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SPIE ADVANCED LITHOGRAPHY PLAN TO ATTEND The world’s premier lithography event. Conferences and Courses: 24-28 February 2019 Exhibition: 26-27 February 2019 San Jose, California, USA ADVANCE TECHNICAL PROGRAM PROGRAM CURRENT AS OF 2 NOVEMBER 2018 spie.org/AL19program
CONNECTING MINDS.
ADVANCING LIGHT.
ADVANCED
LITHOGRAPHY 2019
TECHNOLOGIES FOR LITHOGRAPHY R&D, DEVICES, TOOLS,
FABRICATION, AND SERVICES.
Conferences and Courses: 24-28 February 2019
Exhibition: 26-27 February 2019
San Jose, California, USA
One Week
Many Opportunities
CUTTING-EDGE RESEARCH
WORLD-CLASS SPEAKERS
TRAINING AND EDUCATION
FOCUSED TECHNICAL TOPICS
Register Today
spie.org/AL19program
YOUR CONFERENCE
REGISTRATION
INCLUDES:
- Conference sessions, plenaries,
panels and workshops,
technical group meetings,
and poster session
- Welcome reception
- Exhibition
- Lunches and dessert snacks
on Tuesday and Wednesday
Everything you need to know about (excluding student attendees)
the meeting is online - Coffee breaks
• Up-to-date paper listings and session times
- Breakfast breads
• Hotel, travel, and complete registration information
- A choice of Proceedings
• Schedule your week: MySchedule Tool and phone apps
• Information about local travel options
Reserve Hotel Rooms by: 31 JANUARY 2019
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Registration Rates Increase after: 8 FEBRUARY 2019
SPIE Conference App
PROGRAM CURRENT AS OF: 2 November 2018
Learn · Connect · Do Business
SPIE is the international society for optics and photonics, an educational not-for-profit organization founded in 1955 to advance light- SPIE International Headquarters SPIE Europe Office
based science, engineering, and technology. The Society serves nearly 264,000 constituents from 166 countries, offering conferences
and their published proceedings, continuing education, books, journals, and the SPIE Digital Library in support of interdisciplinary PO Box 10 2 Alexandra Gate
information exchange, professional networking, and patent precedent. SPIE provided more than $4 million in support of education Bellingham, WA 98227-0010 USA Ffordd Pengam, Cardiff, CF24 2SA UK
and outreach programs in 2018. Tel: +1 360 676 3290 Tel: +44 29 2089 4747
SPIE would like to express its deepest appreciation to the symposium chairs, conference chairs, program committees, session chairs,
Fax: +1 360 647 1445 Fax: +44 29 2089 4750
and authors who have so generously given their time and advice to make this symposium possible. help@spie.org • spie.org info@spieeurope.org • spie.org
The symposium, like our other conferences and activities, would not be possible without the dedicated contribution of our participants
and members. This program is based on commitments received up to the time of publication and is subject to change without notice.
THIS PROGRAM IS CURRENT AS OF 2 NOVEMBER 2018. Find complete, up-to-date information and create your personalized schedule at spie.org/al19program. 1
Plenary Presentations Executive Committee
pages 6–7 Ofer Adan, Applied Materials (Israel)
Jason P. Cain, Advanced Micro Devices, Inc. (USA)
Don’t miss these world-class speakers discussing the Will Conley, Cymer – An ASML company (USA)
latest directions and most promising breakthroughs. Nelson Felix, IBM Corp. (USA)
Kenneth A. Goldberg, Lawrence Berkeley National Lab.
(USA)
Roel Gronheid, KLA-Tencor/ICOS Belgium (Belgium)
Jongwook Kye, SAMSUNG Electronics Co., Ltd. (Korea.
Republic of)
Special Events Catherine B. Labelle, Consultant (USA)
Kafai Lai, IBM T.J. Watson Research Ctr. (USA)
page 8 Soichi Owa, Nikon Corp. (Japan)
Eric M. Panning, Intel Corp. (USA)
Join your peers and colleagues at these special
Martha I. Sanchez, IBM Research – Almaden (USA)
events including the Welcome Reception, and a
panel discussion on Lithography Scaling: Is this Daniel P. Sanders, IBM Research – Almaden (USA)
the end? Vladimir A. Ukraintsev, Qorvo™ (USA)
Richard Wise, Lam Research Corp. (USA)
Chi-Min Yuan, NXP Semiconductors (USA)
Advisory Committee
Award Announcements Robert D. Allen, IBM Research - Almaden (USA)
page 9 William H. Arnold, ASML US, Inc. (USA)
Timothy A. Brunner, GLOBALFOUNDRIES Inc. (USA)
Don't miss any of the award announcemnts and Ralph R. Dammel, EMD Performance Materials Corp. (USA)
presenations at 2019 Advanced Lithography. Donis G. Flagello, Nikon Research Corp. of America (USA)
Harry J. Levinson, HJL Lithography (USA)
Burn Lin, National Tsing Hua Univ. (Taiwan)
Chris A. Mack, Fractilia, LLC (USA)
Christopher J. Progler, Photronics, Inc. (USA)
Bruce W. Smith, Rochester Institute of Technology (USA)
Exhibition C. Grant Willson, The Univ. of Texas at Austin (USA)
Anthony Yen, ASML US, LP (USA)
page 11
Exhibit at SPIE Advanced Lithography. Join global
suppliers for lithography research and development,
devices, tools, fabrication, and services.
2 SPIE ADVANCED LITHOGRAPHY 2019 · spie.org/al19program · #SPIELitho ·
Join industry leaders to solve the latest challenges
in lithography and patterning in the semiconductor industry.
Conferences: Hear the latest advancements in optical lithography, metrology, or EUV.
Extreme Ultraviolet (EUV) Lithography X (Goldberg) . . . . . . . . . . . . 14–44
APPLICATION TRACKS
Novel Patterning Technologies for Semiconductors, MEMS/NEMS
and MOEMS 2019 (Sanchez) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–46 Look for these icons to help you
easily locate presentations you
Metrology, Inspection, and Process Control for Microlithography want to attend on these hot topics.
XXXIII (Ukraintsev) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–47 The presentations are scheduled to
prevent timing conflicts.
Advances in Patterning Materials and Processes XXXVI (Gronheld) 14–46
Optical Microlithography XXXII (Kye) . . . . . . . . . . . . . . . . . . . . . . . . . . . 15–29
Design-Process-Technology Co-optimization for Overlay Machine
Stochastics
Manufacturability XIII (Cain) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15–46 Learning
7 CONFERENCES
Advanced Etch Technology for Nanopatterning VIII (Wise) . . . . . . . 15–35
Courses: Stay competitive. Optimal training for career enhancement, taught by recognized experts in industry and academia.
