ADVANCED LITHOGRAPHY TECHNICAL PROGRAM - SAN JOSE, CALIFORNIA, USA Conferences and Courses: 23-27 February 2020 Exhibition: 25-26 February 2020 - SPIE
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ADVANCED LITHOGRAPHY TECHNICAL PROGRAM SAN JOSE, CALIFORNIA, USA Conferences and Courses: 23–27 February 2020 Exhibition: 25–26 February 2020 #SPIELitho spie.org/al
CONNECTING MINDS.
ADVANCING LIGHT.
ADVANCED
LITHOGRAPHY 2020
TECHNOLOGIES FOR LITHOGRAPHY R&D, DEVICES,
TOOLS, FABRICATION, AND SERVICES
Conferences and Courses: 23–27 February 2020
Exhibition: 25–26 February 2020
San Jose, California, USA
Welcome to San Jose
CUTTING-EDGE RESEARCH
WORLD-CLASS SPEAKERS
TRAINING AND EDUCATION
FOCUSED TECHNICAL TOPICS
spie.org/AL
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2020
Welcome
2,100 For over 40 years, SPIE Advanced Lithography has played a key role in bringing together the
ATTENDEES micro- and nanolithography community. Lithography continues to be challenged to extend
into ever-shrinking generations, yet remain manufacturable and cost effective. State-of-the-art
processes continue with immersion lithography and multiple patterning, while EUV lithography
PLENARY moves closer toward production readiness. At the same time, the lithography community
PRESENTATIONS
aggressively pursues alternative patterning approaches and complementary solutions. Success
calls for unique interdisciplinary interactions and coordinated efforts between lithographers,
450 layout designers, materials scientists, and metrology/process control engineers to enable cost-
PAPERS efficient patterning solutions.
A full spectrum of lithography and patterning topics are encompassed by this year’s
14 symposium across seven complementary conferences. Participants come from a broad array
COURSES of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology,
materials, etch, design, process integration, and novel new approaches. Through provocative
NETWORKING panel discussions and seminars, the symposium also probes current issues being faced as
EVENTS we extend current methods, move toward alternative approaches, and identify new ways to
complement one technology with another.
Over the years, SPIE Advanced Lithography has provided the unique and primary forum for
50
COMPANIES meeting and interacting with a wide range of industry experts, researchers, and key players
working on patterning technology development. Attendance ensures that participants learn and
share the latest developments in areas of central importance to many vital technology fields.
EXHIBITION All conferences are organized by current practitioners of the art—Conference Chairs, working
Meet top suppliers showcasing the newest products, together with organizing committees that are experts in these fields. Numerous courses have
innovations, and cutting-edge technologies. Discuss also been organized, which are taught by recognized experts from industry and academia.
specific requirements face-to-face.
Additional information is available from the many manufacturers' exhibits that allow tool
makers, material suppliers, and software groups to showcase new products, while interacting
one-on-one with participants.
We welcome you to San Jose for SPIE Advanced Lithography's 45th year!
SPIE is the international society for optics and photonics, an educational
not-for-profit organization founded in 1955 to advance light-based 2020 SYMPOSIUM CHAIRS
science, engineering, and technology. The Society serves nearly 264,000
constituents from 166 countries, offering conferences and their published
proceedings, continuing education, books, journals, and the SPIE Digital Will Conley Kafai Lai
Library in support of interdisciplinary information exchange, professional
networking, and patent precedent. SPIE provided more than $5 million in Cymer—An ASML IBM T.J. Watson
support of education and outreach programs in 2019. company (USA) Research Ctr.
SPIE would like to express its deepest appreciation to the symposium
(USA)
chairs, conference chairs, program committees, session chairs, and
authors who have so generously given their time and advice to make this
symposium possible.
The symposium, like our other conferences and activities, would not
be possible without the dedicated contribution of our participants and
members. This program is based on commitments received up to the time
of publication and is subject to change without notice.
THIS PROGRAM IS CURRENT AS OF 10 JANUARY 2020. Find the latest on the SPIE CONFERENCE APP. 1
Plenary Presentations
pages 6–7 EXECUTIVE COMMITTEE
Ofer Adan, Applied Materials (Israel)
Don’t miss these world-class speakers discussing the Will Conley, Cymer – An ASML company (USA)
latest directions and most promising breakthroughs. Nelson Felix, IBM Corp. (USA)
Roel Gronheid, KLA-Tencor/ICOS Belgium (Belgium)
Ryoung-Han Kim, IMEC (Belgium)
Catherine B. Labelle, (USA)
Kafai Lai, IBM T.J. Watson Research Ctr. (USA)
Anna Lio, Intel Corp. (USA)
Soichi Owa, Nikon Corp. (Japan)
Special Events Eric M. Panning, Intel Corp. (USA)
page 8 Mark C. Phillips, Intel Corp. (USA)
John C. Robinson, KLA Corp. (USA)
Join your peers and colleagues at these special Martha I. Sanchez, IBM Research – Almaden (USA)
events including the Welcome Reception, and a Daniel P. Sanders, IBM Research – Almaden (USA)
Panel Discussion: EUV Lithography Perspective: Richard Wise, Lam Research Corp. (USA)
From the Beginning to HVM, and symposium-wide Chi-Min Yuan, NXP Semiconductors (USA)
Panel Discussion.
ADVISORY COMMITTEE
Robert D. Allen, IBM Research - Almaden (USA)
William H. Arnold, ASML US, Inc. (USA)
Award Announcements Timothy A. Brunner, GLOBALFOUNDRIES Inc. (USA)
page 9 Ralph R. Dammel, EMD Performance Materials Corp. (USA)
Donis G. Flagello, Nikon Research Corp. of America (USA)
Don't miss any of the award announcemnts and Harry J. Levinson, HJL Lithography (USA)
presenations at 2020 Advanced Lithography. Burn Lin, National Tsing Hua Univ. (Taiwan)
Chris A. Mack, Fractilia, LLC (USA)
Christopher J. Progler, Photronics, Inc. (USA)
Bruce W. Smith, Rochester Institute of Technology (USA)
Anthony Yen, ASML US, LP (USA)
Exhibition
page 13
Exhibit at SPIE Advanced Lithography. Join global
suppliers for lithography research and development,
devices, tools, fabrication, and services.
Download the
SPIE Conference App
2 SPIE ADVANCED LITHOGRAPHY 2020 · spie.org/al · #SPIELitho ·
Join industry leaders to solve the latest challenges
in lithography and patterning in the semiconductor industry.
Conferences: Hear the latest advancements in optical lithography, metrology, and EUV.
Extreme Ultraviolet (EUV) Lithography XI (Felix) . . . . . . . . . . . . . . . . . . . . . . 16–45
Novel Patterning Technologies for Semiconductors, MEMS/NEMS APPLICATION TRACKS
and MOEMS 2020 (Sanchez) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16–45
Look for these icons to help
Metrology, Inspection, and Process Control for Microlithography you easily locate presentations
XXXIV (Adan) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16–45 you want to attend on these
hot topics. The presentations
Advances in Patterning Materials and Processes XXXVII (Gronheid) . . . . 16–34 are scheduled to prevent tim-
ing conflicts.
Optical Microlithography XXXIII (Owa) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17–35
Design-Process-Technology Co-optimization for
Manufacturability XIV (Yuan) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17–45
7 CONFERENCES Stochastics Overlay Machine
Learning
Advanced Etch Technology for Nanopatterning IX (Wise) . . . . . . . . . . . . . . 17–33
Courses: Stay competitive. Optimal training for career enhancement, taught by recognized experts in industry and academia. See page 11 for schedule.
