ATLAS ITk BO, CS, GE, MI, TN, UD - CSN1 Meeting - Roma, 6 Febbraio 2017 Gian-Franco Dalla Betta1, Claudia Gemme2 On behalf of RD_FASE2: ATLAS ...
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G.-F. Dalla Betta Feb. 6, 2017
ATLAS ITk
CSN1 Meeting – Roma, 6 Febbraio 2017
Gian-Franco Dalla Betta1, Claudia Gemme2
1 Universityand TIFPA INFN / Trento
2 INFN Genova
On behalf of RD_FASE2: ATLAS Pixel
BO, CS, GE, MI, TN, UD
Overview of the Phase-II Pixel upgrade
ü The project is now accelerating significantly given the schedule for the
Pixel TDR (Dec 2017).
• Possibility to have two FE
submissions is included in the
schedule. Module op:miza:on
can start with first chip.
• Module produc:on and
loading: ~27-33 months
2
Overview of the Phase-II Pixel upgrade
ü The project is now accelerating significantly given the schedule for the
Pixel TDR (Dec 2017).
Zoom in 2017:
• Layout definition will allows groups to take
commitments on parts of detector.
• and preliminary design of the local supports.
• RD53-A will be submitted in spring 2017à
technological demonstrator of the 65 nm technology
and module prototypes with small pixel size.
• Bump bonding marker survey.
• Sensors: identify the baseline designs to be used in
the detector. A preliminary design of the data
transmission and power distribution scheme will be
included in the TDR.
• Start of ATLAS chip design.
3
G.-F. Dalla Betta 4 Feb. 6, 2017
INFN Contribution to ITk & R&D’s
Main target of the R&D
– 3D Pixel Sensors → RD_FASE2 – (common with CMS)
• In partnership with FBK (Trento)
• Baseline technology in Layer 0 (maybe also L1 and Ring0)
– Bump-bonding → RD_FASE2 (in part common with CMS)
• Indium thermo-compression process with Leonardo (ex Selex)
– Pixel R/O chip (RD53) → common CHIPIX65 project of CSN5
– Pixel module assembly / tes:ng → RD_FASE2
– CMOS sensors (with STM) → HVR_CCPD project of CSN5
– Mul: module R/O & DAQ → RD_FASE2
– Local support / CO2 cooling → RD_FASE2
– Simula:on & tracking
Several topics also co-funded
4 by EU AIDA2020
G.-F. Dalla Betta 5 Feb. 6, 2017
Assegnazioni RD_FASE2 a ITk 2014-2017
(inclusi items comuni con CMS)
A3vità Descrizione BO CS GE MI TN UD TOT
Sviluppo sensori con FBK
3D - - 65 - 38.5 - 103.5
(inclusi substra:, etc.)
Bump bonding di moduli per
BB sensori & Qualificazione Bump - - 62 110 - - 172
bonding ad alta densita’ su W. 12”
Assemblaggio moduli, test,
MODULI - 7 22 2 8.5 2 41.5
irraggiamen:, etc.
