Challenging Existing Test Paradigm - Modernizing the production test flow Warren Latter Staff Test Engineer
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www.onsemi.com
Challenging Existing Test Paradigm
Modernizing the production test flow
Warren Latter
Staff Test Engineer
Contents
Introductions
What do we make?
Test History – Legacy system
New test cell planning
How did it go?
Benefits and recommendations
2 Test Leadership Forum NI Week 2018
www.onsemi.com
Introductions
ON Semiconductor Named One of the 2018 World’s Most Ethical Companies® by Ethisphere Institute
The company receives recognition for third consecutive time; honors those who operate with purpose
and incorporate integrity into their ecosystems.
Burlington facility history
2007 Re-branded
2012 Semtech acquires gennum
Spin off from Westinghouse
2007 Spin off from GENNUM
2007 Launch 2010 On Semi acquires SDT
4 Test Leadership Forum NI Week 2018
Test Engineering group history Warren Latter Brook Rayner 5 Test Leadership Forum NI Week 2018
What do we make in Canada?
Overview of products
6 Test Leadership Forum NI Week 2018
What Do We Make in Canada?
Wireless Products
PTIC or TRFC designed in Canada
ON Semiconductor’s PTICs have excellent RF performance and low
power consumption, making them suitable for any mobile handset or
radio application.
PTICs have the ability to change their capacitance, in response to BIAS
voltage, in order to support adaptive impedance matching for antennae
across the different cell phone frequency bands
Our location is responsible for PTIC test development and support
7 Test Leadership Forum NI Week 2018
What Do We Make in Canada? (cont’d) Medical and Hearing Instrument products Miniature System-in-Package (SiP) solutions including DSP such as Ezairo 7100, large EPROM, all passive components and optional BLE wireless The Ezairo 7100 series of open-programmable DSP-based systems meets the high performance and stringent power consumption requirements of advanced hearing aids and hearing implant devices. The unique, high-precision quad- core architecture is the industry’s most integrated, flexible and power efficient single chip solution. RSL10 is a Bluetooth 5 certified, multi-protocol radio System on Chip (SoC). Industry's best EEMBC® ULPMark™ scores (1090 ULPMark CP @ 3 V; 1260 @ 2.1 V) 8 Test Leadership Forum NI Week 2018
SiP (hybrid) Packaging Capability is available as a service Ultra-Miniature SiP Medical Assemblies ON Semiconductor has proven leadership in miniature System-in-Package (SiP) solutions, addressing the highly space-constrained requirements of hearing aid manufacturers for over four decades. As other medical devices shrink in size, they too can benefit from the same miniaturization techniques and assembles. 9 Test Leadership Forum NI Week 2018
Hearing Instrument SiP Products
Let’s look deeper
10 Test Leadership Forum NI Week 2018SiP (hybrid) product Example
Wireless connectivity
11 Test Leadership Forum NI Week 2018Hearing Instruments take many forms 12 Test Leadership Forum NI Week 2018
SiP (Hybrid) Test History
We once built our own tester
13 Test Leadership Forum NI Week 2018Legacy Test System (cont’d)
Custom 3” x 3” SiP (hybrid) plate chuck
EG1034
Computer tower
DIB
3” x 3” SiP (hybrid) plate
DIB,
Daughter card,
Contactor
PCI 4451
14 Test Leadership Forum NI Week 2018Legacy flow
Assembled Plate level Test map
SiP (hybrid)s testing using generated Plate form test is not at the end
in plate form HT program with rejects
of the manufacturing process
Manual sort Negative marking for rejects
of rejected
Dicing: Plates
devices and Mark rejects Manual sort
passing singulated
devices.
Sample test after saw process
Manual Tape and reel
100% visual Manual load
inspection Dry bake into Tape and
(manual) reel
15 Test Leadership Forum NI Week 2018Packaging trends vs. plate level test
Ball count = 59
Ball spacing = 0.44mm
Ball size = 0.3mm
Addition of BLENew Test Cell Planning The new paradigm
Determining the next platform
Good support for a PXI based system based on previous analysis of ATE
equipment market
First thought: replace the PC with PXI rack
•No real advantage staying with legacy flow
•How do we integrate the rack into the test cell?
•What handler/prober can we use?
•What software will we use?
18 Test Leadership Forum NI Week 2018Determining the next platform (cont’d)
NI introduced the STS product line
• Solved test cell integration with standard docking
• DIB lock option solved the changeover requirement
• PXI base made it affordable
• STS software suite
So now we have a tester
19 Test Leadership Forum NI Week 2018Determining the next platform (cont’d)
A concurrent project - to reduce manual handling after dicing
• First thought: Implement automated taping
• Second thought: Can an automated taper test the devices?
• Third thought: Does a Handler for singulated SiP devices exist?
The handler search settled on Exatron
• Ability to handle custom SiP package after dicing
• Ability to inspect the SiP package and solder balls
• Ability to output into tape and reel
• Minimal change-over for package mix
20 Test Leadership Forum NI Week 2018Illustrated Flow Comparison
Legacy Flow: Implemented Flow:
Assembled SiP Plate level Test map
(hybrid)s in testing using generated with
plate form HT program rejects
Assembled SiP Dicing
(hybrid)s in (singulated
plate form plates)
Manual sort of
rejected
devices and Dicing: Plates
Mark rejects
passing singulated
devices.