SC101: Introduction to Microlithography: Theory, SC1263: NEW Stochastic Lithography, (Mack, Petersen), p. 53
Materials, and Processing, (Willson, Bowden,
Dammel), . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 49 SC1264: NEW Machine Learning for Lithography,
(Shiely), . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . p. 53
SC1099: Chemistry and Lithography, (Okoroanyanwu), p. 50
SC885: Principles and Practical Implementation of
SC1100: Scatterometry in Profile, Overlay and Focus Multiple Patterning, (Dusa, Hsu), . . . . . . . . . . p. 54
Process Control, (Cramer, Turovets) . . . . . . . . p. 50
SC888: EUV Lithography, (Bakshi, Ahn, Naulleau), . . p. 55
SC1132: Computational Basis for Advanced
Lithography Techniques, (Lai), . . . . . . . . . . . p. 51 SC992: Lithography Integration for Semiconductor
FEOL & BEOL Fabrication, (Lin, Zhang), . . . . p. 56
SC1133: Advanced concepts in Metrology Toolset
Stability and Matching, (Solecky, Adan), . . . . p. 51 SC1030: Interaction of Physical Design and
13 COURSES Lithography, (Yuan), . . . . . . . . . . . . . . . . . . . . p. 49
SC1158: Metrology of Image Placement, (Starikov), . . p. 52
SC616: Practical Photoresist Processing, (Dammel), p. 54
DAILY EVENT SCHEDULE . . . . . . . . . . . . . . . . . . . . . . . 4 GENERAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . 58–60
EVENT SPONSORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Registration · Author/Presenter Information · Policies ·
Food and Beverage · Onsite Services · Parking and Car Rental
TECHNICAL CONFERENCE
SPIE POLICIES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62–63
SESSION SCHEDULE . . . . . . . . . . . . . . . . . . . . . . . . . 12–13
PROCEEDINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
THIS PROGRAM IS CURRENT AS OF 2 NOVEMBER 2018. Find complete, up-to-date information and create your personalized schedule at spie.org/al19program. 3
DAILY SCHEDULE
SUNDAY MONDAY TUESDAY WEDNESDAY THURSDAY
Special Events Welcome and Announcements (Conley, Lai), Symposium-wide Panel Discussion - Women in Optics Networking Lunch, 12:00 Award Announcement for Conf. 10959:
8:00 am to 8:30 am, p. 6 Lithography Scaling: Is This the End? to 1:00 pm, p. 8 Presentation of the 2019 Karel Urbanek
(Levinson, Mack), 6:00 to 8:00 pm, p. 8 Best Student Paper Award, 10:20 to 10:30
Plenary Presentation: The Future is Quantum, Poster Session, 5:30 to 7:30 pm, p. 8
am, p. 9
8:30 to 9:10 am, (Gil), p. 6
Plenary Presentation: 3D NAND Flash Award Announcement for Conf. 10961:
Technology: Roadmap, Process, Design and Presentation of the 2019 Cymer Leadership
for Best Student Paper Award, 10:20 to
Challenges, 9:10 to 9:50 am, (Choe), p. 6 EXHIBITION, p. 11 10:30 am, p. 9
10:00 am to 5:00 pm 10:00 am to 4:00 pm
Plenary Presentation: Patterning Process
Innovation in 3D NAND, (Steen, van
Schravendijk, Kubis, Cromwijk, Kattouw), 9:50
to 10:30 am, p. 7
Award Announcement for Conf. 10959:
Presentation of the 2018 Diana Nyyssonen
Memorial Award for Best Paper in
Metrology, 11:00 to 11:15 am, p. 9
Award Announcement for Conf. 10960:
Presentation of the 2018 C. Grant Willson
Award for Best Paper, 2018 Hiroshi Ito
Memorial Award for the Best Student
Paper, and 2018 Jeffrey Byers Memorial
Best Poster Award, 2:00 to 2:20 pm, p. 9
SPIE Fellow Member and Student Luncheon,
12:30 to 1:30 pm, p. 8
Welcome Reception, 6:00 to 7:00 pm, p. 8
Panel Discussion: Nanotechnology in
Microlithography: Intersecting the Quantum
Future and the Semiconductor Industry
(Barnes, Kline), 7:10 to 8:40 pm, p. 8
Conferences Conf. 10957 Extreme Ultraviolet (EUV) Lithography X (Goldberg), p. 14–44
Conf. 10958 Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2019 (Sanchez), p. 14–46
Conf. 10959 Metrology, Inspection, and Process Control for Microlithography XXXIII (Ukraintsev), p. 14–47
Conf. 10960 Advances in Patterning Materials and Processes XXXVI (Gronheld), p. 14–46
Conf. 10961 Optical Microlithography XXXII (Kye), p. 15–29
Conf. 10963 Advanced Etch Technology for Nanopatterning VIII (Wise), p. 15–35 Conf. 10962 Design-Process-Technology Co-optimization for Manufacturability XIII
(Cain), p. 15–46
COURSES: Sunday, Monday, and Thursday
See Course schedule and course
descriptions pages 49–55.
4 SPIE ADVANCED LITHOGRAPHY 2019 · spie.org/al19program · #SPIELitho ·
ATTEND THE
Plan to Attend
LEADING EVENT FOR THE
LITHOGRAPHY COMMUNITY For over 40 years, SPIE Advanced Lithography has played a key role in bringing together the
micro- and nanolithography community. Lithography continues to be challenged to extend
into ever-shrinking generations, yet remain manufacturable and cost effective. State-of-
the-art processes continue with immersion lithography and multiple patterning while EUV
lithography moves closer toward production readiness. At the same time, the lithography
2019 community aggressively pursues alternative patterning approaches and complementary solu-
tions. Success calls for unique interdisciplinary interactions and coordinated efforts between
lithographers, layout designers, materials scientists, and metrology/process control engineers
to enable cost-efficient patterning solutions.
A full spectrum of lithography and patterning topics are encompassed by this year’s sym-
posium across seven complementary conferences. Participants come from a broad array of
backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology,
materials, etch, design, process integration, and novel new approaches. Through provocative
2,200 panel discussions and seminars, the symposium also probes current issues being faced as
ATTENDEES we extend current methods, move toward alternative approaches, and identify new ways to
complement one technology with another.
3 Over the years, SPIE Advanced Lithography has provided the unique and primary forum for
PLENARY meeting and interacting with a wide range of industry experts, researchers, and key players
PRESENTATIONS working on patterning technology development. Attendance ensures that participants learn
and share the latest developments in areas of central importance to many vital technology
500 fields.
PAPERS
All conferences are organized by current practitioners of the art, Conference Chairs, working
together with organizing committees that are experts in these fields. Numerous courses have
13 also been organized, which are taught by recognized experts from industry and academia.
COURSES Additional information is available from the many manufacturers' exhibits that allow tool
makers, material suppliers, and software groups to showcase new products while interacting
one-on-one with participants.
NETWORKING
EVENTS We welcome you for SPIE Advanced Lithography's 44th year!
2019 SYMPOSIUM CHAIRS
60
COMPANIES
Will Conley Kafai Lai
Cymer—An ASML IBM T.J. Watson
company (USA) Research Ctr.
EXHIBITION (USA)
Meet top suppliers showcasing the newest products,
innovations, and cutting-edge technologies. Discuss
specific requirements face-to-face.
THIS PROGRAM IS CURRENT AS OF 2 NOVEMBER 2018. Find complete, up-to-date information and create your personalized schedule at spie.org/al19program. 5
WELCOME, AND PLENARY PRESENTATIONS
Monday 25 February 2019 · 8:00 am to 10:30 am
8:30 to 9:10 am 9:10 to 9:50 am
Convention Center, Grand Ballroom 220A
The Future is Quantum 3D NAND Flash Technology: Roadmap,
Process, Design and Challenges
Dario Gil
8:00 am to 8:30 am Jeongdong Choe
Chief Operating Officer, IBM Research (USA)
Welcome and Announcements Some of the most important technical advances
Senior Technical Fellow, TechInsights (Canada)
Symposium Chairs: Will Conley, Cymer-An ASML Company (USA) of the 20th century were enabled by decades Due to many of technical barriers and issues on
and Kafai Lai, IBM T. J. Watson Research Ctr. (USA) of fundamental scientific exploration, whose manufacturing 2D NAND Flash devices such as
initial purpose was simply to extend human quadruple patterning technology (QPT), air-gap
· Introduction of New SPIE Fellows understanding. This era marked the creation process, crosstalk/interference and CG/FG lean-
and widespread usage of “classical” computers, ing, 3D NAND Flash architectures represent an
· Presentation of the Zernike Awards which represent information as bits – 0 and 1. Despite the contin- opportunity to overcome the limitations of pla-
ued computational advances we have experienced over the past nar technology. Now, 3D NAND Flash technology is popular in in-
· Presentation of the Nick Cobb century, there are still many important and relevant problems dustry and commercial market, and it is one of the most prominent
Memorial Scholarship that “classical” computers cannot solve. integrated solution for the nonvolatile storage devices including
SSD and high volumes of data. After Samsung mass-produced
We are witnessing rapid progress in a new computing paradigm
their modified TCAT 3D V-NAND with 24L in 2013, Toshiba/West-
– Quantum Computing. Quantum computing takes advantage of
ern Digital BiCS, SK Hynix P-BiCS and Micron/Intel 3D FG CuA
the laws of quantum mechanics found in nature and represents
8:30 to 10:30 am have been commercialized. Already, all the major NAND players
a fundamental change from classical information processing.