Sviluppo sistema READ-OUT
READ-OUT 42.5 - - - - - 42.5
mul: modulo
MECCANICA QA suppor: locali e contributo al
- 8 26 57 - - 91
E COOLING Cooling System ITk
Total per Group 42.5 15 175 169 47 2 450.5
Grand Total 450.5
G.-F. Dalla Betta 6 Feb. 6, 2017
Milestones 2014
Data Descrizione % Note
31-05-2014 Presentazione documenti relativi alle attivita' di R&D, 100
pianificazione temporale e gruppi coinvolti
20-12-2014 Realizzazione batch sensori planari a 100
FBK con prove tecniche di foratura
Milestones 2015
Data Descrizione % Note
31-07-2015 Verifica batch FBK n. 2 pixel planari su wafer DWB 100
6". Se positiva seguono test di moduli single ROC
con pixel planari
30-11-2015 Qualifica della prima produzione di pixel 0 Riportata
3D single side FBK al 2016
G.-F. Dalla Betta 7 Feb. 6, 2017
Milestones 2016
Data Descrizione % Note
31-07-2016 Pixels, Caratterizzazione in clean 100
room di dispositivi planari e 3D
30-11-2016 Pixels, test in laboratorio di moduli 3D 100
30-11-2016 Pixels,Definizione Layout per pixel 3D e 100
planari compatibili con i prototipi del
chip di lettura previsto per RD53
Milestones 2017
Data Descrizione % Note
31-07-2017 Prove su fascio di rivelatori a pixel 3D 100
con chip di lettura FEI4 e PSI46dig
31-10-2017 Caratterizzazioni in laboratorio di Confidenti di
sensori a pixel planari con pitch soddisfare
50x50um e 25x100um pienamente
Italian R&Ds à 3D sensors
ü Achieved so far:
• Feasibility of small-pitch 3D demonstrated, tested with large pitch read-out
• Extensive testing of 3D modules under way with good results
• Very promising results also from irradiated test structures
Preliminary
test beam
results
8
Italian R&Ds à 3D sensors
ü Achieved so far:
• Feasibility of small-pitch 3D demonstrated
• Extensive testing of 3D modules under way with good results
• Very promising results also from irradiated test structures
ü Towards the TDRà Qualify FBK as a 3D vendor
• Need to qualify sensors for extreme radiation
hardness. 3D wafer: New layout
• proceed with irradiations of FE-I4 modules, looking
forward to RD53A ROCs (~fall 2017)
• One 3D batch being launched now (funded by AIDA
2020), another one (already funded by RD_FASE2) to
be produced, essential to finalize this R&D, still waiting
for the new agreement with FBK for pixel sensors.
9
Italian R&Ds à Bump-Bonding@Leonardo
ü Achieved so far:
• Bump bonded FBK 3D and planar sensors.
• High bump density deposition (50x50 µm2 over 2x2 cm2) validated with
electrical and visual QA on 6” wafers with dummy chains.
• Started validation of high density BB on 12” wafer. So far just bump
deposition on bare Silicon.
Bump R of dummy chains
Source scan of a 3D sensor bump
bonded to a +FEI4 by Leonardo
High density Bumps X-ray 10Italian R&Ds à Bump-Bonding@Leonardo
ü Achieved so far:
• Bump bonded FBK 3D and planar sensors.
• High bump density deposition (50x50 µm2 over 2x2 cm2) validated with
electrical and visual QA on 6” wafers with dummy chains.
• Started validation of high density BB on 12” wafer. So far just bump
deposition on bare Silicon.
ü Towards the TDRà Qualify Leonardo as a BB vendor
• Next step is to deposit bumps on 12” wafer with
resistive chains. If successful to be used for
RD53A wafer in Fall 2017
• For the TDR and beyond: Qualify Leonardo to do
high density In bump deposition on 12” wafers
12” dummy chain wafer
and maybe part of the flip-chip.
• Deposited wafers may be flip-chipped by users in
the collaboration (BCN, Moscow, Glasgow, Geneva,
etc...).
11Italian R&Ds à Read-out
ü Profiting of IBL (and Pixel Layer 2/1 on-going upgrades) experience
in Read-Out Card design/production/qualification.
ü The idea is to produce a table top card, replacing the ROC+BOC
current pit implementation:
• Manpower: 2 FTE with electronics Workshop in Bologna
• For the TDR: qualify the system for the detector offline readout.
12Italian R&Ds à Mechanics/Cooling
Plant in USA15 PP2 PP1
7
Chiller
9
Transfer line 8
Pump 7
2 3 4 5
1 6 Staves
PP1 Splitting box
ü Participation to the ITK cooling
system with the design,
construction and tests of the
splitting box (Genova):
• Prototypes to be ready in
summer for QA at CERN.
13Italian R&Ds à Mechanics/Cooling
ü CO2 evaporative system with recycle now available for ATLAS and LHCb
in Milano.
ü Slim longeron (Support of the inclined solution)
• Manufacturing of the Al moulding.
