UM10412 UBA2021 evaluation board Rev. 1 - 2 November 2010 - User manual - NXP Semiconductors
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UM10412 UBA2021 evaluation board Rev. 1 — 2 November 2010 User manual Document information Info Content Keywords UBA2021, evaluation board, TL, CFL Abstract This document is the user manual for the UBA2021 evaluation board.
NXP Semiconductors UM10412
UBA2021 evaluation board
Revision history
Rev Date Description
01 20101102 First issue
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
UM10412 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
User manual Rev. 1 — 2 November 2010 2 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
1. Introduction
This document describes the UBA2021 main board in combination with the UBA2021
daughter board. The main board is designed to be a flexible platform for demonstrating
the functionality of the UBA2014 and UBA2021 fluorescent tube drivers in different
applications. Please note that this board is not a complete ballast design for fluorescent
tubes. The default setup permits a T5 HE 35 W fluorescent lamp to be demonstrated.
2. Safety warnings and cautions
WARNING
Lethal voltage and fire ignition hazard
The non-insulated high voltages that are present when operating this product, constitute a
risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test
area by personnel qualified according to local requirements and labor laws to work with
non-insulated mains voltages and high-voltage circuits. This product shall never be operated
unattended.
Remark: Galvanic isolation of the mains phase using a variable transformer is always
recommended. These devices can be recognized by the symbols shown in Figure 1.
019aaa690 019aaa691
a. Isolated b. Not isolated
Fig 1. Variac isolation symbols
The board is intended as an evaluation board to build different TL and or CFL
applications. To optimize flexibility, almost no protection is build in (except for IC internal
protection). The board does not conform with any safety norm.
CAUTIONS:
• Do not supply voltages to the board without a daughter board correctly inserted.
Failing to do so may damage the board.
• Always operate with burner (lamp) connected to the board and connected to the
resonant circuit. Failing to do so may damage the board.
• Do not use the UBA2021 daughter board in combination with the (old) V1.1 main
board. The V1.1 board is blue instead of green.
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User manual Rev. 1 — 2 November 2010 3 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
3. Board description
The board consists of two separate PCBs. The main board with the resonance circuit and
a small daughter board with the UBA2021 IC.
3.1 Daughter board
The daughter board contains the UBA2021 IC with the preheat, sweep and oscillator
capacitors, the low voltage supply (VDD) components and some other low voltage
components.
The daughter PCB can easily be replaced if it becomes damaged. Care should be taken
that the board is inserted properly and to assist this, pin 11 has been removed from the
daughter board to prevent inserting the board incorrectly.
019aaa283
Fig 2. Daughter board
3.2 Main board
The main board has been designed for both TL or CFL applications and comprises the
following:
• DC and AC input connectors
• Dimming input
• Two sockets for FETs
• Two different transformers
• Area for experiments
• Connectors for up to four burners
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User manual Rev. 1 — 2 November 2010 4 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
019aaa289
Fig 3. UBA2014/21 Main board with UBA2021 daughter board inserted
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User manual Rev. 1 — 2 November 2010 5 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
4. Schematics
Figure 4 is a schematic of the daughter board with the UBA2021 IC. The component
values for the oscillator and sweep are RREF = 30 kΩ, CF = 100 pF, CP = 330 nF. These
values will give a minimum oscillator frequency of 39.5 kHz and a preheat time of 1.85 s.