reached up to 64L/72L and even more than 90L. Although NAND
Two properties of quantum behavior – superposition and en-
Plenary Presentations tanglement – may allow quantum computers to one day address
players are now free from QPT, 3D NAND technology challenges
for further scaling down on 3D NAND process integration such
problems intractable for today’s conventional classical machines.
as very high aspect ratio channel and source contact formation,
Plenary presentations During this talk, I will give an overview of quantum computing, charge leakage from trap layer, forming staircase/word line pad
sponsored by what it means for the future of technology, and how we can connection and multi-stack cell architecture are still on the list
separate hype from reality. of their technology barriers. Different cell layouts/design, masks,
Dario Gil is the Chief Operating Officer of IBM Research, a global patterning (Photolithography and Etching), process integration/
organization with over 3,000 researchers across 13 laboratories sequence and materials have been used for each 3D NAND ar-
and 21 locations devoted to advancing the frontiers of information chitecture. The general scaling trend for every 3D NAND Flash
technology. As COO, Dr. Gil is responsible for guiding the strategic technology is to increase the number of integrated layers. How
agenda of IBM Research, defining IBM’s annual Global Technol- to successfully reach out the process integration for the next 3D
ogy Outlook, driving operations and financial plan execution, and NAND generation? We’ll review recent progress on 3D NAND cell
establishing partnerships with companies and universities world- architecture from major 3D NAND players. Future challenges/
wide. As the Vice President of AI and Quantum Computing, Dr. direction and prospection will be discussed as well.
Gil is also responsible for IBM’s global research efforts in artificial Jeongdong Choe has a Ph.D. in electronic engineering and 26+
intelligence and for IBM's quantum computing program. He co- years’ experience in semiconductor process integration for DRAM,
chairs the MIT-IBM Watson AI Lab along with Professor Anantha (V) NAND, SRAM and logic devices. Dr. Choe’s background in-
Chandrakasan, Dean of the MIT School of Engineering. Dr. Gil’s cludes positions as a Team Lead in R&D for SK-Hynix and Samsung,
research results have appeared in over 20 international journals where he optimized process and device architectures with state-
and conferences and he is the author of numerous patents. Dr. of-the-art technologies for mass production. He received a Ph.
Gil is an elected member of the IBM Academy of Technology. D., Electronics (Semiconductor) at Sungkyunkwan Univ.; a Master
He received his Ph.D. in Electrical Engineering and Computer Degree, Materials Engineering (Metallurgical) at Yonsei Univ.;
Science from MIT. a Bachelor’s Degree, Metallurgical Engineering at Yonsei Univ.
6 SPIE ADVANCED LITHOGRAPHY 2019 · spie.org/al19program · #SPIELitho ·
WELCOME, AND PLENARY PRESENTATIONS
results in reliability concerns. In order to circumvent this limitation Bart van Schravendijk is currently Chief Technical Officer, Di-
9:50 to 10:30 am Toshiba proposed a bit cost scaling architecture with the memory electrics at Lam Research Corporation, Fremont, CA, USA. At
devices stacked on each other, what we now call 3D NAND. First Lam, he is focused on emerging technologies in the dielectric
Patterning Process Innovation in 3D demonstrated by Toshiba at VLSI 2007, it wasn’t until 2013 when deposition area. In recent years these have found their applica-
NAND the first chips were commercially available from Samsung. tion in VNAND, MRAM and Phase Change memories. He has 30+
The revolutionary 3D NAND device drives greater process and years of experience in wafer fabrication equipment development,
Steven Steen integration complexity than any device in the past. Node transi- process technology and process integration. He has authored over
Director, Product Management-3D Memory tions now target a layer increase above lateral scaling and up to 95 patents and numerous publications.
Software, ASML (Netherlands) 96 layers of devices are currently being produced. The devices Michael Kubis holds a PhD in physics. He worked 5 years in ma-
in the entire stack are patterned in a single pass using a high as- terial science research before joining Semiconductor Industry
pect ratio etch and subsequent gate stack & channel multi-layer in 2001. He worked as Process Engineer and Senior Manager in
deposition. We will discuss how many of the process parameters Deep-Trench technology DRAM R&D and HVM until joining ASML
impact the formation of yielding devices. Variations in the layer in 2010 were he became System Engineer for on-product overlay
Bart van Schravendijk stack uniformity, stress management, alignment, imaging, hard applications. He is now Senior Manager of the System Engineering
mask transfer & the high aspect ratio etches all require careful Patterning Team at ASML.
Chief Technology Officer, Dielectrics, Lam attention and in certain cases new capabilities for optimal results.
Research Corp. (USA) Jan Willem Cromwijk is Product System Engineer for 3D Memory
Different integration approaches with multi-tier approaches split Solutions in ASML. He studied Mechanical Engineering at Univer-
the layers to reduce patterning cost and complexity. sity of Twente, and graduated in the department of Fluid Dynamics
Formation of the contacts to every device layer is a second aspect and Heat Transfer on Modelling of Cavitation and Two-phase flows.
of the 3D revolution. This area has undergone a transformation After a year at Cambridge University, Department of Applied
through the holistic optimization of the patterning processes. Mathematics and Theoretical Physics, he started at TNO, the
We will discuss how staircase patterning has evolved from linear Netherlands Organization for Applied Scientific Research. In
Micheal Kubis single step staircases to highly efficient binary staircases to save 1997 he joined Philips, in several positions within Research and
Senior Management System Engineer, ASML on cost, cycle time and yields. The patterning doesn’t require high Development of Philips Innovations Services and Philips Light-
(Netherlands) end lithography and proven technology can be used if key chal- ing. In 2007 he joined ASML, as System Engineer for Immersion,
lenges are met such as edge placement error, thick resist imaging NXE 3100, in the EUV Source program, and since 2016 in the 3D
in combination with resist and etch contributions. Memory Solutions program.
The process innovations in 3D NAND are continuing to drive down Hans Kattouw studied Applied Physics at the University of Twente
cost, improve yields and result in an ever improving bit cost. in the department of Low Temperatures and Superconductivity.
Jan Willem Cromwijk Creativity and perseverance will continue to drive Moore’s Law. After working as an IT consultant, he joined ASML in 2000 where
Product System Engineer, ASML (Netherlands) Steven Steen is director of Product Management at ASML. In he has held several positions within Development & Engineer-
this role he is responsible for the 3D Memory product portfolio ing, Customer Service, Product Management and now System
at ASML. He studied at the Hogeschool Enschede and started Engineering. He has worked on the development of immersion
his career at IBM’s T.J. Watson Research Center during the final lithography, and has extensive knowledge on focus, overlay and
stages of his education. 3D NAND process and device technology. In his free time, he plays
Leading edge innovation is the consistent thread during his 20 electric guitar and climbs mountains.
years’ experience in semiconductor R&D (of which 15 in lithog-
Hans Kattouw
raphy). Steven joined IBM in 1997 to develop and commercialize Coffee Break 10:30 am to 11:00 am
System Engineer for 3D NAND device and ap- full chip timing diagnostics through Picosecond Imaging Circuit
plications, ASML (Netherlands) Analysis. In 2001, Steven joined the microelectronics research line
and started his career in lithography there. During a wide variety
of roles he worked to realize numerous device technologies and
business opportunities. He moved to the Netherlands and joined
ASML in 2012 to lead the definition and development of innova-
NAND Flash has grown from an infant technology to a crucial tions and unique product offerings to ASML’s customers. Holder
building block of modern appliances. Introduced in 1989 [XX], the of over 22 US Patents and 35 published research papers, Steven
technology has enabled ever-increasing storage capacity through continues to think of new applications and the challenges of the
scaling the underlying device structures. The end of scaling was future. Outside of work he is often found near the water for sail-
reached with too few electrons defining the memory state which ing, swimming or other forms of water sports.
