CMS Pixel Upgrade for Phase I - G.M. Bilei Per il consorzio Tracker Bari, Catania, Firenze, Genova, Milano, Padova, Pavia, Pisa, Perugia, Torino ...
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CMS Pixel Upgrade for Phase I
G.M. Bilei
Per il consorzio Tracker
Bari, Catania, Firenze, Genova, Milano, Padova, Pavia, Pisa, Perugia, Torino
Roma July 3rd 2013
New Pixel Detector layout • Extra layer in barrel and end-cap • Efficient seeding + robust tracking in increasing track density • L4↑ reduce gap to TIB, L1↓ reduce impact of MS on dxy/dz resolution • TDR approved last Sep. 2012 with strong support from LHCC Pisa 19.3.2013 G.M. Bilei
Parameters: present layout vs upgrade Roma 3.72013 G.M. Bilei 3
Pixel Upgrade for Phase I : news and short term
• The Pixel project is progressing pretty much according to the plan
• ROC PSI46dig / TBM08: Engineering run submitted in Jan. was delivered in Apr.
Performance of new ROC according to specs. High rate test beam end of July.
- 6 ROC wafers delivered in first half of April 2013
- 24 ROC additional wafers (delivered end of May)
(more than enough for 3-4 wafers for each production center)
• High rate Test Beam in DESY (end of July) and at FNAL (Nov.)
• Sensors: Ready to launch production. PRR (Production Readiness Review passed)
• HDI: High Density Interconnect circuit pre-series launched
• Digital Test Boards in production at PSI (ready by Sep.)
• Preparation of few pilot Forward Pixel modules to be installed in CMS in 2014
to be tested as pilot system with collisions.
• Goal: to produce in each consortium few and final digital module by end of 2013
• Goal: Launch pixel module production by late spring 2014.
Roma 3.72013 G.M. Bilei 4
Overall draft schedule Pixel Construction
We are on track so far with the schedule.
Installation in CMS planned for winter shutdown 2016-17
Roma 3.72013 G.M. Bilei 5
INFN Contribution to 50% of BPix layer 3
Draft INFN Plan
2011 Start setting up
2012-13 Production ~ 8 old analog modules
Dec. 2013 Production of few new modules
Late spring 2014 Start mass production
Late spring 2015 complete module prod
2016 Commissioning and Installation
Half Layer 22 faces
8 modules/faces =176 modules
Needs ∼ 250 modules Primo modulo analog ROC
allowing for 80% yield prodotto in ITALIA
and 15% spares
Roma 3.72013 G.M. Bilei 6
INFN plan and objectives for 2013
• Completing construction of 8 old modules with analog ROC at IZM
- All parts are available. First 4 modules bump bonded and in testing
- INFN production centers basically ready for assembly, testing and
qualification
• In parallel starting with KIT the qualification of the Selex BB process and
assessing costs.
• Set up the readout systems for digital ROC in the lab and get experience.
• Select Bump Bonding vendor by Oct 2013 at latest.
• Construction of first prototypes with new digital pixel modules end of 2013
• Participate to the DESY high rate test beam in beginning of Aug. 2013
• Preparation for mass construction (new readout cards, database, software
analysis, quality control procedures etc.) to start in late spring 2014
Milestone INFN Gruppo I Pixel Upgrade: on track
1/12/2013 Realizzazione primi prototipi nuovi moduli Pixel Upgrade con ROC Digitale
Roma 3.7.2013 G.M. Bilei 7
Module construction flow chart
Pisa
Sensors Pisa
test
Perugia
Company Bare
SiN-rails
Bump Module
glue
bond test
module
characteri- Perugia/Pisa
ROC zation
Test after
dicing Half Layer
Bond Assembly
Glue HDI to Module
ROCs to Burn-in and
bare module testing
Padova HD testing
Bari X-ray
calibration
TBM Glue/bond Test before
and HDI TBM to glue HDI to
testing HDI sensor
Catania
Centro di produzione di Pisa
Tasks di Pisa:
- Pixel Wafer Sensors QA
- Bump Bonding & Bare Module QA
1
- ROC Wafers management
2
- Assemblaggio Base strips
– Test del Bare Module
3
• Test Board for DAQ (1)
• Probe card (2)
• Bare module Jig (3)
– Assemblaggio Base strips
• Incollaggio Base strips (4)
• Incollaggio bare module
su base strips (5)
5
4
• Module handle per trasporto (6)
Roma 3.7.2013 A. Messineo
6
Pisa: Attività Bump Bonding
2
Linee
di
possibile
produzione
– Proge(o
con
IZM
(Bump
Sn/Ag)
• Prodo7
I
primi
4
Pixel
Bare
Modules
– In
tes?ng
a
Pisa
– Prog(o
con
Selex
(Bump
In)
• INFN
+
KIT
– Produzione
prevista
a
se(embre
Primo prototupo INFN
Bare Module BPIX
prodotto da IZM
A. Messineo
Roma 3.7.2013Pisa: Piano immediato futuro
• Entro
2013
– Adeguamento
set-‐up
al
nuovo
ROC
• Digitale
• Nuova
geometria
– 4
@8-+>"%-,>,>A3)",B"C)9"()*+,-".,/01)
wafers
8”gia
disponibili:
in
QA
al
PSI
C,>)K"L848>51"G$."B,-"$%&'"M0--)*>1A"*,>"5=5815N1)" O)P3)M>)/"(3-8*4":;Centro di ROC Testing di Padova
Task di Padova:
Test di wafers con ROC psi46dig dopo procedura
di taglio, assottigliamento e metallizzazione.