• Thermo mechanical FEA: stress in the cell critical interfaces and thermal
radiation effect studies. Al mould short prototype
Cell FEA studies
SLIM Local Support
for Inclined Layout
• Planned CO2 tests of cooling circuits with the 2PACL Traci unit.
• Planned measurement of the cell solder/tim interfaces before and after
cooling/pressure cycles.
14Aggio
E cosa costruiamo? rn
un p amenti in
aio di
mesi
ü We are discussing if to take responsibility of building one End-cap,
so far uncovered.
• The other one is built by UK colleagues.
• Building the innermost barrel layers - as originally proposed to better
match our sensor interests - seems to be difficult as there is a strong
US interest and our design and engineering capabilities are limited.
• This is not expected to damage our interest and leadership in the 3D
sensors as the pixel production model decouples the module
production&test from their installation on detector.
ü Meeting in Genova on Feb 8/9 to discuss the current status of the
activities, push them to be relevant in the Pixel TDR and discuss if
to take the responsibility to deliver the End-cap.
ü This is an ambitious project (2.5 m length, 60 cm diameter, 2.5 m2
surface) but may be a big opportunity to boost the Italian
contribution:
• New groups have shown interests in this opportunity (Lecce, Frascati).
15Production organization for the pixel detector
Lab1Lab1 Lab1Lab2
Lab3 Modules and
LabN LabM
Supports QA sites
are not necessarily
Pool of Qualified Pool of Qualified correlated to the
Modules Supports Loading sites
(3D, planar…) (Staves, Half-Rings)
Barrel Loading Sites receive EC Loading Sites receive
QA Staves + QA module QA Half-rings + QA
Module Loading: modules
Robot, Survey
Loaded supports
QA:
HW setup, source,
cold boxAggio
A possible model for Italy rn
un p amenti in
aio di
mesi
ü Module Assembly e QA:
• Assembly e QA dei 3D (~1 m2 /2 vendors ) – per paragone 0.04 m2 sono i
3D installati in IBL.
• Altro se necessario per il nostro share.
à Coinvolgere piu’ lab: almeno 2 per module assembly, 4-5 per module QA.
àE’ MOLTO importante per il formare competenze per l’operazione negli
anni futuri!
ü Module Loading and QA:
• A Genova montati in passato ~ 40 staves (~500-600) moduli.
• Procedura lenta , va sicuramente ottimizzata.
à1/2 siti per il Loading (Genova/xx)
à Almeno 2 siti per la QA dei moduli sui supporti.
ü Integration:
• To be defined.Aggio
rnam
uFeb.
n pa6,i 2017ent
G.-F. Dalla Betta 18 o di m i in
esi
Riassunto FTE 2017
Sezione First+Name Family+Name Ruolo RD_FASE2+ HVR_CCPD CHIPIX65 AIDA2020
BO Federica Fabbri PhD 0,20 1 1 1
BO Davide3 Falchieri Tecn.3Cat.3D 0,20 1 1 1
Total for the 4 R&D of interest for ITk BO
BO
Alessandro3
Carla
Gabrielli
Sbarra
RU
RIC
0,20
1
1
0,20
1
1
1
1
BO Antonio Sidoti RIC 0,20 0,20 1 1
- 39 persons (same as in 2016) BO
CS
Maximiliano
Anna
Sioli
Mastroberardino
PA
RU
0,20
0,50
1
1
1
1
1
1
CS Daniela Salvatore Assegnista 0,30 1 1 1
- 18 FTE (was 16.2 in 2016) GE
GE
Giovanni
Andrea
Darbo
Favareto
DR
Assegnista
0,60
0,30
0,30
1
1
1
1
1
GE Andrea Gaudiello PhD 0,50 0,30 1 1
GE Claudia Gemme RIC 0,20 0,10 1 0,15
GE Silvia Miglioranzi Assegnista 0,20 1 1 1
GE Paolo Morettini 11RIC 0,60 0,20 1 1
Sez. RD_FASE2 HVR_CCPD CHIPIX65 AIDA2020 GE
GE
Hideyuki
Leonardo
Oide
Rossi
Borsa
DR
0,40
0,20
1
0,10
1
1
1
1
GE Cecilia Rossi Tecn. 0,30 1 1 1
BO 1.00 0.40 - - GE
MI
Mario3
Gianluca
Sannino
Alimonti
PA
RIC
0,40
0,50
0,20
1
1
1
1
0,20
MI Attilio Andreazza PA 1 0,30 1 1
CS 0.80 - - - MI
MI
Mauro
Simone
Citterio
Coelli
D1TEC
Tecn.