THIS PROGRAM IS CURRENT AS OF 2 NOVEMBER 2018. Find complete, up-to-date information and create your personalized schedule at spie.org/al19program. 7
SPECIAL EVENTS
Technical Events Symposium-wide Panel Discussion
Social Networking Events
Nanotechnology in Microlithography Tuesday 26 February 2019 · 6:00 to 8:00 pm SPIE Fellow Member and
Panel on Intersecting the Quantum Location: Convention Center, Grand Ballroom Student Luncheon
Future and the Semiconductor Industry 220A Monday 25 February 2019 · 12:30 to 1:30 pm
Monday 25 February 2019 · 7:10 to 8:40 pm Lithography Scaling: Is This the End? Location: Marriott, Salon I
Location: Convention Center, Grand Ballroom Moderators: Harry J. Levinson, HJL Lithography (USA); Student conference attendees and SPIE Fellow Members are
220C Chris A. Mack, Fractilla (USA) invited to this engaging networking lunch. This event gives stu-
Moderators: Bryan M. Barnes and R. Joseph Kline, NIST (USA) Lithography scaling has been the main driver of Moore’s dents an opportunity to network with SPIE Fellows who will share
Law for many decades, but lately scaling has slowed. The their insights into career paths in lithography. Lunch is com-
Quantum computing has been a long-anticipated emerging plimentary. Fellow Members will receive a personal invitation,
computational paradigm to complement and compete with difficulties of extending 193-nm immersion multiple pat-
terning, the lack of manufacturing readiness of EUV, and student seating is available on a first-come, first-served basis.
conventional CMOS technologies. The last decade has featured
reports of the initial development of using CMOS processing difficulties in scaling the transistor gate pitch means that
techniques for qubits and the atomistic fabrication of single atom semiconductor manufacturers have looked elsewhere for
transistors. Will the semiconductor industry embrace this new so-called "scaling boosters": new materials, new transis- Welcome Reception
architype, and if so, how? When quantum devices begin to scale tor architectures, vertical integration, and new design
approaches that can increase density without lithography Monday 25 February 2019 · 6:00 to 7:00 pm
as predicted, will our industry be ready to integrate radically
different architectures and device structures? Are there known scaling. Moreover, stochastics could potentially limit the Location: Convention Center, Ballroom Con-
obstacles not yet addressed that would enable the industry to yield of all lithography-scaled features at some dimension. course
more readily adopt and benefit from today’s achievements in the Is this the end of scaling? If so, what will come next? This
cross-symposium panel will bring in experts from every Join your colleagues at the Welcome Reception. Relax,
laboratory? What are the emerging designs and the potential
conference to discuss these and other critical issues af- socialize, and enjoy beverages and hors-d'oeuvres on the
fundamental challenges that are to be overcome? We have as-
fecting the future of our community. first night of the conference. All attendees welcome.
sembled a panel of experts that will share their insights on the
state-of-the-art in quantum computing as well as intellectual Beverage tickets are included with your paid conference
leaders that will share their vision of the eventual merger of registration. Please remember to wear your registration
these new technologies with our computing capabilities today, badge. Dress is casual.
even as lithography is approaching the near-atomic domain.
Join us as we discuss the impending critical impact of quantum
Poster Session
computing on the semiconductor industry. Wednesday 27 February 2019 · 5:30 to 7:30 pm
Location: Convention Center, Hall 2 Women in Optics Networking Lunch
Posters will be on display from 10:00 am to 5:00 pm on Wednes- Wednesday 27 February 2019 · 12:00 to 1:00 pm
day, and from 5:30 pm to 7:30 pm during the poster session.
Location: Convention Center, Room 114
Come to view the high quality papers that are presented in this
alternative format and interact with the poster authors who will Join other women in the field for informal discussions and net-
be present during the poster session. Enjoy light refreshments working during the scheduled lunch on Wednesday. Welcome
while networking with your colleagues. and opening remarks by Dr. Emily Gallagher.
Full author or technical registration is required for entry into the Emily Gallagher is a Principal Member of
poster session. Please wear your registration badge. Technical Staff at IMEC, focusing on pellicle
Sponsored by membrane development, EUV imaging and
photomasks. Emily received her PhD in physics
studying free electron lasers before shifting
to the semiconductor industry. She worked at
IBM Microelectronics, working in wafer pro-
cess, device characterization, and lithography
before leading EUV mask development. She
has authored over 80 technical papers, holds ~20 patents, and
is an SPIE Fellow.
8 SPIE ADVANCED LITHOGRAPHY 2019 · spie.org/al19program · #SPIELitho ·AWARD ANNOUNCEMENTS
Nick Cobb Memorial Scholarship Advances in Patterning Materials and Optical Microlithography (10961)
Monday 25 February 2019 • 8:00 to 8:30 am Processing Technology (10960)
Monday 25 February 2019 • 2:00 to 2:20 pm Presentation of the 2019 Cymer
Sponsored by
Leadership for Best Student Paper Award
Presentation of the 2018 C. Grant Willson Award Sponsored by
Award for Best Paper
and
Presentation of the 2018 Hiroshi Ito
Metrology, Inspection, and Process Memorial Award for the Best Student
Control for Microlithography (10959) Paper
Monday 25 February 2019 • 11:00 to 11:15 am
These Awards Sponsored by
Presentation of the 2018 Diana Nyyssonen
Memorial Award for Best Paper in
Metrology
Presentation of the 2018 Jeffrey Byers
Award Sponsored by Memorial Best Poster Award
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TM
Thursday 28 February 2019 • 10:20 to 10:30 am
Presentation of the 2019 Karel Urbanek
Best Student Paper Award
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10 SPIE ADVANCED LITHOGRAPHY 2019 · spie.org/al19program · #SPIELitho ·EXHIBITION
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- Etch technology for nanoprinting Abeam Technologies, Inc.
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C&D Semiconductor Services, Inc.
- Metrology, inspection, OPC, and
process control Cadence Design Systems, Inc.
Canon U.S.A. Inc.
- Design and manufacturing software
Carl Zeiss SMT GmbH
- Materials and chemicals Cosmotec, Inc.
- Imaging equipment Coventor, Inc.
- Lasers Energetiq Technology, Inc.
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- Resist materials and processing
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Inspectrology LLC Pall Corp. Solid State Technology
Tuesday 26 February 2019 J.A. Woollam PCAS Canada Synopsys, Inc.
10:00 am to 5:00 pm JENOPTIK Optical Systems, LLC Philips Innovation Services Tokyo Electron America, Inc.
Wednesday 27 February 2019 JEOL USA Inc. Philips SCIL Nanoimprint Solutions Vistec Electron Beam GmbH
10:00 am to 4:00 pm JSR Micro, Inc. Pozzetta, Inc. XEI Scientific, Inc.
