Photonics West 2021: Laser Tech Talks - The VIXAR Technology Toolbox - Leading into the Next Generation of 3D Sensing Applications - Vixar Inc.
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www.osram-os.com / www.vixarinc.com Photonics West 2021: Laser Tech Talks The VIXAR Technology Toolbox - Leading into the Next Generation of 3D Sensing Applications Klein Johnson (CTO Vixar) March 9th, 2021
OSRAM Opto Semiconductors – Innovation & Passion
A Global Leader in Lighting Components and Solutions
We shape the future of light
Product portfolio Automotive Product portfolio Sensing Product portfolio Visualization Product portfolio Illumination
2 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021
OSRAM + Vixar
Technology and
Operational Excellence
AN
COMPANY
✓ VCSEL Design expertise ✓ High performance, high volume ✓ High volume manufacturing
VCSEL products expertise
✓ Design for reliability ✓ High quality, high reliable VCSEL
products ✓ Experienced quality systems
organization
✓ Dual outsourced manufacturing ✓ Robust dual and triple sourced
partners supply chain ✓ Internal Wafer and Packaging
production
✓ Packaging expertise ✓ Best in class package options
✓ Packaging expertise
3 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021
VCSEL 101
VCSEL vs. Edge-Emitter VCSEL Advantages
✓ Wafer level testing
✓ Surface mount, chip-on-board packaging
✓ 1D and 2D arrays
✓ Circular, low divergence beam
✓ High modulation rate & risetimes
✓ Narrow spectral width
✓ Low electrical power consumption
✓ High reliability
✓ Low thermal wavelength shift
100% wafer level testing
>500K VCSELs per 6” wafer
4 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021
Comprehensive VCSEL Product Portfolio
650 850 1000
Chip portfolio covering focus applications
✓ Broad wavelength range 670 - 940nm
✓ Biometrics, Security, 3D sensing, atomic sensors
✓ Power classes serving different applications from Proxy to LiDAR
670nm 680nm 795nm 850nm 895nm 940nm
Die
1mW 8-40mW 0.2mW 0.5W – 10/30W 0.2mW 0.010W – 10W / 150W ✓ First dual junction chip optimized for operating condition in mobile
phone, 53% Efficiency achieved for the operating conditions
between 2W and 3W, 3J and 5J chips in development
✓ Further EPI and efficiency over temperature improvement
on roadmap
Ceramic Laminated Leadframe
✓ Application dedicated chip designs (e.g. stripe or random)
2835 0402
850 & 940nm 940nm
Dedicated Package platforms
Ceramic Quad Flat Pack no Leads
4144 2433
Platforms
850 & 940nm 940nm ✓ Platforms (PLCC, QFN, Ceramic) serving consumer, Mobile and
Automotive / Industry with dedicated package designs
PLCC Ceramic ✓ Respecting established industry standards 0402, 2835, 3020, …
3020 3654
850nm 940nm ✓ Special versions including MLA, ESD, MPD, IC available
PLCC ✓ Customized derivates for special application
3020
670 nm & 680 nm
5 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021
Industry Target Applications and Success Stories
Measurement Techniques for 3D Sensing
Direct Time of Flight (dToF) Indirect Time of Flight (iToF)
Structured Light Camera Illumination / Stereo Vision
6 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021
VCSELs in 3D sensing
Structured light Time of Flight
• 3D optical sensors are becoming
widespread in consumer, industrial, and Critical metrics:
automotive applications • Power scaling
• Conversion efficiency
• Thermal Stability
• Beam quality and divergence
• Compact packaging
• Low parasitics (fast risetimes)
• Array uniformity
VCSEL TOF illuminator
7 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021
Portfolio and Technology Toolbox
1 Multi-Junction 940nm VCSELs