SC101 Introduction to Microlithography: Theory, Materials, SC1158 Overlay
Metrology of Image Placement (Starikov)
and Processing (Bowden, Dammel)
SC1263 Stochastic Lithography (Mack, Petersen)
SC1030 Interaction of Physical Design and Lithography Stochastics
(Yuan)
SC1264 Machine
Machine Learning for Lithography (Shiely)
SC1099 Chemistry and Lithography (Okoroanyanwu)
Learning
SC616 Practical Photoresist Processing (Dammel)
SC1100 Scatterometry in Profile, Overlay and Focus Process
Control (Cramer, Turovets) SC885 Principles and Practical Implementation of Multiple
Patterning (Dusa, Hsu)
SC111 Lithography Process Control (Levinson)
SC888 EUV Lithography (Bakshi, Ahn, Naulleau)
SC1132 Computational Basis for Advanced Lithography
Techniques (Lai) SC992 Lithography Integration for Semiconductor FEOL
& BEOL Fabrication (Lin, Zhang)
14 COURSES SC1133 Advanced concepts in Metrology Toolset Stability and
Matching (Adan)
FLOOR PLAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 INDEX OF AUTHORS, CHAIRS,
AND COMMITTEE MEMBERS . . . . . . . . . . . . . . . . . . . . . . 46–59
DAILY EVENT SCHEDULE . . . . . . . . . . . . . . . . . . . . . . . . 5
GENERAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . 60–62
EVENT SPONSORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Author/Presenter Information · Policies ·
TECHNICAL CONFERENCE Food and Beverage · Onsite Services · Parking and Car Rental
SESSION SCHEDULE . . . . . . . . . . . . . . . . . . . . . . . . . 14–15
SPIE POLICIES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64–65
PROCEEDINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
THIS PROGRAM IS CURRENT AS OF 10 JANUARY 2020. Find the latest on the SPIE CONFERENCE APP. 3
SAN JOSE CONVENTION CENTER AND MARRIOTT HOTEL
2ND LEVEL
210D
212B 210C
NO 212A
RT
H
210B Exhibition Posters
211B
211A 210A
Hall 1 Hall 2
114
113
112
111
Down to Rooms Speaker
111–114 Check-in
Street Level Registration
Meeting Rooms Food SPIE
Cart Bookstore
Think
Tank Grand Grand
Guadalupe Ballroom Ballroom
220C 220B
Salon II
Salon I
Hilton Hotel
Willow
Glen III
Marriott
Willow
Glen II Grand
Willow
Salon V Ballroom
Glen I
Salon VI 220A
Westin
San Jose Marriott,
Second Floor
Hyatt Place
4 SPIE ADVANCED LITHOGRAPHY 2020 · spie.org/al · #SPIELitho ·
DAILY SCHEDULE
SUNDAY MONDAY TUESDAY WEDNESDAY THURSDAY
Special Events
Welcome and Announcements;
Introduction of New SPIE Fellows;
Presentation of the Zernike Awards;
Presentation of the Nick Cobb Memorial
Scholarship, 8:00 - 8:30 AM, p. 6
Plenary Presentation: High performance
mapping for deep learning applications
(Rush), 8:30 - 9:10 AM, p, 6
Plenary Presentation: In-memory
computing for AI applications
(Eleftheriou), 8:30 AM - 9:10 AM, p. 7
Plenary Presentation: Process
technologies leading a future of
semiconductor memory (KIOKU) EXHIBITION, EXHIBITION,
devices (Hashimoto), 9:50 AM - 10:30 10:00 AM - 5:00 PM 10:00 AM - 4:00 PM
AM, p. 7
Women in Optics Networking Lunch, Poster Session, 5:30 PM - 7:30 PM, p. 8
SPIE Fellow Member and Student 12:00 PM - 1:00 PM, p. 8
Luncheon, 12:30 PM - 1:30 PM, p. 8
Panel Discussion: EUV Lithography
Welcome and Networking Event, 6:00 Perspective: From the Beginning to
PM - 7:00 PM, p. 8 HVM, 3:50 PM - 5:50 PM, p. 8
Intersecting the Quantum Future and LGBTQ Lithographers Social, 5:00 PM -
the Semiconductor Industry (Barnes), 8:00 PM, p. 8
7:15 PM - 8:45 PM, p. 8
Symposium-wide Panel Discussion, 6:00
PM - 8:00 PM, p. 8
Conferences
Extreme Ultraviolet (EUV) Lithography XI (Felix), p. 16–45
Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020 (Sanchez), p. 16-45
Metrology, Inspection, and Process Control for Microlithography XXXIV (Adan), p. 16–45
Advances in Patterning Materials and Processes XXXVII (Gronheid), p. 16–35
Optical Microlithography XXXIII (Owa), p. 17–35
Design-Process-Technology Co-optimization for Manufacturability XIV
(Yuan), p. 17–45
Advanced Etch Technology for Nanopatterning IX (Wise), p. 17–33
COURSES: Sunday, Monday, and Thursday
See Course schedule page 11.
See course descriptions and register onsite.
THIS PROGRAM IS CURRENT AS OF 10 JANUARY 2020. Find the latest on the SPIE CONFERENCE APP. 5
WELCOME AND PLENARY PRESENTATIONS
Distinguished
speakers
Monday 24 February 2020 · 8:00 AM - 10:30 AM
8:30 AM - 9:10 AM 9:10 AM - 9:50 AM
Location: Convention Center, Grand Ballroom 220A
High performance mapping for deep In-memory computing for AI
8:00 AM - 8:30 AM learning applications applications
Welcome and Announcements Allen Rush Evangelos Eleftheriou
Symposium Chairs: Will Conley, Cymer-An ASML Company (USA) Senior Fellow, Advanced Micro Devices, Inc. IBM Fellow, Cloud & Computing Infrastructure
and Kafai Lai, IBM T. J. Watson Research Ctr. (USA) (USA) Zurich Research Laboratory, IBM Research -
Deep Learning has emerged as a powerful tool Zürich (Switzerland)
- Introduction of New SPIE Fellows for many types of applications, including detec- Performing computations on conventional
tion, classification, semantic interpretation and von Neumann computing systems results in a
- 2020 Zernike Award Presentation to many other challenging, data driven applica- significant amount of data being moved back
tions. This talk addresses the challenges of the and forth between the physically separated
mapping of the key algorithms for deep learning onto the various memory and processing units. This costs time and energy, and
Winfried Kaiser, constitutes an inherent performance bottleneck. It is becoming
engines and accelerators that are used in HW and SW platforms.
Semiconductor Manufacturing Technology increasingly clear that for application areas such as AI (Artificial
Business Group; Carl Zeiss SMT GmbH Allen Rush is currently a Senior Fellow at AMD. His main respon-
sibility is chief scientist for machine learning, including strategies, Intelligence), we need to transition to computing architectures
technology development and product planning. Previously he in which memory and logic coexist in some form. In-memory
held a similar role for imaging and computer vision. Prior to join- computing is a novel non-von Neumann approach where certain
- Presentation of the Nick Cobb ing AMD, he spent many years focusing on imaging technologies, computational tasks are performed in the memory itself. This is
including CTO positions at several startup companies. enabled by the physical attributes and state dynamics of memory
Memorial Scholarship devices, in particular resistance-based non-volatile memory
technology. Several computational tasks such as logical opera-
tions, arithmetic operations and even certain machine learning
tasks can be implemented in such a computational memory
8:30 AM - 10:30 AM unit. I will present how computational memories accelerate AI
applications and will show small- and large-scale experimental
Plenary Presentations demonstrations that perform high-level computational primitives,
such as ultra-low-power inference engines, optimization solvers
Plenary presentations sponsored by including compressed sensing and sparse coding, linear solvers
and temporal correlation detection. Moreover, I will discuss the ef-
ficacy of this approach to efficiently address not only inferencing
but also training of deep neural networks. The results show that
6 SPIE ADVANCED LITHOGRAPHY 2020 · spie.org/al · #SPIELitho ·
WELCOME AND PLENARY PRESENTATIONS
this co-existence of computation and storage at the nanometer tance of non-volatile memory also continues to grow, alongside
scale could be the enabler for new, ultra-dense, low-power, and demands for lower prices, higher performance and improved
massively parallel computing systems. Thus, by augmenting reliability. To meet these demands, we developed revolutionary
conventional computing systems, in-memory computing could technologies including multi-bit-per cell technology and three-
help achieve orders of magnitude improvement in performance dimensional Flash memory technology. Recently, in addition, new
and efficiency. storage class memory (SCM) technology is being developed to
Evangelos Eleftheriou, received his Ph.D. degree in Electri- bridge the gap between flash memory and DRAM, enabling a new
cal Engineering from Carleton University, Ottawa, Canada, in generation of electronic devices. Manufacturing process technol-
1985. In 1986, he joined the IBM Research – Zurich laboratory ogy must adapt quickly and efficiently to keep up with rapidly
in Rüschlikon, Switzerland, as a Research Staff Member. Since changing design techniques. During this talk, Mr. Hashimoto will
1998, he has held various management positions and is currently provide an overview of the key steps in the memory manufac-
responsible for the neuromorphic computing activities of IBM turing process. In addition, Mr. Hashimoto will provide guidance
Research – Zurich. His research interests include signal process- regarding how process and lithography engineers might approach
ing, coding, non-volatile memory technologies and emerging the current paradigm shift in manufacturing process technology. EQUITY
computing paradigms such as neuromorphic and in-memory Koji Hashimoto received an MS degree in electric engineering Is access to
computing for AI applications. He has authored or coauthored from Kyusyu University, Fukuoka, in 1988. After joining Toshiba opportunities,
over 200 publications, and holds over 160 patents (granted and ULSI Research Center, Toshiba Corporation, Kawasaki, in 1988, fair treatment, and
pending applications). In 2002, he became a Fellow of the IEEE. he worked on the development of megabit DRAM device tech- advancement for all
He was co-recipient of the 2003 IEEE Communications Society nology with Fujio Masuoka who is inventor of Flash memory. people; it’s about
eliminating barriers
Leonard G. Abraham Prize Paper Award. He was also co-recipient With the first announcement of RIM type (Self aligned) Phase
that prevent full
of the 2005 Technology Award of the Eduard Rhein Foundation. shift mask technology in IEDM 1989, he worked on Phase shift participation.