1
0,40
0,10
1
1
1
1
1
MI Luca Frontini PhD 1 1 0,60 1
MI Danilo Giugni P1TEC 0,50 1 1 1
GE 3.70 1.20 - 0.15 MI Valentino Liberali PA 1 0,20 0,40 1
MI Chiara Meroni DR 0,25 0,30 1 0,15
MI Francesco Ragusa PO 0,10 0,30 1 1
MI 2.12 1.20 1.50 0.35 MI Seyedruhollah Shojali Assegnista 1 1 0,50 1
MI Clara Troncon 11RIC 0,37 1 1 1
TN Maurizio Boscardin RIC 0,10 1 1 1
TN 3.30 - - 1.00 TN Gian1Franco Dalla3Betta PO 0,50 1 1 1
TN Mostafa El3Khatib PhD 0,50 1 1 1
TN Roberto Iuppa RTD1A 0,10 1 1 1
UD 1.30 - - - TN
TN
David
Roberto
Macii
Mendicino
PA
PhD
0,70
1
1
1
1
1
1
1,00
TN D3M3S Sultan PhD 0,70 1 1 1
Total 12.22 2.80 1.50 1.50 TN
UD
Giovanni
Mario3Paolo
Verzellesi
Giordani
PO
RU
0,70
0,30
1
1
1
1
1
1
UD Gilberto Giugliarelli RU 1,00 1 1 1
Total 39 12,22 2,80 1,50 1,50
Lecce e Frascati hanno dimostrato serio interesse a partecipare;
altri laboratori potrebbero aumentare il loro contributo à FTE>25 nei prossimi anniG.-F. Dalla Betta Feb. 6, 2017
Itk Money Matrix
Pixel Contributions Italy
Common Item Contribution Italy GRAND TOTAL = 6282,60 kCHFFinal Message
ü 2017 important steps:
• Contribute to the TDR!
• Test 3D sensor at very high fluence and produce new batches for
test and assembly with RD53A.
• Qualify the high density bump deposition on 12” wafers.
• Choose a detector part to built and contribute with our expertize
there.
20G.-F. Dalla Betta 21 Feb. 6, 2017 Back-Up Slides • Funding 2014-2017 • General ITK • Sensors • Bump Bonding • Mechanics • ITk Cooling • Electronics
G.-F. Dalla Betta 22 Feb. 6, 2017
RD_FASE2: Assegnazioni 2017
Funding23
G.-F. Dalla Betta Feb. 6, 2017
RD_FASE2: Assegnazioni 2016
1 2
Funding
3
1) In corso ordine congiunto GE-MI a Selex per BB (40 kEuro)
+ residuo ~12 kEuro per lavorazione wafer 12’’
2) In attesa di riattivazione convenzione per ordine a FBK
3) Include contributo 2016 a Baby DemoG.-F. Dalla Betta Feb. 6, 2017
RD_FASE2: Assegnazioni 2015
A3vità Descrizione BO CS GE MI TN UD
6" Wafer procurement (SOI, wafer bonding, epi) - - - - 10.0 -
3D
PicoScope 6407 Digi:zer with 1.5 GHz probes and
accessories.