2 905nm 5J VCSELs
3 Flip-Chip VCSELs
4 Segmented VCSEL Designs
8 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021
VCSEL Innovations
Multi-Junction VCSEL Technology – 940 nm Single junction MQW Multi-junction QWs
Motivation:
- Increase gain volume by periodically stacking active regions in cavity
- Carrier regeneration in tunnel junctions → increased slope efficiency R. Koda et al, APL (2005)
- Re-optimize gain & loss in cavity for net efficiency improvement
- Trade off voltage and current for driver compatibility (faster rise time) Equivalent
- Compatible with high volume fabrication circuit model
Design Features:
- Top emitting VCSEL with backside cathode
- Oxide aperture confinement
- p- and n-type AlGaAs DBRs
- Low resistance n+/p+ tunnel junction
- n-type GaAs substrates - 6-inch wafer processing
- MOCVD grown epi
9 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021
VCSEL Innovations
Multi-Junction VCSEL Technology – 940 nm
Power Voltage Efficiency
Single 10um aperture, CW
10 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021940nm VCSEL Development at Vixar
Vixar 940nm VCSEL performance history
Single aperture VCSELs at room temp, CW
Triple
Power (mW) junction
Single
Improvements in 940nm SJ VCSEL performance junction Double
junction
• Slope efficiency improvement from 0.85 W/A → 1.15 W/A
• 42% → 53% power conversion last year
Slope (W/A)
Recent introduction of multijunction VCSELs
• Slope efficiencies >5 W/A (5 junction)
• Threshold current and losses do not scale with # junctions
Efficiency (%)
→ Power conversion efficiencies >60%
11 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021VCSEL Innovations
Double-Junction VCSEL Technology – Temperature Performance
Wall Plug Efficiency
60%
50%
Efficiency [%]
40%
30%
20%
20 °C
10%
80 °C
0%
0 5 10 15 20
Current [mA]
Single 10um aperture, CW,
Solder Temperature
12 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021Portfolio and Technology Toolbox
1 Multi-Junction 940nm VCSELs
2 905nm 5J VCSELs
3 Flip-Chip VCSELs
4 Segmented VCSEL Designs
13 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021905nm for Automotive LiDAR
Direct Time of Flight
Direct TOF LiDAR:
- All solid-state solution
- Time gated detector measures object distance
- Automotive LiDAR for fully autonomous vehicles
Laser Source Challenges:
- High Peak Power
- High Power Density / Brightness
- Short Rise/Fall Times (1 – 10’s of nS’s)
- High Thermal Stability (>125 C)
- High Reliability
Why 905nm:
- Historical choice
- Longer wavelength is invisible to the human eye
- Improved SNR with avalanche photodiodes (APDs, SPAD’s) for outdoor applications
14 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021VCSEL Innovations
Multi-Junction VCSEL Technology – 905 nm 5 Junction
905nm 5J VCSEL - CW Performance
Discrete VCSEL Die: 50
Optical Power [mW]
40
- Single aperture : 10µm diameter
30
- Operating condition: CW 20
20 C
10
LIV Comparison: 0
0 5 10 15
- Peak efficiency: > 54% Current [mA]
- Peak slope efficiency: 5.3 W/A
- > 40 mW Power / Aperture 905nm 5J VCSEL - CW Performance
60.00
Wall Plug Efficiency [%]
50.00
40.00
30.00
20.00 20 C
10.00
-
0 5 10 15
Current [mA]
15 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021VCSEL Innovations
Multi-Junction VCSEL Technology – 905 nm 5 Junction
High power VCSEL array die:
- Layout : 99 apertures (10µm Diameter)
- Die Area : 0.64 mm2 (incl. bondpads)
- Pulse Characteristics : 13 ns, 0.09% DC
Experimental Results:
- Power : >150 W Peak Power
- Beam : 28° FWHM
- Peak power density >2kW/mm2 @ 105C
- ~20% droop 40C → 125C
16 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021Portfolio and Technology Toolbox