A1
C1
2 1 CI RHV 1 R1 2 1 R2 2 1 R8 2
14 13 Vbrg
100 nF 150 kΩ 150 kΩ 160 kΩ
CP G1
C2
8 2 GH
2 1
CF S1
12 3 SH
330 nF/16 V
C4
RREF FS 1 2
C3 10 1
2 1
UBA2021P G2 100 nF 1 1
100 pF 6 GL C6
C5
470 pF/
R3 n.c. X2
DNP
1 2 4 500 V
TP V1 2 2
30 kΩ SGND VS VDD 1 2
11 5
1 BAS29 1 1
RS PGND C7 V2 C8
9 7
1 μF/ BAS29 1 nF/
25 V 100 V
2 2 2
PCS_2021 Pin 11 is cut off
2 R4 1 for correct insertion
2 X1
47 Ω 1 1
V3
BAS29 C9 R5
1
1 10 nF/ 10 kΩ 2
50 V 3
1 E 2 2
V4 B 4
R6 BC857C SH 5
1 kΩ GH 6
C 7
2 C
B Vbrg 8
V5
BC847C
GL 9
1 1 10
R7 C10 E 11
3.3 kΩ 2.2 nF/
100 V 12
2 2 PCS_2021 13
header 13
019aaa284
Fig 4. Daughter board with UBA2021 circuit
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User manual
UM10412
NXP Semiconductors
VDC
1 R20 2
Vbrg
connection for daughterboard 220 kΩ
1 R22 2 1 R23 2 1 R24 2 1 R25 2
X89
1 CSN 1 placed in header 43 kΩ 43 kΩ 47 kΩ 47 kΩ
X78 TP R1 X2
1 2 1 D
1 CSP 2 GH C1
X79 TP 33 Ω
1 2
2 V3
1 Vref 3 1 Cdc
X80 TP G 2SK3569 X114 68 nF/400 V
R35 3 R2
1 LVS 4 header 2 2 1
X81 TP 56 kΩ S
socket 3 Y5 0Ω
1 SH 5 2
X82 TP jumper
T1 12
1 GH 6 1 2 C4 1
X83 TP SH 1 2 X90 TP
All information provided in this document is subject to legal disclaimers.
1 PCS 7 6 10 1
X84 TP 33 nF/100 V X92 TP
1 Vbrg 8 X115 9 1
X85 TP C5 X94 TP
header 2 1 1 2
1 GL 9 1
Rev. 1 — 2 November 2010
X86 TP placed in header 7 X96 TP
R3 X14 2 1 33 nF/100 V
1 10 1 2 1 D 760 870 401
X87 TP GL Y6
11 33 Ω 2 jumper 2 R4 1
1 V6
G 2SK3569 1 0Ω
1 VDD 12 R36 3 C6
X88 TP 56 kΩ S 4.7 nF
1 PCS_2021 13 socket 3
X120 TP 2 2000 V
socket 13 1 R37 2 1 R38 2 2
LVS
connector position 11 0Ω 5.6 kΩ
glued sealed to prevent PCS_2021 1 1 1
1 R5 2 C19
erroneous insertion of R39 V16
470 nF
1.2 kΩ 1N4937
daughterboard 8.2 kΩ 63 V
2 2 2
1 1 X32
R6
1
R31 Y7
1Ω 2
1 kΩ jumper
2W X33
2 2 header 2 header 3
Y8
ground connections for X34 jumper lamp current sense circuit
1
oscilloscope probes PCS Y9 V11 X39
2 1 2 3 1 R7 2 1 2 LCS 1
jumper
X104 X105 X106 X107 X102 X108 X103 X109
UBA2021 evaluation board
1 kΩ 2
TP TP TP TP TP TP TP TP 1 1 1 header 2 1 1 CSN 1 1 1 1N4937 1
R8 R9 C18 C11 C12 C17 R10 3
1 1 1 1 1 1 1 1 R32 V12
1Ω 1Ω 2.2 nF 10 nF 1 nF 680 nF 33 Ω
100 kΩ 1N4937
2W 2W 100 V 100 V 100 V 50 V 2W header 3
2 2 2 2 2 2 2 2 2
Y10
UM10412
jumper
© NXP B.V. 2010. All rights reserved.