- - - - 8.5 -
6" dummy wafers - test deposi:on on 6" and
- - - 20.0 - -
Funding
BB
high-density bumps (150 k-bumps/chip)
BB for 3D sensor test - - 24.0 - - -
Upgrade R/O Systems - 2.0 2.0 2.0 - 2.0
MOD
Module assembly and irradia:on, RD on flex - - 10.0 - - -
MM-R/O Mul: module R/O 15.0 - - - - -
CO2/µCH Develop µ-channel cooling - - - 10.0 - -
15.0 2.0 36.0 32.0 18.5 2.0
Total requested by ATLAS
105.5G.-F. Dalla Betta Feb. 6, 2017
RD_FASE2: Assegnazioni 2014
2014: CSN1 funded (Feb and May) R&D Phase 2 activities for ATLAS &
CMS inner trackers.
– Development of 3D and Ac:ve Edge sensors with FBK – 3 Batches (ATLAS/CMS)
– Bump-bonding: development of Indium bumps (6” sensors) and produce
modules
Funding
– Develop a technology for pixel detector hybridiza:on using C (dielectric) instead
of R (bump-bonding) coupling
– Comple:on of CO2 test plant (combined ATLAS / LHCb)
Assigned on Sezione Category ATLAS/CMS/COMMON Assigned DescripVon
Feb 2014 GE 3D COMMON 21 000 Wafer for 3D sensors (common with CMS)
Apr 2014 GE 3D COMMON 44 000 3 processes at FBK: 2 commiped with MEMS3
May 2014 GE HV ATLAS 13 000 HV-CMOS Hybridiza:on + 3 FE-I4B wafers
May 2014 MI BB ATLAS 27 000 BB of 3D (IBL design on 6") + 3 FE-I4B wafers
May 2014 MI CO2/µ-CH ATLAS 20 000 TRACI: co-funded with LHCb
125 000Itk Layout à strip TDR
One layout for strip; two concepts for pixel.
General ITk
Strip
Pixel
08/05/2015 Roadmap to Layout Workshop 26The ITK Pixel detector: FullyInclined
Outer Barrel
General ITk
End cap
Innermost: Barrel + endcap
Same Endcap in both layouts, optimized for the Extended
27The ITK Pixel detector: Extended
Outer Barrel
General ITk
End cap
Innermost: Barrel + endcap
Same Endcap in both layouts, optimized for the Extended
28performance
General ITk
29Surfaces
General ITk
Una Endcap à 3.3 m2 ma in processo di ottimizzazione, si potrebbe ridurre
del 30%
Il Pixel detector oggi e’ 1.9 m2Bump-bonding: Selex à Leonardo
ü Requirements/challenges:
• 5x bump density of current IBL à 120 k-bumps/chip FEI4 size
• Optimize the process on dummies (produced by FBK), studying bump height, size
and the process parameters as pressure and temperature.
• Visual, mechanical and electrical test of the parts and assemblies.
• Bump deposition on 12-inch electronics and 8-inch sensors wafers (was 8”
Bump Bonding
and 6”)
• Optimize the process on dummy supports
• Wafers and deposition masks procured: test uniformity of bumps deposition.
• Handling of thin electronics (100 µm has been achieved for few FEI4 test
modules).
• Indium bumps have an easier process that does not need temporary support
wafer à competitive for innermost layers
• 10x total surface (14-18 m2 vs current pixel of 1.7):
• Need to optimize production flows and reduce bottle-necks as Flip-chip à
outsourcing ?
ü We are working with Leonardo for the R&D phase and to qualify it as vendor.
31Bump Bonding
Bump Bonding
Bump-bonding@Leonardo: resistive chains
ü Very promising results from first resistive chain tests on 6”:
• Bumps resistivity as expected
• No open among 64k bumps (3 chips)
• No indication of shorts (either by X-rays or R measurement)
• Mechanical tests with thermal cycles on module-like structure are fine.
Flip-chip planarity needs to be improved.
Bump Bonding
•
ü Next steps:
• Resistive chain QA with 12” wafers
• … until high pitch density is available with real sensors/RD53A
34Bump-bonding@Leonardo: 12” deposition
ü Bump deposition on 12” bare wafer (just Si, no pattern) with several
bumps openings under test
• Wafer has been visually analyzed and bumps height measured with a
profilometer
• preliminary results on bump height (~10 µm) uniformity good (~1 µm) if
opening is larger than 16 µm.
