ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO

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ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO
ATLAS and CMS and HL-LHC
 upgrade: status and plans
           Krisztian Peters
       PoF preparation meeting
           March 18, 2019
ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO
The DESY groups in ATLAS and CMS
Two strong and influential groups on ATLAS and
CMS
-   Each group has roughly 100 members
-   ~4-6 PhDs graduate in both groups every year
-   Groups have high visibility and leading roles in detector
    operation, object reconstruction, physics analysis and
    upgrades
-   Many management and leadership positions covered by                                     Physics Coordinator
                                                                                                      K. Mönig
    DESY scientists
                                                                         Physics Analysis                        Combined Performance
    • Deputy spokesperson, physics coordinator,Collaboration Board
      Chair, physics and performance group conveners, etc.           B-Physics        Exotics              E-gamma          Flavour tag
                                                                                                                              C. Pollard

                                                                     Heavy ions        Higgs             Inner Tracking      Jet/etmiss
                                                                                     K. Tackmann

                                                                        SM             SUSY                  Muon               Tau
                                                                                       F. Meloni
                                                                        Top        Upgrade Phys.         Phys. Model.
                                                                                                            S. Amaroso

                                                                                                                                           2
ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO
Detector Operations and Upgrade
CMS: fast beam condition monitor (BCM1F) for online measurement of luminosity
constructed at DESY and group has a leading role in operation

ATLAS: responsibility for maintenance and further development of prompt calibration loop
for the semiconductor tracker (SCT)

New tracking detectors for Phase-1 upgrade
-   Construction of 287 modules for 4th layer
    of CMS pixel detector at DESY, installed in
    early 2017

-   ATLAS added innermost layer (IBL) and
    track trigger (FTk) with collaboration of DESY

                                                                                       3
ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO
Detector and algorithm performance studies
Involved in many performance studies required for successful data analyses:
-   From photon identification to Monte Carlos studies
-   CMS: pivotal role in alignment of CMS detector, handling
    about 200000 alignment parameters simultaneously
-   ATLAS: strong contributions to tracking aspects for
    current and future tracking systems to adjust to ever
    increasing pile-up events

                                                                              4
ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO
Computing
TIER-2 and National Analysis Facility (NAF)
-   Allow for complementary usage of the same data source
-   TIER-2: large national and international impact on the WLCG
-   NAF: more than 600 users registered. Direct access to the entire TIER-2 GRID storage with ~7000 CPU
    cores

                                                                                                          5
ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO
Physics analysis
Large impact to the overall LHC physics programme

Higgs physics:
-   Move from Higgs discovery (DESY contribution) in Run 1 to precision Higgs physics
-   Leading contributions to recent observations of ttH production and H→bb decays

                                                                                        6
ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO
Physics analysis
Large impact to the overall LHC physics programme

Top physics, Standard Model measurements and DM and other BSM searches:

                                                                          7
ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO
Phase 2 upgrade
DESY groups are delivering a silicon strip end-cap detector as a German contribution to
each experiment end of 2024
-   Includes 3 years of module production
-   In strong collaboration with German institutes
-   DESY groups play leading roles in the design and construction of tracking detectors

                                                                                          8
ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO
R&D for Phase 2 upgrade
Based on R&D from detector concept to production
-   Novel silicon concepts developed for HL-LHC
    • DESY leading role in sensor studies and module designs
-   Performance studies on sensors and full modules
    • DESY test beam key for tracker developments

-   From silicon modules to full detector: covering many areas from
    simulation to mechanical construction
-   Supported by R&D performed within “Matter and Technologies”
-   TDRs approved, with DESY members as main authors

                                                                      9
ATLAS AND CMS AND HL-LHC UPGRADE: STATUS AND PLANS - KRISZTIAN PETERS POF PREPARATION MEETING MARCH 18, 2019 - DESY INDICO
Detector Assembly Facility (DAF)
Dedicated facility for detector development and
construction to be used for HL-LHC tracking detectors
-   Existing buildings 25c and 26. About 1000 m2 clean rooms and
    200 m2 lab space
-   10 MEUR from DESY for refurbishment and lab equipment