019aaa286
7 of 26
Fig 5. Main board half-bridge and resonance circuit - version R1CNXP Semiconductors UM10412
UBA2021 evaluation board
VDC In = 400 V
X1 V1
1 2 1 VDC
2 1N4937 2
R27
MKDS 2.5/2-5.08 75 kΩ
1
C16 1
47 μF/
2 V2 350 V 2
GBU8K 2 R33
75 kΩ
VAC In = 230 V 50 Hz L1
F1 2 4 1 1
1
X3 Fuseholder 5x20 1.5 mH 2
1 1 1
C2 C3 R29
47 nF/ 47 nF/ 1 75 kΩ
2
305 Vac 305 Vac 3 C15 1
MKDS 2.5/2-5.08
2 2 47 μF/
350 V 2
2 R34
F2 75 kΩ
Y12
2A Cover 1
019aaa287
Fig 6. Main board input section
External
dimming voltage 1 R40 2 VDD
0 V to 10 V 75 kΩ
X68
1 1 R18 2 CSP
2 33 kΩ 1 1 1
C14
R19 V15
MKDS 2.5/2-5.08 10 nF/
11 kΩ DNP
100 V
2 2 2
019aaa285
Fig 7. Main board dimming input (only in combination with UBA2014 daughter board)
X117
header 2
Y11
jumper
1 2
SH
1 X67 1 T2
X67 TP 10 X70 1
2 mH
X70 TP
1 X69 2 15 μH
X69 TP 9 X72 1
2.5 mH
X72 TP
1 X73 3
X73 TP
3 mH 8 X74 1
1 X75 4 X74 TP
X75 TP 15 μH
3.5 mH 7 X76 1
1 X77 5 X76 TP
X77 TP
4 mH
1 X91 6
X91 TP
DNP 019aaa300
Fig 8. Main board transformer T2/T3
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User manual Rev. 1 — 2 November 2010 8 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
X110 X111 X112 X113
header 2 header 2 header 2 header 2 Y1 Y2
jumper jumper
Y3 Y4
1 2 1 2 1 2 1 2 jumper jumper
LAMP 4
X8
1 1 1
X90 TP X6 TP
1 1 2
X92 TP X9 TP
1 1 3
X94 TP X11 TP
EXPERIMENTING AREA
1 1 4
X96 TP X13 TP
1 MKDS 2.2/4-5.08
X15 TP
SH
1 LAMP 3
X17 TP X21
1 1 1
X18 TP X19 TP X20 TP
1 1 2
X22 TP X23 TP X24 TP
1 1 3
X25 TP X26 TP X27 TP
1 1 4
X28 TP X29 TP X30 TP
1 MKDS 2.2/4-5.08
X31 TP
SH
1 LAMP 2
X35 TP X42
1 1 1
X36 TP X37 TP X38 TP
1 1 2
X43 TP X40 TP X41 TP
1 1 3
X44 TP X45 TP X46 TP
EXPERIMENTING AREA
1 1 4
X47 TP X48 TP X49 TP
1 MKDS 2.2/4-5.08
X50 TP
SH
1 LAMP 1
X52 TP X56
1 1 1
X53 TP X54 TP X55 TP
1 1 2
X57 TP X58 TP X59 TP
1 1 3
X60 TP X61 TP X62 TP
1 1 4
X63 TP X64 TP X65 TP
1 MKDS 2.2/4-5.08
X66 TP
019aaa288
Fig 9. Main board lamp connectors and experimental area
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User manual Rev. 1 — 2 November 2010 9 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
5. Connectors
5.1 Power supply connectors
The board can be supplied by either a high voltage DC or a mains AC input. For most
applications the high voltage DC input should be used. In the final product, a PFC of
choice may be used to replace the high voltage DC supply.
For some applications (such as CFL applications) the rectified mains is sufficient. In these
cases a mains input of 230 V AC may be used.
Table 1. DC high voltage input connector X1
Connector Signal Comment
X1-1 + + 400 V DC in
X1-2 GND Ground
Table 2. AC input connector X3
Connector Signal Comment
X3-1 ~ Mains 230 V AC
X3-2 ~ Mains 230 V AC
5.2 Dimming input
The UBA2021 does not have dimming functionality so this input is not used. If dimming is
required, please use the UBA2014.
5.3 Lamp connectors
There are four lamp connectors on the board. The connectors are listed in Table 3,
Table 4, Table 5 and Table 6, together with the names of the test points that are connected
to them.
Table 3. Lamp 1 (X56)
TP Comment
X55 connection for filament 1
X59 connection for filament 1
X62 connection for filament 2
X65 connection for filament 2
Table 4. Lamp 2 (X42)
TP Comment
X38 connection for filament 1
X41 connection for filament 1
X46 connection for filament 2
X49 connection for filament 2
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UBA2021 evaluation board
Table 5. Lamp 3 (X21)
TP Comment
X20 connection for filament 1
X24 connection for filament 1
X27 connection for filament 2
X30 connection for filament 2
Table 6. Lamp 4 (X8)
TP Comment
X6 connection for filament 1
X9 connection for filament 1
X11 connection for filament 2
X13 connection for filament 2
5.4 Test points
Eight black ground pins (X102 to X109) are distributed over the board so that
(oscilloscope) probes can be grounded without the need for long grounding wires.
Remark: A test pin is available for each pin of the daughter board.