Bump Bonding
• Some problems at the photoresist lift-off due to low number of bumps
(bump density is nominal but only in spots uniformly distributed over the
wafer surface).
ü Next steps on daisy chains:
• More tests needed with high bumps density all over the wafer and
daisy chains to measure bump resistivity.
• Resistive chains layout on 12” is a common layout for all the groups.
• In fabrication nowà BB in March.
35Bump-bonding@Leonardo: 12” deposition
Bump Bonding
36SLIM LONGERON PROTOTYPE PRODUCTION: MANUFACTURING
OF ALUMINUM MOULDS
STRUCTURE ALUMINUM
MOULDS FOR:
• TEST PROTOTYPES
• FULL LENGTH
COMPONENTS
FOR THE PRODUCTION OF
THE CARBON FIBER
Mechanics
LONGERON
MODEL OF THE MOULD
INTERNAL COMPONENTS
WITH CRITICAL MACHINING
DETAIL OF THE CARBON FILAMENTS
CORNER CROSSING (THE VOLUME FIBER
NEEDS TO BE MAINTAINED CONSTANT)
37STAINLESS STEEL
MOULD
ALUMINUM MOULD
SHORT PROTOTYPE (200
mm)
Mechanics
PRODUCED IN MILANO
MECHANICAL
WORKSHOP
SENT TO CERN
TO TEST THE DE-
MOULDING PROPERTIES
WORK IN PROGRESS: MANUFACTURING STUDIES FOR ALUMINUM FULL
ASSEMBLY MOULD, LENGTH 400 mm
38EXAMPLES OF CARBON FIBER LONGERON STRUCTURES UNDER TEST
Mechanics
39THERMO-MECHANICAL FEA: EVALUATION OF THE STRESS
IN THE CELL CRITICAL INTERFACES
BARREL CELL
SLIM CELL CRITICAL INTERFACES
ISO-GRAPHITE BLOCK USE OF ADVANCED MATERIALS
(NO ALL DATA ARE AVAILABLE)
Sn-37Pb SOLDER • SOLDERING (BRAZING)
BETWEEN PIPE AND
PHASE-CHANGE
THERMAL
COOLING BLOCK
Mechanics
TPG PLATE • PHASE-CHANGE-THERMAL
INTERFACE
MATERIAL INTERFACE-MATERIAL
TILTED CELL
MATERIAL CTE AND YOUNG
MODULES UNDER
INVESTIGATION
FEA CALCULATION OF THE
STRESS IN THE INTERFACES
40FEA STUDY: EFFECT OF THE THERMAL RADIATION
ON THE THERMAL FIGURE OF MERIT
THERMAL RADIATION EFFECT MODEL:
CELL IN A CLOSED CYLINDER ENVELOPE
TO SIMULATE THE ENERGY EXCHANGE WITH THE
SURROUNDING ENVIRONMENT DUE TO THE
INFRARED RADIATION
EMISSIVITY CASES STUDIED
• Ɛ = 1 (BLACK BODY)
• Ɛ = 0.5 (GRAY BODY)
Mechanics
41Mechanics
EFFECT OF THE THERMAL RADIATION HEAT EXCHANGE WITH A
SURROUNDING ENVIRONMENT AT 20 °C, FOR BOTH THE BARREL AND
TILTED SLIM CELLS:
THE THERMAL FIGURE OF MERIT CHANGES WITH THE COOLING
TEMPERATURE, WITH THE EMISSIVITY OF THE FACING OBJECTS
=> INCREMENT OF THE 6 TO 9 % OF THE TFOM DUE TO THERMAL
RADIATION EXCHANGE
42COLD BOX FOR SLIM CELL
SOLDERING/THERMAL INTERFACE
THERMAL TEST BEFORE AND AFTER THERMAL/PRESSURE CYCLING
DEDICATED COLD BOX
DESIGN COMPLETED
CONSTRUCTION WORK IN PROGRESS