• Setup (in camera pulita a Padova):
Alessi probe-station, Testboard per DAQ,
Probe-card, Software sviluppato dal PSI.
• ad oggi: Testati singoli ROCs ‘analogici’.
6 ROCs tagliati, senza bumps.
6 ROCs tagliati, assottigliati e con bumps di Sn/Ag
depositati dalla IZM.
• prossimi mesi:
- visita al Paul Scherrer Institute (PSI) per collaborare
al test dei primi wafers con ROC dig.
- upgrade del setup ed inizio test di 4 wafers.
Roma 3.7.2013 M. Dall’OssoCatania – HDI Production
TBM gluing jig Bonding jig on bonder Electric test setup (mockup) Shipping box
Center Setup
• Mechanical jigs, holders, fixtures: built 2011-2013
• Electronics boards for test: procured 2011-2012
• Shipping boxes: Plastic mokups:5 available and in use
Anodized Aluminum: 20 under construction in 2013
10 more planned for beginning 2014
• Vacuum-gas sealer for 1) long-term storing and 2) shipping: bought early 2013
Old-HDI test prod: ongoing
36 HDIs obtained from PSI Vacuum-gas sealer
all either known-faulty or deteriorated because stored for years with no care
Ø 1 used as mechanical model for TBM gluing and bonding Test prod of upgraded HDI:
Ø 3 glued, bonded, tested OK è shipped to Bari for module construction next
Ø 9 glued, bonded, ready to be tested • Planned to start in fall 2013
Ø 8 available for production (will use only if needed, otherwise give to Germany • Samples of new cable ordered
Ø 15 (4 known-faulty and used for initial gluing and bonding practice, 11 found faulty • Some electronics boards for
for various reasons at different prod steps) released to Germany, DESY or Bari for test ‘ordered’ to collaborating
mechanical practice. producing Institutes
Salvatore Costa - Catania 13Centro di assemblaggio di Bari
Tasks di Bari:
- Mechanical assembly bare module e HDI
- Wire bonding e test modulo
In Corso Piani Futuri
• Setup
completato
per
la
pre-‐ • Assemblaggio
rimanen?
moduli
produzione
con
ROC
analogici
• Prove
di
assemblaggio
a
secco
e
• Definizione
procedure
di
test
con
la
colla
su
modulo
dummy
• Avviamento
finalizzazione
dei
• Assemblato
il
primo
modulo.
tools
di
produzione
Microsaldatura
e
fast
test
del
• Assemblaggio
primi
moduli
primo
modulo
ROC
analogico
digitali
entro
2013
in
corso
Roma 3.7.2013 L. FioreCentro di assemblaggio di Bari
Setup Assemblaggio
Setup Test
Roma 3.7.2013 L. FioreCentro di qualificazione di Perugia
Tasks di Perugia:
- Module thermal cycle tests
- Module Xray qualification
- Module calibration
- Contribution test beam
Thermal
test
box
• Construction of Thermal test box completed
• Ongoing optimization of thermal cycles parameter in order to
reach the target low temperature of -20 °C
• Control software tested
•Software integrated with El comandante test bench software
Roma 3.7.2013 M. Menichelli 16
Centro di qualificazione di Perugia
Full
Pixel
module
tested
with
small
Xray
tube
Tube
characterisAcs
• AcceleraAng
Voltage:
40
kV
• Current:
90
µA
Fluorescence
target:
• Molybdenum(Mo):
17.48
keV
• Silver(Ag):
22.16
KeV
• Cadmium(Cd):
23,3
KeV
17 Roma 3.7.2013 M. MenichelliPerugia: Setting up high rate test
• 900 W (200 kV max) tube taken from AMS
(designed for radiation damage studies)
• Tube under optimization both for X-ray
fluorescence characterization and for radiation
damage studies
Roma 3.7.2013 M. Menichelli 18INFN Pixel Upgrade: status of funding Roma 3.72013 19
Richieste Sblocco SJ Pixel Luglio 2013
Chiediamo lo sblocco SJ per le seguenti voci
Cotruzione Apparati:
• 10 K€ su Pisa per Bumb Bonding (ad integrare gli altri 10 K€ assegnati a Pisa
Set. 2012)
Obiettivo è costruire pre-prototipi moduli digitali entro 2013 quindi si necessita
intero budget per far partire ordine.