DAF status:
-   Clean rooms in 25c is now in operation and ready for the
    upcoming production
-   Assembly hall in 26 is also completed and is now being
    commissioned
-   DAF will be in use for LHC Upgrades until about 2026
-   Lab infrastructure for module production in Zeuthen in
    preparation to complement DESY facilities

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11
                                                                                                                                                   TDR 2018

                                                                                                                                                                                                                                                                                                                                                                                                                       Scintillator

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                         Calorimeter Endcap
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                          Hadronic (CE-H)
                                         SiPM-on-Tile technology developed by CALICE for Linear Collider calorimeters

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                  Silicon
CMS endcap calorimeter phase 2 upgrade

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                 Electromagnetic (CE-E)
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                   Calorimeter Endcap

                                                                                                                                                                         34                                                                                                                                                                                         Chapter 2. Active elements
                                                                                                                                                                                      permits
                                                                                                                                                                                                                   Sensor arrangement in the layers

                                                                                                                                                                                                                                                                                            r
                                                                                                                                                                                                                                                                               to
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                                                                                                                                                                                                                                                           til
                                                                                                                                                CMS High-Granularity Calorimeter (HGCAL)

                                                                                                                                                                                                                                                           in
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                                                                                                                                                                                                                                                                                          con
                                                                                                                                                                            radiation

                                                                                                                                                                                                                                                                                                        Sili

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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                              CE-H (Si+Scint)
                                                                                                                                                                                                                                                                                                                                                                                                                      Plane 49

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                   16
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                              Stainless steel, Cu

                                                                                                                                                                         Figure 2.13: Layout of wafers and tiles in a layer where both are present: the 22nd layer of CE-H.                                                                                                                                                        Missing Area inside 356cm 2
                                                                                                                                                                                                                                                                                                                                                                                                                                 Missing Area outside 6031cm 2
                                                                                                                                                                         cast and machined or injection-moulded, as individual tiles or multiple tile units (megatiles). In                                                                                                                  highest fully covered eta and radius 2.858 379.0 mm
                                                                                                                                                                         addition, the reflective coating with paint or foil is still subject to optimisation by prototyping.                                                                                                              Lowest fully covered eta and radius 1.545 1470.8 mm
                                                                                                                                                                                                                                                            • Scintillating tiles with SiPM readout

                                                                                                                                                                         Both approaches build on experience: painted megatiles are used in the CMS HCAL, and foil-
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                            205 t

                                                                                                                                                                                                                                                                                                                                                                                                                                   Number of Halves sensors 18
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                    9λ

                                                                                                                                                                                                                                                                                                                                                                                                                                 Number of Choptwos sensors 0
                                                                                                                                                                         wrapped individual tiles have been developed in the CALICE framework. The final choice, to                                                                                                                                                                     Number of Fives sensors 0
                                                                                                                                                                   where

                                                                                                                                                                         be made in 2019, will be driven by cost, performance, and ease of assembly considerations, e.g.                                                                                                                                                              Number of Full sensors 294
                                                                                                                                                                                                                                                                                                                                                                                      Scintillators

                                                                                                                                                                         the amount of light yield loss and noise increase due to irradiation, and by thermal-mechanical
                                                                                                                                                                                                                                                            • Silicon sensors in CE-E and high

                                                                                                                                          Plane 8                                                                                                                                                                                                                 InnerRadius (mm): 327.8 OuterRadius (mm): 1599.9 Z (cm): 329.1
                                                                                                                                                                                                                            HGCAL = Sampling calorimeter

                                                                                                                                                                         considerations. The thermal expansion coefficient of plastic scintillator is 78 ⇥ 10-6 K 1 and thus
                                                                                                                                                                                                                                                                                                                                                                                                                                   4-30 cm2
                                                                                                                                                                                                                                                              in low-radiation regions of CE-H

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                   -30 ° C

                                                                                                                                                                         5 times larger than that of the copper cooling plate and the PCB. For a temperature difference of
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                              CE-H (Si)
                                                                                                                                                                                                                                                                                                                                                                                         500m2