In 2005, he was appointed an IBM Fellow. The same year he was mask development for sub-half micron lithography. From 1993 to
also inducted into the IBM Academy of Technology. In 2009, he 1996, he joined the quarter micron DRAM development project
was co-recipient of the IEEE CSS Control Systems Technology with IBM and Siemens at IBM East Fishkill, NY, and worked on
Award and of the IEEE Transactions on Control Systems Technol- lithography process development. From 1996 to 2009, he worked
ogy Outstanding Paper Award. In 2016, he received an honoris the development of high-end lithography technology and its ap-
causa professorship from the University of Patras, Greece. In 2018, plication to the Flash memory, DRAM, high-end CMOS, SRAM,
he was inducted into the US National Academy of Engineering CMOS Sensors at the Process and Manufacturing Engineering
as Foreign Member. Center, Toshiba Corporation, Yokohama. From 2009 to 2013, DIVERSITY
for Group Manager of Advanced Lithography Process Group, Includes all the ways in
at the Advanced Memory Development Center, Toshiba Cor- which people differ—
poration, Yokkaichi, he led lithography development for 32nm identity markers such
9:50 AM - 10:30 AM to 15nm NAND Flash memory. From 2013 to 2016, for Director as race, ethnicity,
gender, ability, sexual
of Advanced Fine-patterning Development Department and
orientation, and more.
Process technologies leading a future Advanced Process Development Department, at the Advanced
of semiconductor memory (KIOKU) Memory Development Center, Toshiba Corporation, Yokkaichi, he
managed the development of lithography, dry etching and other
devices unit processes for the 3D memories. After joining to the Institute
INCLUSION
Goes beyond diversity:
of Memory Technology Research and Development in 2017, for
Koji Hashimoto it’s the act of creating
General Manager of Process Technology Research and Develop- an environment
General Manager, Process Technology Research ment Center, Toshiba Memory Corporation, Yokkaichi, he has been where everyone feels
& Development Center, KIOXIA Corp. (Japan) top managed Research and Development of all unit processes welcomed, respected,
“KIOKU” in Japanese means “memory,” but the related to new memories. From Oct. 1th 2019, Toshiba Memory supported, and valued.
word entails much more than merely recording Corporation was changed company name to Kioxia Corporation.
data. KIOKU encompasses powerful, emotional In SPIE related work, his 7 papers in SPIE Micro-lithography (1998,
and nostalgic memories – the type of memories 2002, 2003, 2004, 2006, 2008, 2009) and 2 papers in SPIE Asia
that define humanity and life. To uplift the world (2008) were published for the first author.
with memory (KIOKU), we have developed new memory tech-
nologies to meet the demands of a rapidly changing market. As
Break 10:30 AM to 11:00 AM
we enter the IoT era, the amount of data produced and consumed
by data centers, in industry, by surveillance, in automobiles, and
Coffee service available until 4:00 PM spie.org/inclusion
so on, continues to grow. Therefore, the demand for and impor-
THIS PROGRAM IS CURRENT AS OF 10 JANUARY 2020. Find the latest on the SPIE CONFERENCE APP. 7
SPECIAL EVENTS
Technical Events Symposium-wide Panel Discussion Social Networking Events
Intersecting the Quantum Future Tuesday 25 February 2020 SPIE Fellow Member and Student Luncheon
and the Semiconductor Industry 6:00 PM - 8:00 PM Monday 24 February 2020 · 12:30 PM - 1:30 PM
Location: Convention Center, Location: Marriott, Salon V
Monday 24 February 2020 · 7:15 PM - 8:45 PM
Grand Ballroom 220A
Location: Convention Center, Grand Ballroom 220C Student conference attendees and SPIE Fellow Members are invited to
Symposium Chairs: Will Conley, Cymer–An ASML this engaging networking lunch. This event gives students an oppor-
Moderators: Bryan M. Barnes, NIST; Erik Hosler, PsiQuantum; R.
company and Kafai Lai, IBM T. J. Watson Research Ctr. tunity to network with SPIE Fellows who will share their insights into
Joseph Kline, NIST
Moderators: Chris Mack, Fractilia, LLC and Harry J. career paths in lithography. Lunch is complimentary. Fellow Members
Quantum computing has been a long-anticipated emerging com- will receive a personal invitation, student seating is available on a first-
Levinson, HJL Lithography.
putational paradigm to complement and compete with conven- come, first-served basis.
tional CMOS technologies. The last decade has featured reports The topic of this year’s symposium-wide panel is “A
of the initial development of using CMOS processing techniques toast to Lithography's past: what we learned from
for qubits and the atomistic fabrication of single atom transistors. technologies not used in HVM.” Over the years, a num- Women in Optics Networking Lunch
Will the semiconductor industry embrace this new architype, and ber of lithographic concepts were pursued for use in Tuesday 25 February 2020 · 12:30 PM - 1:30 PM
if so, how? When quantum devices begin to scale as predicted, manufacturing when optical lithography finally reached Location: Convention Center, Room 114
will our industry be ready to integrate radically different architec- its long-anticipated limits. While there appeared to be
tures and device structures? Are there known obstacles not yet good reasons initially to invest substantially, in terms Join other women in the field for informal discussions and networking
addressed that would enable the industry to more readily adopt of people and money, in these concepts, most were not during the scheduled lunch on Tuesday. Open to women with a paid
and benefit from today’s achievements in the laboratory? What are ultimately adopted for use in high-volume manufactur- registration badge. No advance registration is required. However, seat-
the emerging designs and the potential fundamental challenges ing (HVM). In this year’s symposium-wide panel, people ing is limited and will be granted on a first-come, first-served basis..
that are to be overcome? We have assembled a panel of experts who were involved in developing these concepts
that will share their insights on the state-of-the-art in quantum will share their perspectives on what lessons can be LGBTQ+ Lithographers Social
computing as well as intellectual leaders that will share their vision learned from their experiences.
of the eventual merger of these new technologies with our com- Tuesday 25 February 2020 · 7:00 PM - 8:00 PM
puting capabilities today, even as lithography is approaching the Location: Paper Plane (72 S. First Street)
near-atomic domain. Join us as we discuss the impending critical
Poster Session
Relax and make new friends at this informal gathering of LGBTQ+
impact of quantum computing on the semiconductor industry. Wednesday 26 February 2020 lithographers and scientists! The event will be held a short walk from
5:30 PM - 7:30 PM the Convention Center at the Paper Plane cocktail bar. Allies always
Panel Discussion: EUV Lithography Location: Convention Center, Hall 2 welcome. Contact Maryann (tungmc@stanford.edu) with any questions.
Perspective: From the Beginning to HVM All symposium attendees – You are invited to attend the
Tuesday 25 February 2020 · 3:50 PM - 5:50 PM evening Poster Session to view the high-quality posters and Welcome and Networking Event
Location: Convention Center, Grand Ballroom 220A engage the authors in discussion. Enjoy light refreshments Monday 24 February 2020 · 6:00 PM - 7:00 PM
while networking with colleagues in your field. Authors Location: Convention Center, Grand Ballroom Concourse
Moderatos: Nelson Felix, IBM Thomas J. Watson Research Ctr. may set up their posters between 10:00 am and 5:00 pm
and David T. Attwood, Univ. of California, Berkeley. the day of their poster session. Attendees are required to Join your colleagues at the Welcome Reception. Relax, socialize, and
SPIE will celebrate the entry of Extreme Ultraviolet Lithography wear their conference registration badges to access the enjoy beverages and hors-d'oeuvres on the first night of the conference.