DRY-AIR FLUXED CHAMBER
WITH INTERNAL DEW POINT MEASUREMENT
CO2 COOLING SUPPLY
Mechanics
FROM 2PACL TRACI COOLING UNIT
ARMAFLEX INSULATION
TEMPERATURE PROBES ATTACHED TO THE SYSTEM
UNDER TEST
POWER SUPPLY FOR HEATER DUMMY LOAD
SLIM BARREL/TILTED CELL UNDER TEST
PRE-QUALIFICATION USING A DUMMY PROTOTYPE
43TEST PLAN:
1. MEASUREMENT OF THE THERMAL FIGURE OF MERIT, APPLYING POWER WITH HEATERS
AND MEASURING THE TEMPERATURES, COOLING THE CELL USING THE CO2 SUPPLY
FROM THE TRACI UNIT
2. CYCLE THE PROTOTYPE (100) TIMES BETWEEN AMBIENT AND COLD TEMPERATURE (- 40
°C)
3. POST-MEASUREMENT OF THE THERMAL FIGURE OF MERIT AFTER THE CYCLES
Mechanics
THERMAL TEST CLIMATIC CHAMBER
44CO2 TEST OF COOLING CIRCUIT CRITICAL COMPONENTS
WITH 2PACL TRACI UNIT
SWAGELOK FLOW RESTRICTOR
CALIBRATED ORIFICE= 0,25 mm (0,01 ")
CO2 T, P (OUTLET FLOW RESTRICTOR)= -20 °C, 20 barA
3.5
3
ORIFICE PRESSURE DROP - bar
2.5
2
1.5
Mechanics
1
0.5
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
MASS FLOW RATE - g/s
CO2 FLUID-DYNAMIC CHARACTERIZATION
MILANO COOLING LAB. SOLVED THE PROBLEMS FOUND
2PACL TRACI V.3 UNIT IN THE PUMP: NEW GASKET TO
WITHSTAND EXPLOSIVE DE-
COMPRESSION
UNDER FINAL COMMISSIONING
AT CERN
45NEXT FEA TASKS:
ANSYS ACP FINITE ELEMENT ANALYSIS
SLIM LONGERON FEA PERFORMANCE. RIGIDITY, VIBRATION
FREQUNCIES, THERMO-MECANICAL STABILITY, MOUNTING
Mechanics
FIXATIONS AND DETAIL STUDIES
EXAMPLE OF OPTIMIZATION PROCESS FOR THE TILTED
CELL COOLING BLOCK
46ITk Cooling system
Genova is involved in the splizng box project and produc:on.
3D metallic printed prototype by summer :me.
Plant in USA15 PP2 PP1
ITK Cooling
7
Chiller
9
Transfer line 8
Pump 7
2 3 4 5
1 6 Staves
Splitting Box Splitting
Box
Plant →PP1
PP1 → Detector
• Common Mechanics group
• Pixel side
(Lukasz Zwalinski, Paolo Petagna, … )
(Danilo Giugni,…)
• DEMO & BABY DEMO
47Scheda Pixel_ROD
Features
• 7-series Xilinx® FPGAs
ü Kintex®7 XC7K325T for trigger and data processing
ü Zynq® Z020 with physical dual-core ARM Cortex-A9
• 1 x PCIe Express interface (4GB/s towards the PC memory)
• 16 x GTX@ 10Gb/s
ü 1 x 10-Gb/s link (GBTx)
• 1 x HPC (400-pin) HS (Half pair BOC-ROD)
Read-out
• 2 x LPC (160-pin) HS differen:al lines
Man Power (anyone Welcome!!)
• INFN (Lab. Elepronica)
• G. Balbi, D. Falchieri, G. Pellegrini
• DIFA: A. Gabrielli + studen:
• G. D’amen (XXX PhD 12-2017)
• N. Giangiacomi (XXXI PhD 12-2018)
• F. Alfonsi (Magistrale 06-17)
• C. Pre: (Magistrale 03-17)You can also read