Table 7. Connections of the daughter board
Test Pin Name Comment
X78 CSN negative input for the average current sensor for UBA2014
daughter board
X79 CSP positive input for the average current sensor for UBA2014
daughter board
X80 Vref reference voltage output for UBA2014 daughter board
X81 LVS lamp voltage sensor input for UBA2014 daughter board
X82 SH source for the high-side switch
X83 GH gate output for the high-side switch
X84 PCS preheat current sensor input for UBA2014 daughter board
X85 Vbrg Connection to VDC via R20 (220 kΩ)
X86 GL gate output for the low-side switch
X87 GND ground
X88 VDD low voltage supply
X120 PCS_2021 preheat current sense for the UBA2021 daughter board
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5.5 Transformer T1
In the default setup, transformer T1 will be used and is connected with jumpers to lamp
connector 4 (X 8). The transformer specifications are listed in Section 6.
Table 8. Default connection transformer T1
Header Comment
X110 Insert to connect T1 to filament 1, lamp 4
X111 Insert to connect T1 to filament 1, lamp 4
X112 Insert to connect T1 to filament 2, lamp 4
X113 Insert to connect T1 to filament 2, lamp 4
X114 Insert to connect SH to transformer T1
X115 Insert to connect T1 to resonant capacitor C6 (4.7 nF, 2000 V)
5.6 FET
Two NMOST FETs should be placed in X2 and X14. The supplied NMOST's are Toshiba
2SK3569 (VDS = 600 V; ID = 10 A; RDSon = 0.54 Ω). When using different NMOS types, the
values of gate resistors R1 and R3 (default 33 Ω) maybe changed.
5.7 Current sense selection
A feed forward mechanism in the UBA2021 ensures that the lamp power will not increase
above the maximum allowed value due to an increased mains voltage. This means that
the operating frequency is controlled by the bus voltage rather than by the lamp current or
the half-bridge current.
Table 9. Current sensing selection
X33 pins 1 and 2 pins 2 and 3
half-bridge open open
lamp current open open
5.7.1 Half-bridge current sensing
The half-bridge current is sensed for controlling the preheat current. Different values of
the sense resistor can be selected using jumpers X32 and X34. To connect the lamp to
ground, X39 should be shorted between pin 2 and pin 3.
Table 10. Current sensing selection
X32 X34 Resistance
short short 0.5 Ω
short open 1.0 Ω
open short 1.5 Ω
open open 2.0 Ω
5.7.2 Lamp current sensing
The UBA2021 does not sense the lamp current, so X39 should be shorted between pin 2
and pin 3 in order to connect the lamp to ground.
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UBA2021 evaluation board
5.8 Using transformer T3
The jumper X117 should be inserted to use the flexible transformer T3. This will connect
SH to pin 1 of the transformer. Table 11 shows the different inductance values. The
specifications of the transformer are listed in Section 6.
Table 11. Transformer T3 primary connections - Inductance to pin 1 (X67)
Connection Inductance
X69 2.0 mH
X73 2.5 mH
X75 3.0 mH
X77 3.5 mH
X91 4.0 mH
Table 12. Transformer T3 secondary connections
Connection Inductance
X70-X72 15 μH
X74-X76 15 μH
Transformer T3 has a double footprint that enables the use of different types of
transformers. The transformers are referred to as T2 and T3 on the schematic drawings.
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UBA2021 evaluation board
6. Transformer specifications
6.1 Transformer T1
6.1.1 Schematic diagram
• Manufacturer: Würth Elektronik
• Part number: 760870401
12
N3
1
10
N1
9
6
N2
7
019aaa301
Fig 10. Transformer T1 schematic diagram
6.1.2 Winding specification
Table 13. Electrical characteristics for transformer T1
Properties Test conditions Value Unit Tolerance
Inductance N1 50 kHz/0.1 V L0 2.9 mH ±5%
Turns ratio N1 - N5 N1: N2: N3 TR 26.1 : 1 : 1 ±3%