(EUVL) into high volume manufacturing (HVM) with a special poster session. All attendees welcome.
retrospective session. Highlights will include perspectives by true Posters that are not set up by the 5:00 pm cut-off time will Please remember to wear your registration badge. Dress is casual.
pioneers of EUVL, the formation of early teams, the gathering of be considered no-shows, and their manuscripts may not be
resources and organization of the industry based EUV LLC and published. Poster authors should accompany their posters Meet the Editor Reception
its partnering with the three national laboratory ‘Virtual National from 5:30 to 7:30 pm to answer questions from attendees.
Laboratory’, the hand-off to SEMATECH and industry partners, All posters and other materials must be removed no later Wednesday 26 February 2020 · 5:30 PM - 6:30 PM
the emergence of key suppliers, and IC manufacturers’ efforts in than 7:45 pm. Any posters or materials left behind at the Location: Convention Center, Hall 2, (during the Poster
partnership with ASML and other suppliers. close of the poster session will be considered unwanted Session)
Presenters: Hiroo Kinoshita, Bill Silfvast, Andy Hawryluk, John and will be discarded. SPIE assumes no responsibility for Meet Harry Levinson, Co-Editor-in-Chief of the SPIE Journal of Micro/
Carruthers, Chuck Gwyn, Peter Silverman, Rick Stulen, Don posters left up after the end of each poster session. Nanolithography, MEMS, and MOEMS (JM3). Please remember to wear
Sweeney, Stefan Wurm, Yan Borodovsky, Anthony Yen, Winfried your conference registration badge to access the poster session.
Kaiser, Jos Benschop, Robert Brainard, Frank Abboud, Song-Sue Sponsored by
Kim, and Martin van den Brink.
Sponsored by
8 SPIE ADVANCED LITHOGRAPHY 2020 · spie.org/al · #SPIELitho ·AWARD ANNOUNCEMENTS
Metrology, Inspection, Advances in Patterning Extreme Ultraviolet (EUV)
and Process Control for Materials and Processes (11326) Lithography (11323)
Microlithography (11325 ) Monday 24 February 2020 · 2:00 to 2:10 PM Thursday 27 February 2020 · 3:10 to 3:30 PM
Monday 24 February 2020 · 10:50 to 11:10 AM
Presentation of the 2020
Presentation of the 2019 Diana Presentation of the 2019 C. Grant Cymer Leadership for Best
Nyyssonen Memorial Award for Willson Award for Best Paper Student Paper Award
Best Paper in Metrology and Award Sponsored by
Award Sponsored by Presentation of the 2019
Hiroshi Ito Memorial Award for
the Best Student Paper
These Awards Sponsored by
Thursday 27 February 2020 · 9:40 to 10:00 AM
Presentation of the 2020 Karel
Urbánek Best Student Paper Award
Award Sponsored by
Presentation of the 2019 Jeffrey
Byers Memorial Best Poster Award
Award Sponsored by
TM
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10 SPIE ADVANCED LITHOGRAPHY 2020 · spie.org/al · #SPIELitho ·COURSES
SPIE Courses are focused, efficient training from the most
· 14 ·
experienced and accomplished minds in industry and research. SPIE
Gain knowledge from the experts and apply it directly to your daily work. COURSES
SUNDAY 23 FEBRUARY 2020 MONDAY 24 FEBRUARY 2020
SC101 Introduction to Microlithography: Theory, SC1030 Interaction of Physical Design and
Materials, and Processing (Bowden, Lithography (Yuan) 1:30 PM to 5:30 PM,
Dammel) 8:30 AM - 5:30 PM, $685 / $397 / $420 / $269 / $485
$805
SC111 Lithography Process Control (Levinson)
8:30 AM - 5:30 PM, $730 / $415 / $850 THURSDAY 27 FEBRUARY 2020
SC885 Principles and Practical Implementation SC616 Practical Photoresist Processing
of Multiple Patterning (Dusa, Hsu) 8:30 AM - (Dammel) 8:30 AM - 12:30 PM, $420 /
5:30 PM, $685 / $397 / $805 $269 / $485
SC888 EUV Lithography (Bakshi, Ahn, Naulleau)
8:30 AM - 5:30 PM, $920 / $491 / $1,040
SC992 Lithography Integration for Semiconductor
FEOL & BEOL Fabrication (Lin, Zhang) 8:30 Review course descriptions
AM - 5:30 PM, $685 / $397 / $805 onsite or online.
SC1099 Chemistry and Lithography
(Okoroanyanwu) 8:30 AM - 5:30 PM, $785 / SEE SPIE CASHIER
$437 / $905
TO REGISTER
SC1100 Scatterometry in Profile, Overlay and
Focus Process Control (Cramer,
Turovets) 1:30 PM to 5:30 PM, $420 / $269
SPIE Student Members
/ $485 receive significant
SC1132 Computational Basis for Advanced discounts on courses.
· Learn from the best. This is your opportunity for direct Lithography Techniques (Lai) 8:30 AM -
instruction from legends in the semi/litho industry, many of 12:30 PM, $420 / $269 / $485
SC1133 Advanced concepts in Metrology Toolset
whom are pioneers in their fields Stability and Matching (Adan) 1:30 PM - APPLICATION TRACKS
5:30 PM, $420 / $269 / $485 Easily find sessions on these three
· Course topics are aligned with current industry needs and trends SC1158 Metrology of Image Placement
important topics within the program. Each
conference has grouped the applicable
(Starikov) 1:30 PM to 5:30 PM, $425 / $271
presentations together and do not overlap
/ $490
· Earn CEUs for professional continuing education requirements with other conferences.
SC1263 Stochastic Lithography (Mack, Petersen)
8:30 AM - 5:30 PM, $685 / $397 / $805 • Machine Learning
spie.org/education • Stochastics
SC1264 Machine Learning for Lithography (Shiely)
Information for Course attendees: 8:30 AM - 5:30 PM, $730 / $415 / $850 • Overlay
spie.org/education/course-attendees
Prices: Members / Student Member / Non-Members
MONEY-BACK GUARANTEE CONTINUING EDUCATION UNITS
We are confident that once you experience an SPIE course for yourself you will look to us for your future SPIE is accredited by the International Association for Continuing Education and Training
education needs. However, if for any reason you are dissatisfied, we will gladly refund your money. We just (IACET) and is authorized to issue the IACET CEU.
ask that you tell us what you did not like; suggestions for improvement are always welcome.
THIS PROGRAM IS CURRENT AS OF 10 JANUARY 2020. Find the latest on the SPIE CONFERENCE APP. 11Thanks to the following sponsors for their
generous support of SPIE Advanced Lithography
TM
Promotional Partner:
Semiconductor Digest
12 SPIE ADVANCED LITHOGRAPHY 2020 · spie.org/al · #SPIELitho ·EXHIBITION
Don't miss
the Exhibition
See the industry’s most important
exhibition for lithography research
and development, devices, tools,
fabrication, and services.
TECHNOLOGIES See these companies
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control Canon U.S.A., Inc.
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ibss Group, Inc. Osiris International GmbH Seiwa Optical America Inc.
INKO Industrial Corp. Pall Corp. Semiconductor Digest
Tuesday 25 February 2020 J.A. Woollam SEQENS Shin-Etsu MicroSi, Inc.
10:00 AM - 5:00 PM JENOPTIK Light & Optics Philips Innovation Services Synopsys, Inc.
Wednesday 26 February 2020 JEOL USA Inc. PM B.V. TEL - Tokyo Electron U.S. Holdings
10:00 AM - 4:00 PM JSR Micro, Inc. POLLEN Metrology Vistec Electron Beam GmbH
Kayaku Advanced Materials, Inc. Pozzetta, Inc. XEI Scientific, Inc.