1 Multi-Junction 940nm VCSELs
2 905nm 5J VCSELs
3 Flip-Chip VCSELs
4 Segmented VCSEL Designs
17 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021Driver Modules
Desire to move to more integrated solutions – Flip Chip VCSELs
Component TOF Module Future Integration
optic
Ceramic Diffuser in lid for
QFN
desired FOV
Raw VCSEL beam
(+) Std-VCSEL (-)
Eye safety:
Submount
• Monitor
photodiode
• MLA Interlock
Diffuser Optics
High efficiency 3W FC-VCSEL
940nm VCSEL chip (+) (-)
Driver I.C. Submount or PCB
18 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021VCSEL Innovations
Bottom Emitting Flip-Chip VCSELs
Packaging Advantages: Top Emitting VCSEL
- Reduced Packaging Footprint
- Low-Cost Packaging
- Lower Inductance
- 2D Array Addressability (+) VCSEL Die (-)
- On-Chip Optics
Submount
Performance Advantages:
- High Power Density
- Reduced Beam Divergence
- Reduced Thermal Resistance Flip-Chip VCSEL
- Reduced Pulse Rise Times
Available for custom chip layouts
Flip-Chip VCSEL Die
- First demonstration samples available
(+) (-)
Submount or PCB
19 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021VCSEL Innovations
Bottom Emitting Flip-Chip VCSELs – Optical Power
High power VCSEL array die:
Optical Power over Driving Current
- Chip footprint : 1.0 mm x 1.0 mm 12
- Emission area: 0.67 mm x 0.66 mm 10 Emission
Optical Power [W]
- Operating condition: 100µs, 1% DC, Ts = 20⁰C 8 side
6 12 µm
Beam Divergence 4
20 µm
50 µm
- 12 µm Diameter – 20° FWHM 2
100 µm
- 20 µm Diameter – 15° FWHM
0
- 100 µm Diameter – 10° FWHM 0 5 10 15 20
Current [A]
Side
LIV Comparison:
Peak Optical power : Flip-Chip Wall Plug Effiency (WPE) View
50
- > 10W at 20° C 20° C
40 40° C
60° C
Peak efficiency:
Efficiency [%]
30 80° C
- > 43% at 20° C
- > 34% at 80° C 20
Mounting
10 Side
0
0 2 4 6 8
Current [A]
20 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021Portfolio and Technology Toolbox
1 Multi-Junction 940nm VCSELs
2 905nm 5J VCSELs
3 Flip-Chip VCSELs
4 Segmented VCSEL Designs
21 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021VCSEL Innovations
Segmented VCSELs
Advantages:
- Incorporate proximity and flood illumination
- Improve total module efficiency
- Illumination power scalability by zone
- Improve TOF/LiDAR spatial resolution
- Reduce unwanted object glare from a zones 2D Regional + Proximity
1D Line Scanning
- Flexible 1D and 2D array options
Technology is compatible with Multi-Junction and
bottom emitting flip-chip VCSEL technology
Integrated with packaging optics to improve
illumination selectivity in target sensing fields-of-view
22 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021VCSEL Technology Achievements
Solution: Power Boost Solution: Size Reduction / Addressability
Technology: Multi-Junction VCSELs Technology: Backside Emitter
High Laser Efficiency Successful flip-chip, backside Emitter
> 60% wall-plug-efficiency for single aperture Over 40% wall-plug-efficiency
> 50% wall-plug-efficiency for power arrays
>10W in a 1mm² chip
Standard Product Die – Now Available!
Solution: Addressability Solution: Automotive LiDAR Illumination
Technology: Customized VCSEL Die Technology: 905nm 5J VCSEL Technology
Ease in custom, flexible designs High Peak Power Performance
Incorporate multi–functionality into a Over 150W of peak Power
single VCSEL die
High Thermal Stability up to 125 °C
23 The VIXAR Technology Tool Box – Leading into the Next Generation of 3D Sensing Applications | Klein Johnson
Photonics West 2021: Laser Tech Talks | 03/09/2021www.osram-os.com / www.vixarinc.com Questions?
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