DC-resistance N1 at 20 °C RDC1 2.7 Ω maximum
DC-resistance N2 at 20 °C RDC2 180 mΩ maximum
DC-resistance N3 at 20 °C RDC3 180 mΩ maximum
Saturation current N1 dL/L=20 % ISAT 1.6 A typical
Leakage inductance N1 200 kHz/0.1 V rest shorted LS 350 μH maximum
Coupling capacitance 20 kHz/1 V all windings CWW 11.0 pF typical
Hipot test 3 mA, 1s all windings HV 1.2 kV
6.1.3 Dimensions
• Core: RM-8 (Ferroxcube RM/I or equivalent)
• Core material: 3F3, N87 or equivalent
• Bobbin: RM-8 (12 pin, vertical type)
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UBA2021 evaluation board
12
11
10 1
3 2
21.59 mm
(max)
8 9
7 4
5
6
21.59 mm 17.27 mm
(max) (max) 019aaa251
Fig 11. Transformer T1
6.2 Transformer T3
6.2.1 Schematic diagram
• Manufacturer: Würth Elektronik
• Part number: 760870402
10
1
N1 N7
2
N2
3 9
N3
4 8
N4
5
N5 N6
6
7
019aaa302
Fig 12. Transformer T3 schematic diagram
Table 14. Electrical characteristics for transformer T3
Properties Test conditions Value Unit Tolerance
InductanceN1-N5 50 kHz/0.1 V L0 4.0 mH ±5%
Turns ratio N1 - N5 N1: N2: N3: N4: N5: N6: N7 TR 12 : 1.33, 1.25 : 1.17, 1.17 : 1:1 ±3%
DC-resistance N1-N5 at 20 °C RDC1-5 1.85 Ω ± 20 %
DC-resistanceN6 at 20 °C RDC6 135 mΩ ± 20 %
DC-resistance N7 at 20 °C RDC7 140 mΩ ± 20 %
Saturation current N1-N5 dL/L = 20 % ISAT 1.0 A typical
Leakage inductance N1-N5 200 kHz/0.1 V rest shorted LS 275 μH typical
Coupling capacitance 20 kHz/1 V all windings CWW 30.0 pF typical
Hipot test 3 mA, 1 s all windings HV 3.0 kV
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User manual Rev. 1 — 2 November 2010 15 of 26NXP Semiconductors UM10412
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6.2.2 Dimensions
10 1
31.5 mm
(max)
6 5
31.5 mm 21 mm
(max) (max) 019aaa299
Fig 13. Transformer T3
• Core: E30/15/7
• Core material: Ferrite
• Air gap in center leg: 1100 μm
• Bobbin: CSH-E30/7-1S-10P
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UBA2021 evaluation board
7. Application example
7.1 Default application T5 HE 35 W
The default settings of the board are for a T5 HE 35 W burner.
Table 15. Default settings
Jumper Position Comment
X32 short half-bridge sense resistor 1 Ω (used for PCS)
X34 open -
X33 1-2 open, 2-3 short use lamp current sensing
X114 short connect transformer T1
X115 short -
X39 1-2 shorted, 2-3 open connect lamp to lamp current sense circuit
X110, X111, X112, X113 short connect to lamp 4
X117 open do not connect transformer T3
Table 16. External connections for T5 HE 35W
Jumper Position Comment
X1 VDC 400 V DC
X68 External dimming the UBA2021 board has no dimming so this input can be left open.
X8 burner T5 HE 35 W burner
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User manual Rev. 1 — 2 November 2010 17 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
8. Bill of Materials (BOM)
Table 17. BOM daughter board
Reference Value or type no. Component
A1 UBA2021P NXP Semiconductors UBA2021P IC
C1, C4 100 nF/50 V Capacitor ceramic X7R, 50 V, 10 %
C2 330 nF/16 V Capacitor ceramic X7R, 16 V, 10 %
C3 100 pF/100 V Capacitor ceramic C0G, 50 V, 1 %
C5 n.m. -
C6 470 pF/500 V Capacitor ceramic 500 V NP0 5 %
C7 1 μF/25 V Capacitor ceramic X7R 25 V, 10 %
C8 1 nF/100 V Capacitor ceramic X7R 100 V, 10 %
C9 10 n Capacitor ceramic X7R, 50 V, 10 %
C10 2.2 n / 100 V Capacitor ceramic X7R 100 V, 10 %
R1, R2 150 kΩ Resistor 1 % 0.125 W 100 ppm RC12H
R3 30 kΩ Resistor 1 % 0.125 W 100 ppm RC12H
R4 47 Ω Resistor 1 % 0.125 W 0 to +500 ppm RC12H
R5 10 kΩ Resistor 1 % 0.125 W 100 ppm RC12H
R6 1 kΩ Resistor 1 % 0.125 W 100 ppm RC12H
R7 3.3 kΩ Resistor 1 % 0.125 W 100 ppm RC12H
R8 160 kΩ Resistor 1 % 0.125 W 100 ppm RC12H
V1, V2, V3 BAS29 NXP Semiconductors, Diode, 50 ns 90 V 250 mA
V4 BC857C NXP Semiconductors, PNP transistor