San Jose Convention Center Hall 1
Zygo Corporation
Contact SPIE Sales to Exhibit: Tel: +1 360 676 3290 · Fax: +1 360 647 1445 · SPIESales@spie.org
THIS PROGRAM IS CURRENT AS OF 10 JANUARY 2020. Find the latest on the SPIE CONFERENCE APP. 13SESSION SCHEDULE
CONFERENCE 11323 CONFERENCE 11324 CONFERENCE 11325
Extreme Ultraviolet (EUV) Novel Patterning Technologies for Metrology, Inspection, and Process
Lithography XI Semiconductors, MEMS/NEMS and Control for Microlithography XXXIV
MOEMS 2020
Monday Session 1 · Mon 11:00 AM to 12:20 PM Opening Remarks · 3:30 PM to 3:50 PM Opening Remarks and Award Announcements ·
24 February Keynote Session
Session 1 · Mon 3:50 PM to 5:10 PM
10:50 AM to 11:10 AM
Session 2 · Mon 1:20 PM to 3:20 PM Keynote Session Session 1 · Mon 11:10 AM to 12:30 PM
The Future is High NA Keynote Session
Session 3 · Mon 3:50 PM to 5:50 PM Session 2 · Mon 1:30 PM to 3:30 PM
Inorganic Resists: Joint Session with Pattern Placement and Overlay
conferences 11323 and 11326 Metrology I
Session 3 · Mon 3:50 PM to 5:30 PM
Challenges and New Methods
Tuesday Session 4 · Tue 8:00 AM to 10:00 am Session 2 · Tue 8:00 AM to 10:00 AM
25 February Stochastics: Joint Sessions with Conferences Imprint Lithography Session 4 · Tue 8:00 AM to 10:00 am
11323 and 11326 Inspection and Mass Metrology
Session 3 · Tue 10:30 AM to 12:10 PM
Session 5 · Tue 10:30 AM to 12:30 PM Scanning Probe Lithography Session 5 · Tue 10:30 AM to 12:10 PM
Stochastics of EUV Patterning High Aspect Ratio Metrology
Session 4 · Tue 1:40 PM to 3:00 PM
Session 6 · Tue 2:00 PM to 3:00 PM Nanoimprint Lithography for Semiconductors Session 6 · Tue 1:40 PM to 3:00 PM
EUV Scanner Monitoring Roughness Metrology
Session 5 · Tue 3:30 PM to 6:30 PM
EUV Poster Preview Speed Talks I · 3:00 to 3:20 PM Quantum Computing Session 7 · Tue 3:30 PM to 5:10 PM
Panel discussion · 3:50 PM to 5:50 PM New Methods: Student Session
EUV Lithography Retrospective: from the beginning
to HVM
Wednesday Session 7 · Wed 8:00 AM to 10:00 am Session 6 · Wed 8:00 AM to 10:00 AM
26 February EUV Patterning and Etch: Joint session with Multi-Beam Mask Writing Session 8 · Wed 8:00 AM to 10:00 am
conferences 11323 and 11329 Session 7 · Wed 10:30 AM to 12:10 PM 3D Profile and Shape Analysis
Session 8 · Wed 10:30 AM to 11:50 am Multi-Beam Direct Write Lithography Session 9 · Wed 10:30 AM to 12:10 PM
Progress in EUV Sources Session 8 · Wed 1:40 PM to 3:00 PM Scatterometry
Session 9 · Wed 1:20 PM to 3:40 PM 3-D Printing Session 10 · Wed 1:40 PM to 3:00 PM
Progress in EUV Masks Session 9 · Wed 3:30 PM to 5:30 PM Machine Learning
Session 10 · Wed 4:10 PM to 4:50 PM Neuromorphic Computing Session 11 · Wed 3:30 PM to 5:30 PM
EUV OPC and Modeling Pattern Placement and Overlay Metrology II
EUV Poster Preview Speed Talks II · 4:50 to 5:30 PM
Thursday Session 11 · Thu 8:00 AM to 10:20 am Session 10 · Thu 8:00 AM to 10:00 AM
27 February Atomically Precise Lithography: TopDown Session 12 · Thu 8:00 AM to 9:40 AM
EUV Resist Fundamentals
Approach Metrology for the EUV Era
Session 12 · Thu 10:50 AM to 12:30 PM
Session 11 · Thu 10:30 AM to 11:50 AM 2020 Karel Urbánek Best Student Paper Award
EUV Mask Inspection and Pellicle
Atomically Precise Lithography: BottomUp Presentation · 9:40 AM to 10:00 AM
Session 13 · Thu 1:30 PM to 3:10 PM Approach Session 13 · Thu 10:30 AM to 12:10 PM
New Concepts in EUV
Session 12 · Thu 1:40 PM to 3:20 PM Pattern Placement and Overlay Metrology III
ASML Best Student Paper Award and Closing MEMS/NEMS Session 14 · Thu 1:40 PM to 3:00 PM
Remarks · 3:10 PM to 3:30 PM
Session 13 · Thu 3:50 PM to 4:50 PM Late Breaking News
Novel Patterning and Applications
14 SPIE ADVANCED LITHOGRAPHY 2020 · spie.org/al · #SPIELitho ·SESSION SCHEDULE
CONFERENCE 11326 CONFERENCE 11327 CONFERENCE 11328 CONFERENCE 11329
Advances in Patterning Optical Microlithography Design-Process-Technology Advanced Etch Technology
Materials and Processes XXXVII XXXIII Co-optimization for for Nanopatterning IX
Manufacturability XIV
Opening Remarks and Awards
Announcements · 2:00 PM to 2:10 PM
Session 1 · Mon 2:10 PM to 3:10 PM
Keynote Session
Session 2 · Mon 3:50 PM to 5:50 PM
Inorganic Resists: Joint Session with
conferences 11323 and 11326
Session 3 · Tue 8:00 AM to 10:00 AM Session 1 · Tue 10:30 AM to 12:10 PM
Stochastics: Joint Sessions with Keynote Session and Latest Topic Session 1 · Tue 8:00 AM to 10:00 AM
Conferences 11323 and 11326 Keynote Session
Session 2 · Tue 1:40 PM to 3:20 PM
Session 4 · Tue 10:30 AM to 12:10 PM Machine Learning and Session 2 · Tue 10:30 AM to 12:10 PM
Novel Resists Computational Lithography I Materials and Etch Integration
Session 5 · Tue 1:40 PM to 3:20 PM Session 3 · Tue 3:50 PM to 5:30 PM Session 3 · Tue 1:40 PM to 3:20 PM
Fundamentals and Modeling Machine Learning and Computational Patterning and
Computational Lithography II Patterning Process Control
Session 6 · Tue 3:50 PM to 5:30 PM
Integration Session 4 · Tue 3:50 PM to 5:40 PM
Atomic Layer Etching and Novel Plasma
Techniques
Session 7 · Wed 8:10 AM to 10:00 AM Session 4 · Wed 8:00 AM to 10:00 am Session 1 · Wed 8:00 AM to 10:00 AM Session 5 · Wed 8:00 AM to 10:00 AM
Deposition-based Patterning Process Control, Resist Modeling AI and Machine Learning EUV Patterning and Etch: Joint
session with conferences 11323 and
Session 8 · Wed 10:30 AM to 12:10 PM Session 5 · Wed 10:30 AM to 12:10 PM Session 2 · Wed 10:30 AM to 12:10 PM 11329
Novel Patterning Lithography Equipment, Focus Control Advanced Designs
Session 6 · Wed 10:30 AM to 12:10 PM
Session 9 · Wed 1:40 PM to 3:00 PM Session 6 · Wed 1:40 PM to 3:00 PM Session 3 · Wed 1:40 PM to 3:10 PM Patterning Solutions for Emerging
Supplier DUV and EUV Matching Pattern Matching Applications
Session 10 · Wed 3:30 PM to 5:10 PM Session 7 · Wed 3:30 PM to Session 4 · Wed 3:40 PM to 4:40 PM Session 7 · Wed 1:40 PM to 4:00 PM
Underlayers 5:10 PM DFM by Chip Makers Advanced Patterning Integration
Overlay and CD control
Poster Preview Speed Talks · 5:10 PM to
5:30 pm
Session 5 · Thu 8:00 AM to 10:00 AM APPLICATION TRACKS
Design for Manufacturing
Easily find sessions on these three important
Session 6 · Thu 10:30 AM to 12:00 PM topics within the program. Each conference has
Device and Integration grouped the applicable presentations together
and do not overlap with other conferences.
Session 7 · Thu 1:30 PM to 3:00 PM
DPTCO from Equipment Vendors • Machine Learning
Session 8 · Thu 3:30 PM to 5:00 PM
DPTCO from EDA Vendors • Stochastics
• Overlay
THIS PROGRAM IS CURRENT AS OF 10 JANUARY 2020. Find the latest on the SPIE CONFERENCE APP. 15CONFERENCE 11323 CONFERENCE 11324 CONFERENCE 11325 CONFERENCE 11326
Monday - Thursday 24–27 February Monday - Thursday 24–27 Monday - Thursday 24–27 Monday - Wednesday 24–26
2020 • Proceedings of SPIE Vol. 11323 February 2020 • Proceedings February 2020 • Proceedings February 2020 • Proceedings
of SPIE Vol. 11324 of SPIE Vol. 11325 of SPIE Vol. 11326
Extreme Ultraviolet
Novel Patterning Metrology, Advances in
(EUV) Lithography XI
Conference Chair: Nelson M. Felix, IBM Corp.