San Jose Convention Center Hall 1 King Industries Inc. Qoniac GmbH Zygo Corporation
Contact SPIE Sales to Exhibit: Tel: +1 360 676 3290 · Fax: +1 360 647 1445 · SPIESales@spie.org
THIS PROGRAM IS CURRENT AS OF 2 NOVEMBER 2018. Find complete, up-to-date information and create your personalized schedule at spie.org/al19program. 11SESSION SCHEDULE
CONFERENCE 10957 CONFERENCE 10958 CONFERENCE 10959
Extreme Ultraviolet (EUV) Novel Patterning Technologies for Metrology, Inspection, and Process
Lithography X Semiconductors, MEMS/NEMS and Control for Microlithography XXXIII
MOEMS 2019
Monday
25 February Session 1 · Mon 11:00 am to 12:20 pm
Keynote Session Opening Remarks and Award
Announcement · 11:00 am to 11:15 am
Session 1 · Mon 11:15 am to 12:25 pm
Keynote Session
Session 2 · Mon 2:00 pm to 3:20 pm Session 2 · Mon 1:30 pm to 3:10 pm
The Future is High NA Overlay News
Session 3 · Mon 3:50 pm to 5:30 pm Opening Remarks · 3:30 pm to 3:50 pm Session 3 · Mon 3:40 pm to 5:20 pm
Inorganic Resists: Joint session with conferences 10960 Challenges and New Methods
and 10957 Session 1 · Mon 3:50 pm to 5:10 pm
Keynote Session
Tuesday Session 4 · Tue 8:00 am to 10:00 am Session 2 · Tue 8:00 am to 10:00 am Session 4 · Tue 8:00 am to 10:00 am
26 February Stochastics and Exposure Mechanisms: Joint session MEMS/NEMS and MOEMS I Inspection I
with conferences 10960 and 10957
Session 3 · Tue 10:30 am to 12:10 pm Session 5 · Tue 10:30 am to 12:10 pm
Session 5 · Tue 10:30 am to 11:50 am MEMS/NEMS/and MOEMS II Advances in Physical Characterization
Order from Chaos: Stochastic Modeling
Session 4 · Tue 1:40 pm to 3:20 pm Session 6 · Tue 1:30 pm to 3:10 pm
EUV Poster Preview Speed Talks I · 11:50 am to 12:10 pm LWR
Nanoimprint Lithography I: Technology
Session 6 · Tue 1:40 pm to 3:20 pm Session 7 · Tue 3:40 pm to 5:20 pm
Session 5 · Tue 3:50 pm to 5:50 pm
EUV Mask Fidelity New Methods: Student Session
Nanoimprint Lithography II: Manufacturing
Session 7 · Tue 3:50 pm to 4:50 pm
Printing at the Edge: EUV Patterning Applications
Wednesday Session 8 · Wed 8:00 am to 10:00 am Session 6 · Wed 8:00 a m to 10:00 am Session 8 · Wed 8:00 am to 10:00 am
27 February EUV Patterning and Etch:Joint session with conferences Multi-beam Lithography: Invited Session Machine Learning
10957 and 10963
Session 7 · Wed 10:30 am to 12:10 pm Session 9 · Wed 10:30 am to 12:10 pm
Session 9 · Wed 10:30 am to 12:10 pm Directed Self-assembly I: Joint session with SEM
EUV Masks, Defects, and Pellicles conferences 10960 and 10958
Session 10 · Wed 1:40 pm to 3:00 pm
EUV Imaging Enhancement I Session 10 · Wed 1:30 pm to 3:10 pm
Session 8 · Wed 1:40 pm to 3:20 pm SEM and e-Beam Metrology
EUV Poster Preview Speed Talks II · 3:00 to 3:20 pm
Novel Patterning and Applications I
Session 11 · Wed 3:50 pm to 4:50 pm Session 11 · Wed 3:40 pm to 5:20 pm
EUV Imaging Enhancement II Session 9 · Wed 3:50 pm to 4:50 pm Overlay
3-D Printing and Structures: Invited Session
EUV Poster Preview Speed Talks III · 4:50 to 5:10 pm
Thursday Session 12 · Thu 8:00 am to 10:00 am Session 10 · Thu 8:00 am to 10:00 am Session 12 · Thu 8:00 am to 10:00 am
28 February Progress in EUV Sources Quantum/Neuromorphic Computing: Invited Session Design Interactions with Metrology:Joint session with
conferences 10959 and 10962
Session 13 · Thu 10:30 am to 12:10 pm Session 11 · Thu 10:30 am to 12:10 pm 2019 Karel Ubanek Best Student Paper Award
EUV OPC and Modeling: Joint session with conferences Novel Patterning and Applications II Presentation · 10:20 to 10:30 am
10957 and 10962
Session 12 · Thu 1:30 pm to 2:30 pm Session 13 · Thu 10:30 am to 12:10 pm
Novel Materials/Novel Directed Self-assembly Process Control
Session 14 · Thu 1:30 pm to 3:10 pm
Inspection II
Session 15 · Thu 3:40 pm to 5:20 pm
Optical Metrology and Late News
12 SPIE ADVANCED LITHOGRAPHY 2019 · spie.org/al19program · #SPIELitho ·SESSION SCHEDULE
CONFERENCE 10960 CONFERENCE 10961 CONFERENCE 10962 CONFERENCE 10963
Advances in Patterning Optical Microlithography Design-Process-Technology Advanced Etch Technology
Materials and Processes XXXVI XXXII Co-optimization for for Nanopatterning VIII
Manufacturability XIII
Opening Remarks and Award Announcements Session 1 · Mon 1:30 pm to 3:30 pm
· 2:00 pm to 2:20 pm Keynote Session: Plasma Based Patterning
Session 1 · Mon 2:20 pm to 3:20 pm Innovations
Keynote Session Session 2 · Mon 4:00 pm to 6:00 pm
Session 2 · Mon 3:50 pm to 5:30 pm Materials and Etch Integration
Inorganic Resists: Joint session with conferences
10960 and 10957
Session 3 · Tue 8:00 am to 10:00 am Opening Remarks · 8:00 am to 8:20 am
Stochastics and Exposure Mechanisms: Session 1 · Tue 8:20 am to 10:00 am
Joint session with conferences 10960 and 10957 Keynote Session
Session 4 · Tue 10:30 am to 12:10 pm Session 2 · Tue 10:30 am to 12:10 pm
EUV Resists Machine Learning and Computational
Lithography I Session 3 · Tue 1:30 pm to 3:10 pm
Session 5 · Tue 1:40 pm to 3:20 pm
Patterning Process Control and Computational
Resist Fundamentals Session 3 · Tue 1:40 pm to 3:20 pm Patterning
Session 6 · Tue 3:50 pm to 5:10 pm Machine Learning and Computational
Lithography II Session 4 · Tue 3:40 pm to 5:40 pm
Integration
Atomic Layer Etching and Novel Plasma
Session 4 · Tue 3:50 pm to 5:30 pm Techniques
Resist Modeling and Process Control
Session 7 · Wed 8:10 am to 10:00 am Session 5 · Wed 8:00 am to 9:40 am Session 1 · Wed 8:00 am to 10:00 am Session 5 · Wed 8:00 am to 10:00 am
Monolayer Materials in Device Fabrication Lithography Equipment Design-Technology Co-optimization EUV Patterning and Etch: Joint session with
conferences 10957 and 10963
Session 8 · Wed 10:30 am to 12:10 pm Closing Remarks · 9:40 am to 10:00 am Session 2 · Wed 10:30 am to 12:10 pm
Directed Self-assembly I: Joint session with Layout Analytics Session 6 · Wed 10:30 am to 12:10 pm
conferences 10960 and 10958 Patterning Solutions for Emerging
Applications
Session 9 · Wed 1:40 pm to 3:20 pm
Directed Self-assembly II: Defectivity Session 3 · Wed 1:40 pm to 3:20 pm Session 7 · Wed 1:40 pm to 3:20 pm
Machine Learning Advanced Patterning Integration
Session 10 · Wed 3:50 pm to 4:50 pm
Student Session Session 4 · Wed 3:50 pm to 5:30 pm Session 8 · Wed 3:50 pm to 5:10 pm
Process Modeling and Layout Optimization Patterning Solutions for Emerging
Poster Preview Speed Talks · 4:50 to 5:20 pm Applications II
Session 11 · Thu 8:00 am to 10:00 am APPLICATION TRACKS
Material Supplier Session 5 · Thu 8:00 am to 10:00 am Easily find sessions on these three important
Session 12 · Thu 10:30 am to 12:10 pm Design Interactions with Metrology: Joint topics within the program. Each conference has
Underlayers session with conferences 10959 and 10962 grouped the applicable presentations together
Tribute to C. Grant Willson (retiring in 2019) Session 6 · Thu 10:30 am to 12:10 pm and do not overlap with other conferences.