V5 BC847C NXP Semiconductors, NPN transistor
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User manual Rev. 1 — 2 November 2010 18 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
Table 18. BOM main board
Reference Value or type no. Component
C1 68 nF/400 V Capacitor MKT 400 V DC 10 %
C2, C3 47 nF/305 V AC Capacitor, MKP Class X2 20 %
C4, C5 33 nF/100 V Capacitor MKT 100 V DC 5 %
C6 4.7 nF/2000 V Capacitor MKP radial potted, 5 %
C11, C14 10 nF/100 V Capacitor ceramic disc X7R, 10 %
C12 1 nF/100 V Capacitor ceramic disc X7R, 10 %
C15, C16 47 μF/350 V Capacitor elco rad 350 V 105 °C 20 %
C17 680 nF/50 V Capacitor ceramic disc X7R, 10 %
C18 2.2 nF/100 V Capacitor ceramic disc X7R, 10 %
C19 470 n/63 V Capacitor MKT 63 V DC 5 %
F1 Fuse holder 5 x 20 Fuse holder for 5 mm x 20 mm fuses
F2 2A Fuse 5 mm x 20 mm time lag
L1 1.5 mH Inductor Choke Ir = 850 mA, R= 580 mΩ
R1, R3 33 Ω Resistor 1 % 0.6 W 50 ppm MRS25
R2, R4 0Ω Zero Ohm Link Im= 25 A at 25 °C
R5 8.2 KΩ Resistor 1 % 0.6 W 50 ppm MRS25
R6, R8, R9 1Ω2W Resistor Power 5 % 2 W 100 ppm/°C MFP
R7 1 KΩ Resistor 1 % 0.6 W 50 ppm MRS25
R10 33 Ω 2 W Resistor Power 5 % 2 W 450 ppm/°C Carbon Film
R18 33 kΩ Resistor 1 % 0.6 W 50 ppm MRS25
R19 11 kΩ Resistor 1 % 0.6 W 50 ppm MRS25
R20 220 kΩ Resistor 1 % 0.6 W 50 ppm MRS25
R22, R23 43 kΩ Resistor 1 % 0.6 W 50 ppm MRS25
R24, R25 47 kΩ Resistor 1 % 0.6 W 50 ppm MRS25
R27, R29, R33, R34 75 kΩ Resistor 1 % 0.6 W 50 ppm MRS25
R31 1.0 kΩ Resistor 1% 0.6 W 50 ppm MRS25
R32 100 kΩ Resistor 1% 0.6 W 50 ppm MRS25
R35, R36 56 kΩ Resistor 1% 0.6 W 50 ppm MRS25
R37 0Ω Zero Ohm Link Im = 25 A at 25 °C
R38 5.6 kΩ Resistor 1 % 0.6 W 50 ppm MRS25
R39 1.2 kΩ Resistor 1 % 0.6 W 50 ppm MRS25
R40 75 kΩ Resistor 1 % 0.6 W 50 ppm MRS25
T1 760870401 Würth Elektronik Part number: 760870401
T3 760870402 Würth Elektronik Part number: 760870402
V1, V11, V12, V16 1N4937 Diode, fast recovery, 600 V, 1 A
V2 GBU8K BRIDGE 800 V, 8 A TH
V3, V6 2SK3569 MOSFET N-ch 600 V 10 A 0.54 Ω
V15 n.m. -
X1, X3, X68 MKDS 2,5/2-5,08 Terminal block (screw) 2-pole, p = 2e, 2.5 mm2
X2, X14 Socket 3 Socket straight p = 2.54, h = 7 mm
X8, X21, X42, X56 MKDS 2,5/4-5,08 Terminal block (screw) 4-pole, p = 2e, 2.5 mm2
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User manual Rev. 1 — 2 November 2010 19 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
9. Layout
T R1A
019aaa291 019aaa290
Top view Bottom view
Fig 14. Daughter PCB layout
V1 V3
C7 C6 C5
C1 C3 R1 3
C2
1
C8 V2 2 V4 3
R7 V5 3
R6 C10 R5
1 R3
C9 3
C11 C4 A1
1 2 R4
1 X1 3 R2
019aaa292 019aaa296
Top view Bottom view
Fig 15. Daughter board silk screen
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User manual Rev. 1 — 2 November 2010 20 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
TOP SIDE
3322 029 91481 UBA2014EB R1C
019aaa295
Fig 16. UBA2014/21 main board PCB layout top view
UM10412 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
User manual Rev. 1 — 2 November 2010 21 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
BOTTOM SIDE
B
019aaa293
Fig 17. UBA2014/21 main board PCB layout bottom view
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User manual Rev. 1 — 2 November 2010 22 of 26xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
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User manual
UM10412
NXP Semiconductors
X66
L1 1 T2 EXPERIMENTING AREA
V2 GND
SH
X63 X64
X117 X70
T3 X56 LAMP 1
X67 15 μH X60 X61 X65
2 mH X72
10
10
1
1
X69 X57 X58 X62
2.5 mH X74
2
2
9
9
X73 15 μH X53 X54 X59
C3
3 mH X76
3
3
8
8
2 A/T X75 X52 X55
C2 3.5 mH X91 SH
4
4
7
7
HALF
1
X77 4 mH X50
BRIDGE
GND X42 LAMP 2
5
5
6
6
X3 X47 X48 X49
1
1 R1
g
High
Side X109 X44 X45 X46
d
FET
All information provided in this document is subject to legal disclaimers.