Technologies for Inspection, and Patterning Materials
(USA)
Semiconductors, Process Control for and Processes
Conference Co-Chair: Anna Lio, Intel Corp. (USA)
Program Committee: Jos P. Benschop, ASML
MEMS/NEMS and Microlithography XXXVII
Netherlands B.V. (Netherlands); Robert L.
Brainard, SUNY CNSE/SUNYIT (USA); Martin
MOEMS 2020 XXXIV Conference Chair: Roel Gronheid, KLA-Tencor/
ICOS Belgium (Belgium)
Burkhardt, IBM Thomas J. Watson Research Conference Chair: Martha I. Sanchez, IBM Conference Chair: Ofer Adan, Applied
Ctr. (USA); Sonia Castellanos Ortega, Advanced Conference Co-Chair: Daniel P. Sanders, IBM
Research - Almaden (USA) Materials (Israel)
Research Ctr. for Nanolithography (Netherlands); Research - Almaden (USA)
Yasin Ekinci, Paul Scherrer Institut (Switzerland); Conference Co-Chair: Eric M. Panning, Intel Conference Co-Chair: John C. Robinson, KLA
Program Committee: Robert Allen, IBM
Andreas Erdmann, Fraunhofer-Institut für Corp. (USA) Corp. (USA)
Research - Almaden (USA); Gilles R. Amblard,
Integrierte Systeme und Bauelementetechnologie Program Committee: Alan D. Brodie, KLA Program Committee: John A. Allgair, BRIDG SAMSUNG Austin Semiconductor LLC (USA);
IISB (Germany); Allen H. Gabor, IBM Corp. (USA); Corp. (USA); Richard A. Farrell, Facebook Inc. (USA); Masafumi Asano, Tokyo Electron Ramakrishnan Ayothi, JSR Micro, Inc. (USA);
Emily E. Gallagher, IMEC (Belgium); Kenneth (USA); Naoya Hayashi, Dai Nippon Printing Ltd. (Japan); Benjamin D. Bunday, AMAG Ryan Callahan, FUJIFILM Electronic Materials
A. Goldberg, Lawrence Berkeley National Lab. Co., Ltd. (Japan); Daniel J. C. Herr, The Consulting, LLC (USA); Jason P. Cain, U.S.A., Inc. (USA); James F. Cameron,
(USA); Naoya Hayashi, Dai Nippon Printing Co., Univ. of North Carolina at Greensboro (USA); Advanced Micro Devices, Inc. (USA); Xiaomeng DuPont Electronics & Imaging (USA); Joy Y.
Ltd. (Japan); Eric Hendrickx, IMEC (Belgium); Tatsuhiko Higashiki, Toshiba Corp. (Japan); Chen, Taiwan Semiconductor Manufacturing Cheng, Taiwan Semiconductor Manufacturing
Soichi Inoue, Toshiba Memory Corp. (Japan); Erik R. Hosler, PsiQuantum, LLC. (USA); Co. Ltd. (Taiwan); Hugo Cramer, ASML Co. Ltd. (Taiwan); Ralph R. Dammel, EMD
Srividya Jayaram, Mentor, a Siemens Business Stephen M. Kuebler, Univ. of Central Florida Netherlands B.V. (Netherlands); Timothy Performance Materials Corp. (USA); Anuja De
(USA); Bryan S. Kasprowicz, Photronics, Inc. (USA); J. Alexander Liddle, National Institute F. Crimmins, Intel Corp. (USA); Shunsuke Silva, IBM Corp. (USA); Danilo De Simone,
(USA); Insung Kim, SAMSUNG Electronics of Standards and Technology (USA); Chi- Koshihara, Hitachi High-Technologies Corp. IMEC (Belgium); Douglas Guerrero, Brewer
Co., Ltd. (Korea, Republic of); Seong-Sue Kim, Chun Liu, IBM Corp. (USA); Hans Loeschner, (Japan); Yi-Sha Ku, Industrial Technology Science, Inc. (USA); Clifford L. Henderson,
SAMSUNG Electronics Co., Ltd. (Korea, Republic IMS Nanofabrication GmbH (Austria); John Research Institute (Taiwan); Byoung-Ho Lee, Univ. of South Florida (USA); Craig D.
of); Toshio Konishi, Toppan Printing Co., Ltd. G. Maltabes, Applied Materials GmbH & Co. SK hynix, Inc. (Korea, Republic of); Philippe Higgins, GLOBALFOUNDRIES Inc. (USA);
(Japan); Marie E. Krysak, Intel Corp. (USA); Ted KG (USA); Laurent Pain, CEA-LETI (France); Leray, IMEC (Belgium); Narender Rana, Christoph K. Hohle, Fraunhofer-Institut für
Liang, Intel Corp. (USA); Chang-Moon Lim, Ivo W. Rangelow, Technische Univ. Ilmenau Western Digital Corp. (USA); Christopher Photonische Mikrosysteme (Germany); Scott
SK Hynix, Inc. (Korea, Republic of); Luciana (Germany); Douglas J. Resnick, Canon J. Raymond, Onto Innovation Inc. (USA); W. Jessen, Texas Instruments Inc. (USA);
Meli, IBM Corp. (USA); Lawrence S. Melvin Nanotechnologies, Inc. (USA); Ricardo Ruiz, Matthew J. Sendelbach, Nova Measuring Yoshio Kawai, Shin-Etsu Chemical Co., Ltd.
III, Synopsys, Inc. (USA); Hiroaki Morimoto, Lawrence Berkeley National Lab. (USA); Instruments Inc. (USA); Richard Silver, National (Japan); Qinghuang Lin, ASML US, Inc. (USA);
Toppan Printing Co., Ltd. (Japan); Patrick P. Chandrasekhar Sarma, Intel Corp. (USA); Institute of Standards and Technology (USA); Nobuyuki N. Matsuzawa, Panasonic Corp.
Naulleau, Lawrence Berkeley National Lab. (USA); Ines A. Stolberg, Vistec Electron Beam GmbH Eric Solecky, GLOBALFOUNDRIES Inc. (USA); (Japan); Steve S. Putna, Intel Corp. (USA);
Christopher S. Ngai, Applied Materials, Inc. (Germany); Hsinyu Tsai, IBM Research - Alexander Starikov, I&I Consulting (USA); Alok Mark H. Somervell, Tokyo Electron America,
(USA); Shinji Okazaki, ALITECS Co., Ltd. (Japan); Almaden (USA); Wei Wu, The Univ. of Southern Vaid, GLOBALFOUNDRIES Inc. (USA) Inc. (USA); Jason K. Stowers, Inpria (USA);
Eric M. Panning, Intel Corp. (USA); Moshe E. California (USA) Raluca Tiron, CEA-LETI (France); Rick Uchida,
Preil, KLA Corp. (USA); Kurt G. Ronse, IMEC Tokyo Ohka Kogyo America, Inc. (USA);
(Belgium); Akiyoshi Suzuki, Gigaphoton Inc. Conference 11325 begins on page 18. Thomas I. Wallow, ASML Brion Technologies
(Japan); Anna Tchikoulaeva, Lasertec U.S.A., Inc. Conference 11324 begins on page 20.
(USA)
Zweigniederlassung Deutschland (Germany); Edita Conference Sponsor
Tejnil, Mentor Graphics Corp. (USA); Thomas I.
Conference 11326 begins on page 19.
Wallow, ASML Brion (USA); Obert R. Wood II,
GLOBALFOUNDRIES Inc. (USA)
Conference 11323 begins on page 18.
Conference Sponsor
16 SPIE ADVANCED LITHOGRAPHY 2020 · spie.org/al · #SPIELitho ·CONFERENCE 11327 CONFERENCE 11328 CONFERENCE 11329
SPEAKERS DO NOT HAVE
Tuesday - Wednesday 25–26 Wednesday - Thursday 26–27 Tuesday - Wednesday 25–26 February
THE OPTION TO USE
February 2020 • Proceedings February 2020 • Proceedings 2020 • Proceedings of SPIE Vol. 11329
THEIR OWN DEVICE
of SPIE Vol. 11327 of SPIE Vol. 11328
Advanced Etch 1. Upload in advance
Optical Design-Process- You are required to upload
Technology for your presentation file in
Microlithography Technology Co- Nanopatterning IX advance in one of two ways:
XXXIII optimization for Conference Chair: Richard S. Wise, Lam ONLINE:
Conference Chair: Soichi Owa, Nikon Corp.