· 1:40 pm to 5:00 pm EUV OPC and Modeling: Joint session with • Machine Learning
conferences 10957 and 10962
Session 7 · Thu 1:30 pm to 3:30 pm • Stochastics
Hotspot Detection
• Overlay
THIS PROGRAM IS CURRENT AS OF 2 NOVEMBER 2018. Find complete, up-to-date information and create your personalized schedule at spie.org/al19program. 13CONFERENCE 10957 CONFERENCE 10958 CONFERENCE 10959 CONFERENCE 10960
Monday–Thursday Monday–Thursday Monday–Thursday Monday–Thursday
25–28 February 2019 25–28 February 2019 25–28 February 2019 25–28 February 2019
Proceedings of SPIE Vol. 10957 Proceedings of SPIE Vol. 10958 Proceedings of SPIE Vol. 10959 Proceedings of SPIE Vol. 10960
Extreme Ultraviolet Novel Patterning Metrology, Advances in
(EUV) Lithography X Technologies for Inspection, and Patterning Materials
Conference Chair: Kenneth A. Goldberg,
Lawrence Berkeley National Lab. (USA)
Semiconductors, Process Control for and Processes XXXVI
Conference Co-Chair: Nelson M. Felix, IBM MEMS/NEMS and Microlithography Conference Chair: Roel Gronheid, KLA-Tencor/
ICOS Belgium (Belgium)
Corp. (USA)
Program Committee: Jos P. Benschop, ASML
MOEMS 2019 XXXIII Conference Co-Chair: Daniel P. Sanders, IBM
Research - Almaden (USA)
Netherlands B.V. (Netherlands); Robert L. Conference Chair: Martha I. Sanchez, IBM Conference Chair: Vladimir A. Ukraintsev,
Brainard, SUNY CNSE/SUNYIT (USA); Martin Research - Almaden (USA) Qorvo Corp. (USA) Program Committee: Robert Allen, IBM
Burkhardt, IBM Thomas J. Watson Research Research - Almaden (USA); Gilles R. Amblard,
Conference Co-Chair: Eric M. Panning, Intel Conference Co-Chair: Ofer Adan, Applied
Ctr. (USA); Sonia Castellanos Ortega, Advanced SAMSUNG Austin Semiconductor LLC (USA);
Corp. (USA) Materials (Israel)
Research Ctr. for Nanolithography (Netherlands); Ramakrishnan Ayothi, JSR Micro, Inc. (USA);
Xuemei Chen, GLOBALFOUNDRIES Inc. (USA); Program Committee: Alan D. Brodie, KLA- Program Committee: John A. Allgair, BRIDG Ryan Callahan, FUJIFILM Electronic Materials
Deniz Elizabeth Civay, GLOBALFOUNDRIES Tencor Corp. (USA); Juan J. de Pablo, The (USA); Masafumi Asano, Tokyo Electron U.S.A., Inc. (USA); Joy Y. Cheng, Taiwan
Inc. (USA); Daniel Corliss, IBM Corp. Univ. of Chicago (USA); Richard A. Farrell, TEL Ltd. (Japan); Benjamin D. Bunday, Abeam Semiconductor Manufacturing Co. Ltd. (Taiwan);
(USA); Yasin Ekinci, Paul Scherrer Institut Technology Ctr., America, LLC (USA); Naoya Technologies, Inc. (USA); Jason P. Cain, Ralph R. Dammel, EMD Performance Materials
(Switzerland); Andreas Erdmann, Fraunhofer- Hayashi, Dai Nippon Printing Co., Ltd. (Japan); Advanced Micro Devices, Inc. (USA); Xiaomeng Corp. (USA); Anuja De Silva, IBM Corp. (USA);
Institut für Integrierte Systeme und Tatsuhiko Higashiki, Toshiba Corp. (Japan); Chen, Taiwan Semiconductor Manufacturing Danilo De Simone, IMEC (Belgium); Douglas
Bauelementetechnologie IISB (Germany); Allen H. Erik R. Hosler, GLOBALFOUNDRIES Inc. Co. Ltd. (Taiwan); Hugo Cramer, ASML Guerrero, Brewer Science, Inc. (USA); Clifford
Gabor, GLOBALFOUNDRIES Inc. (USA); Emily (USA); J. Alexander Liddle, National Institute Netherlands B.V. (Netherlands); Timothy L. Henderson, Univ. of South Florida (USA);
E. Gallagher, IMEC (Belgium); Florian Gstrein, of Standards and Technology (USA); Chi- F. Crimmins, Intel Corp. (USA); Shunsuke Craig D. Higgins, GLOBALFOUNDRIES Inc.
Intel Corp. (USA); Naoya Hayashi, Dai Nippon Chun Liu, IBM Corp. (USA); Hans Loeschner, Koshihara, Hitachi High-Technologies Corp. (USA); Christoph K. Hohle, Fraunhofer-Institut
Printing Co., Ltd. (Japan); Eric Hendrickx, IMEC IMS Nanofabrication GmbH (Austria); John (Japan); Yi-Sha Ku, Industrial Technology für Photonische Mikrosysteme (Germany);
(Belgium); Soichi Inoue, Toshiba Corp. (Japan); G. Maltabes, Applied Materials GmbH & Co. Research Institute (Taiwan); Byoung-Ho Lee, Scott W. Jessen, Texas Instruments Inc. (USA);
Bryan S. Kasprowicz, Photronics, Inc. (USA); KG (USA); Laurent Pain, CEA-LETI (France); SK hynix, Inc. (Korea, Republic of); Philippe Yoshio Kawai, Shin-Etsu Chemical Co., Ltd.
Insung Kim, SAMSUNG Electronics Co., Ltd. Ivo W. Rangelow, Technische Univ. Ilmenau Leray, IMEC (Belgium); Narender Rana, (Japan); Qinghuang Lin, ASML US, Inc. (USA);
(Korea, Republic of); Seong-Sue Kim, SAMSUNG (Germany); Douglas J. Resnick, Canon Western Digital Corp. (USA); Christopher J. Nobuyuki N. Matsuzawa, Panasonic Corp.
Electronics Co., Ltd. (Korea, Republic of); Toshio Nanotechnologies, Inc. (USA); Ricardo Ruiz, Raymond, Nanometrics Inc. (USA); John C. (Japan); Steve S. Putna, Intel Corp. (USA);
Konishi, Toppan Printing Co., Ltd. (Japan); Ted HGST (USA); Chandrasekhar Sarma, Intel Robinson, KLA-Tencor Corp. (USA); Martha Mark H. Somervell, Tokyo Electron America,
Liang, Intel Corp. (USA); Chang-Moon Lim, SK Corp. (USA); Ines A. Stolberg, Vistec Electron I. Sanchez, IBM Research - Almaden (USA); Inc. (USA); Jason K. Stowers, Inpria (USA);
Hynix, Inc. (Korea, Republic of); Anna Lio, Intel Beam GmbH (Germany); Hsinyu Tsai, IBM Matthew J. Sendelbach, Nova Measuring James W. Thackeray, Dow Electronic Materials
Corp. (USA); Luciana Meli, IBM Corp. (USA); Thomas J. Watson Research Ctr. (USA); Instruments Inc. (USA); Richard Silver, National (USA); Raluca Tiron, CEA-LETI (France);
Lawrence S. Melvin III, Synopsys, Inc. (USA); Kevin T. Turner, Univ. of Pennsylvania (USA); Institute of Standards and Technology (USA); Rick Uchida, Tokyo Ohka Kogyo America,
Hiroaki Morimoto, Toppan Printing Co., Ltd. Marco J. Wieland, MAPPER Lithography Eric Solecky, GLOBALFOUNDRIES Inc. (USA); Inc. (USA); Thomas I. Wallow, ASML Brion
(Japan); Patrick P. Naulleau, Lawrence Berkeley (Netherlands); Wei Wu, The Univ. of Southern Alexander Starikov, I&I Consulting (USA); Alok Technologies (USA)
National Lab. (USA); Christopher S. Ngai, California (USA) Vaid, GLOBALFOUNDRIES Inc. (USA)
Applied Materials, Inc. (USA); Shinji Okazaki,
ALITECS Co., Ltd. (Japan); Eric M. Panning, Intel Conference Sponsor
Corp. (USA); Moshe E. Preil, KLA-Tencor Corp.