Singulated
handler system:
Orientate, Dry bake
100% visual Manual load inspect, test,
inspection Dry bake into Tape and Tape & reel
(manual) reel
21 Test Leadership Forum NI Week 2018Project potential risks
Budget
New production flow
New test platform
New test boards and sockets
New development environment
New device handler
•New inspection system
•New packaging System
22 Test Leadership Forum NI Week 2018New System Implementation
Actualization of the plan
23 Test Leadership Forum NI Week 2018Implemented system
• NI STS T2
• Exatron 900
series handler
• Custom DIB and
daughter cards
• LabVIEW
• Test Stand
• TSM
• Custom OnSemi
Test equipment
24 Test Leadership Forum NI Week 2018NI STS Benefits STS provides open HW platform ATE benefits at an affordable cost Direct docking to test handler DIB locking system Test Stand and TSM provide the benefits of an organized flow model with integration of previously developed IP Integration of custom hardware 25 Test Leadership Forum NI Week 2018
DIB
Blind mate RF
connections route
high frequency signals
to DUT
DIB design high density connectors to daughter card
Custom test sockets provide contact to the DUTs
DIB and daughter cards designed by Dynamic Test Solutions
26 Test Leadership Forum NI Week 2018Handler
Devices are picked up using vision system Dual site plunge to socket
Output to
Input tape and reel
inspection
checks
orientation,
package
outline and
solder ball
dimensionsOn Semi Custom Test Instruments
Open space in the chassis is available for customization or expansion
Test, communication and
programming resources
USB custom resources (6)
Controlled via Python code called
directly via LabVIEW
P151 connector block and flying
leads for signal integration
Blind mate RF connections
Fully integrated into Test Stand flow
with parallel multi-site supportNI Training
LabVIEW development 1 and 2 were provided locally in Burlington, Ontario
by NI
Test Stand 1 was provided as online training
Test Stand 2 and TSM were attended as Boot Camp in Austin TX
Hands-on course (5 days)
Access to support engineers
Sufficient to begin test development
29 Test Leadership Forum NI Week 2018Software development
Ramp-up on Test Stand and TSM was quicker than expected
LabVIEW software enables development of small, focused Vis
Existing Python scripts were reused with modifications to support
multi-site
Existing .NET dlls and executables were easily re-used in Test Stand
Callback routines enable customization of many test executive
behaviors
Libraries of code enable quick development of new sequences
30 Test Leadership Forum NI Week 2018Project timeline
LabVIEW training
Budget
approvals
DIB and daughter card development
Test stand training
First product development
to dual site Bin 1
Second product
Handler arrival, setup and prep
Production qualification
Oct Dec Jan Apr July
2015 2016Benefits Summarizing the returns
Project risk review
ü Budget
ü New production flow
ü New test platform
ü New test boards and sockets
ü New development environment
ü New device handler
ü New inspection system
ü New packaging System
33 Test Leadership Forum NI Week 2018Equipment Procurement Results
üTester
üOff-the-shelf but customizable
üLong platform life to match product cycle
üTest centric software
üSingulated device Handler
üPick and inspect custom SiP devices
üMinimum change-over effort
üOutput into tape or tray
34 Test Leadership Forum NI Week 2018Benefits
üElimination of manual handling after test
üSignificant reduction in cycle time = flexible delivery capability
üDUAL site parallel test is faster than legacy single site test
üPlatform enables continuous improvement for future benefits
üReuse of previously developed test IP
Assembled SiP Plate level Test map
(hybrid)s in testing using generated with
plate form HT program rejects Assembled SiP Dicing
(hybrid)s in (singulated
plate form plates)
Manual sort of
rejected Dicing: Plates
devices and Mark rejects
singulated
passing
devices.
Singulated
handler system:
Orientate, Dry bake
100% visual Manual load
inspection Dry bake into Tape and inspect, test,
(manual) reel Tape & reel
35 Test Leadership Forum NI Week 2018Quality Reduction of manual handling with any manual steps occurring before test Improved test coverage from higher channel count Lab grade instrumentation Elimination of manual taping step Test Database lookup of device Bin status for taping loose devices 36 Test Leadership Forum NI Week 2018
ROI Projection
ON Semi installed three dual-
site test cells including STS-T2
and Exatron handlers at a cost
of ~US$1M
Aside from the clear technical
and process capability that the
new systems provides there is Reduction in PM
a significant savings to be Scrap Avoidance
realized Labor
Tool Cost
Linear (Tool Cost)
ROI of ~ $60k/month and 1 3 6 9 12 15 18 21 24
payback within 21 months.
37 Test Leadership Forum NI Week 2018Closing Thoughts
Recommendations
38 Test Leadership Forum NI Week 2018Recommendations
Understand your test requirements
Maintain awareness of the test equipment market and capability
Use multi-site parallel test to maximize tester resource utilization when
testing small devices
Look for holistic solutions to improve your process as you upgrade test
Select experienced vendors and partners to enable your success
Keep a common test development environment if possible
Develop your own system only if there is no other option
39 Test Leadership Forum NI Week 2018Questions, Comments, Concerns?
http://keep-calm.net/
Image: iQoncept/Shutterstock.
http://peoples-free.com/
40 Test Leadership Forum NI Week 2018Links
• http://www.onsemi.com/site/pdf/EZAIRO7100-PB.pdf
• http://www.onsemi.com/PowerSolutions/content.do?id=18573
• http://www.onsemi.com/PowerSolutions/content.do?id=18727
• http://www.onsemi.com/PowerSolutions/product.do?id=RSL10&pdf=Y
• http://www.onsemi.com/site/pdf/Corporate_Fact_Sheet.pdf
• http://www.larsenassociates.com/Exatron.html
• http://www.ni.com/semiconductor-test-system
• http://www.larsenassociates.com/Exatron.html
• http://www.ni.com/semiconductor-test-system
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