• 47 K€ su Perugia per chips ROC e TBM e circuiti HDI. Set. 2012 era stata
assegnata una prima parte e messo SJ una seconda.
Gli engineering run dei chip ROC e TBM sono stati consegnati, I chip sono in
test e funzionano secondo specs. Emissione ordine entro Nov. per produzione
Sviluppo:
• 15 K€ su MiB per acquisto rivelatori a diamanti della società II-VI.
Primi test condotti da RD42 incoraggianti. I dispositivi sembrano avere
migliore performance di altri vendors e potrebbero rivelarsi utili anche per
capir meglio gli effetti di polarizzazione,
Roma 3.7.2013 G.M. Bilei 20Pixel: Funding Requests for 2014 Roma 3.7.2013 G.M. Bilei 21
Pixel MoU in preparation – (April RRB table) INFN contribution to construction 803 Ke (963 KCHF). Roma 3.72013 G.M. Bilei 22
Human Resources for Pixel Phase I
In Totale circa 15 FTE
In linea con quanto previsto e discusso
al Gruppo I in Apr. 2011.
Composizione e FTE stabile nel
periodo 2012-2015
Roma 3.7.2013 G.M. Bilei 23Tracker personnel and activities !"#$ !"#% !"#& !"#' !"#(
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!"#$ !"#% !"#& !"#' !"#(INFN Gruppo I April 2011 Roma 3.72013 G.M. Bilei 25
Phase 2 R&D Roma 3.7.2013 G.M. Bilei 26
Requirements: HL LHC Tracker Upgrade
• Increased radiation hardness to 3000 fb-1
– Detector meant to survive without maintenance.
– Robustness and redundancy.
• Increased granularity to resolve 140 → 200 mb/BX
• Reduce material and improve tracking performance
• Provide tracking @ Level-1
• CMS HL Upgrade Technical Proposal planned end of 2014
• Tracker Technical Design Reports in ~ 2016
• Aim at delivering upgraded Tracker for LS3 (2022-2023)
Roma 3.7.2013 G.M. Bilei 27News: Tracker Baseline layout defined
Option
• ×4 granularity in strip sensors (on average)
• 3 more layers of pixellated sensors
– Unambiguous 3d coordinates – helps track finding in high pile-up
• pT modules in all layers
– All coordinates available at Level-1 (with cut at ~2 GeV)
– Powerful pattern recognition for HLT and offline
• Greatly reduced material.
– In the whole rapidity range. Up to a factor of 4 at 1.0 < η < 1.5.
• Tracking resolution improved in all aspects
• Cost under revision and scrutiny. Draft by October 2013 RRB
Roma 3.7.2013 G.M. Bilei 28Overview INFN CMS Pixel and Tracker R&D
3 main areas of R&D activities in Italy : Readout Chip, Sensors, TK Trigger.
Synergies and common projects (PRIN, GR5 calls, RD53) with ATLAS in the 3
areas of R&D
1. Pixel Readout Chip
– 65 nm CMOS technology for future pixel chip (smaller pixel, lower thresh. & power)
– CMS Bari, Torino, Perugia, Pisa, Padova, Pavia (CERN, FNAL)
– 2014 funding request for 70 K€ submitted SJ (Torino)
– RD53 common project approved by LHCC (collaboration with ATLAS)
– CHIPIX65 project submitted to GR5 Call (CMS-ATLAS common effort)
2. Pixel Sensors
– Different technologies and material under consideration
– Pixel Planar and 3D Silicon sensors (CMS Bari, Firenze, Milano, Pisa, Torino)
Pixel Diamond (Milano)
– Collaboration with many groups in CMS (FNAL, Purdue, KIT, CERN etc.) ATLAS
– ACTIVE project submitted to Gr5 call (CMS-ATLAS common effort)
– Need to start in 2014 either financed by GR5 or GR1.
Roma 3.7.2013 G.M. BileiOverview INFN Pixel and Tracker R&D
3. Track Trigger with AM
Develop a L1 triggering system based on AM
New generation of faster and denser AM.
Pisa, Perugia (Hardware), Padova, Firenze (Simulations)
Common ATLAS and CMS R&D since the last PRIN 2010
PRIN submitted in 2012
Funding request for 11 k€ submitted to GR1
New mezzanine card to be developed and programmed to perform latency
measurements on the VME test stand currently under installation in Perugia and Pisa.
4. Simulations
- Simulations studies for Phase 1 Pixel upgrade
Catania, Firenze
- Simulations studies on different layouts for Phase 2 Tracker and Pixel upgrade
Catania, Firenze
- Track Trigger simulations
Padova, Pisa, Firenze
Roma 3.7.2013 G.M. Bilei 30You can also read