(Japan)
Manufacturability Research Corp. (USA) http://spieuploads.com
(portal closes @ 5:00 PM
Conference Co-Chair: Catherine B. Labelle,
Conference Co-Chair: Mark C. Phillips, Intel XIV Intel Corp. (USA)
PST, 21 February 2020)
Corp. (USA) Program Committee: Efrain Altamirano- ONSITE AT SPEAKER
Conference Chair: Chi-Min Yuan, NXP
Program Committee: Jack Chen, Semiconductors (USA) Sánchez, IMEC (Belgium); John Arnold, IBM CHECK-IN: using your
NanoPatterning Technology Co Ltd. (Taiwan); Thomas J. Watson Research Ctr. (USA); Keun USB device, upload at
Conference Co-Chair: Ryoung-Han Kim, IMEC Hee Bai, SAMSUNG Electronics Co., Ltd.
Will Conley, Cymer, An ASML company
(Belgium)
least 2 hours before
(USA); Carlos Fonseca, Tokyo Electron (Korea, Republic of); Julie Bannister, Tokyo session or the day
America, Inc. (USA); Bernd Geh, Carl Zeiss Program Committee: Robert Aitken, ARM Electron America, Inc. (USA); Maxime Darnon, before if presenting in
SMT GmbH (USA); Yuri Granik, Mentor Inc. (USA); Jason P. Cain, Advanced Micro LN2 CNRS (Canada); Sebastian U. Engelmann,
IBM Thomas J. Watson Research Ctr. (USA);
first morning session
Graphics Corp. (USA); Harsha Grunes, Intel Devices, Inc. (USA); Luigi Capodieci, Motivo,
Corp. (USA); Toshiyuki Hisamura, Xilinx, Inc. (USA); Lifu Chang, HiSilicon Technologies Eric A. Hudson, Lam Research Corp. (USA);
Inc. (USA); Stephen D. Hsu, ASML San Co., Ltd. (USA); Neal V. Lafferty, Mentor, Kaushik A. Kumar, Tokyo Electron Ltd. (Japan); 2. Preview your
Jose (USA); Young Seog Kang, SAMSUNG a Siemens Business (USA); Ya-Chieh Lai, Qinghuang Lin, IBM Thomas J. Watson
Research Ctr. (USA); Ru-Gun Liu, Taiwan
presentation onsite
Electronics Co., Ltd. (Korea, Republic of); Cadence Design Systems, Inc. (USA); Lars W.
Sachiko Kobayashi, Toshiba Corp. (Japan); Liebmann, TEL Technology Ctr., America, LLC Semiconductor Manufacturing Co. Ltd. (Taiwan); All presenters are strongly
Jongwook Kye, SAMSUNG Electronics Co., (USA); Ru-Gun Liu, Taiwan Semiconductor Nihar Mohanty, Oculus VR, LLC (USA); Jake encouraged to visit Speaker
Ltd. (Korea, Republic of); Kafai Lai, IBM Manufacturing Co. Ltd. (Taiwan); Kevin Lucas, O’Gorman, Hitachi High Technologies America, Check-In at least 2 hours
Corp. (USA); Ken-Ichiro Mori, Canon Inc. Synopsys, Inc. (USA); Andrew R. Neureuther, Inc. (USA); Erwine Pargon, CNRS/LTM (France);
prior to their presentation to
(Japan); John S. Petersen, IMEC (USA); Univ. of California, Berkeley (USA); Shigeki Nicolas Posseme, CEA-LETI (France); Ricardo
Ruiz, Lawrence Berkeley National Lab. (USA); preview their files through the
Daniel Sarlette, Infineon Technologies Nojima, KIOXIA Corp. (Japan); David Z. Pan,
Dresden (Germany); Kunal N. Taravade, The Univ. of Texas at Austin (USA); Chul- Yuyang Sun, Mentor Graphics Corp. (USA); Ying SPIE presentation system.
Synopsys, Inc. (USA); Edita Tejnil, Mentor Hong Park, SAMSUNG Electronics Co., Ltd. Zhang, NAURA (USA); Anthony Yen, ASML US,
Graphics Corp. (USA); Geert Vandenberghe, (Korea, Republic of); Piyush Pathak, Cadence LP (USA)
IMEC (Belgium); Reinhard Voelkel, SUSS Design Systems, Inc. (USA); Michael L. Rieger,
MicroOptics SA (Switzerland); Uwe D. Zeitner, Consultant (USA); Vivek K. Singh, Intel Corp.
SPIE will record the audio
Conference 11329 begins on page 21.
Fraunhofer-Institut für Angewandte Optik und (USA); Lynn T. Wang, GLOBALFOUNDRIES plus screen content of all
Feinmechanik (Germany) Inc. (USA) presentations. Recordings
will be published on the SPIE
Conference 11327 begins on page 23. Conference 11328 begins on page 29. Digital Library with author
permission only.
Conference Sponsor
THIS PROGRAM IS CURRENT AS OF 10 JANUARY 2020. Find the latest on the SPIE CONFERENCE APP. 17Monday 24 February
CONFERENCE 11325
CONFERENCE 11323 Metrology, Inspection,
Extreme Ultraviolet (EUV) and Process Control for
Lithography XI Microlithography XXXIV
PLENARY SESSION · ROOM: CONVENTION CENTER, GRAND BALLROOM 220A · 8:00 AM TO 10:00 AM
8:00 AM to 8:30 AM · Welcome and Announcements 8:30 AM: 9:50 AM:
Symposium Chairs: Will Conley, Cymer, An ASML Company
High performance mapping for deep Process technologies
(USA), and Kafai Lai, IBM T. J. Watson Research Ctr. (USA) learning applications leading a future of
Allen Rush, Advanced Micro Devices, Inc. (USA) semiconductor memory
· Introduction of New SPIE Fellows (KIOKU) devices
· Presentation of the Zernike Award Koji Hashimoto, kioxia Corporation
(Japan)
· Presentation of the Nick Cobb Memorial Scholarship 9:10 AM:
In-memory computing for AI applications
Evangelos Eleftheriou, IBM Research - Zürich (Switzerland)
Plenary presentations sponsored by
Coffee Break · Mon 10:30 AM to 11:00 AM
SESSION 1 LOCATION: CONVENTION CENTER,
LOCATION: CONVENTION CENTER, GRAND BALLROOM 220B, 10:50 AM TO 11:10 AM
GRAND BALLROOM 220A Opening Remarks and Award
MON 11:00 AM TO 12:20 PM
Announcements
Keynote Session Session Chairs: Ofer Adan, Applied Materials Israel, Ltd. (Israel);
Session Chairs: Nelson M. Felix, IBM Thomas John C. Robinson, KLA Corp. (USA)
J. Watson Research Ctr. (USA); Anna Lio, Intel Presentation of the 2019 Diana Nyyssonen Best Paper
Corp. (USA) Award in Metrology
11:00 am: Next generation patterning using Award Sponsored by
EUV lithography (Keynote Presentation), Sam
Sivakumar, Intel Corp. (USA). . . . . . . . . . [11323-1]
11:40 am: Pushing EUV patterning to the atomic
scale (Keynote Presentation), Patrick P. Naulleau,
The Ctr. for X-Ray Optics (USA). . . . . . . [11323-2] SESSION 1 APPLICATION TRACKS
Lunch Break . . . . . . . . . Mon 12:20 pm to 1:20 pm LOCATION: CONVENTION CENTER, GRAND BALLROOM Easily find sessions on these three
220B , MON 11:10 AM TO 12:30 PM important topics within the program.
Keynote Session Each conference has grouped the
Session Chairs: Ofer Adan, Applied Materials Israel, Ltd. applicable presentations together
(Israel); John C. Robinson, KLA Corp. (USA) Overlay and do not overlap with other
11:10 am: Metrology for advanced transistor and memristor devices
conferences.
and materials (Keynote Presentation), Alain C. Diebold, Nathaniel C.