(USA); Kurt G. Ronse, IMEC (Belgium); Akiyoshi
Suzuki, Gigaphoton Inc. (Japan); Thomas I.
Wallow, ASML Brion (USA); Obert R. Wood II,
GLOBALFOUNDRIES Inc. (USA)
Conference Sponsor
14 SPIE ADVANCED LITHOGRAPHY 2019 · spie.org/al19program · #SPIELitho ·CONFERENCE 10961 CONFERENCE 10962 CONFERENCE 10963
Tuesday–Wednesday Wednesday–Thursday Monday–Tuesday
26–27 February 2019 27–28 February 2019 25–26 February 2019
Proceedings of SPIE Vol. 10961 Proceedings of SPIE Vol. 10962 Proceedings of SPIE Vol. 10963
Optical Design-Process- Advanced Etch
Microlithography Technology Co- Technology for
XXXII optimization for Nanopatterning VIII
Conference Chair: Jongwook Kye, SAMSUNG Manufacturability XIII Conference Chair: Richard S. Wise, Lam
Electronics Co., Ltd. (Korea, Republic of) Research Corp. (USA)
Conference Chair: Jason P. Cain, Advanced
Conference Co-Chair: Soichi Owa, Nikon Micro Devices, Inc. (USA) Conference Co-Chair: Catherine B. Labelle,
Corp. (Japan) Consultant (USA)
Conference Co-Chair: Chi-Min Yuan, NXP
Program Committee: Will Conley, Cymer, Semiconductors (USA) Program Committee: Efrain Altamirano-
An ASML company (USA); Carlos Fonseca, Sánchez, IMEC (Belgium); Julie Bannister,
Program Committee: Robert Aitken, ARM Inc.
Tokyo Electron America, Inc. (USA); Bernd Tokyo Electron America, Inc. (USA); Maxime
(USA); Luigi Capodieci, KnotPrime Inc. (USA);
Geh, Carl Zeiss SMT GmbH (USA); Yuri Darnon, LN2 CNRS (Canada); Sebastian U.
Lifu Chang, Qualcomm Inc. (USA); Ryoung-
Granik, Mentor Graphics Corp. (USA); Harsha Engelmann, IBM Thomas J. Watson Research
Han Kim, IMEC (Belgium); Neal V. Lafferty,
Grunes, Intel Corp. (USA); Young Seog Kang, Ctr. (USA); Eric A. Hudson, Lam Research Corp.
Mentor Graphics Corp. (USA); Ya-Chieh Lai,
SAMSUNG Electronics Co., Ltd. (Korea, (USA); Kaushik A. Kumar, Tokyo Electron Ltd.
Cadence Design Systems, Inc. (USA); Lars
Republic of); Sachiko Kobayashi, Toshiba (Japan); Qinghuang Lin, IBM Thomas J. Watson
W. Liebmann, GLOBALFOUNDRIES Inc.
Corp. (Japan); Kafai Lai, IBM Corp. (USA); Research Ctr. (USA); Ru-Gun Liu, Taiwan
(USA); Ru-Gun Liu, Taiwan Semiconductor
Ken-Ichiro Mori, Canon Inc. (Japan); John Semiconductor Manufacturing Co. Ltd. (Taiwan);
Manufacturing Co. Ltd. (Taiwan); Kevin Lucas,
S. Petersen, Periodic Structures, Inc. (USA); Nihar Mohanty, Oculus VR, LLC (USA); Jake
Synopsys, Inc. (USA); Andrew R. Neureuther,
Mark C. Phillips, Intel Corp. (USA); Daniel O'Gorman, Hitachi High Technologies America,
Univ. of California, Berkeley (USA); Shigeki
Sarlette, Infineon Technologies Dresden Inc. (USA); Erwine Pargon, CNRS/LTM (France);
Nojima, Toshiba Corp. (Japan); David Z. Pan,
(Germany); Xuelong Shi, Semiconductor Nicolas Posseme, CEA-LETI (France); Ricardo
The Univ. of Texas at Austin (USA); Chul-
Manufacturing International Corp. (China); Ruiz, HGST (USA); Yuyang Sun, Mentor
Hong Park, SAMSUNG Electronics Co., Ltd.
Bruce W. Smith, Rochester Institute of Graphics Corp. (USA); Anthony Yen, ASML US,
(Korea, Republic of); Piyush Pathak, Cadence
Technology (USA); Kunal N. Taravade, LP (USA); Ying Zhang, Applied Materials, Inc.
Design Systems, Inc. (USA); Michael L. Rieger,
Synopsys, Inc. (USA); Geert Vandenberghe, (USA)
Consultant (USA); Vivek K. Singh, Intel Corp.
IMEC (Belgium); Reinhard Voelkel, SUSS
(USA); Lynn T. Wang, GLOBALFOUNDRIES
MicroOptics SA (Switzerland); Da Yang, Conference Sponsor
Inc. (USA)
Qualcomm Inc. (USA); Uwe D. Zeitner,
Fraunhofer-Institut für Angewandte Optik und
Conference Sponsor
Feinmechanik (Germany)
SPEAKERS ARE NOT ABLE TO PRESENT USING THEIR OWN LAPTOP OR OTHER DEVICE
1. Uploading your presentation in advance 2. Preview your presentation onsite
You are required to upload your presentation file in advance in one of two ways: All presenters are strongly encouraged to visit
ONLINE: ONSITE AT SPEAKER CHECK-IN: using your Speaker Check-In at least 2 hours prior to their
http://spieuploads.com USB device (at least 2 hours before session or presentation to preview their files through the
(portal closes @ 12:00 PM noon Pacific time the day before if presenting in first morning SPIE presentation system, or the day before if
22 February 2019) session) presenting in first morning session).
SPIE will record the audio plus screen content of all presentations; Recordings will be published on the SPIE Digital Library with author permission only.