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                       400 k
                                                                                                                                                                                                new challenges: radiation hardness, data rates, cooling

                                                                                                                                                                                                                                                                                                                                                                                                                                     4000

                                                                                                                                                                         70 K (assembly at 30 C and operation at 40 C) this leads to millimeter-size mismatches and
                                                                                                                                                                         in practice limits the maximum size of megatiles to about 20 cm. In the inner parts with small
                                                                                                                                                                         cells, such a size still represents a significant reduction in the number of parts to be handled.
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                   8

                                                                                                                                                                         On the other hand individual tiles are better suited for assembly using standard pick-and-place
                                                                                                                                                                         tools.
                                                                                                                                                                                                                                                                                                          SiPM-on-Tile read-out boards, electronics integration

                                                                                                                                                                         The tileboard holds the SiPMs, the front-end electronics, LEDs and associated driving circuitry,
                                                                                                                                                                                                                                                              radiation regions of CE-H

                                                                                                                                                                         low voltage regulators and the connectivity to the motherboard that is situated at the outer
                                                                                                                                                                         periphery of the cassette.
                                                                                                                                                       upgrade,

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                           Pb, CuW, Cu
                                                                                                                                                                                                                                                                                                                                                                                                                                   0.5 - 1 cm2

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                    26 X0, 1.5 λ
                                                                                                                                                                                                                                                                                                                                                                                      Silicon

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                   -30 ° C
                                                                                                                                                                                                                                                                                                                                                                                      600m2
                                                                                                                                                                                                                                                                                                                                                                                                                                     27000

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                     13 March 2019
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                              CE-E
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                       6M

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                            23t
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                   28
                                                                                                                                                                                                                                                                                                                                                                                                                                                                           postdoc
                                                                                                                                                                                                                                                               DESY contributes to engineering design

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                then support production and commissioning
                                                                                                                                                                                                                                                                                                                                                                                                       Both endcaps

                                                                                                                                                                                                                                                                                                                                                                                                                                                                        Channel size

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                              Per endcap
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                       #Channels
                                                                                                                                                                                                                                                                                                                                                                        Automated assembly and QC procedures

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                   Op. temp.
                                                                                                                                                                                                                                                                                                                                                                                                                                   #Modules

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                  Absorber

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                            Weight
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                   Layers
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                    Depth
                                                                                                                                                                                                                                                                                                                                                                                                                      Area

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                     Thorben Quast
                                                                                                                        Largely adopted for CMS endcap

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                                                                                                                                                                                                                                                                               l                                                                                                                                                   3x0.5 engineers, 2x0.5 physicists, 0.5                                                                       ia
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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                             Pa

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                     TDR due early 2021
                                                                                                                                                                                                -

                                                                                                                                                                                                                                                                                                          -
                                                                                                                                                                                                                                                                                                          -
                                                                                                                                                                                                                                                                                                          -

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                         -
Future plans
                                                         PoF IV

                                                                     Deliver endcaps
Milestones:                                                          to CERN
-   Endcap assemblies
-   Detector operation, performance studies and analysis of LHC Run 3 data
-   Prepare for HL-LHC
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Finalise phase 2 upgrades
Main milestones and challenges
-   End of 2019: start of pre-production (e.g. ATLAS modules)
-   2020: start of production
-   ~2023: completion of substructures with modules
-   2024: finalisation and testing
-   End of 2024: delivery to CERN

After its use for the ATLAS and CMS tracker end-caps for the HL-LHC, the DAF will be a
major asset for any large-scale, high-precision detector development project at DESY

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Data analysis
Germany is funding HL-LHC upgrades with 120 MEUR (in addition to the 200 MEUR
annual contribution) → Responsibility to carry out a long term programme at the LHC

Prepare to fully exploit the wealth of LHC data – get the full “return on investment” of our
upgrade efforts

                                     Physics analyses along two major themes in ΜU
                                      - Higgs and standard model precision physics
                                      - Search for new physics and for dark matter candidates

                                     Accommodate to the change in physics reach
                                     which comes with the larger dataset but only
                                     minor energy increase

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