GND
s
R35 X2 X40 X43 X41
F1 UBA20 (14/21) Daughter Board
230 VAC 50 Hz 1 1
g
Rev. 1 — 2 November 2010
X89 X36 X37 X38
Low R3 R20 X120 X87 X85 X83 X81 X79
X86
X84
X82
X80
X78
R27
Side d X88 WWW.NXP.COM
R34
FET UBA20 (14/21)
1
X35
X14 s DEMO BOARD
VBRG
R29 R33 GND
VREF
SH
2021
GND
VCC
CSN
PCS
PCS
CSP
LVS
V1.2
GH
SH
C15
GL
X31
R36 X104
GND X21 LAMP 3
C11 X33 C12 X28 X29 X30
C16 R5 C18 1
R32 V12
R31
X25 X26 X27
R6
R10 R7
X32 C17
1
X1 V11 X22 X23 X24
LAMP CURRENT SENSE
1
T1 8 7
TRAFO 1 X18 X19 X20
X105 X106
PREHEAT CURRENT SENSE
X34 GND 6 X114 R4 X39
1
1
V1 1 X17
5
X107 X108
SH SH X8 LAMP 4
VDC_IN = 400 V
X15 X13
ANALOG DIM IN R40 V16 GND
X115 11 C5
R8 R9 X96 X113 X11
0 - 10 V 12
X68 C14 1
1
UBA2021 evaluation board
V15 1 2 X94 X112 X9
C4
C1 1
R19 R37
X103
R22 R24 R2 X92 X111 High Voltages X6
R18 R39 1 On This Board !
C6
1
R38 X90 X110
UM10412
© NXP B.V. 2010. All rights reserved.
X103 1
X102
WW/YY R25
GND GND R23
019aaa294
Fig 18. UBA2014/21 main board silk screen top view
23 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
10. Glossary
CFL — Compact Fluorescent Lamp
MOSFET — Metal–Oxide Semiconductor Field-Effect Transistor
NMOST — Negative channel Metal–Oxide Semiconductor Transistor
TL — Tubular Lamp
UM10412 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
User manual Rev. 1 — 2 November 2010 24 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
11. Legal information
11.1 Definitions NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
Draft — The document is a draft version only. The content is still under
third party customer(s). Customer is responsible for doing all necessary
internal review and subject to formal approval, which may result in
testing for the customer’s applications and products using NXP
modifications or additions. NXP Semiconductors does not give any
Semiconductors products in order to avoid a default of the applications and
representations or warranties as to the accuracy or completeness of
the products or of the application or use by customer’s third party
information included herein and shall have no liability for the consequences of
customer(s). NXP does not accept any liability in this respect.
use of such information.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
11.2 Disclaimers authorization from national authorities.
Evaluation products — This product is provided on an “as is” and “with all
Limited warranty and liability — Information in this document is believed to faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
be accurate and reliable. However, NXP Semiconductors does not give any and their suppliers expressly disclaim all warranties, whether express, implied
representations or warranties, expressed or implied, as to the accuracy or or statutory, including but not limited to the implied warranties of
completeness of such information and shall have no liability for the non-infringement, merchantability and fitness for a particular purpose. The
consequences of use of such information. entire risk as to the quality, or arising out of the use or performance, of this
In no event shall NXP Semiconductors be liable for any indirect, incidental, product remains with customer.