THIS PROGRAM IS CURRENT AS OF 2 NOVEMBER 2018. Find complete, up-to-date information and create your personalized schedule at spie.org/al19program. 15Monday 25 February Monday 25 February
CONFERENCE 10959
CONFERENCE 10957 Metrology, Inspection, CONFERENCE 10957
Extreme Ultraviolet (EUV) and Process Control for Extreme Ultraviolet (EUV)
Lithography X Microlithography XXXIII Lithography X
SESSION 1 11:00 AM TO 11:15 AM
MON 11:00 AM TO 12:20 PM
Keynote Session Opening Remarks and
Session Chairs: Kenneth A. Goldberg, Lawrence Award Announcement
Berkeley National Lab. (USA); Nelson M. Felix, Session Chairs: Vladimir A. Ukraintsev,
IBM Corp. (USA) Qorvo Corp. (USA); Ofer Adan, Applied
Materials Israel, Ltd. (Israel)
EUVL: the natural evolution of optical Presentation of the 2018 Diana Nyyssonen
microlithography (Keynote Presentation), Bernd
Best Paper Award in Metrology
Geh, Carl Zeiss SMT GmbH (USA). . . . . [10957-1] SESSION 2
EUV insertion strategy into logic technology
Award Sponsored by MON 2:00 PM TO 3:20 PM
on the horizon of scaling paradigm change
(Keynote Presentation), Ryoung-Han R. Kim, IMEC The Future is High NA
(Belgium). . . . . . . . . . . . . . . . . . . . . . . . . [10957-2] Session Chairs: Patrick P. Naulleau, Lawrence
Berkeley National Lab. (USA); Jos P. Benschop,
Lunch Break . . . . . . . . . . . Mon 12:20 pm to 2:00 pm ASML Netherlands B.V. (Netherlands)
SESSION 1 High-NA EUV lithography exposure tool progress
MON 11:15 AM TO 12:25 PM (Invited Paper), Jan van Schoot, Eelco van Setten, Kars
Troost, Frank Bornebroek, Rob van Ballegoij, Sjoerd
Keynote Session Lok, Judon Stoeldraijer, Jo Finders, Hans Meiling,
Session Chairs: Vladimir A. Ukraintsev, Qorvo ASML Netherlands B.V. (Netherlands); Paul Graeupner,
Corp. (USA); Ofer Adan, Applied Materials Israel, Joerg Zimmermann, Peter Kuerz, Carl Zeiss SMT
Ltd. (Israel) GmbH (Germany). . . . . . . . . . . . . . . . . . . . . [10957-3]
Overview and status of the 0.5NA EUV microfield
Tough road ahead for device overlay and exposure tool at the advanced light source (Invited
edge placement error (Keynote Presentation), Paper), Christopher N. Anderson, Lawrence Berkeley
Kaustuve Bhattacharyya, ASML Netherlands B.V. National Lab. (USA). . . . . . . . . . . . . . . . . . . [10957-4]
(Netherlands) . . . . . . . . . . . . . . . . . . . . [10959-1]
High-NA EUV lithography: the next step in EUV
Silicon-based quantum computing: imaging, Eelco van Setten, John McNamara, Jan van
manufacturing and metrology challenges Schoot, Kars Troost, Gerardo Bottiglieri, Joseph Zekry,
(Keynote Presentation), Richard M. Silver, Timon Fliervoet, ASML Netherlands B.V. (Netherlands);
National Institute of Standards and Technology Stephen Hsu, ASML San Jose (USA); Joerg
(USA) . . . . . . . . . . . . . . . . . . . . . . . . . . [10959-2] Zimmermann, Jens Timo Neumann, Matthias Roesch,
Paul Graeupner, Carl Zeiss SMT GmbH
Lunch Break . . . . . . . . . . . Mon 12:25 pm to 1:30 pm (Germany) . . . . . . . . . . . . . . . . . . . . . . . . . . [10957-5]
Progress in EUV resists towards high-NA EUV
lithography, Xiaolong Wang, Zuhal Tasdemir, Iacopo
Mochi, Paul Scherrer Institut (Switzerland); Lidia van
Lent-Protasova, Marieke Meeuwissen, Rolf Custers,
Gijsbert Rispens, Rik Hoefnagels, ASML Netherlands
B.V. (Netherlands); Yasin Ekinci, Paul Scherrer Institut
(Switzerland) . . . . . . . . . . . . . . . . . . . . . . . . [10957-6]
16 SPIE ADVANCED LITHOGRAPHY 2019 · spie.org/al19program · #SPIELitho ·CONFERENCE 10959 CONFERENCE 10960
Metrology, Inspection, Advances in Patterning CONFERENCE 10963
and Process Control for Materials and Processes Advanced Etch Technology
Microlithography XXXIII XXXVI for Nanopatterning VIII
SESSION 2 SESSION 1
MON 1:30 PM TO 3:10 PM Overlay MON 1:30 PM TO 3:30 PM
Overlay News Keynote Session: Plasma
Session Chairs: Alexander Starikov, I&I Based Patterning
Consulting (USA); Narender Rana, Western Innovations
Digital Corp. (USA)
2:00 PM TO 2:20 PM Session Chairs: Efrain Altamirano-Sánchez,
On device EPE: minimizing overlay, pattern IMEC (Belgium); Keun Hee Bai, SAMSUNG
placement, and pitch-walk, in presence of EUV, Opening Remarks and Electronics Co., Ltd. (Korea, Republic of)
and etch stochastics, Ofer Adan, Kevin Houchens,
Applied Materials Ltd (Israel). . . . . . . . . . . . [10959-3]
Award Announcements
Patterning paradigm shift: from addition of
Session Chairs: Roel Gronheid, KLA-Tencor/ two to the power of two (Keynote Presentation),
Overlay error investigation for metal containing ICOS Belgium (Belgium); Daniel P. Sanders,
resist (MCR), Roel Gronheid, KLA-Tencor/ ICOS Mircea V. Dusa, ASML Belgium N.V.
IBM Research - Almaden (USA) (Belgium). . . . . . . . . . . . . . . . . . . . . . . . [10963-1]
Belgium (Belgium); Satomi Higashibata, Toshiba
Electronics Europe GmbH (Germany); Yusuke Combining equipment sensors and control
Tanaka, SanDisk Ltd. (Japan); Masaru Suzuki, Advances in Patterning Materials hardware with metrology and advanced
Satoshi Nagai, Toshiba Memory Corp. (Japan);
Waikin Li, Philippe Leray, IMEC (Belgium) . [10959-4]
and Processing Technology (10960) computational methods for comprehensive
3D process control (Keynote Presentation),
Presentation of the 2018 C. Grant Willson David Fried, Coventor, Inc., A Lam Research Co.
Process drift compensation by tunable
wavelength homing in scatterometry based Award for Best Paper and Presentation of (USA); Dan Simon, Boaz Kenane, Lam Research
overlay, Kun Gao, KLA-Tencor New York the 2018 Hiroshi Ito Memorial Award for Corp. (USA); Michael Jamiolkowski, Coventor,
(USA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [10959-5] the Best Student Paper Inc. (USA); Andrew Bailey, Lam Research Corp.
(USA); Marcus Carbery, Lam Research Corp.
Measuring after etch overlay and characterizing (Ireland); Lisheng Gao, Lam Research Corp.
These Awards Sponsored by
tilt fingerprints in multi-tier 3D-NAND structures, (USA); Ye Feng, Atashi Basu, Jiangtao Hu, Jason
Jaap Karssenberg, ASML Netherlands B.V. R. Shields, Richard A. Gottscho, Lam Research
(Netherlands); Honggoo Lee, Dong-Young Lee, Corp. (USA). . . . . . . . . . . . . . . . . . . . . . [10963-2]
Jun-Yeob Kim, Sangjun Han, Chan-Ha Park, SK
Hynix, Inc. (Korea, Republic of); Aileen Soco, ASML Presentation of the 2018 Jeffrey Byers Etch aware computational patterning in
Netherlands B.V. (Netherlands); Nang-Lyeom Oh, Memorial Best Poster Award the era of atomic precision processing
ASML Korea Co., Ltd. (Korea, Republic of); Arno (Keynote Presentation), Peter Ventzek, Tokyo
van Leest, Mir Shahrjerdy, Tjitte Nooitgedagt, ASML Award Sponsored by Electron America, Inc. (USA); Alok Ranjan, TEL
Netherlands B.V. (Netherlands). . . . . . . . . . [10959-6] Technology Ctr., America, LLC (USA) . [10963-3]
Standalone alignment technology enabling feed TM
forward compensation of on-product overlay
errors, Takehisa Yahiro, Junpei Sawamura, Sonyong SESSION 1
Song, Sayuri Tanaka, Yuji Shiba, Satoshi Ando, MON 2:20 PM TO 3:20 PM
APPLICATION TRACKS
Hiroyuki Nagayoshi, Jun Ishikawa, Masahiro Morita,
Easily find sessions on these three Yuichi Shibazaki, Nikon Corp. (Japan) . . . . [10959-7] Keynote Session
important topics within the program. Session Chairs: Roel Gronheid, KLA-Tencor/
ICOS Belgium (Belgium); Daniel P. Sanders, IBM
Each conference has grouped the Research - Almaden (USA)
applicable presentations together and do
not overlap with other conferences. Metal-containing resists for EUV lithography
(Keynote Presentation), Robert L. Brainard,
SUNY Polytechnic Institute (USA) . . . . [10960-1]
• Machine Learning
Increased regulatory scrutiny of
photolithography chemistries: The need for
• Stochastics science and innovation (Keynote Presentation),
Brooke Tvermoes, IBM Corp. (USA); David
• Overlay Speed, GLOBALFOUNDRIES Inc.
(USA) . . . . . . . . . . . . . . . . . . . . . . . . . . [10960-2]
THIS PROGRAM IS CURRENT AS OF 2 NOVEMBER 2018. Find complete, up-to-date information and create your personalized schedule at spie.org/al19program. 17You can also read