Cady, SUNY Polytechnic Institute (USA). . . . . . . . . . . . . . . . . . . . [11325-1] • Machine Learning
11:50 am: Metrology requirements driven by memory scaling (Keynote
Presentation), Cornel Bozdog, Micron Technology, Inc. (USA). [11325-100]
• Stochastics
Lunch Break . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mon 12:30 pm to 1:30 pm
• Overlay
18 SPIE ADVANCED LITHOGRAPHY 2020 · spie.org/al · #SPIELitho ·Monday 24 February
CONFERENCE 11325 CONFERENCE 11326
CONFERENCE 11323 Metrology, Inspection, Advances in Patterning
Extreme Ultraviolet (EUV) and Process Control for Materials and Processes
Lithography XI Microlithography XXXIV XXXVII
SESSION 2 SESSION 2 LOCATION: CONVENTION CENTER, GRAND
LOCATION: CONVENTION CENTER, BALLROOM 220C , 2:00 PM TO 2:10 PM
LOCATION: CONVENTION CENTER, GRAND
GRAND BALLROOM 220A Stochastics BALLROOM 220B, MON 1:30 PM TO 3:30 PM Opening Remarks and Awards
MON 1:20 PM TO 3:20 PM
Pattern Placement and Overlay Announcements
The Future is High NA Overlay Metrology I Session Chairs: Roel Gronheid, ICOS VISION
Session Chairs: Kenneth A. SYSTEMS NV (Belgium); Daniel P. Sanders, IBM
Session Chairs: Alexander Starikov, I&I Consulting (USA); Research - Almaden (USA)
Goldberg, Lawrence Berkeley National Lab.
Jason P. Cain, Advanced Micro Devices, Inc. (USA)
(USA); Ted Liang, Intel Corp. (USA) Presentation of the C. Grant Willson Best
1:30 pm: Computational phase imaging technique for
1:20 pm: High-NA EUV lithography exposure tool: Paper Award
the wafer inspection, Seung Beom Park, Jaehyeon Son,
program progress (Invited Paper), Jan Van Schoot,
Kyungwon Yun, Taewan Kim, Myungjun Lee, SAMSUNG Presentation of the Hiroshi Ito Memorial Best
Eelco van Setten, Kars Troost, Sjoerd Lok, Judon
Electronics Co., Ltd. (Korea, Republic of). . . . . . . [11325-101] Student Paper Award
Stoeldraijer, Rudy Peeters, Jos Benschop, ASML
Netherlands B.V. (Netherlands); Paul Graeupner, Lars 1:50 pm: Contour based metrology: “make measurable what Awards Sponsored by
Wischmeier, Peter Kuerz, Winfried Kaiser, Carl Zeiss is not so”, Bertrand Le-Gratiet, Regis Bouyssou, Julien Ducote,
SMT GmbH (Germany) . . . . . . . . . . . . . . . . . [11323-3] Christophe Dezauzier, Alain Ostrovsky, Charlotte Beylier,
Christian Gardin, STMicroelectronics S.A. (France); Nivea G.
1:40 pm: High-NA EUV lithography optics becomes
Schuch, Paolo Petroni, Loïc Schneider, Matthieu Millequant,
reality (Invited Paper), Lars Wischmeier, Paul
Patrick Schiavone, ASELTA Nanographics (France).[11325-3] Presentation of the Jeffrey Byers Memorial
Gräupner, Peter Kürz, Winfried Kaiser, Carl Zeiss SMT
GmbH (Germany); Jan Van Schoot, Jörg Mallmann, 2:10 pm: Understanding advanced DRAM edge placement Award
Joost de Pee, Judon Stoeldraijer, ASML Netherlands error budget and opportunities for control, Jaeseung
B.V. (Netherlands). . . . . . . . . . . . . . . . . . . . . [11323-4] Jeong, Jinho Lee, Jinsun Kim, Sunyoung Yea, Chan Hwang, Awards Sponsored by
Seung Yoon Lee, Jeongjin Lee, Joon-Soo Park, SAMSUNG
2:00 pm: Perspectives and tradeoffs of novel
Electronics Co., Ltd. (Korea, Republic of); Peter Nikolsky, ASML
absorber materials for high NA EUV lithography, TM
Netherlands B.V. (Netherlands); Daniel Park, ASML Netherlands
Andreas Erdmann, Hazem M. S. Mesilhy, Peter
B.V. (Korea, Republic of); Antonio Corradi, Hyun-Woo Yu, Sun
Evanschitzky, Fraunhofer-Institut für Integrierte
Wook Jung, Denis Ovchinnikov, Vadim Timoshkov, Isabel de SESSION 1
Systeme und Bauelementetechnologie IISB
la Fuente Valentin, Yuxiang Yin, Kaustubh Padhye, Wim Tel,
(Germany); Vicky Philipsen, imec (Belgium); Frank LOCATION: CONVENTION CENTER,
Harm Dillen, Koen Thuijs, Daan Slotboom, ASML Netherlands
Timmermans, ASML Netherlands B.V. (Netherlands);
Markus Bauer, Carl Zeiss SMT GmbH
B.V. (Netherlands); Miao Wang, Rhys Su, Marc Kea, ASML GRAND BALLROOM 220C
Netherlands B.V. (USA); Jin-Woo Lee, Yun-A Sung, Sang-Uk MON 2:10 PM TO 3:10 PM
(Germany) . . . . . . . . . . . . . . . . . . . . . . . . . . . [11323-5]
Kim, Young-Hoon Song, Oh-Sung Kwon, ASML Netherlands
2:20 pm: Lithographic pattern formation in the B.V. (Korea, Republic of); James Lee, ASML Korea Co., Ltd. Keynote Session
presence of aberrations in anamorphic optical (Korea, Republic of). . . . . . . . . . . . . . . . . . . . . . . . . . [11325-4]
systems, Zac A. Levinson, Synopsys, Inc. (USA); Session Chairs: Daniel P. Sanders, IBM
2:30 pm: Real-time full-wafer design-based interlayer virtual Research - Almaden (USA); Roel Gronheid,
Bruce W. Smith, Rochester Institute of Technology
metrology, John L. Sturtevant, Lianghong Yin, Shumay Shang, ICOS VISION SYSTEMS NV (Belgium)
(USA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [11323-6]
Kostas Adam, Mentor, a Siemens Business (USA); Young-
2:40 pm: How we made the Berkeley MET5 Chang Kim, Mentor Graphics Korea Co. Inc. (USA); Marko 2:10 pm: Selective deposition approaches
stable and productive, Christopher Neil Anderson, Chew, Abhinandan Nath, Mentor, a Siemens Business (USA); based on atomic layer deposition and etching
Lawrence Berkeley National Lab. (USA). . . . [11323-7] Alberto López Gómez, Boris Habets, Qoniac GmbH (Keynote Presentation), Erwin W. M. M. Kessels,
(Germany) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [11325-5] Technische Univ. Eindhoven
3:00 pm: Reviewing the EUV resists status towards
(Netherlands) . . . . . . . . . . . . . . . . . . . . . [11326-1]
high-NA EUV lithography, Xiaolong Wang, Li-Ting 2:50 pm: Optical scribe target vs. on device overlay bias
Tseng, Iacopo Mochi, Chia-Kai Yeh, Michaela accuracy validation, Yaniv Abramovitz, Applied Materials 2:40 pm: Metrology for next generation
Vockenhuber, Paul Scherrer Institut (Switzerland); Israel, Ltd. (Israel) . . . . . . . . . . . . . . . . . . . . . . . . . [11325-106] patterning (Keynote Presentation), R. Joseph
Lidia Protasova, Rolf Custers, Gijsbert Rispens, Rik Kline, National Institute of Standards and
3:10 pm: Application of high throughput contour based edge Technology (USA) . . . . . . . . . . . . . . . . . . [11326-2]
Hoefnagels, ASML Netherlands B.V. (Netherlands);
placement error metrology in leading edge DRAM process
Yasin Ekinci, Paul Scherrer Institut
development, Sudharshanan Raghunathan, Teng Wang, Coffee Break. . . . . . . . . . . . . Mon 3:10 pm to 3:40 pm
(Switzerland) . . . . . . . . . . . . . . . . . . . . . . . . . [11323-8]
Lingling Pu, Stefan Hunsche, ASML US, Inc. (USA); Daniel Park,
Coffee Break. . . . . . . . . . . . . Mon 3:20 pm to 3:50 pm Jaden Song, ASML Korea Co., Ltd. (Korea, Republic of); Jung-
chan Kim, Sun-keun Ji, Sang-woo Kim, Gyun Yoo, Cheol-Kyun
Kim, Chan-ha Park, SK Hynix, Inc. (Korea, Republic
of) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [11325-107]
Coffee Break. . . . . . . . . . . . . . . . . . . Mon 3:30 pm to 3:50 pm
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