punitive, special or consequential damages (including - without limitation - lost In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
profits, lost savings, business interruption, costs related to the removal or to customer for any special, indirect, consequential, punitive or incidental
replacement of any products or rework charges) whether or not such damages (including without limitation damages for loss of business, business
damages are based on tort (including negligence), warranty, breach of interruption, loss of use, loss of data or information, and the like) arising out
contract or any other legal theory. the use of or inability to use the product, whether or not based on tort
Notwithstanding any damages that customer might incur for any reason (including negligence), strict liability, breach of contract, breach of warranty or
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards any other theory, even if advised of the possibility of such damages.
customer for the products described herein shall be limited in accordance Notwithstanding any damages that customer might incur for any reason
with the Terms and conditions of commercial sale of NXP Semiconductors. whatsoever (including without limitation, all damages referenced above and
Right to make changes — NXP Semiconductors reserves the right to make all direct or general damages), the entire liability of NXP Semiconductors, its
changes to information published in this document, including without affiliates and their suppliers and customer’s exclusive remedy for all of the
limitation specifications and product descriptions, at any time and without foregoing shall be limited to actual damages incurred by customer based on
notice. This document supersedes and replaces all information supplied prior reasonable reliance up to the greater of the amount actually paid by customer
to the publication hereof. for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
Suitability for use — NXP Semiconductors products are not designed, law, even if any remedy fails of its essential purpose.
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or Safety of high-voltage evaluation products — The non-insulated high
malfunction of an NXP Semiconductors product can reasonably be expected voltages that are present when operating this product, constitute a risk of
to result in personal injury, death or severe property or environmental electric shock, personal injury, death and/or ignition of fire. This product is
damage. NXP Semiconductors accepts no liability for inclusion and/or use of intended for evaluation purposes only. It shall be operated in a designated
NXP Semiconductors products in such equipment or applications and test area by personnel that is qualified according to local requirements and
therefore such inclusion and/or use is at the customer’s own risk. labor laws to work with non-insulated mains voltages and high-voltage
circuits.
Applications — Applications that are described herein for any of these
The product does not comply with IEC 60950 based national or regional
products are for illustrative purposes only. NXP Semiconductors makes no
safety standards. NXP Semiconductors does not accept any liability for
representation or warranty that such applications will be suitable for the
damages incurred due to inappropriate use of this product or related to
specified use without further testing or modification.
non-insulated high voltages. Any use of this product is at customer’s own risk
Customers are responsible for the design and operation of their applications and liability. The customer shall fully indemnify and hold harmless NXP
and products using NXP Semiconductors products, and NXP Semiconductors Semiconductors from any liability, damages and claims resulting from the use
accepts no liability for any assistance with applications or customer product of the product.
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of 11.3 Trademarks
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their Notice: All referenced brands, product names, service names and trademarks
applications and products. are the property of their respective owners.
UM10412 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
User manual Rev. 1 — 2 November 2010 25 of 26NXP Semiconductors UM10412
UBA2021 evaluation board
12. Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Safety warnings and cautions . . . . . . . . . . . . . 3
3 Board description . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Daughter board. . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Main board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Power supply connectors . . . . . . . . . . . . . . . . 10
5.2 Dimming input. . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Lamp connectors . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Test points. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.5 Transformer T1 . . . . . . . . . . . . . . . . . . . . . . . . 12
5.6 FET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.7 Current sense selection . . . . . . . . . . . . . . . . . 12
5.7.1 Half-bridge current sensing . . . . . . . . . . . . . . 12
5.7.2 Lamp current sensing . . . . . . . . . . . . . . . . . . . 12
5.8 Using transformer T3 . . . . . . . . . . . . . . . . . . . 13
6 Transformer specifications . . . . . . . . . . . . . . . 14
6.1 Transformer T1 . . . . . . . . . . . . . . . . . . . . . . . . 14
6.1.1 Schematic diagram . . . . . . . . . . . . . . . . . . . . . 14
6.1.2 Winding specification . . . . . . . . . . . . . . . . . . . 14
6.1.3 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.2 Transformer T3 . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2.1 Schematic diagram . . . . . . . . . . . . . . . . . . . . . 15
6.2.2 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7 Application example . . . . . . . . . . . . . . . . . . . . 17
7.1 Default application T5 HE 35 W . . . . . . . . . . . 17
8 Bill of Materials (BOM). . . . . . . . . . . . . . . . . . . 18
9 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
10 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
11.1 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
11.2 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
11.3 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 2 November 2010
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