise.
Networking
Meet international specialists and industry colleagues from
around the world and make valuable contacts.
Career coaching & Job board
Human Resource professionals provide young professionals
and experienced specialists with an individual career coaching
on site. The job board allows to find out about current vacancies
offered by the exhibiting and cooperating companies as well as
research institutes and to contact potential employers directly
on site.
Organizer Co-organizer
Mesago Messe Frankfurt GmbH
Rotebuehlstraße 83– 85
70178 Stuttgart, Germany
Board of Management: Part of the activities of
Petra Haarburger
Martin Roschkowski
HRB 13344
Contact for further details In cooperation with
Mesago Messe Frankfurt GmbH
Ms. Liane Preuss
Phone: +49 711 61946-49, Fax: -1149
E-Mail: liane.preuss@mesago.comYou can also read
